Inductor components

Abstract

This inductor component comprises at least one inductor element. The inductor element includes: a magnetic layer having uniaxial magnetic anisotropy; first inductor wiring positioned on one side of the magnetic layer in a first direction and extending along a virtual plane that crosses the first direction; second inductor wiring positioned on the other side of the magnetic layer in the first direction; and a first via part electrically connecting the first inductor wiring and the second inductor wiring. The first inductor wiring, the second inductor wiring, and the first via part constitute at least a portion of an inductor that rotates around a rotation axis extending along a second direction that crosses the first direction. The magnetic layer has a first end part that faces the first via part in a third direction, the first via part has a second end part that faces the magnetic layer in the third direction, and the first end part and the second end part are inclined in the same direction with respect to the first direction.

Description

Technical Field

[0001] This disclosure relates to an inductor component.

Background Art

[0002] Patent Document 1 discloses a wound-type magnetic thin film inductor. In the inductor of Patent Document 1, a magnetic thin film is formed on a glass substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the inductor of Patent Document 1, since it is necessary to thicken the glass substrate to wind the coil, miniaturization is difficult and the acquisition efficiency of inductance may be low.

[0005] An object of this disclosure is to provide an inductor component that can be miniaturized and has a high inductance acquisition efficiency.

Means for Solving the Problems

[0006] An inductor component according to one aspect of this disclosure comprises at least one inductor element, wherein the inductor element has a magnetic layer with uniaxial magnetic anisotropy, a first inductor wiring located on one side of the magnetic layer in a first direction and extending along a virtual plane intersecting the first direction, a second inductor wiring located on the other side of the magnetic layer in the first direction, and a first via portion electrically connecting the first inductor wiring and the second inductor wiring Includes, The first inductor wiring, the second inductor wiring, and the first via portion constitute at least a part of an inductor that pivots around a pivot axis extending along a second direction intersecting the first direction. The first via portion is located on the outside of the magnetic layer in a third direction intersecting the first and second directions, The magnetic layer has a first end facing the first via portion in the third direction, The first via portion has a second end facing the magnetic layer in the third direction, The first end and the second end are inclined in the same direction with respect to the first direction. [Effects of the Invention]

[0007] According to the above embodiment of the inductor component, it is possible to realize an inductor component that can be miniaturized and has high inductance acquisition efficiency. [Brief explanation of the drawing]

[0008] [Figure 1] A schematic plan view showing an inductor component according to one embodiment of the present disclosure. [Figure 2] Schematic cross-sectional view along the line X1-X2 in Figure 1. [Figure 3] Schematic cross-sectional view along the line Y1-Y2 in Figure 1. [Figure 4] Schematic cross-sectional view along the line Z1-Z2 in Figure 1. [Figure 5] Figure 1 shows an example of a BH curve for the magnetic layer of an inductor component. [Figure 6] A first schematic cross-sectional view illustrating an example of a manufacturing method for the inductor component shown in Figure 1. [Figure 7] A second schematic cross-sectional view illustrating an example of a manufacturing method for the inductor component shown in Figure 1. [Figure 8] A third schematic cross-sectional view illustrating an example of a manufacturing method for the inductor component shown in Figure 1. [Figure 9] A fourth schematic cross-sectional view illustrating an example of a manufacturing method for the inductor component shown in Figure 1. [Figure 10] The fifth schematic cross-sectional view for explaining an example of a method for manufacturing the inductor component of FIG. 1. [Figure 11] The sixth schematic cross-sectional view for explaining an example of a method for manufacturing the inductor component of FIG. 1. [Figure 12] The seventh schematic cross-sectional view for explaining an example of a method for manufacturing the inductor component of FIG. 1. [Figure 13] The eighth schematic cross-sectional view for explaining an example of a method for manufacturing the inductor component of FIG. 1. [Figure 14] The ninth schematic cross-sectional view for explaining an example of a method for manufacturing the inductor component of FIG. 1. [Figure 15] The tenth schematic cross-sectional view for explaining an example of a method for manufacturing the inductor component of FIG. 1. [Figure 16] The eleventh schematic cross-sectional view for explaining an example of a method for manufacturing the inductor component of FIG. 1. [Figure 17] The twelfth schematic cross-sectional view for explaining an example of a method for manufacturing the inductor component of FIG. 1. [Figure 18] The first figure for explaining an example of a method for forming the magnetic layer of the inductor component of FIG. 1. [Figure 19] The second figure for explaining an example of a method for forming the magnetic layer of the inductor component of FIG. 1. [Figure 20] The first figure for explaining an example of a method for forming a magnetic layer different from that of the inductor component of FIG. 1. [Figure 21] The second figure for explaining an example of a method for forming a magnetic layer different from that of the inductor component of FIG. 1. [Figure 22] The schematic cross-sectional view showing the second modification example of the inductor component of FIG. 1. [Figure 23] The schematic cross-sectional view showing the third modification example of the inductor component of FIG. 1. [Figure 24] The schematic plan view showing the first modification example of the inductor component of FIG. 1. [Figure 25] The cross-sectional view taken along line A1 - A2 of FIG. 24. [Figure 26] The cross-sectional view taken along line B1 - B2 of FIG. 24. [Figure 27] A schematic cross-sectional view showing a second modified example of the inductor component in Figure 1. [Figure 28] Cross-sectional view along line D1-D2 in Figure 27. [Figure 29] A schematic plan view showing a third modified example of the inductor component in Figure 1. [Figure 30] A schematic plan view showing a fourth modified example of the inductor component in Figure 1. [Figure 31] Figure 30 shows the location of the external terminals of the inductor component. [Figure 32] Figure 30 shows an inductor component. [Figure 33] A schematic plan view showing a fifth modified example of the inductor component in Figure 1. [Figure 34] Figure 33 shows the location of the external terminals of the inductor component. [Figure 35] Figure 33 shows an inductor component. [Figure 36] Cross-sectional view along line C1-C2 in Figure 33. [Modes for carrying out the invention]

[0009] Various aspects of this disclosure will be described below.

[0010] The inductor component of the first embodiment is It comprises at least one inductor element, The inductor element is A magnetic layer having uniaxial magnetic anisotropy, A first inductor wiring located on one side of the magnetic layer in the first direction and extending along a virtual plane intersecting the first direction, A second inductor wiring located on the other side of the magnetic layer in the first direction, A first via section electrically connects the first inductor wiring and the second inductor wiring. Includes, The first inductor wiring, the second inductor wiring, and the first via portion constitute at least a part of an inductor that pivots around a pivot axis extending along a second direction intersecting the first direction. The first via portion is located on the outside of the magnetic layer in a third direction intersecting the first and second directions, The magnetic layer has a first end facing the first via portion in the third direction, The first via portion has a second end facing the magnetic layer in the third direction, The first end and the second end are inclined in the same direction with respect to the first direction.

[0011] According to the inductor component of the first embodiment, the first end of the magnetic layer and the second end of the first via can be brought closer together, thereby enabling miniaturization of the inductor. This allows for the realization of a miniaturized inductor component. Furthermore, by bringing the first end of the magnetic layer and the second end of the first via closer together, the volume of the magnetic layer can be increased. This improves the efficiency of inductance acquisition.

[0012] The inductor component of the second embodiment is an inductor component of the first embodiment, The first via portion has a seed layer at the end closest to the first inductor wiring, In a cross-sectional view including the first and third directions, the magnetic layer has a trapezoidal shape in which the end closer to the first inductor wiring is the longer side and the end closer to the second inductor wiring is the shorter side, and the first via portion has a trapezoidal shape (in other words, an inverted trapezoidal shape) with the positions of the longer and shorter sides reversed compared to the magnetic layer.

[0013] According to the inductor component of the second embodiment, the first via portion has an inverted trapezoidal shape in a cross-sectional view including the first and third directions, which improves seed adhesion. Furthermore, since the magnetic layer has a trapezoidal shape, it becomes easier to maintain the distance between the magnetic layer and the first via portion, and insulation can be easily ensured.

[0014] The inductor component of the third embodiment is an inductor component of the first or second embodiment, The second end of the first via portion has a smaller inclination angle with respect to the first direction than the first end of the magnetic layer.

[0015] According to the inductor component of the third embodiment, the first via portion becomes smaller, so the volume of the magnetic layer can be increased.

[0016] The inductor component of the fourth embodiment is an inductor component of the first or second embodiment, The second end of the first via portion has a greater inclination angle with respect to the first direction than the first end of the magnetic layer.

[0017] According to the inductor component of the fourth embodiment, if the first via portion has an inverted trapezoidal shape, the seeding can be made more efficient. When the first via portion has a trapezoidal shape, the first via portion acts as an anchor, which can increase the adhesion strength between the first via portion and the first inductor wiring.

[0018] The inductor component of the fifth embodiment is an inductor component of any of the first to fourth embodiments, The thickness of the magnetic layer in the first direction is 1 μm or more and 10 μm or less.

[0019] According to the inductor component of the fifth embodiment, the thickness of the inductor component can be reduced.

[0020] The inductor component of the sixth embodiment is an inductor component of any of the first to fifth embodiments, The first inductor wiring and the second inductor wiring have both ends in the third direction inclined with respect to the first direction. The absolute values ​​of the inclination angles with respect to the first direction at the first end of the magnetic layer and the second end of the first via are greater than the absolute values ​​of the inclination angles with respect to the first direction at both ends of the first inductor wiring and the second inductor wiring in the second direction.

[0021] According to the inductor component of the sixth embodiment, the occupancy rate per unit area of ​​the first inductor wiring and the second inductor wiring can be increased, thereby reducing the DC resistance of the inductor component.

[0022] The inductor component of the seventh embodiment is an inductor component of any of the first to sixth embodiments, With respect to the first inductor wiring or the second inductor wiring, an external terminal located on the opposite side of the magnetic layer in the first direction, A second via section that electrically connects the first inductor wiring or the second inductor wiring to the external terminal. Equipped with, Each of the first via section and the second via section has both ends in the third direction inclined with respect to the first direction. The inclination angles of the first via portion in the third direction and the inclination angles of the second via portion in the third direction are different with respect to the first direction.

[0023] According to the seventh embodiment of the inductor component, the design freedom of the inductor component can be increased. For example, if the first via portion has an inverted trapezoidal shape and the second via portion has a trapezoidal shape, the first via portion and the second via portion can be easily via-filled. Also, for example, if the second via portion has an inverted trapezoidal shape, the contact with the external terminal can be strengthened.

[0024] The inductor component of the eighth embodiment is an inductor component of the second embodiment, Each of the first inductor wiring and the second inductor wiring has a convex shape that protrudes in the direction from the first inductor wiring toward the second inductor wiring.

[0025] According to the inductor component of the eighth embodiment, the insulating layer covering the first inductor wiring and the second inductor wiring can be easily filled.

[0026] The inductor component of the ninth embodiment is an inductor component of any of the first to eighth embodiments, It comprises multiple inductor elements.

[0027] According to the inductor component of the ninth embodiment, the mounting area of ​​the inductor component can be reduced by providing multiple inductor elements in a single inductor component.

[0028] The inductor component of the 10th embodiment is an inductor component of any of the 1st to 9th embodiments, The absolute value of the angle between the difficult or easy axis of the magnetic layer and the pivot axis is 0 degrees or greater and less than 10 degrees.

[0029] According to the inductor component of the tenth embodiment, since most of the magnetic flux is directed toward the anisotropic axis, the efficiency of inductance acquisition can be improved and the DC superposition characteristics can be improved. Furthermore, since the first inductor wiring extending along the virtual plane, the second inductor wiring, and the first via section constitute part of the inductor, the inductor component can be easily miniaturized (for example, made into a thin film).

[0030] The inductor component of the 11th embodiment is an inductor component of any of the first to tenth embodiments, The magnetic layer is provided along a first virtual plane intersecting the first direction, The first inductor wiring is positioned at a distance from the first virtual plane in the first direction and is provided along a second virtual plane parallel to the first virtual plane. The roughness of the planar portion located on the first virtual plane of the magnetic layer is 3 nm or more and 10 nm or less.

[0031] According to the inductor component of the 11th embodiment, it is possible to improve the efficiency of inductance acquisition while ensuring adhesion of the magnetic layer. For example, if the roughness of the planar portion of the magnetic layer is less than 3 nm, the contact area of ​​the magnetic layer becomes small, and its adhesion decreases. If the roughness of the planar portion of the magnetic layer is greater than 10 nm, the crystal structure of the magnetic material contained in the magnetic layer is randomly arranged, the uniaxial magnetic anisotropy of the magnetic layer is disrupted, and it may not be possible to improve the efficiency of inductance acquisition.

[0032] The embodiments of this disclosure will be described below with reference to the drawings. The following description is not limiting to this disclosure and is essentially illustrative, and may be modified as appropriate without departing from the spirit of this disclosure. The drawings are schematic, and the proportions of the dimensions, etc., do not necessarily correspond to those of reality.

[0033] An inductor component 1 according to one aspect of the present disclosure includes an inductor element 10, as shown in Figure 1. The inductor element 10 includes a magnetic layer 20, a first inductor wiring 30, a second inductor wiring 40, and a first via portion 50 (see Figures 2 and 4).

[0034] As shown in Figures 1 to 4, in this embodiment, the inductor component 1 further comprises a base body 2, a second via portion 60, an external terminal 70, and pad portions 81 and 82. The inductor element 10, the second via portion 60, and the pad portions 81 and 82 are located inside the base body 2, while the external terminal 70 is located outside the base body 2. The pad portions 81 and 82 may constitute part of the first inductor wiring 30 and the second inductor wiring 40, or they may have a different configuration from the first inductor wiring 30 and the second inductor wiring 40.

[0035] As an example, the base body 2 has a roughly rectangular parallelepiped shape. The height direction of the base body 2 is defined as the first direction (e.g., the Z direction), the short side of the base body 2 when viewed along the first direction Z is defined as the second direction (e.g., the Y direction), and the long side of the base body 2 when viewed along the first direction Z is defined as the third direction (e.g., the X direction). As shown in Figures 2 and 3, the base body 2 includes a first principal surface 201 and a second principal surface 202 located at both ends of the first direction Z, respectively.

[0036] Body 2 includes four insulating layers 210, 220, 230, and 240 stacked sequentially along a first direction Z. Insulating layer 220 is an example of a first insulating layer and covers the first inductor wiring 30 and the pad portion 81. Insulating layer 230 covers the magnetic layer 20. Insulating layer 240 covers the second inductor wiring 40 and the pad portion 82. The first main surface 201 is composed of the outer surface of insulating layer 240 in the first direction Z, and the second main surface 202 is composed of the outer surface of insulating layer 210 in the first direction Z. Insulating layer 210 is an example of a second insulating layer that is located further from the magnetic layer 20 in the first direction Z than insulating layer 220 and has a smaller coefficient of thermal expansion than insulating layer 220.

[0037] Each of the insulating layers 210, 220, 230, and 240 contains epoxy, polyimide, phenol, or a combination thereof. Insulating layer 210 may contain insulating fillers or inorganic insulators such as SiO2 and TaO. The magnetic layer 20 has a thickness, for example, a dimension in the first direction Z of 1 μm or more and 10 μm or less.

[0038] The inductor element 10 includes, as an example, three first inductor wirings 30, two second inductor wirings 40, and six first via sections 50. The first inductor wirings 30, the second inductor wirings 40, and the first via sections 50 constitute at least a part of a so-called helical-shaped inductor (coil) that revolves around a pivot axis AX extending along the second direction Y. A helical shape refers to a shape in which the total number of turns of the coil is greater than one turn, but the number of turns of the coil in a cross-section perpendicular to the pivot axis AX is less than one turn. One turn or more means that in a cross-section perpendicular to the pivot axis AX, the wiring of the coil has radially adjacent parts. Less than one turn means that in a cross-section perpendicular to the pivot axis AX, the wiring of the coil does not have radially adjacent parts.

[0039] The magnetic layer 20 has uniaxial magnetic anisotropy. In this embodiment, the magnetic layer 20 has a rectangular shape when viewed along the first direction Z and is located inside the outer shape of the inductor component 1. "Rectangular shape" includes "approximately rectangular shape". The outer shape of the inductor component 1 is, for example, the outer shape of the base body 2. Eight pad portions 81 and 82 are located on both sides of the magnetic layer 20 in its longitudinal direction. The pad portions 81 are located on the same side of the magnetic layer 20 as the first inductor wiring 30, and the pad portions 82 are located on the same side of the magnetic layer 20 as the second inductor wiring 40.

[0040] As shown in Figure 4, the magnetic layer 20 has a first end portion 25 that faces the first via portion 50 in the third direction X. The first end portion 25 is inclined in the same direction as the second end portion 51 of the first via portion 50 that faces the magnetic layer 20 in the third direction X, with respect to the first direction Z. In this embodiment, the first end portion 25 is inclined to approach the first via portion 50 as it moves along the first direction Z from the second inductor wiring 40 toward the first inductor wiring 30. "Inclined in the same direction" means, for example, that in a cross-sectional view including the first direction Z and the third direction X, the angle θ0 formed by the extension line of the first end portion 25 and the extension line of the second end portion 51 is in the range of 0 degrees or more and less than 45 degrees.

[0041] The magnetic layer 20 may be inclined at only one end in the third direction X, or at both ends in the third direction X. Assume that both ends of the magnetic layer 20 in the third direction X are inclined (i.e., the magnetic layer 20 has first ends 25 at each end in the third direction X). In this case, in a cross-sectional view including the first direction Z and the third direction X, the magnetic layer 20 has a trapezoidal shape, where the end closer to the first inductor wiring 30 is the longer side and the end closer to the second inductor wiring 40 is the shorter side.

[0042] An example of the BH curve of the magnetic layer 20 is shown in Figure 5. In Figure 5, the easy axis is shown by a solid line and the difficult axis is shown by a dashed line. As a method for measuring the difficult axis and easy axis of uniaxial magnetic anisotropy, for example, one method is to measure the BH curve of the magnetic layer 20 using a VSM (vibrating sample magnetometer). In this method, the BH curve is measured with the sample rotated 90 degrees, and the side where the BH curve is steeper is taken as the easy axis, and the side where it is flatter is taken as the difficult axis. To exclude the effect of shape anisotropy, an O-shaped or square-shaped sample is preferred, but other samples can also be used.

[0043] In this embodiment, the magnetic layer 20 is configured such that the absolute value of the angle θ (see Figure 1) between the hard axis or easy axis and the pivot axis AX is 0 degrees or greater and less than 10 degrees (for example, the hard axis or easy axis and the pivot axis AX are approximately parallel). For example, suppose the easy axis extends along the short direction of the magnetic layer 20 (i.e., the second direction Y), and the hard axis extends along the long direction of the magnetic layer 20 (i.e., the third direction X). In this case, the absolute value of the angle between the easy axis and the pivot axis AX of the magnetic layer 20 is 0 degrees or greater and less than 10 degrees. For example, suppose the easy axis extends along the long direction of the magnetic layer 20 (i.e., the third direction X), and the hard axis extends along the short direction of the magnetic layer 20 (i.e., the second direction Y). In this case, the absolute value of the angle between the hard axis and the pivot axis AX of the magnetic layer 20 is 0 degrees or greater and less than 10 degrees.

[0044] As shown in Figure 3, the magnetic layer 20 is configured such that its thickness T0, which is the dimension in the first direction Z, is smaller than the thickness T1 of the first inductor wiring 30 and the thickness T2 of the second inductor wiring 40.

[0045] The first inductor wiring 30 is located on one side of the magnetic layer 20 in the first direction Z and extends along a virtual plane P that intersects the first direction Z. The second inductor wiring 40 is located on the other side of the magnetic layer 20 in the first direction Z. In this embodiment, the virtual plane P is located at the boundary between the insulating layers 210 and 220 of the element 2.

[0046] As shown in Figure 1, the first inductor wiring 30 connects one of the four pad portions 81 located on one side of the magnetic layer 20 in the third direction X, when viewed in the first direction Z and in the direction from the second inductor wiring 40 toward the first inductor wiring 30, to one of the four pad portions 81 located on the other side of the magnetic layer 20 in the third direction X. The first inductor wiring 30 connects two pad portions 81 at different positions in the second direction Y and is inclined with respect to the pivot axis AX. The three first inductor wirings 30 extend substantially parallel to each other.

[0047] As shown in Figure 1, the second inductor wiring 40 connects one of the four pad portions 82 located on one side of the magnetic layer 20 in the third direction X, and 21 of the four pad portions 82 located on the other side of the magnetic layer 20 in the third direction X, when viewed in the first direction Z and in the direction from the second inductor wiring 40 toward the first inductor wiring 30. The second inductor wiring 40 connects two pad portions 82 that are in substantially the same position in the second direction Y and is substantially perpendicular to the pivot axis AX. The two second inductor wirings 40 extend substantially parallel to each other.

[0048] The first inductor wiring 30 and the second inductor wiring 40 include, for example, good conductive materials such as copper, silver, gold, or alloys thereof. The first inductor wiring 30 and the second inductor wiring 40 may be metal films formed by, for example, plating, vapor deposition, sputtering, or metal sintered bodies formed by applying and sintering a conductive paste. The first inductor wiring 30 and the second inductor wiring 40 may have a multilayer structure in which multiple metal layers are stacked. The first inductor wiring 30 and the second inductor wiring 40 are configured so as not to be thicker than the thickness of the magnetic layer 20. By configuring them in this way, inductor components with low DC resistance and high inductance acquisition efficiency can be realized.

[0049] The first via section 50 electrically connects the first inductor wiring 30 and the second inductor wiring 40. In this embodiment, as shown in Figure 2, the first via section 50 extends along the first direction Z and connects a pair of pad sections 81 and 82 that are located at approximately the same position in the first direction Z. The first via section 50 has a seed layer at one end of its length in the first direction Z that is closer to the first inductor wiring 30 (for example, the boundary portion 52 with the pad section 81).

[0050] As shown in Figure 4, the first via portion 50 has a second end portion 51 that faces the magnetic layer 20 in the third direction X. In this embodiment, the second end portion 51 is inclined to move away from the magnetic layer 20 as it moves along the first direction Z from the second inductor wiring 40 toward the first inductor wiring 30.

[0051] The first via portion 50 may be inclined at only one end in the third direction X, or at both ends in the third direction X. Let's assume that both ends of the first via portion 50 in the third direction X are inclined (that is, the first via portion 50 has second ends 51 at each end in the third direction X). In this case, in a cross-sectional view including the first direction Z and the third direction X, the first via portion 50 has a trapezoidal shape (in other words, an inverted trapezoidal shape) with the positions of the long and short sides reversed from those of the magnetic layer 20.

[0052] For example, if the inclination angle of the second end 51 of the first via portion 50 with respect to the first direction Z is smaller than that of the first end 25 of the magnetic layer 20, the first via portion 50 can be made smaller, and thus the volume of the magnetic layer 20 can be increased. If the inclination angle of the second end 51 of the first via portion 50 with respect to the first direction Z is larger than that of the first end 25 of the magnetic layer 20, and the first via portion 50 has an inverted trapezoidal shape, the seed coverage can be improved. If the inclination angle of the second end 51 of the first via portion 50 with respect to the first direction Z is larger than that of the first end 25 of the magnetic layer 20, and the first via portion 50 has a trapezoidal shape, the first via portion 50 acts as an anchor, thereby increasing the adhesion strength between the first via portion 50 and the first inductor wiring 30 and the second inductor wiring 40. As an example, the inclination angle with respect to the first direction Z is defined as the angle with respect to a virtual straight line extending in the first direction Z.

[0053] The second via section 60 electrically connects at least one of the first inductor wiring 30 and the second inductor wiring 40 to the external terminal 70. In this embodiment, as shown in Figure 2, the second via section 60 extends along the first direction Z and connects the pad sections 82 located at both ends in the second direction Y to the external terminal 70. Through this connection, the second inductor wiring 40 and the external terminal 70 are electrically connected.

[0054] The external terminals 70 are located on the first main surface 201 of the base body 2. In this embodiment, the inductor component 1 comprises two external terminals 70. Each external terminal 70 has a base layer and a plating layer covering the base layer, and is arranged to cover four pad portions 82 located on the same side in the third direction X relative to the magnetic layer 20 when viewed along the first direction Z. As shown in Figure 2, each external terminal 70 has four recesses 73 corresponding to the four pad portions 82. Each recess 73 is provided in a position that overlaps with the pad portions 82 when viewed along the first direction Z, and is recessed toward the magnetic layer 20.

[0055] The underlayers of the first via section 50, the second via section 60, and the external terminal 70 include, for example, a conductive material such as Ni or Sn. The first via section 50 and the second via section 60 may be composed of a single layer of conductive material or of multiple layers of conductive material. The external terminal 70 may be composed of a single layer of conductive material.

[0056] As shown in Figure 1, each component constituting the inductor component 1 is arranged symmetrically with respect to the center point CP of the element 2 located on the pivot axis AX when viewed along the first direction Z.

[0057] An example of a manufacturing method for the inductor component 1 will be described with reference to Figures 2, 3, and 6-17. Figures 6, 8, 12, 14, and 16 are drawings corresponding to cross-sections along the line X1-X2 in Figure 1, and Figures 7, 9-11, 13, 15, and 17 are drawings corresponding to cross-sections along the line Y1-Y2 in Figure 1.

[0058] As shown in Figures 6 and 7, an insulating layer 210 is formed on a substrate 1000, and a first inductor wiring 30 and a pad portion 81 are formed on the insulating layer 210 to form a first laminate 1001. As the substrate 1000, for example, a substrate with high insulating properties and capable of suppressing eddy currents (for example, a semiconductor substrate, a glass substrate, an organic resin substrate, or a ceramic) is used. The insulating layer 210 is formed, for example, by a process of coating an organic resin onto the substrate 1000 and curing it. The first inductor wiring 30 and the pad portion 81 are formed, for example, by seed formation (sputter Ti / Cu), resist coating, development, exposure, electroplating, resist stripping, and seed etching.

[0059] As shown in Figures 8 and 9, a second laminate 1002 is formed by forming an insulating layer 220 on the insulating layer 210 of the formed first laminate 1001, covering the first inductor wiring 30 and the pad portion 81. The insulating layer 220 is formed, for example, by a process of applying an organic resin onto the insulating layer 210 and curing it.

[0060] As shown in Figure 10, a magnetic layer 20 is formed on the insulating layer 220 of the formed second laminate 1002 to form a third laminate 1003. As shown in Figure 11, the magnetic layer 20 includes a plurality of inorganic insulating layers 21 and a plurality of inorganic magnetic layers 22 that are alternately stacked along the first direction Z. The magnetic layer 20 is formed, for example, by a process of repeatedly sputtering insulation and sputtering magnetization. By depositing the magnetic layer 20 by sputtering in a magnetic field, the atomic arrangement is positioned in the desired location and the direction of the applied magnetic field becomes the axial direction. After forming the magnetic layer 20, the magnetic layer 20 can be formed in the desired location by going through resist coating, exposure, development, etching and resist peeling.

[0061] For example, if the etch rates of the inorganic insulating layer 21 and the inorganic magnetic layer 22 are different, the first end 25 of the magnetic layer 20 may have a stepped shape. In this case, for example, a virtual straight line connecting the edges of the inorganic magnetic layer 22 is calculated using the least squares method. The calculated virtual straight line is considered as the first end 25, and the inclination angle of the first end 25 with respect to the first direction Z is calculated.

[0062] As shown in Figures 12 and 13, an insulating layer 230 is formed on the insulating layer 220 of the formed third laminate 1003, and via openings 501 are formed in the insulating layer 230 to form the fourth laminate 1004. The insulating layer 230 is formed, for example, by a process of applying an organic resin to the insulating layer 220 and curing it. The via openings 501 are formed, for example, using a laser, penetrating the insulating layer 230 along the first direction Z and extending to the insulating layer 220, so that the pad portion 81 is exposed from the bottom surface.

[0063] As shown in Figures 14 and 15, a first via portion 50 is formed in the via opening 501 of the formed fourth laminate 1004, a pad portion 82 is formed on the first via portion 50 and on the insulating layer 230, and a second inductor wiring 40 is formed on the insulating layer 230 to form the fifth laminate 1005. The second inductor wiring 40 and the pad portion 82 are formed, for example, by seed formation (sputter Ti / Cu), resist coating, development, exposure, electroplating, resist stripping, and seed etching.

[0064] As shown in Figures 16 and 17, an insulating layer 240 covering the second inductor wiring 40 and pad portion 82 is formed on the insulating layer 230 of the formed fifth laminate 1005, via openings 601 are formed in the insulating layer 240, and external terminals 70 are formed to form the sixth laminate 1006. The insulating layer 240 is formed, for example, by a process of applying an organic resin on the insulating layer 230 and curing it. The via openings 601 are formed, for example, using a laser, extending along the first direction Z, so that the pad portion 82 is exposed from the bottom surface. The external terminals 70 are formed, for example, by electroless Ni / Au plating. By performing Cu filled plating before electroless Ni / Au plating, external terminals 70 without recesses 73 can be formed.

[0065] The inductor component 1 shown in Figures 2 and 3 is manufactured by removing the substrate 1000 from the formed sixth laminate 1006 and separating it into individual pieces. The substrate 1000 is removed, for example, by polishing or peeling. As described above, in this embodiment, the first inductor wiring 30 and the second inductor wiring 40 are laminated in that order. The lamination order of the first inductor wiring 30 and the second inductor wiring 40 can be determined by the direction of the seed, or by the shape of the first inductor wiring 30 and the second inductor wiring 40.

[0066] Referring to Figures 18 and 19, an example of a method for forming a magnetic layer 20 having first end portions 25 at both ends in the third direction X will be described.

[0067] As shown in Figure 18, a forward-tapered resist 310 is formed on the magnetic layer 20 of the third laminate 1003. A forward-tapered shape means a shape that tapers towards the second inductor wiring 40 from the first inductor wiring 30 along the first direction Z. When the resist 310 and the magnetic layer 20 are etched by dry etching, the resist 310 recedes while the magnetic layer 20 is etched in the direction indicated by the arrow in Figure 18, forming a trapezoidal magnetic layer 20 as shown in Figure 19.

[0068] Inductor component 1 can provide the following effects:

[0069] The inductor component 1 comprises at least one inductor element 10. The inductor element 10 includes a magnetic layer 20 having uniaxial magnetic anisotropy, a first inductor wiring 30, a second inductor wiring 40, and a first via portion 50. The first inductor wiring 30 is located on one side of the magnetic layer 20 in a first direction and extends along a virtual plane intersecting the first direction. The second inductor wiring 40 is located on the other side of the magnetic layer 20 in the first direction. The first via portion 50 electrically connects the first inductor wiring 30 and the second inductor wiring 40. The first inductor wiring 30, the second inductor wiring 40, and the first via portion 50 constitute at least a part of an inductor that pivots around a pivot axis AX extending along a second direction intersecting the first direction. The first via portion 50 is located outside the magnetic layer 20 in a third direction intersecting the first and second directions. The magnetic layer 20 has a first end portion 25 facing the first via portion 50 in the third direction. The first via portion 50 has a second end portion 51 that faces the magnetic layer 20 in the third direction. The first end portion 25 and the second end portion 51 are inclined in the same direction with respect to the first direction. With this configuration, the first end portion 25 of the magnetic layer 20 and the second end portion 51 of the first via portion 50 can be brought closer together, so the inductor can be miniaturized. This makes it possible to realize a miniaturized inductor component 1. In addition, by bringing the first end portion 25 of the magnetic layer 20 and the second end portion 51 of the first via portion 50 closer together, the volume of the magnetic layer 20 can be increased. This makes it possible to improve the efficiency of inductance acquisition.

[0070] The first via portion 50 has a seed layer at the end closest to the first inductor wiring 30, among the two ends in the first direction. In a cross-sectional view including the first and third directions, the magnetic layer 20 has a trapezoidal shape, with the end closest to the first inductor wiring 30 being the longer side and the end closest to the second inductor wiring 40 being the shorter side, while the first via portion 50 has a trapezoidal shape (inverted trapezoidal shape) with the positions of the long and short sides reversed compared to the magnetic layer 20. With this configuration, the inverted trapezoidal shape of the first via portion 50 improves seed coverage. Also, because the magnetic layer 20 has a trapezoidal shape, it becomes easier to maintain the distance between the magnetic layer 20 and the first via portion 50, and insulation can be easily ensured.

[0071] The second end 51 of the first via portion 50 has a smaller inclination angle with respect to the first direction than the first end 25 of the magnetic layer 20. With this configuration, the first via portion 50 is made smaller, so the volume of the magnetic layer 20 can be increased.

[0072] The second end 51 of the first via portion 50 has a greater inclination angle with respect to the first direction than the first end 25 of the magnetic layer 20. With this configuration, for example, if the first via portion 50 has an inverted trapezoidal shape, the seed can be wrapped around it more effectively. Also, for example, if the first via portion 50 has a trapezoidal shape, the first via portion 50 acts as an anchor, which can increase the adhesion strength between the first via portion 50 and the first inductor wiring 30.

[0073] The thickness of the magnetic layer, which is the dimension in the first direction, is 1 μm or more and 10 μm or less. With this configuration, the thickness of the inductor component 1 can be reduced.

[0074] The absolute value of the angle θ between the difficult or easy axis of the magnetic layer 20 and the pivot axis AX is greater than or equal to zero degrees and less than 10 degrees. With this configuration, the majority of the magnetic flux is directed toward the anisotropic axis, which improves the efficiency of inductance acquisition and improves the DC superposition characteristics. Furthermore, since the first inductor wiring 30 extending along the virtual plane P, the second inductor wiring 40 and the first via section 50 constitute part of the inductor, the inductor component 1 can be easily miniaturized (for example, made into a thin film).

[0075] Inductor component 1 can also be configured as follows:

[0076] The magnetic layer 20 is not limited to having a first end portion 25 that is inclined to approach the first via portion 50 as it moves along the first direction Z from the second inductor wiring 40 to the first inductor wiring 30. For example, as shown in Figure 20, the first end portion 25 may be inclined to move away from the first via portion 50 as it moves along the first direction Z from the second inductor wiring 40 to the first inductor wiring 30.

[0077] Figure 20 shows an example of an inverted trapezoidal magnetic layer 20 having first end portions 25 at both ends in the third direction X (an example of a method for forming an inductor component 1 in which the direction of inclination of the first end portions 25 in the magnetic layer 20 is reversed compared to Figure 1). The magnetic layer 20 in Figure 20 is formed, for example, as follows. As shown in Figure 21, a resist 320 having a substantially rectangular cross-sectional shape is formed on the magnetic layer 20 of the third laminate 1003. When the resist 320 and the magnetic layer 20 are etched by wet etching, the magnetic layer 20 is etched diagonally (indicated by arrows in Figure 21) from the part where liquid replacement is easy, and the inverted trapezoidal magnetic layer 20 shown in Figure 20 is formed.

[0078] As shown in Figure 22, both ends of the first inductor wiring 30 and the second inductor wiring 40 in the third direction Z may be inclined with respect to the first direction Z. The inclination angles of both ends of the first inductor wiring 30 in the third direction Z with respect to the first direction Z and the inclination angles of both ends of the second inductor wiring 40 in the third direction Z with respect to the first direction Z may be the same or different. In the inductor component 1 of Figure 22, the pad portion 81 constitutes part of the first inductor wiring 30, and the pad portion 82 constitutes part of the second inductor wiring 40. In a cross-sectional view including the first direction Z and the third direction Z, the first inductor wiring 30 and the second inductor wiring 40 may be trapezoidal or inverted trapezoidal. In this case, by configuring the first inductor wiring 30 and the second inductor wiring 40 so that the absolute values ​​of the inclination angles with respect to the first direction Z at the first end 25 of the magnetic layer 20 and the second end 51 of the first via portion 50 are greater than the absolute values ​​of the inclination angles with respect to the first direction Z at the first inductor wiring 30 and the second inductor wiring 40, the occupancy rate per unit area of ​​the first inductor wiring 30 and the second inductor wiring 40 can be increased. As a result, the DC resistance of the inductor component 1 can be reduced.

[0079] In the inductor component 1 shown in Figure 22, each of the first inductor wiring 30 and the second inductor wiring 40 has a convex shape that protrudes in the direction from the first inductor wiring 30 toward the second inductor wiring 40. In the inductor component 1 shown in Figure 22, the first via portion 50 has a seed layer at the end of the first direction Z that is closer to the first inductor wiring 30 (for example, the boundary portion 52 with the pad portion 81). With this configuration, insulating layers 220 and 240 covering the first inductor wiring 30 and the second inductor wiring 40 can be easily filled.

[0080] As shown in Figure 23, the first via section 50 and the second via section 60 may each have ends inclined with respect to the first direction Z in the third direction X. Figure 23 is a drawing corresponding to a cross-section along the line E1-E2 in Figure 1. In Figure 23, the inclination angle of the first via section 50 with respect to the first direction Z is shown by θ1, and the inclination angle of the second via section 60 with respect to the first direction Z is shown by θ2. In this case, the inclination angles θ1 and θ2 are different from each other. In other words, the inclination angles with respect to the first direction Z are different at both ends of the first via section 50 in the third direction Z and at both ends of the second via section 60 in the third direction Z (for the first via section 50, one end in the third direction Z is shown in Figure 23). By configuring in this way, the design freedom of the inductor component 1 can be increased. For example, as shown in Figure 23, if the first via section 50 has an inverted trapezoidal shape and the second via section 60 has a trapezoidal shape, the first via section 50 and the second via section 60 can be easily via-filled. Furthermore, for example, if the second via portion 60 has an inverted trapezoidal shape (see Figure 2), the contact with the external terminal 70 can be strengthened.

[0081] As shown in Figures 24 to 26, the inductor component 1 may include a first via portion 50 that overlaps with the magnetic layer 20 at least in part when viewed along the pivot axis AX. In this case, the magnetic flux can be blocked by the first via portion 50, thereby preventing noise leakage to the surroundings of the inductor component 1. As shown in Figure 25, the portion surrounded by the first inductor wiring 30, the second inductor wiring 40, and the first via portion 50 constitutes the core portion 3.

[0082] In the inductor component 1 shown in Figures 24 to 26, when viewed along the first direction Z, one of the two external terminals 70 covers two pad portions 82 located at one end of the second direction Y, and the other of the two external terminals 70 covers two pad portions 82 located at the other end of the second direction Y. The pad portions 81 and 82 located at both ends of the second direction Y have portions 811 and 821 that extend along the third direction X, as shown in Figure 26. The first via portion 50 connecting the pad portions 81 and 82 located at both ends of the second direction Y is configured to connect portions 811 and 821. As shown in Figures 25 and 26, portions 811 and 821 are configured to overlap at least half of the magnetic layer 20 when viewed along the pivot axis AX. In the inductor component 1 shown in Figures 24 to 26, when viewed along the pivot axis AX, at least half of the magnetic layer 20 overlaps with the first via portion 50, thus more reliably preventing noise leakage to the surroundings of the inductor component 1. In the inductor component 1 shown in Figures 24 to 26, no recess 73 is formed on the external terminal 70.

[0083] As shown in Figures 27 and 28, the inductor component 1 may include a first via portion 50 that penetrates the magnetic layer 20 along a first direction Z. That is, the magnetic layer 20 may have through holes 23 capable of accommodating the first via portion 50. In this case, the magnetic layer 20 can be made as large as possible along the virtual plane P, thereby increasing the efficiency of inductance acquisition of the inductor component 1 while suppressing leakage flux. In the inductor component 1 of Figures 27 and 28, the magnetic layer 20 has a plurality of through holes 23 corresponding to each of the first via portions 50. Each through hole 23 is configured to accommodate the first via portion 50 while forming a gap between itself and the first via portion 50. The shape of each through hole 23 is not limited to a rectangular shape; it may be circular or any other polygonal shape.

[0084] The inductor component 1 in Figures 27 and 28 is mounted on a substrate 4. That is, the substrate 4 is connected via an insulating layer 210. The substrate 4 includes, for example, a high-resistance silicon substrate, a glass substrate, and a ceramic substrate. Terminals 90 that can be electrically connected to an external circuit are formed inside the substrate 4. The inductor component 1 in Figures 27 and 28 has a vertical wiring 61 that penetrates the insulating layer 210 along a first direction Z and connects one pad portion 81 and the terminal 90. That is, the inductor component 1 in Figures 27 and 28 is configured to be electrically connectable to an external circuit via the vertical wiring 61 and the terminal 90. The vertical wiring 61 increases the degree of freedom in the mounting location of the inductor component 1.

[0085] As shown in Figure 29, the inductor component 1 may include a base body 2 having different surface roughnesses on the first main surface 201 and the second main surface 202. In this case, the adhesion to the molding material can be improved by resin molding on the main surface with the greater surface roughness. In the inductor component 1 of Figure 29, the external terminal 70 is located on the first main surface 201, and the base body 2 has a recess 203 that is recessed in the first direction Z from the first main surface 201 toward the magnetic layer 20. In the inductor component 1 of Figure 29, the base body 2 has two recesses 203, but it may have one recess 203 or three or more recesses 203. As an example, the base body 2 is configured so that the first main surface 201 is located closer to the magnetic layer 20 than the external terminal 70. In the inductor component 1 of Figure 29, the external terminal 70 is located furthest from the magnetic layer 20, so the inductor component 1 can be easily mounted on a substrate 4 or the like.

[0086] As shown in Figures 30 to 32, the inductor component 1 may have an external terminal 70 that includes a first external terminal 71 and a second external terminal 72, which is a dummy terminal not electrically connected to either the first inductor wiring 30 or the second inductor wiring 40. The first external terminal 71 is electrically connected to at least one of the first inductor wiring 30 or the second inductor wiring 40. In the inductor component 1 of Figure 30, the magnetic layer 20 is positioned such that the second direction Y is the longitudinal direction and the third direction X is the short direction. Two first external terminals 71 and two second external terminals 72 are provided on each side of the pivot axis AX. In the third direction X, one first external terminal 71 and one second external terminal 72 face each other. In the inductor component 1 of Figure 30, the second external terminal 72 includes three terminals 721 having the same shape as the first external terminal 71 and one terminal 722 having a different shape from the first external terminal 71. Terminal 722 is configured to be used as a "direction mark" to indicate the mounting direction of the inductor component 1. This configuration improves the mounting strength of the inductor component 1. Furthermore, by making the shape of the second external terminal 72 different from that of the first external terminal 71, the mounting direction of the inductor component 1 can be easily identified.

[0087] The inductor component 1 shown in Figures 30 to 32 comprises multiple inductor elements 10. As an example, the inductor component 1 shown in Figures 30 to 32 comprises two inductor elements 10. Each inductor element 10 constitutes at least a part of each of the two inductors L1 and L2. In the inductor component 1 shown in Figures 30 to 32, a pair of terminals 711 of the first external terminal 71 are located at both ends of inductor L1, and a pair of terminals 712 are located at both ends of inductor L2. By providing multiple inductor elements 10 in a single inductor component 1 in this way, the mounting area of ​​the inductor component 1 can be reduced.

[0088] The spacing between the first inductor wiring 30 or the second inductor wiring 40 of adjacent inductor elements 10 may differ along the first inductor wiring or the second inductor wiring 40. This configuration improves the design flexibility regarding the lead-out position of the external terminal 70. It also allows for adjustment of the coupling coefficient. For example, in the inductor component 1 shown in Figures 30 to 32, the spacing between the second inductor wiring 40 of adjacent inductor elements 10 located at both ends in the second direction Y differs along the direction in which the second inductor wiring 40 extends (e.g., the third direction X). In other words, two adjacent second inductor wirings 40 are non-parallel to each other. The external terminal 70 of the inductor component 1 shown in Figures 30 to 32 is positioned asymmetrically with respect to the center point CP of the element 2 when viewed along the first direction Z.

[0089] As shown in Figures 33 to 36, the inductor component 1 may have 2N (where N is a natural number) inductor elements 10. In the inductor component 1 of Figures 33 to 36, the inductor component 1 has 4 inductor elements 10. Each inductor element 10 constitutes at least a part of each of the 4 inductors L1 to L4. In the inductor component 1 of Figures 33 to 36, of the first external terminals 71, a pair of terminals 711 are located at both ends of inductor L1, a pair of terminals 712 are located at both ends of inductor L2, a pair of terminals 713 are located at both ends of inductor L3, and a pair of terminals 714 are located at both ends of inductor L4. In the inductor component 1 of Figures 33 to 36, inductors L1 and L2 pivot around pivot axis AX1, and inductors L3 and L4 pivot around pivot axis AX2. The pivot axes AX1 and AX2 extend parallel (including approximately parallel) with a gap between them in the third direction X. In this way, by arranging N (=2) inductors L1 and L2 around one pivot axis AX1 and N (=2) inductors L3 and L4 around the other pivot axis AX2, the symmetry of the inductor component 1 is ensured, and internal stress can be suppressed. For example, if two inductors are arranged around one pivot axis AX1 and only one inductor is arranged around the other pivot axis AX2, space in the magnetic layer 20 may be wasted. Therefore, by providing the inductor component 1 with 2N (N is a natural number) inductor elements 10, the space in the magnetic layer can be used effectively.

[0090] In the inductor component 1 shown in Figures 33 to 36, as an example, a magnetic layer 20 is provided in the center and includes a through hole 24 extending along the first direction Z. As shown in Figure 36, the through hole 24 is configured to accommodate two first via portions 50. The magnetic layer 20 as a whole has a ring shape, and each inductor L1, L2, L3, L4 revolves around pivot axes AX1, AX2 extending along the longitudinal direction of the magnetic layer 20 (for example, the second direction Y). This configuration makes it possible to realize an inductor component 1 with low leakage flux.

[0091] In the inductor component 1 shown in Figures 33 to 36, as an example, the coupling coefficient of the first inductor (e.g., inductors L1 and L2) is configured to be greater than the coupling coefficient of the second inductor (e.g., inductors L3 and L4). By strengthening the coupling, ripple can be suppressed, and by combining weakly coupled inductors to create a multi-phase design, the efficiency of the DC-DC converter can be improved.

[0092] The inductor component 1 only needs to have at least one inductor element 10.

[0093] The inductor component 1 is not limited to having an external terminal 70 located on the first main surface 201 of the base body 2, but may also have an external terminal 70 located on the second main surface 202 of the base body 2, or may have external terminals 70 located on both the first main surface 201 and the second main surface 202 of the base body 2.

[0094] The magnetic layer 20 is not limited to including an inorganic insulating layer 21 and an inorganic magnetic layer 22 laminated along a first direction. For example, the magnetic layer 20 may be composed of a composite material of resin and magnetic filler. In this case, the resin includes, for example, epoxy, polyimide, acrylic, phenol, and combinations thereof. The magnetic filler includes, for example, FeSiCr-based, FeNi-based, FeSi-based, pure Fe-based, and combinations thereof.

[0095] The magnetic layer 20 may be provided along a first virtual plane P1 (see Figure 3). The first virtual plane P1 is a plane (e.g., the XY plane) that extends in a direction intersecting the height direction of the element 2 (e.g., the first direction Z), and is located at the boundary between the insulating layer 220 and the insulating layer 230. In this case, the magnetic layer 20 has a planar portion 26 located on the first virtual plane P1. The planar portion 26 is configured to have a roughness of 3 nm or more and 10 nm or less. The first inductor wiring 30 is provided along a second virtual plane P2, as shown in Figure 3. The second virtual plane P2 is located at a distance from the first virtual plane P1 in the first direction Z and extends parallel to the first virtual plane P1. "Parallel" includes "approximately parallel". By configuring it in this way, the adhesion of the magnetic layer 20 can be ensured while improving the efficiency of inductance acquisition. For example, if the roughness of the planar portion 26 of the magnetic layer 20 is less than 3 nm, the contact area of ​​the magnetic layer 20 decreases, and its adhesion deteriorates. If the roughness of the planar portion 26 of the magnetic layer 20 is greater than 10 nm, the crystal structure of the magnetic material contained in the magnetic layer 20 becomes disorderly, disrupting the uniaxial magnetic anisotropy of the magnetic layer 20, and making it impossible to improve the efficiency of inductance acquisition.

[0096] "Roughness" refers to, for example, the arithmetic surface roughness Ra obtained in a 10 μm range of the flat portion 26. The arithmetic surface roughness Ra is obtained, for example, using a Keyence VK-X1000 laser microscope in accordance with JIS B 0601. If it is difficult to obtain the roughness from the vertical direction of the flat portion 26, the line roughness (LER) obtained from the vertical cross-section of the flat portion 26 may be used as the "roughness" of the flat portion 26.

[0097] This disclosure allows for the appropriate combination of any embodiment and / or variation from the various embodiments and variations described above. Combinations of embodiments and / or variations include combinations of configurations included in the embodiments and / or examples.

[0098] This disclosure is adequately described through the embodiments and / or modifications described herein with reference to the accompanying drawings, but the embodiments and / or modifications described herein are not exhaustive. Many modifications and variations are possible for those skilled in the art of this disclosure. Such modifications and variations should be understood to be included in this disclosure as long as they do not fall outside the scope of this disclosure. [Explanation of symbols]

[0099] 1. Inductor component 2. Base body 201 First Main Surface 202 Second Main Surface 203 Recess 210, 220, 230, 240 insulating layer 3. Core section 4 circuit boards 10 Inductor elements 20 Magnetic layer 21 Inorganic insulating layer 22 Inorganic magnetic layer 23 Through holes 23, 24 Through holes 25 First end 30 First Inductor Wiring 40. Wiring of the second inductor 50 1st Beer Club 51 Second end 52 Boundary part 60. Second Beer Club 61 Vertical wiring 70 External terminals 71 First external terminal Terminals 711, 712, 713, 714 72 Second external terminal Terminals 721 and 722 73 recess 81, 82 Pad section 811, 821 part 90 terminals 310, 320 Resist Via openings 501, 601 1000 circuit boards 1001 First Laminate 1002 Second Laminate 1003 Third layer 1004 4th layer 1005 Fifth layer 1006 Layer 6

Claims

1. It comprises at least one inductor element, The inductor element is A magnetic layer having uniaxial magnetic anisotropy, A first inductor wiring is located on one side of the magnetic layer in the first direction and extends along a virtual plane intersecting the first direction, A second inductor wiring located on the other side of the magnetic layer in the first direction, A first via section electrically connects the first inductor wiring and the second inductor wiring. Includes, The first inductor wiring, the second inductor wiring, and the first via portion constitute at least a part of an inductor that pivots around a pivot axis extending along a second direction intersecting the first direction. The first via portion is located on the outside of the magnetic layer in a third direction intersecting the first and second directions, The magnetic layer has a first end facing the first via portion in the third direction, The first via portion has a second end facing the magnetic layer in the third direction, An inductor component in which the first end and the second end are inclined in the same direction with respect to the first direction.

2. The first via portion has a seed layer at the end closest to the first inductor wiring, In a cross-sectional view including the first and third directions, the magnetic layer has a trapezoidal shape in which the end closer to the first inductor wiring is the longer side and the end closer to the second inductor wiring is the shorter side, and the first via portion has a trapezoidal shape with the positions of the longer and shorter sides reversed compared to the magnetic layer, as described in claim 1.

3. The inductor component according to claim 1 or 2, wherein the second end of the first via portion has a smaller inclination angle with respect to the first direction than the first end of the magnetic layer.

4. The inductor component according to claim 1 or 2, wherein the second end of the first via portion has a greater inclination angle with respect to the first direction than the first end of the magnetic layer.

5. The inductor component according to claim 1 or 2, wherein the thickness of the magnetic layer in the first direction is 1 μm or more and 10 μm or less.

6. The first inductor wiring and the second inductor wiring have both ends in the third direction inclined with respect to the first direction. The inductor component according to claim 1 or 2, wherein the absolute value of the inclination angle with respect to the first direction at the first end of the magnetic layer and the second end of the first via is greater than the absolute value of the inclination angle with respect to the first direction at both ends of the first inductor wiring and the second inductor wiring in the second direction.

7. With respect to the first inductor wiring or the second inductor wiring, an external terminal located on the opposite side of the magnetic layer in the first direction, A second via section that electrically connects the first inductor wiring or the second inductor wiring to the external terminal. Equipped with, Each of the first via portion and the second via portion has both ends in the third direction inclined with respect to the first direction. The inductor component according to claim 1 or 2, wherein the inclination angles of the first via portion in the third direction and the inclination angles of the second via portion in the third direction are different with respect to the first direction.

8. The inductor component according to claim 2, wherein each of the first inductor wiring and the second inductor wiring has a convex shape that protrudes in the direction toward the second inductor wiring from the first inductor wiring.

9. An inductor component according to claim 1 or 2, comprising a plurality of the inductor elements.

10. The inductor component according to claim 1 or 2, wherein the absolute value of the angle between the difficult or easy axis of the magnetic layer and the pivot axis is zero degrees or greater and less than 10 degrees.

11. The magnetic layer is provided along a first virtual plane that intersects the first direction, The first inductor wiring is positioned at a distance from the first virtual plane in the first direction and is provided along a second virtual plane parallel to the first virtual plane. The inductor component according to claim 1 or 2, wherein the roughness of the planar portion located on the first virtual plane of the magnetic layer is 3 nm or less and 10 nm or more.

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