Coil assembly

Abstract

A coil assembly includes a main body having one surface and another surface opposite to each other, a support substrate disposed inside the main body, a coil part disposed on at least one surface of the support substrate, an end portion of an outermost turn of the coil part disposed closer to the one surface of the main body than the another surface of the main body, a lead-out part connected to the outermost turn of the coil part and exposed to the one surface of the main body, and an anchor part connected to the lead-out part and including a via hole pad disposed between the lead-out part and the coil part inside the main body.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0083864, filed on July 8, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a coil assembly. Background Technology

[0003] An inductor (a type of coil assembly) is a typical passive electronic component used in electronic devices, along with resistors and capacitors.

[0004] As electronic devices achieve higher performance and become smaller, the number of electronic components used in these devices increases while miniaturizing.

[0005] In the case of a thin-film coil assembly, a main body is formed on a substrate on which the coil portion is formed by laminating and curing a magnetic composite sheet in an insulating resin, and an external electrode is formed on the surface of the main body. Summary of the Invention

[0006] One aspect of this disclosure is to improve the bonding strength between the main body and the coil portion.

[0007] Another aspect of this disclosure is to improve the bonding strength between the main body and the lead-out section.

[0008] Another aspect of this disclosure is increasing the number of turns in the coil section.

[0009] According to one aspect of this disclosure, a coil assembly includes: a body having one surface and another surface opposite to each other; a support substrate disposed inside the body; a coil portion disposed on at least one surface of the support substrate, the end of the outermost turn of the coil portion being configured to be closer to the one surface of the body than the other surface of the body; a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body; and an anchor portion connected to the lead-out portion and including a via pad disposed inside the body between the lead-out portion and the coil portion.

[0010] According to one aspect of this disclosure, a coil assembly includes: a body having one surface and another surface opposite to each other; a support substrate disposed inside the body; a coil portion disposed on the support substrate; a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body; and an anchor portion extending from the lead-out portion to a space between the coil portion, the lead-out portion, and a side surface of the body connecting the one surface and the other surface.

[0011] According to one aspect of this disclosure, a coil assembly includes: a body having one surface and another surface opposite to each other; a support substrate disposed inside the body; a coil portion disposed on the support substrate; a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body; and a conductive pattern comprising the same material as the lead-out portion, the conductive pattern extending from the lead-out portion to the space between the coil portion, the lead-out portion, and the side surface of the body connecting the one surface and the other surface. Attached Figure Description

[0012] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0013] Figure 1 This is a schematic perspective view of a coil assembly according to a first embodiment of the present disclosure.

[0014] Figure 2 This is a schematic perspective view of a coil assembly according to a first embodiment of the present disclosure when viewed from below.

[0015] Figure 3 It is along Figure 1 A schematic diagram of the cut-off point in direction A.

[0016] Figure 4 The setting is shown Figure 3 Enlarged view of the first lead-out portion and the first anchor portion in the dashed area.

[0017] Figure 5 This is a schematic perspective view of a coil assembly according to a second embodiment of the present disclosure.

[0018] Figure 6 This is a schematic perspective view of a coil assembly according to a second embodiment of the present disclosure when viewed from below.

[0019] Figure 7 It is along Figure 5 A schematic diagram of the cut-off direction A'.

[0020] Figure 8 The setting is shown Figure 7 Enlarged view of the first lead-out portion and the first anchor portion in the dashed area.

[0021] Figure 9 This is a schematic perspective view of a coil assembly according to a third embodiment of the present disclosure.

[0022] Figure 10 This is a schematic perspective view of a coil assembly according to a third embodiment of the present disclosure when viewed from below.

[0023] Figure 11 It is along Figure 9 A schematic diagram taken from the direction A.

[0024] Figure 12 The setting is shown Figure 11 Enlarged view of the first lead-out portion and the first anchor portion in the dashed area. Detailed Implementation

[0025] The terminology used in the description of this disclosure is for describing particular embodiments and is not intended to limit the disclosure. Unless otherwise indicated, singular terms include plural forms. The terms "comprising," "including," "constructed as," etc., in the description of this disclosure are used to indicate the presence of features, quantities, steps, operations, elements, components, or combinations thereof, without excluding the possibility of combining or adding one or more additional features, quantities, steps, operations, elements, components, or combinations thereof. Furthermore, the terms "set on," "placed on," etc., may indicate that an element is placed on or under an object, and do not necessarily mean that the element is placed above the object with respect to the direction of gravity.

[0026] The terms “integrated into” and “combined into” can refer not only to components that are in direct and physical contact with each other, but also to a configuration in which another component is located between the components, so that the component also comes into contact with other components.

[0027] For ease of description, the dimensions and thicknesses of the elements shown in the accompanying drawings are illustrated by way of example, but this disclosure is not limited thereto.

[0028] In the attached figures, the L direction is the first direction or the length (longitudinal) direction, the W direction is the second direction or the width direction, and the T direction is the third direction or the thickness direction.

[0029] In the following, a coil assembly according to exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Referring to the drawings, the same or corresponding components may be designated by the same reference numerals, and repeated descriptions will be omitted.

[0030] In electronic devices, various types of electronic components can be used, and various types of coil assemblies can be used between electronic components to remove noise or for other purposes.

[0031] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency (HF) inductors, ordinary ferrite beads, high-frequency (GHz) ferrite beads, common-mode filters, etc.

[0032] (First Embodiment)

[0033] Figure 1 This is a schematic perspective view of a coil assembly according to a first embodiment of the present disclosure. Figure 2This is a schematic perspective view of a coil assembly according to a first embodiment of the present disclosure when viewed from below. Figure 3 It is along Figure 1 A schematic diagram of the cut-off point in direction A. Figure 4 Showing settings Figure 3 Enlarged view of the first lead-out portion and the first anchor portion in the dashed area. Figure 3 The internal structure of a coil assembly according to a first embodiment of the present disclosure is shown.

[0034] Reference Figures 1 to 4 According to an exemplary embodiment, the coil assembly 1000 may include a main body 100, a support substrate 200, a coil portion 300, lead-out portions 410 and 420, anchor portions 510 and 520, a connecting portion 600, and external electrodes 710 and 720.

[0035] According to this embodiment, the body 100 can form the appearance of the coil assembly 1000, and the coil portion 300 can be embedded in the body 100.

[0036] The main body 100 can be formed into a hexahedral shape as a whole.

[0037] based on Figure 1 , Figure 2 and Figure 3 The main body 100 has a first surface 101 and a second surface 102 that are opposite each other in the length direction L, a third surface 103 and a fourth surface 104 that are opposite each other in the width direction W, and a fifth surface 105 and a sixth surface 106 that are opposite each other in the thickness direction T. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the main body 100 may correspond to the wall surface of the main body 100 that connects the fifth surface 105 and the sixth surface 106 of the main body 100. In the following, the two end surfaces of the main body 100 may refer to the first surface 101 and the second surface 102, respectively; the two side surfaces of the main body 100 may refer to the third surface 103 and the fourth surface 104, respectively; and one surface and the other surface of the main body 100 may refer to the sixth surface 106 and the fifth surface 105, respectively.

[0038] As an example, the body 100 may be formed such that the coil assembly 1000 (in which the external electrodes 710 and 720, which will be described later, are formed) has a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.8 mm, but this disclosure is not limited thereto. Since the above values ​​are only values ​​that do not reflect process errors, etc. in the design, the above values ​​should be considered to be within the scope of this disclosure to the extent that they can be identified as process errors.

[0039] The term "length of coil assembly 1000" can refer to the maximum length of a plurality of line segments connecting the outermost boundary line of the coil assembly shown in the cross-section in the length-thickness (LT) direction within the central portion of the coil assembly 1000 in the width (W) direction, as seen in an optical microscope or scanning electron microscope (SEM) image. Alternatively, the term "length of coil assembly 1000" can refer to the minimum length of a plurality of line segments connecting the outermost boundary line of the coil assembly shown in the cross-section in the length-thickness (LT) direction within an optical microscope or scanning electron microscope (SEM) image of the coil assembly 1000 in the cross-section in the width (W) direction, as seen in an optical microscope or scanning electron microscope (SEM) image. Optionally, the term "length of coil assembly 1000" may refer to the arithmetic mean of at least three lengths of a plurality of line segments that connect the outermost boundary line of the coil assembly shown in the cross-section image and are parallel to the length (L) direction, based on an optical microscope or scanning electron microscope (SEM) image of a cross-section of the central portion of the coil assembly 1000 in the width (W) direction and in the length-thickness (LT) direction.

[0040] The term "thickness of coil assembly 1000" may refer to the maximum length of a plurality of line segments connecting the outermost boundary line of the coil assembly shown in the cross-section in the length-thickness (LT) direction within the central portion of the coil assembly 1000 in the width (W) direction, as seen in an optical microscope or scanning electron microscope (SEM) image. Alternatively, the term "thickness of coil assembly 1000" may refer to the minimum length of a plurality of line segments connecting the outermost boundary line of the coil assembly shown in the cross-section in the length-thickness (LT) direction within an optical microscope or scanning electron microscope (SEM) image of the coil assembly 1000 in the cross-section in the width (W) direction, as seen in an optical microscope or scanning electron microscope (SEM) image. Optionally, the term "thickness of coil assembly 1000" may refer to the arithmetic mean of at least three lengths of a plurality of line segments connecting the outermost boundary line of the coil assembly shown in the cross-section image and parallel to the thickness (T) direction, based on an optical microscope or scanning electron microscope (SEM) image of a cross-section of the central portion of the coil assembly 1000 in the width (W) direction and in the length-thickness (LT) direction.

[0041] The term "width of coil assembly 1000" may refer to the maximum length of a plurality of line segments connecting the outermost boundary line of the coil assembly shown in the cross-section in the width-thickness (WT) direction within the central portion of the coil assembly 1000 in the length (L) direction, as seen in an optical microscope or scanning electron microscope (SEM) image. Alternatively, the term "width of coil assembly 1000" may refer to the minimum length of a plurality of line segments connecting the outermost boundary line of the coil assembly shown in the cross-section in the width-thickness (WT) direction within the central portion of the coil assembly 1000 in the length (L) direction, as seen in an optical microscope or scanning electron microscope (SEM) image. Optionally, the term "width of coil assembly 1000" may refer to the arithmetic mean of at least three lengths of a plurality of line segments, which are connected to the outermost boundary line of the coil assembly shown in the cross-section image and parallel to the width (W) direction, based on an optical microscope or scanning electron microscope (SEM) image of a cross-section of the central portion of the coil assembly 1000 in the length (L) direction and in the width-thickness (WT) direction.

[0042] The length, width, and thickness of the coil assembly 1000 can each be measured using a micrometer. In this method, measurement is performed by zeroing a micrometer with repeatability and reproducibility (R&R), inserting the coil assembly 1000 between the tips of the micrometer, and rotating the measuring rod. When measuring the length of the coil assembly 1000 using a micrometer, the length can refer to a single measurement or the arithmetic mean of multiple measurements. This can be applied equivalently to the width and thickness of the coil assembly 1000.

[0043] The body 100 may include a magnetic material and a resin. Specifically, the body 100 may be formed by laminating at least one magnetic composite sheet in which the magnetic material is dispersed in a resin. However, the body 100 may have a structure other than that in which the magnetic material is dispersed in a resin. For example, the body 100 may be formed using a magnetic material (such as ferrite) or a non-magnetic material.

[0044] Magnetic materials can be ferrite powder particles or magnetic metal powder particles.

[0045] Examples of ferrite powder particles may include one or more of the following ferrites: spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites, etc.), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites, etc.), garnet-type ferrites (such as Y-based ferrites, etc.) and Li-based ferrites.

[0046] Magnetic metal powder particles may include one or more of the following: iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, magnetic metal powder particles may be one or more of the following powders: pure iron powder, Fe-Si based alloy powder, Fe-Si-Al based alloy powder, Fe-Ni based alloy powder, Fe-Ni-Mo based alloy powder, Fe-Ni-Mo-Cu based alloy powder, Fe-Co based alloy powder, Fe-Ni-Co based alloy powder, Fe-Cr based alloy powder, Fe-Cr-Si based alloy powder, Fe-Si-Cu-Nb based alloy powder, Fe-Ni-Cr based alloy powder, and Fe-Cr-Al based alloy powder.

[0047] Magnetic metal powder particles can be amorphous or crystalline. For example, magnetic metal powder particles can be Fe-Si-B-Cr based amorphous alloy powders, but are not limited to this.

[0048] Each of the magnetic metal powder particles may have an average diameter of approximately 0.1 μm to 30 μm, but is not limited thereto.

[0049] The body 100 may include two or more types of magnetic metal powder particles dispersed in a resin. The term "different types of magnetic powder particles" refers to magnetic powder particles dispersed in a resin that are distinguished from each other by at least one of average diameter, composition, crystallinity, and shape.

[0050] The resin may include, but is not limited to, epoxy resins, polyimides, liquid crystal polymers, etc., in single or combined forms.

[0051] The main body 100 may include a core C extending through the central portion of each of the support substrate 200 and the coil portion 300. The core C may be formed by filling the central portion of the coil portion 300 with a magnetic composite sheet, but this disclosure is not limited thereto.

[0052] The support substrate 200 can support the coil section 300, the lead-out sections 410 and 420, and the anchor sections 510 and 520 (described later).

[0053] A support substrate 200 may be disposed within the main body 100 such that one surface of the support substrate 200 is perpendicular to one surface 106 of the main body 100. When the coil assembly 1000 according to this embodiment is mounted on a mounting plate (such as a printed circuit board), the sixth surface 106 of the main body 100 can be used as a mounting surface. In this embodiment, since one surface of the support substrate 200 is configured to be perpendicular to the sixth surface 106 of the main body 100, the coil portion 300, which will be described later and disposed on the support substrate 200, can be used as a vertical coil. Since the magnetic field induced in the core C of the main body 100 by the coil portion 300 serving as a vertical coil is parallel to the sixth surface 106 of the main body 100, the coil assembly 1000 according to this embodiment can reduce noise induced to the mounting plate, etc.

[0054] The support substrate 200 may include an insulating material, such as a thermosetting insulating resin like epoxy resin, a thermoplastic insulating resin like polyimide, or a photosensitive insulating resin. Alternatively, the support substrate 200 may include an insulating material in which reinforcing materials (such as glass fiber or inorganic fillers) are impregnated in an insulating resin. For example, the support substrate 200 may include insulating materials such as prepreg, Ajinomoto Build-up Film (ABF), FR-4, bismaleimide triazine (BT) film, photosensitive dielectric (PID) film, copper clad laminate (CCL), etc., but is not limited thereto.

[0055] Inorganic fillers may be one or more selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc powder, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3).

[0056] When the support substrate 200 is formed using an insulating material including reinforcing material, the support substrate 200 provides improved rigidity. When the support substrate 200 is formed using an insulating material that does not include glass fiber, the support substrate 200 facilitates thinning of the entire coil portion 300 to reduce the width of the coil assembly. When the support substrate 200 is formed using an insulating material including a photosensitive insulating resin, the number of processes used to form the coil portion 300 can be reduced. Therefore, this can be advantageous in terms of reducing production costs, and fine vias can be formed.

[0057] The coil portion 300 may be disposed on the support substrate 200. The coil portion 300 may be embedded in the main body 100 to exhibit the characteristics of the coil assembly 1000. For example, when the coil assembly 1000 is used as a power inductor, the coil portion 300 may store an electric field as a magnetic field to maintain the output voltage, thereby stabilizing the power of the electronic device.

[0058] The coil portion 300 may be formed on at least one of the two opposing surfaces of the support substrate 200, and may form at least one turn. The coil portion 300 may be disposed on one and another opposing surfaces of the support substrate 200 in the width direction W of the body 100. Specifically, in this embodiment, the coil portion 300 may include coil patterns 311 and 312 and a through hole 320.

[0059] Each of the first coil pattern 311 and the second coil pattern 312 may be in the form of at least one turn formed as a planar spiral around the core C of the body 100. For example, based on Figure 1 In the direction of the first coil pattern 311, at least one turn of the first coil pattern 311 may be formed around the core C on the front surface of the support substrate 200. At least one turn of the second coil pattern 312 may be formed around the core C on the rear surface of the support substrate 200. Each of the first coil pattern 311 and the second coil pattern 312 may be formed such that the end of the outermost turn of the lead-out patterns 411 and 412, which are connected to the lead-out portions 410 and 420 described later, extends further in the thickness (T) direction to one side of the sixth surface 106 of the body 100 than the central portion of the body 100. As a result, compared to the case where the end of the outermost turn of the coil is only formed as the central portion of the body in the thickness direction, the first coil pattern 311 and the second coil pattern 312 can increase the total number of turns of the coil portion 300.

[0060] The via 320 can penetrate the support substrate 200 to connect the innermost turns of the first coil pattern 311 and the second coil pattern 312.

[0061] Therefore, the coil section 300 can be used as a single coil for integral connection.

[0062] Leads 410 and 420 may be connected to the outermost turns of the coil portion 300 and may be exposed on a surface 106 of the body 100 to be spaced apart from each other. Specifically, leads 410 and 420 may include a first lead 410 connected to the end of the outermost turn of the first coil pattern 311 and a second lead 420 connected to the end of the outermost turn of the second coil pattern 312. The first lead 410 and the second lead 420 may be exposed on a sixth surface 106 of the body 100 to be spaced apart from each other.

[0063] Lead-out portions 410 and 420 may be correspondingly disposed on one and another opposing surfaces of the support substrate 200, and may include lead-out patterns 411 and 421 exposed on one surface 106 of the body 100, and auxiliary lead-out patterns 412 and 422, respectively. Specifically, the first lead-out portion 410 may include a first lead-out pattern 411 disposed on one surface of the support substrate 200 and a first auxiliary lead-out pattern 412 disposed on the other surface of the support substrate 200 corresponding to the first lead-out pattern 411. The second lead-out portion 420 may include a second lead-out pattern 421 disposed on the other surface of the support substrate 200 and a second auxiliary lead-out pattern 422 disposed on one surface of the support substrate 200 corresponding to the second lead-out pattern 421. The first lead-out pattern 411 may be connected to the end of the outermost turn of the first coil pattern 311 via a connecting portion 600 (described later), and the second lead-out pattern 421 may be connected to the end of the outermost turn of the second coil pattern 312 via a connecting portion 600 (described later). The first auxiliary lead-out pattern 412 may be spaced apart from the second coil pattern 312, and the second auxiliary lead-out pattern 422 may be spaced apart from the first coil pattern 311. The auxiliary lead-out patterns 412 and 422 are not directly connected to the coil portion 300, but are connected to the coil portion 300 via lead-out patterns 411 and 421, via the connecting portion 600, and via anchor portions 510 and 520 (described later). The auxiliary lead-out patterns 412 and 422 may be respectively disposed on two surfaces of the support substrate 200 at positions corresponding to lead-out patterns 411 and 421, so that their areas are exposed on the sixth surface 106 of the body 100 according to their respective areas corresponding to lead-out patterns 411 and 421. Therefore, when the external electrodes 710 and 720 (described later) are formed on the surface of the body 100, undesirable appearance of the external electrodes 710 and 720 can be prevented.

[0064] Anchor portions 510 and 520 may be connected to lead portions 410 and 420, and may include via pads 511, 512, 521 and 522 disposed between lead portions 410 and 420 in the body 100 and coil portion 300.

[0065] Specifically, anchor portions 510 and 520 may include a first anchor portion 510 connected to the first lead-out portion 410 and a second anchor portion 520 connected to the second lead-out portion 420. The first anchor portion 510 may include: a first via pad 511 connected to the first lead-out pattern 411; a first via pad 512 connected to the first auxiliary lead-out pattern 412; and a first connecting via 513 penetrating the support substrate 200 to connect the first via pads 511 and 512 to each other. The second anchor portion 520 may include: a second via pad 521 connected to the second lead-out pattern 421; a second via pad 522 connected to the second auxiliary lead-out pattern 422; and a second connecting via 523 penetrating the support substrate 200 to connect the second via pads 521 and 522 to each other.

[0066] Via pads 511, 512, 521, and 522 may contact and connect to leads 410 and 420. For example, first lead pattern 411 and first via pad 511 may contact and connect to each other, first auxiliary lead pattern 412 and first via pad 512 may contact and connect to each other, second lead pattern 421 and second via pad 521 may contact and connect to each other, and second auxiliary lead pattern 422 and second via pad 522 may contact and connect to each other.

[0067] Anchor portions 510 and 520 may extend from leads 410 and 420 toward the interior of body 100, spaced apart from the outermost turns of coil portion 300. Alternatively, anchor portions 510 and 520 may extend from leads 410 and 420 into the space between the side surfaces of coil portion 300, leads 410 and 420, and body 100, connecting one surface 106 and another surface 105. Anchor portions 510 and 520 prevent each of coil portion 300 and leads 410 and 420 from delamination from body 100 by external force. As an example, the first anchor portion 510 may extend from the first lead 410 with an angle range greater than 0 degrees to 90 degrees or less. The phrase “the first anchor portion 510 and the first lead-out portion 410 have an angular range of greater than 0 degrees to 90 degrees or less” can refer, as an example, to a line segment connecting the center of the first connecting through-hole 513 of the first anchor portion 510 and the center of the exposed surface of the first lead-out pattern 411 of the first lead-out portion 410 exposed on the sixth surface 106 of the body 100, based on the cross-section of the body 100 in the length-thickness (LT) direction, having an angular range of greater than 0 degrees to 90 degrees or less relative to the sixth surface 106 of the body 100, but this disclosure is not limited thereto.

[0068] The connecting portion 600 can contact and connect with the outermost turn of the coil portion 300 and the leads 410 and 420. For example, the connecting portion 600 can be provided between the outermost turn of the coil portion 300 and the leads 410 and 420, and can contact and connect with the outermost turn of the coil portion 300 and the leads 410 and 420.

[0069] The connecting portion 600 may include a plurality of connecting portions 600 spaced apart from each other. As an example, the connecting portion 600 may include a plurality of connecting portions 600 spaced apart from each other between the end of the outermost turn of the first coil pattern 311 and the first lead-out pattern 411. Each of the spaced-apart connecting portions 600 can connect the end of the outermost turn of the first coil pattern 311 to the first lead-out pattern 411. Additionally, the connecting portion 600 may include a plurality of connecting portions 600 spaced apart from each other between the end of the outermost turn of the second coil pattern 312 and the second lead-out pattern 421. Each of the spaced-apart connecting portions 600 can connect the end of the outermost turn of the second coil pattern 312 to the second lead-out pattern 421. At least a portion of the body 100 may be disposed between the spaced-apart connecting portions 600. As a result, the bonding strength between each of the leads 410 and 420 and the body 100 may be improved.

[0070] Although a detailed description of the first lead-out portion 410 and the first anchor portion 510 has been given, this description is equivalent to that of the second lead-out portion 420 and the second anchor portion 520.

[0071] Each of the coil portion 300, lead-out portions 410 and 420, anchor portions 510 and 520, and connecting portion 600 may include a conductive material, such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or alloys thereof, but the conductive material is not limited thereto. In one example, the coil portion 300, lead-out portions 410 and 420, anchor portions 510 and 520, and connecting portion 600 may include the same conductive material. In this case, each of the anchor portions 510 and 520 may include a conductive pattern.

[0072] Each of the coil portion 300, lead-out portions 410 and 420, anchor portions 510 and 520, and connecting portion 600 may include at least one conductive layer. For example, when the first coil pattern 311, via 320, connecting portion 600, first lead-out pattern 411, first via pad 511, first connecting via 513, second auxiliary lead-out pattern 422, second via pad 521, and second connecting via 523 are formed on the front surface of the support substrate 200 by plating (based on...) Figure 1When the direction is specified, each of the first coil pattern 311, via 320, first lead-out pattern 411, first via pad 511, first connecting via 513, second auxiliary lead-out pattern 422, second via pad 521, and second connecting via 523 may include a seed layer and an electroplated layer. The seed layer may be formed by vapor deposition, such as chemical plating or sputtering. Each of the seed layer and electroplated layer may have a single-layer structure or a multi-layer structure. An electroplated layer with a multi-layer structure may have a conformal film structure in which one electroplated layer is covered by another electroplated layer or the other electroplated layer is only laminated on one surface of an electroplated layer. The seed layer of the first coil pattern 311 and the seed layer of the via 320 may be integrally formed such that no boundary is formed between them, but this disclosure is not limited thereto. The electroplated layer of the first coil pattern 311 and the electroplated layer of the via 320 may be integrally formed such that no boundary is formed between them, but this disclosure is not limited thereto.

[0073] In this embodiment, since the coil portion 300 is positioned perpendicular to the sixth surface 106 (mounting surface) of the main body 100, the mounting area is reduced while maintaining the volume of the main body 100. Therefore, a greater number of electronic components can be mounted on a mounting plate with the same area. Furthermore, in this embodiment, since the coil portion 300 is positioned perpendicular to the sixth surface 106 (mounting surface) of the main body 100, the direction of the magnetic flux induced in the core C by the coil portion 300 is parallel to the sixth surface 106 of the main body 100. Therefore, noise induced on the mounting surface of the mounting substrate can be relatively reduced.

[0074] External electrodes 710 and 720 may be spaced apart from each other on the sixth surface 106 of the body 100 to connect to the leads 410 and 420, respectively. Specifically, the first external electrode 710 may be disposed on the sixth surface 106 of the body 100 to contact and connect with each of the first lead-out pattern 411 and the first auxiliary lead-out pattern 412. The second external electrode 720 may be disposed on the sixth surface 106 of the body 100 to contact and connect with each of the second lead-out pattern 421 and the second auxiliary lead-out pattern 422. In this embodiment, since the external electrodes 710 and 720 contact and connect with each other to the auxiliary lead-out patterns 412 and 422, respectively, the connection reliability between the external electrodes 710 and 720 and the coil portion 300 can be improved. As an example, the support substrate 200 may be disposed between the first lead-out pattern 411 and the first auxiliary lead-out pattern 412 to be exposed on the sixth surface 106 of the body 100. In this case, a recess may be formed in the region of the first external electrode 710, which corresponds to the support substrate 200 exposed to the sixth surface 106 of the body 100 due to plating deviation, but this disclosure is limited thereto.

[0075] When the coil assembly 1000 is mounted on a printed circuit board or the like, the external electrodes 710 and 720 can electrically connect the coil assembly 1000 to the printed circuit board or the like. As an example, the coil assembly 1000 can be mounted in such a way that the sixth surface 106 of the body 100 can face the upper surface of the printed circuit board, and the external electrodes 710 and 720 spaced apart from each other on the sixth surface 106 of the body 100 and the connection portion of the printed circuit board can be connected to each other.

[0076] The external electrodes 710 and 720 may be formed using conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or alloys thereof, but the conductive materials are not limited to these.

[0077] Each of the external electrodes 710 and 720 may be formed having a multilayer structure. As an example, each of the external electrodes 710 and 720 may include a first metal layer configured to contact the leads 410 and 420, and a second metal layer disposed on the first metal layer. The first metal layer may be formed by vapor deposition (such as sputtering, electroless plating) or electroplating, or by coating and curing a conductive resin comprising conductive powder particles (such as copper (Cu)). The second metal layer may be formed on the first metal layer by electroplating. The second metal layer may be formed having a multilayer structure, and as a non-limiting example, the second metal layer may include a first plating layer and a second plating layer formed on the first plating layer. As an example, the first metal layer may include copper (Cu), the first plating layer may include nickel (Ni), and the second plating layer may include tin (Sn).

[0078] The coil assembly 1000 according to this embodiment may further include an insulating layer formed along the surfaces of the support substrate 200, the coil portion 300, the leads 410 and 420, the anchor portions 510 and 520, and the connecting portion 600. An insulating layer may be provided to insulate the coil portion 300 from the body 100, and the insulating layer may include known insulating materials (such as parylene), but this disclosure is not limited thereto. The insulating layer may be formed by methods such as vapor deposition. However, this disclosure is not limited thereto, and the insulating layer may also be formed by laminating insulating films onto both surfaces of the support substrate 200.

[0079] The coil assembly 1000 according to this embodiment may further include an insulating layer disposed on each of the first surface 101, second surface 102, third surface 103, fourth surface 104, and fifth surface 105 of the body 100, and in the region on the sixth surface 106 of the body 100 where the external electrodes 710 and 720 are not formed. The insulating layer may include at least one of thermoplastic resins (such as polystyrene-based resins, vinyl acetate-based resins, polyester-based resins, polyethylene-based resins, polypropylene-based resins, polyamide-based resins, rubber-based resins, or acrylic-based resins), thermosetting resins (such as phenol-based resins, epoxy-based resins, urethane-based resins, melamine-based resins, or alkyd-based resins), and photosensitive insulating resins.

[0080] (Second Embodiment)

[0081] Figure 5 This is a schematic perspective view of a coil assembly according to a second embodiment of the present disclosure. Figure 6 This is a schematic perspective view of a coil assembly according to a second embodiment of the present disclosure when viewed from below. Figure 7 It is along Figure 5 A schematic diagram of the cut-off direction A'. Figure 8 The setting is shown Figure 7 Enlarged view of the first lead-out portion and the first anchor portion in the dashed area. Figure 7 The internal structure of a coil assembly according to a second embodiment of the present disclosure is shown.

[0082] Reference Figures 1 to 4 and Figures 5 to 8 The coil assembly 2000 according to the second embodiment includes anchor portions 510 and 520 that are different from those of the coil assembly 1000 according to the first embodiment. Therefore, only the anchor portions 510 and 520 of the second embodiment will be described. The description of the first embodiment can be applied as is to other elements.

[0083] Reference Figures 5 to 8A groove R is formed in at least one of the via pads 511, 512, 521, and 522 applied to the anchor portions 510 and 520 of the second embodiment. Specifically, at least one of the via pads 511, 512, 521, and 522 may have a shape in which the groove R is formed in a cross section in the length-thickness (LT) direction perpendicular to the sixth surface 106 of the body 100. Although typical via pads are formed to have an overall circular shape, at least one of the via pads 511, 512, 521, and 522 applied to the second embodiment may be formed to have, for example, a circular cross section with 1 / 4 removed. At least a portion of the body 100 is disposed in the portion of the via pads 511, 512, 521, and 522 removed by forming the groove R. As a result, the bonding strength between the anchor portions 510 and 520 and the body 100 can be further improved. The groove R may be based, for example, on Figure 7 The coordinates are formed in the third quadrant region of the first via pad 511. As an example, the groove R formed in the first via pad 511 may have a shape that opens toward the edge formed by the sixth surface 106 of the body 100 and the second surface 102 of the body 100.

[0084] The groove R may be formed to penetrate the anchor portions 510 and 520. As an example, the groove R may have a shape that extends in the width (W) direction of the body 100 to penetrate each of the first via pads 511 and 512 and the first connection via 513. As a result, unlike the first embodiment, the first connection via 513 of the second embodiment may have a shape that exposes the body 100.

[0085] Although the above description focuses on the first lead-out portion 410 and the first anchor portion 510, such description can be equivalently applied to the second lead-out portion 420 and the second anchor portion 520.

[0086] (Third Embodiment)

[0087] Figure 9 This is a schematic perspective view of a coil assembly according to a third embodiment of the present disclosure. Figure 10 This is a schematic perspective view of a coil assembly according to a third embodiment of the present disclosure when viewed from below. Figure 11 It is along Figure 9 A schematic diagram taken from the direction A. Figure 12 The setting is shown Figure 11 Enlarged view of the first lead-out portion and the first anchor portion in the dashed area. Figure 11 The internal structure of a coil assembly according to a third embodiment of the present disclosure is shown.

[0088] Reference Figures 1 to 4 and Figures 9 to 12The coil assembly 3000 according to the third embodiment includes anchor portions 510 and 520 that are different from those of the coil assembly 1000 according to the first embodiment. Therefore, only the anchor portions 510 and 520 of the third embodiment will be described. The description of the first embodiment can be applied as is to other elements.

[0089] Reference Figures 9 to 12 The anchor portions 510 and 520 applied in the third embodiment may further include: connecting patterns 514 and 524 connecting the spaced-apart lead-out patterns 411 and 421 and via pads 511 and 521; and auxiliary connecting patterns 515 and 525 connecting the spaced-apart auxiliary lead-out patterns 412 and 422 and via pads 512 and 522. Unlike the first embodiment, in the third embodiment, the lead-out patterns 411 and 421, the auxiliary lead-out patterns 412 and 422, and the via pads 511, 512, 521, and 522 are spaced apart from each other, but are connected to each other by connecting patterns 514 and 524 and auxiliary connecting patterns 515 and 525.

[0090] Specifically, the first lead-out pattern 411 and the first via pad 511 are spaced apart from each other, and a first connecting pattern 514 is disposed between the first lead-out pattern 411 and the first via pad 511 to contact and connect with each of the first lead-out pattern 411 and the first via pad 511. The first auxiliary lead-out pattern 412 and the first via pad 512 are spaced apart from each other, and a first auxiliary connecting pattern 515 is disposed between the first auxiliary lead-out pattern 412 and the first via pad 512 to contact and connect with each of the first auxiliary lead-out pattern 412 and the first via pad 512. The second lead-out pattern 421 and the second via pad 521 are spaced apart from each other, and a second connecting pattern 524 is disposed between the second lead-out pattern 412 and the second via pad 521 to contact and connect with each of the second lead-out pattern 412 and the second via pad 521. The second auxiliary lead-out pattern 422 and the second via pad 522 are spaced apart from each other, and the second auxiliary connection pattern 525 is disposed between the second auxiliary lead-out pattern 422 and the second via pad 522 to contact and connect with each of the second auxiliary lead-out pattern 422 and the second via pad 522.

[0091] In the case of the third embodiment, since the leads 410 and 420 are separated from the via pads 511, 512, 521 and 522, but are connected by the connecting patterns 514 and 524 and the auxiliary connecting patterns 515 and 525, the contact area between the anchors 510 and 520 and the body 100 can be increased, and the bonding strength between the anchors 510 and 520 and the body 100 can be improved.

[0092] As described above, according to an exemplary embodiment, the bonding strength between the body and the coil portion can be improved.

[0093] According to an exemplary embodiment, the bonding strength between the body and the lead-out portion can be improved.

[0094] According to an exemplary embodiment, the number of turns in the coil section can be increased.

[0095] Although exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: The main body has one surface and another surface that are opposite to each other; A support substrate is disposed inside the main body; A coil portion is disposed on at least one surface of the support substrate, wherein the end of the outermost turn of the coil portion is configured to be closer to one surface of the body than the other surface of the body; The lead-out portion is connected to the outermost turn of the coil portion and exposed on one surface of the body; as well as An anchor portion, connected to the lead-out portion inside the main body and including a via pad, the via pad being disposed between the lead-out portion and the coil portion, the anchor portion including: a first via pad configured to correspond to one surface of the support substrate; a second via pad configured to correspond to the other surface of the support substrate; and a connecting via penetrating the support substrate to connect to the first via pad and the second via pad.

2. The coil assembly as claimed in claim 1, wherein, The lead-out portion includes a lead-out pattern and an auxiliary lead-out pattern exposed on one surface of the body.

3. The coil assembly as claimed in claim 2, wherein, The first via pad and the second via pad are in contact with and connected to the lead-out pattern and the auxiliary lead-out pattern, respectively.

4. The coil assembly as claimed in claim 3, wherein, A groove is provided in at least one of the first via pad and the second via pad.

5. The coil assembly as claimed in claim 4, wherein, The groove extends through the first via pad, the connecting via, and the second via pad.

6. The coil assembly as claimed in claim 4, wherein, The groove opens in a cross section perpendicular to the one surface of the body toward the edge between the one surface of the body and a side surface of the body connected to the one surface of the body.

7. The coil assembly as claimed in claim 2, wherein, The anchor portion further includes a first connecting pattern and a second connecting pattern, the first connecting pattern connecting the lead-out patterns and the first via pad that are spaced apart from each other, and the second connecting pattern connecting the auxiliary lead-out patterns and the second via pad that are spaced apart from each other.

8. The coil assembly of claim 1, further comprising: The connecting portion contacts and connects with each of the outermost turns of the coil portion and the lead-out portion.

9. The coil assembly of claim 8, wherein, The connecting portion comprises multiple parts spaced apart from each other.

10. The coil assembly of claim 9, wherein, At least a portion of the main body is disposed between the plurality of portions spaced apart from each other.

11. The coil assembly as claimed in any one of claims 1 to 10, wherein, The coil portion includes: a first coil pattern and a second coil pattern, respectively disposed on one opposite surface and another surface of the support substrate; and a through hole penetrating the support substrate to connect the one surface and the other surface of the support substrate to each other. The lead-out portion includes a first lead-out portion connected to the outermost turn of the first coil pattern and a second lead-out portion connected to the outermost turn of the second coil pattern, and The anchor portion includes a first anchor portion connected to the first lead-out portion and a second anchor portion connected to the second lead-out portion.

12. The coil assembly of claim 11, further comprising: The first external electrode and the second external electrode are configured to be spaced apart from each other on the one surface of the body and respectively connected to the first lead-out portion and the second lead-out portion.

13. The coil assembly of claim 1, wherein, The at least one surface of the support substrate is perpendicular to the one surface of the body.

14. A coil assembly, comprising: The main body has one surface and another surface that are opposite to each other; A support substrate is disposed inside the main body; The coil portion is disposed on the support substrate; The lead-out portion is connected to the outermost turn of the coil portion and exposed to the one surface of the body; as well as An anchor portion extends from the lead-out portion to the space between the coil portion, the lead-out portion, and the side surface connecting the one surface and the other surface of the body, and is spaced apart from the one surface of the body. The anchor portion includes: a first via pad configured to correspond to one surface of the support substrate; a second via pad corresponding to the other surface of the support substrate; and a connecting via penetrating the support substrate to connect to the first via pad and the second via pad.

15. The coil assembly of claim 14, wherein, The lead-out portion includes a lead-out pattern and an auxiliary lead-out pattern exposed on one surface of the body.

16. The coil assembly of claim 15, wherein, The first via pad and the second via pad are in contact with and connected to the lead-out pattern and the auxiliary lead-out pattern, respectively.

17. The coil assembly as claimed in claim 15 or 16, wherein, A groove is provided in at least one of the first via pad and the second via pad.

18. The coil assembly of claim 15, wherein, The anchor portion further includes: a first connecting pattern connecting the lead-out patterns and the first via pad that are spaced apart from each other; and a second connecting pattern connecting the auxiliary lead-out patterns and the second via pad that are spaced apart from each other.

19. A coil assembly, comprising: The main body has one surface and another surface that are opposite to each other; A support substrate is disposed inside the main body; The coil portion is disposed on the support substrate; The lead-out portion is connected to the outermost turn of the coil portion and exposed to the one surface of the body; as well as A conductive pattern, comprising the same material as the lead-out portion, extends from the lead-out portion to the space between the coil portion, the lead-out portion, and the side surface of the body connecting one surface and the other surface, and is spaced apart from the one surface of the body. The conductive pattern includes: a first via pad configured to correspond to one surface of the support substrate; a second via pad corresponding to the other surface of the support substrate; and a connecting via penetrating the support substrate to connect to the first via pad and the second via pad.

20. The coil assembly of claim 19, further comprising a connecting portion extending from the lead-out portion to the coil portion.

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