Leak detection sheet
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TOPPAN HOLDINGS INC
- Filing Date
- 2022-08-25
- Publication Date
- 2026-06-23
AI Technical Summary
【0012】 本発明によれば、水分や油分の漏れを検出する被検査体に対して、ベース基材に積層された粘着層を用いて接着した場合、導電性配線がベース基材で覆われた状態となり、それにより、ベース基材上に保護層を積層することなく導電性配線を物理的な外力から保護することができ、導電性配線を物理的な外力から保護しながらも、導電性配線をコネクタ等に電気的に容易に接続することができる。また、粘着層がベース基材の導電性配線が形成されていない領域に積層されており、その厚みが導電性配線の厚みよりも厚いことで、粘着層によって被着体に接着された状態において、被検査体にて漏れによって発生した水分や油分が、導電性配線と被着体との間に生じた隙間に入り込んで導電性配線に付着することになり、被検査体にて漏れによって発生した水分や油分を精度よく検出することができる。
Smart Images

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Abstract
Claims
1. A liquid leak detection sheet having a base substrate and a pair of conductive wirings formed in a first direction on one surface of the base substrate, One of the surfaces of the base substrate has an adhesive layer laminated between the pair of conductive wirings, A liquid leak detection sheet is configured such that the thickness of the adhesive layer is greater than the thickness of the conductive wiring, so that when the sheet is adhered to the object to be inspected by the adhesive layer, oil or moisture can enter the gap formed between the conductive wiring and the object to be inspected from both ends of the base substrate in the first direction.
2. A liquid leak detection sheet having a base substrate and a pair of conductive wirings formed in a first direction on one surface of the base substrate, On one of the surfaces of the base substrate, an adhesive layer laminated between the pair of conductive wirings, The protective layer is laminated on one side of the base substrate and adhered to the base substrate by the adhesive layer, A liquid leak detection sheet wherein the protective layer is not bonded to the conductive wiring, and the thickness of the adhesive layer is greater than the thickness of the conductive wiring, so that when the base substrate is bonded to the object to be inspected, oil or moisture can enter the gap formed between the conductive wiring and the protective layer from both ends of the base substrate in the first direction.