Sensor modules and systems

Abstract

This sensor module includes a sensor and a housing. The housing houses the sensor. The housing includes an attachment surface and an opposing surface. The attachment surface is attached to an object. The opposing surface is located opposite the attachment surface. The sensor is provided on the opposing surface.

Description

Technical Field

[0001] The present disclosure relates to a sensor module and a system.

Background Art

[0002] WO 2020 / 171156 A1 (Patent Document 1) discloses a cutting tool including a holder having a sensor mounted therein and a cutting insert.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] The sensor module according to the present disclosure includes a sensor and a housing. The housing houses the sensor. The housing has an attachment surface and an opposing surface. The attachment surface is attached to an object. The opposing surface is located opposite to the attachment surface. The sensor is provided on the opposing surface.

Brief Description of the Drawings

[0005] [Figure 1] FIG. 1 is a perspective view of a sensor module according to the first embodiment. [Figure 2] FIG. 2 is an exploded perspective view showing the internal structure of the sensor module according to the first embodiment. [Figure 3] FIG. 3 is a plan view of the sensor module according to the first embodiment. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3. [Figure 5] FIG. 5 is an exploded perspective view of the housing according to the first embodiment. [Figure 6] FIG. 6 is a plan view of the substrate according to the first embodiment. [Figure 7]Figure 7 is a plan view of the sensor according to the first embodiment. [Figure 8] Figure 8 is a cross-sectional view along the line segment VIII-VIII in Figure 7. [Figure 9] Figure 9 is a perspective view of the sensor module according to the second embodiment. [Figure 10] Figure 10 is an exploded perspective view showing the internal structure of the sensor module according to the second embodiment. [Figure 11] Figure 11 is a plan view of the sensor module according to the second embodiment. [Figure 12] Figure 12 is a cross-sectional view along the line segment XII-XII in Figure 13. [Figure 13] Figure 13 is an exploded perspective view of the housing according to the second embodiment. [Figure 14] Figure 14 is an exploded perspective view showing the internal structure of the sensor module according to the third embodiment. [Figure 15] Figure 15 is an exploded perspective view of the housing according to the third embodiment. [Figure 16] Figure 16 is an exploded perspective view showing the internal structure of the sensor module according to the fourth embodiment. [Figure 17] Figure 17 is a plan view of the sensor module according to the fourth embodiment. [Figure 18] Figure 18 is a cross-sectional view along the line segment XVIII-XVIII in Figure 17. [Figure 19] Figure 19 is an exploded perspective view of the housing according to the fifth embodiment. [Figure 20] Figure 20 is a partially enlarged plan view showing the internal structure of the sensor module according to the fifth embodiment. [Figure 21] Figure 21 is an exploded perspective view of the housing according to the fifth embodiment and the first modified example. [Figure 22] Figure 22 is a partially enlarged plan view showing the internal structure of the sensor module according to the first modified example in the fifth embodiment. [Figure 23] Figure 23 is an exploded perspective view of the housing according to the second modified example of the fifth embodiment. [Figure 24] FIG. 24 is a partially enlarged plan view showing the internal structure of the sensor module according to the second modification of the fifth embodiment. [Figure 25] FIG. 25 is an exploded perspective view of the housing according to the third modification of the fifth embodiment. [Figure 26] FIG. 26 is a partially enlarged plan view showing the internal structure of the sensor module according to the third modification of the fifth embodiment. [Figure 27] FIG. 27 is a perspective view of the system according to the sixth embodiment. [Figure 28] FIG. 28 is a side view of the system according to the sixth embodiment. [Figure 29] FIG. 29 is a perspective view of the system according to the seventh embodiment. [Figure 30] FIG. 30 is an exploded perspective view of the system according to the eighth embodiment. [Figure 31] FIG. 31 is an exploded perspective view of the system according to the ninth embodiment. [Figure 32] FIG. 32 is a perspective view of the system according to the ninth embodiment.

MODE FOR CARRYING OUT THE INVENTION

[0006] [PROBLEMS TO BE SOLVED BY THE PRESENT DISCLOSURE] There has been room for improvement in attaching a sensor to an object in order to measure a physical quantity of the object such as a cutting tool.

[0007] An object of the present disclosure is to provide a sensor module capable of easily attaching a sensor to an object.

[0008] [EFFECTS OF THE PRESENT DISCLOSURE] According to the present disclosure, it is possible to provide a sensor module capable of easily attaching a sensor to an object.

[0009] [OUTLINE OF THE EMBODIMENT] First, an outline of the embodiment of the present disclosure will be described.

[0010] (1) The sensor module relating to this disclosure comprises a sensor and a housing. The housing houses the sensor. The housing has a mounting surface and an opposing surface. The mounting surface is attached to an object. The opposing surface is located opposite the mounting surface. The sensor is provided on the opposing surface.

[0011] The sensor module described herein allows for easy attachment to an object. Furthermore, the sensor can be attached to an object without reducing the rigidity of the object, such as a cutting tool.

[0012] (2) In the sensor module described in (1) above, the sensor may have a strain sensor. This makes it possible to measure the strain of the object.

[0013] (3) The sensor module according to (1) or (2) above may include a circuit board electrically connected to the sensor. In this way, the sensor is supplied with power via the circuit board. Furthermore, the information detected by the sensor can be transmitted to the wireless communication unit via the circuit board.

[0014] (4) The sensor module described in (3) above may be provided on a circuit board and may have terminals for supplying power to the sensor. This allows power to be supplied to the sensor from a power supply module or the like via the terminals.

[0015] (5) The sensor module relating to (4) above may include a power supply module electrically connected to the terminal. This allows power to be supplied from the power supply module to the sensor via the terminal.

[0016] (6) In the case of the sensor module described in (5) above, the power supply module may be housed in a housing. This eliminates the need for cables to extend outside the housing. Furthermore, even when there are strict space limitations for mounting the sensor module, the sensor module can be easily attached to the object. In addition, if the object to which the sensor module is attached is a cutting tool such as a cutting tool, interference between the cable and the insert, or interference between the cable and the workpiece, is eliminated.

[0017] (7) The sensor module according to (5) or (6) above may include a cable connecting the terminals to the power supply module. The cable may be placed on the circuit board or at a position further away from the circuit board than the sensor. This allows the sensor to be placed near the insert portion if the object to which the sensor module is attached is a cutting tool such as a cutting tool. Also, because the cable is placed at a position away from the insert portion, the cable can avoid interference with the insert portion and with the workpiece.

[0018] (8) In the case of a sensor module according to any of (3) to (7) above, the sensor may be placed between the opposing surface and the substrate. This makes it possible to miniaturize the sensor module.

[0019] (9) A sensor module relating to any of (1) to (7) above may be provided with a protective member to cover the sensor. This protects the sensor. The protective member can also be used to bond and fix the housing portion and the lid portion of the housing.

[0020] (10) In the case of the sensor module described in (9) above, the protective member may be made of resin. This allows the information detected by the sensor to be transmitted wirelessly to the outside of the housing.

[0021] (11) In the case of a sensor module according to any of (1) to (10) above, the sensor may be positioned on the opposing surface at the position with the shortest distance from the mounting surface. If the sensor is a strain sensor, this will result in the closest distance from the sensor to the object, allowing the sensor to accurately detect the strain of the object. If the sensor is a temperature sensor, this will result in the closest distance from the sensor to the object, allowing the sensor to accurately detect temperature changes of the object.

[0022] (12) In the case of a sensor module according to any of (1) to (11) above, a recess may be provided on the opposing surface. A sensor may be placed in the recess. If the sensor is a strain sensor, this reduces the distance from the sensor to the object, allowing the sensor to accurately detect the strain of the object. If the sensor is a temperature sensor, this reduces the distance from the sensor to the object, allowing the sensor to accurately detect temperature changes of the object. The recess also serves as a marker for where to attach the sensor.

[0023] (13) In the case of a sensor module according to any of (1) to (12) above, a groove may be provided on the opposing surface. The sensor may be placed on the groove. This causes stress concentration in the groove, increasing the strain detected by the sensor. As a result, the sensor can accurately detect the strain of the object.

[0024] (14) The system relating to this disclosure comprises a sensor module relating to any of (1) to (13) above and an object. The object is an element involved in machining or plastic deformation. This makes it possible to measure the physical quantities of the element involved in machining or plastic deformation. As a result, the state of the element involved in machining or plastic deformation, which is the object, can be determined from the measured physical quantities.

[0025] [Details of the embodiment] The details of the embodiments of this disclosure (hereinafter also referred to as these embodiments) will be described below with reference to the drawings. In the following drawings, identical or corresponding parts will be given the same reference numerals, and their descriptions will not be repeated.

[0026] (First Embodiment) <Sensor Module Configuration> First, let's describe the sensor module 1 according to the first embodiment.

[0027] Figure 1 is a perspective view of the sensor module 1 according to the first embodiment. Figure 2 is an exploded perspective view showing the internal structure of the sensor module 1 according to the first embodiment. Figure 3 is a plan view of the sensor module 1 according to the first embodiment. Figure 4 is a cross-sectional view along the line segment IV-IV in Figure 3. The sensor module 1 according to the first embodiment includes a housing 3, a substrate 4, a sensor 5, a wireless communication unit 6, a terminal 7, a cable 8, and a protective member 9. Note that the protective member 9 is not shown in Figures 1 to 3.

[0028] The sensor module 1 shown in Figures 1 to 4 is a module having sensors for measuring the physical quantities of an object. There may be one sensor 5, as shown in Figure 2. There may be multiple sensors 5, and the multiple sensors 5 may measure different physical quantities from each other.

[0029] The object in question may be, for example, an element related to machining. An element related to machining may be, for example, a component of a machine tool such as a cutting tool, turret, spindle, tool post, table, and chuck, or it may be a workpiece, or it may be anything else that affects machining.

[0030] The object in question may be, for example, an element involved in plastic deformation. An element involved in plastic deformation may be, for example, a mold, punch, die, base and frame of a forging machine, or any other element that affects plastic deformation.

[0031] As shown in Figure 2, the internal space of the housing 3 houses the circuit board 4, the sensor 5, the wireless communication unit 6, the terminal 7, a portion of the cable 8, and the protective member 9 (see Figure 4). The housing 3 has a lid 31 and a housing section 32. The lid 31 is attached to the housing section 32 so as to partially close the opening of the housing section 32.

[0032] The shape of the housing 3 may be modified to match the shape of the object to which it is attached. In a plan view in the z direction, the shape of the housing 3 may be elliptical or rectangular (see Figure 9). As shown in Figure 3, in a plan view in the z direction, both ends of the housing 3 may be semicircular. In a plan view in the z direction, the housing 3 may be bent, for example, L-shaped. Depending on the shape of the object to which it is attached, the mounting surface 33a of the housing 3 may be a flat surface or a smooth curved surface. The housing 3 may be shaped to be embedded in the object, for example, in the shape of a male screw.

[0033] The housing 3 may be made of a metal material having high rigidity. The housing 3 may be made of a resin material. The housing 3 may be made of other rigid materials such as metal and resin.

[0034] Figure 5 is an exploded perspective view of the housing 3 according to the first embodiment. As shown in Figures 4 and 5, the housing portion 32 is concave and has a mounting surface 33a, an outer wall surface 33b, an opposing surface 34, and an inner wall surface 35. The lid portion 31 is flat and has an upper surface 33c and a lower surface 36. The opposing surface 34 is located opposite the mounting surface 33a. The opposing surface 34 is the bottom surface of the housing portion 32. When the lid portion 31 is attached to the housing portion 32, the inner wall surface 35 is connected to the lower surface 36. In this way, the opposing surface 34, the inner wall surface 35, and the lower surface 36 form the internal space of the housing 3.

[0035] The mounting surface 33a is the surface to which the device is attached to an object such as a cutting tool. The outer wall surface 33b is located opposite the inner wall surface 35. The upper surface 33c is located opposite the lower surface 36. The outer wall surface 33b is connected to the mounting surface 33a.

[0036] As shown in Figures 1 to 4, the direction in which the housing 3 extends is defined as the x-direction. The direction perpendicular to the x-direction is defined as the y-direction. The direction perpendicular to both the x-direction and the y-direction is defined as the z-direction. The opposing surface 34 and the mounting surface 33a are surfaces that extend in the x-direction and the y-direction, and are surfaces perpendicular to the z-direction. The opposing surface 34 and the lower surface 36 are spaced apart from each other in the z-direction, straddling the internal space of the housing 3.

[0037] The lid portion 31 may be provided with a first notch n1 and a through hole h. Each of the first notch n1 and the through hole h is formed to extend from the upper surface 33c to the lower surface 36.

[0038] As shown in Figures 1 to 4, the first notch n1 may be located, for example, at one end of the cover 31 in the x-direction. The first notch n1 may be located, for example, in the center of the cover 31 in the y-direction. As will be described later, the cable 8 is inserted through the first notch n1. The through hole h may be located in a position that overlaps the wireless communication unit 6, as shown in Figure 3.

[0039] As shown in Figure 4, the protective member 9 fills the internal space of the housing 3. The protective member 9 covers the substrate 4, the sensor 5, the wireless communication unit 6, and a portion of the cable 8. In this way, the protective member 9 protects the substrate 4, the sensor 5, and the wireless communication unit 6. The protective member 9 may also bond the housing 32 and the lid 31 together. As a result, the lid 31 can be attached to the housing 32. The protective member 9 may be formed of, for example, an insulating resin.

[0040] If the sensor 5 and substrate 4 inside the housing 3 are to be protected from processing oil and chips scattered from outside the housing 3 without using the protective member 9, it is necessary to completely isolate the sensor 5 and substrate 4 from the outside of the housing 3 without providing through holes h or the like in the housing 3. However, if the housing 3 is made of metal, radio waves will be blocked. As a result, it is not possible to wirelessly transmit information such as strain detected by the sensor 5 to the outside of the housing 3. On the other hand, in the sensor module 1 according to this embodiment, since the protective member 9 is made of resin, it is possible to wirelessly transmit information such as strain detected by the sensor 5 to the outside of the housing 3 without blocking radio waves.

[0041] The opposing surface 34 has a first opposing surface portion 34a and a second opposing surface portion 34b. Specifically, the opposing surface 34 is provided with a recess H1. As shown in Figure 4, the recess H1 is located opposite the cable 8 to the substrate 4 in the x-direction.

[0042] The recess H1 is formed from a second opposing surface portion 34b and a side portion 34c. The side portion 34c is connected to the first opposing surface portion 34a and the second opposing surface portion 34b. The side portion 34c may extend in a direction along the z-direction. In a plan view of the opposing surface 34, the side portion 34c may be formed to surround the sensor 5. The side portion 34c may be inclined with respect to the z-direction.

[0043] The second opposing surface portion 34b is the surface located in the recess H1 at the furthest point from the first opposing surface portion 34a in the z-direction. In other words, the second opposing surface portion 34b is the surface of the opposing surface 34 closest to the mounting surface 33a in the z-direction. From a different perspective, as shown in Figure 4, in the z-direction, the distance t2 between the second opposing surface portion 34b and the mounting surface 33a is smaller than the distance t1 between the first opposing surface portion 34a and the mounting surface 33a.

[0044] The opposing surface 34 may have only one recess H1. Alternatively, multiple recesses H1 may be formed on the opposing surface 34, corresponding to the number of sensors 5.

[0045] The substrate 4 is positioned on the first opposing surface 34a. The sensor 5 is positioned on the second opposing surface 34b. In this configuration, the sensor 5 is positioned on the opposing surface 34 at the shortest distance from the mounting surface 33a. This minimizes the distance from the sensor 5 to the object. In other words, if the sensor 5 is a strain sensor, it can accurately detect the strain of the object. If the sensor 5 is a temperature sensor, it can accurately detect temperature changes in the object. The recess H1 also serves as a marker for where to attach the sensor 5. The sensor 5 may also be positioned on the first opposing surface 34a.

[0046] As shown in Figure 2, the substrate 4 extends in the x-direction within the internal space of the housing 3. The substrate 4 includes an insulating layer such as resin and a circuit pattern (not shown) made of copper or the like formed on the surface of the insulating layer.

[0047] Figure 6 is a plan view of the substrate 4 according to the first embodiment. A connector 41, a wireless communication unit 6, and a terminal 7 are provided on the surface of the substrate 4. The substrate 4 is electrically connected to the sensor 5. Specifically, as shown in Figure 4, the sensor 5 is electrically connected to the substrate 4 via the connector 41 and wiring 42. The terminal 7 is connected to the cable 8. As mentioned above, the cable 8 is inserted through the first notch n1. In this way, the cable 8 extends from the internal space of the housing 3 to the outside. A portion of the cable 8 extending to the outside of the housing 3 may be electrically connected to a power supply (not shown) located outside the housing 3. In other words, the terminal 7 supplies power to the sensor 5 and the wireless communication unit 6 via the cable 8 connected to the power supply.

[0048] As shown in Figure 2, the terminal 7 may be positioned at the furthest point in the x-direction on the surface of the substrate 4 from the sensor 5. From a different perspective, the cable 8 may be positioned on the substrate 4 or at a position further away from the substrate 4. This allows the sensor 5 to be positioned near the insert if the object to which the sensor module 1 is attached is, for example, a cutting tool such as a cutting tool. Furthermore, because the cable 8 is positioned away from the insert, it can avoid interference with the insert and the workpiece.

[0049] From the perspective of the sensor 5, the wireless communication unit 6 may be positioned closer to the terminal 7 in the x-direction on the surface of the substrate 4. As mentioned above, in a plan view in the z-direction, the wireless communication unit 6 may be positioned to overlap with the through hole h (see Figure 3). In this way, even if the housing 3 is made of metal, the through hole h in the lid 31 allows information such as strain detected by the sensor 5 to be transmitted wirelessly to the outside.

[0050] An AD converter (not shown) may be placed on the surface of the substrate 4. The information such as strain detected by the sensor 5 is an analog signal. Therefore, by placing the AD converter on the surface of the substrate 4, the analog signal can be converted into a digital signal and transmitted to the wireless communication unit 6.

[0051] The sensor 5 according to the first embodiment may include, for example, a strain sensor. The sensor 5 may include, for example, a sensor capable of measuring a desired physical quantity. The sensor 5 may include, for example, a strain sensor, a temperature sensor, or an acceleration sensor.

[0052] The strain sensor may be a strain gauge having a metal circuit, a semiconductor sensor having a semiconductor element, or it may incorporate other strain measurement methods.

[0053] The configuration of the sensor 5 according to the first embodiment, when it has a strain gauge, will now be described. Figure 7 is a plan view of the sensor 5 according to the first embodiment. Figure 8 is a cross-sectional view along the line segment VIII-VIII in Figure 7. In Figure 7, the metal thin film pattern 52 is shown with a dotted line. The sensor 5 includes, for example, a base plate 51, a metal thin film pattern (metal thin film resistor) 52, a lead 54, and a protective layer 53.

[0054] A thin metal film pattern 52 and a protective layer 53 are formed on the surface of the base plate 51. The back surface of the base plate 51 can be placed on the opposing surface 34 using an adhesive. The base plate 51 may be made of, for example, an insulating ceramic material. The base plate 51 may also be made of stainless steel.

[0055] The metal thin film pattern 52 may include an electrode portion 52a. A lead 54 may be electrically connected to the electrode portion 52a. Alternatively, a metallic material such as copper, silver, or gold may be coated onto the surface of the electrode portion 52a, and the lead 54 may be soldered to the surface of the electrode portion 52a. The lead 54 is electrically connected to the wiring 42. The metal thin film pattern 52 may be made of, for example, nickel-chromium (NiCr) or chromium (Cr) based material.

[0056] The protective layer 53 is placed on the base plate 51 so as to cover the metal thin film pattern 52 and the lead 54. In this way, the protective layer 53 protects the metal thin film pattern 52. The protective layer 53 may be an insulating material such as a thin film of alumina (Al2O3) or silicon dioxide (SiO2).

[0057] When distortion occurs in the object, the metal thin film pattern 52 expands and contracts via the opposing surface 34 of the housing 3 and the base plate 51. As the metal thin film pattern 52 expands and contracts, its resistance changes, allowing the amount of distortion in the object corresponding to the change in resistance to be calculated. The resistance may be converted to a voltage using a bridge circuit. In this way, even if the change in resistance is minute, the amount of distortion can be measured from the voltage.

[0058] (Second Embodiment) <Sensor Module Configuration> Next, the sensor module 1 according to the second embodiment will be described. The sensor module 1 according to the second embodiment differs from the sensor module 1 according to the first embodiment mainly in that, in a plan view from the z direction, the substrate 4 overlaps the sensor 5, and in other respects, it is the same as the sensor module 1 according to the first embodiment. The following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.

[0059] Figure 9 is a perspective view of the sensor module 1 according to the second embodiment. Figure 10 is an exploded perspective view showing the internal structure of the sensor module 1 according to the second embodiment. Figure 11 is a plan view of the sensor module 1 according to the second embodiment. Figure 12 is a cross-sectional view along the line segment XII-XII in Figure 11. Figure 13 is an exploded perspective view of the housing 3 according to the second embodiment. Note that in Figure 12, the stepped portion 37 is shown by a dotted line.

[0060] As shown in Figures 9 to 13, the lid portion 31 may be provided with a second notch n2 and a third notch n3. Each of the second notch n2 and the third notch n3 is formed to extend from the upper surface 33c to the lower surface 36.

[0061] In a plan view from the z direction, the position of the second notch n2 may be changed to match the position of the cable 8. As shown in Figure 10, the terminal 7 is located at one end of the substrate 4 in the y direction. Therefore, in a plan view from the z direction, the cable 8 extends outward from one end of the internal space of the housing 3 in the y direction. Therefore, as shown in Figure 11, the second notch n2 may be located, for example, at one end of the lid 31 in the y direction.

[0062] The third notch n3 is located, for example, opposite the second notch n2 in the y-direction. The third notch n3 may be positioned to overlap the wireless communication unit 6, as shown in Figure 11. In this way, the position of the third notch n3 may be changed to match the position of the wireless communication unit 6 in a plan view from the z-direction.

[0063] As shown in Figure 13, a stepped portion 37 is provided at the boundary between the inner wall surface 35 of the housing 3 and the first opposing surface portion 34a. The stepped portion 37 protrudes from the first opposing surface portion 34a toward the lid portion 31. The stepped portion 37 has a mounting surface 37a and a side wall surface 37b. The mounting surface 37a is the surface on which the substrate 4 is placed. The mounting surface 37a extends along both the x and y directions. The mounting surface 37a is connected to the inner wall surface 35. The side wall surface 37b is connected to both the mounting surface 37a and the first opposing surface portion 34a. The side wall surface 37b extends along both the x and z directions.

[0064] In the z-direction, the mounting surface 37a is positioned above the sensor 5. In this way, by placing the substrate 4 on the mounting surface 37a of the stepped portion 37, the sensor 5 can be positioned between the opposing surface 34 (second opposing surface portion 34b) on which the sensor 5 is located and the substrate 4. In other words, in a plan view from the z-direction, the sensor 5 can be positioned so as to overlap the substrate 4 in the x-direction, and the housing 3 can be miniaturized in the x-direction.

[0065] (Third embodiment) <Sensor Module Configuration> Next, the sensor module 1 according to the third embodiment will be described. The sensor module 1 according to the third embodiment differs from the sensor module 1 according to the first embodiment mainly in that the housing portion 32 is flat and the lid portion 31 is concave, but in other respects it is the same as the sensor module 1 according to the first embodiment. The following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.

[0066] Figure 14 is an exploded perspective view showing the internal structure of the sensor module 1 according to the third embodiment. Figure 15 is an exploded perspective view of the housing 3 according to the third embodiment. As shown in Figures 14 and 15, the housing 32 is flat and has a mounting surface 33a and an opposing surface 34. The opposing surface 34 is located opposite the mounting surface 33a. As shown in Figure 14, the sensor 5 and the substrate 4 are mounted in the flat housing 32.

[0067] The lid 31 is concave and has an upper surface 33c, an outer wall surface 33b, an inner wall surface 35, and a lower surface 36. The inner wall surface 35 is connected to the lower surface 36. The outer wall surface 33b is located opposite the inner wall surface 35. The upper surface 33c is located opposite the lower surface 36. The outer wall surface 33b is connected to the upper surface 33c. When the lid 31 is attached to the housing 32, the inner wall surface 35 is connected to the opposing surface 34. In this way, the opposing surface 34, the inner wall surface 35, and the lower surface 36 form the internal space of the housing 3.

[0068] Since the housing section 32 is flat and lacks an inner wall surface 35 and an outer wall surface 33b, the rigidity of the housing section 32 is reduced. As a result, if the sensor 5 is a strain sensor, the sensor 5 mounted on the housing section 32 can detect even small strains.

[0069] As described above, in the sensor module 1 according to the third embodiment, the housing 3 has a concave lid portion 31 and a flat housing portion 32. However, the shapes of the housing portion 32 and the lid portion 31 may be changed as appropriate. For example, the lid portion 31 and the housing portion 32 may be concave relative to each other.

[0070] (Fourth Embodiment) <Sensor Module Configuration> Next, the sensor module 1 according to the fourth embodiment will be described. The sensor module 1 according to the fourth embodiment differs from the sensor module 1 according to the first embodiment mainly in that the power supply is housed in the internal space of the housing 3, and is otherwise the same as the sensor module 1 according to the first embodiment. The following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.

[0071] Figure 16 is an exploded perspective view showing the internal structure of the sensor module 1 according to the fourth embodiment. Figure 17 is a plan view of the sensor module 1 according to the fourth embodiment. Figure 18 is a cross-sectional view along the line segment XVIII-XVIII in Figure 17. As shown in Figures 16 and 18, the sensor module 1 has a power supply module 11 as a power source. The power supply module 11 includes a battery. The power supply module 11 is housed in the internal space of the housing 3. The power supply module 11 is electrically connected to terminal 7 via wiring. The lid 31 does not necessarily have to have a first notch n1 through which the cable 8 is inserted. In this way, the sensor module 1 has a structure in which there is no cable 8 extending from the internal space of the housing 3 to the outside.

[0072] If the power supply is located outside the housing 3, the location of the power supply or the length of the cable 8 connecting the power supply and the sensor module 1 will limit the location where the sensor module 1 can be installed. In the sensor module 1 according to the fourth embodiment, by mounting the power supply module 11 that supplies power to the sensor 5 in the internal space of the housing 3, the sensor module 1 can be installed on the object without being subject to the above limitations. Therefore, even when there are strict limitations on the space in which to install the sensor module 1, the sensor module 1 can be easily attached to the object.

[0073] Furthermore, if the object to which the sensor module 1 is attached is a cutting tool such as a turning tool, interference between the cable 8 and the insert, or between the cable 8 and the workpiece, is eliminated. For example, even during turning, interference between the rapidly rotating workpiece and the cable 8 is eliminated. In addition, the sensor module 1 can be attached to the object even if the object is moving or rotating.

[0074] The battery contained in the power supply module 11 may be a disposable battery or a replaceable battery. A partition may be provided near the power supply module 11 to prevent the protective member 9 from flowing into the power supply module 11 and covering the power supply module 11, thereby hindering battery replacement. The lid 31 may also be divided into a part that covers the power supply module 11 and a part that does not. In this way, when replacing the battery, the battery can be replaced by opening and closing only the part of the lid 31 that covers the power supply module 11.

[0075] The battery included in the power supply module 11 may support wired power supply or wireless power supply. If the battery supports wired power supply, a first notch n1 through which the cable 8 is inserted may be provided in the housing 3. If the battery supports wireless power supply, the first notch n1 through which the cable 8 is inserted may not be provided in the housing 3. Therefore, the battery can be charged easily.

[0076] The power supply module 11 can be placed anywhere within the internal space of the housing 3 without any particular restrictions, and may be placed near the terminal 7 as shown in Figure 18. As shown in Figure 18, the power supply module 11 may be placed further away from the sensor 5 than the circuit board 4. The power supply module 11 may also be placed closer to the sensor 5 than the circuit board 4.

[0077] (Fifth embodiment) <Sensor Module Configuration> Next, the sensor module 1 according to the fifth embodiment will be described. The sensor module 1 according to the fifth embodiment differs from the sensor module 1 according to the first embodiment mainly in that a groove 38 is provided on the opposing surface 34, and is otherwise the same as the sensor module 1 according to the first embodiment. The following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.

[0078] Figure 19 is an exploded perspective view of the housing 3 according to the fifth embodiment. Figure 20 is a partially enlarged plan view showing the internal structure of the sensor module 1 according to the fifth embodiment. As shown in Figures 19 and 20, grooves 38 are provided on the opposing surfaces 34.

[0079] As shown in Figure 20, in a plan view of the opposing surface 34, the groove 38 is positioned to overlap with the sensor 5. In other words, the sensor 5 is positioned on top of the groove 38. In a plan view of the opposing surface 34, the groove 38 may also be positioned to overlap with the recess H1. In this way, when strain occurs in the object, stress concentration occurs in the groove 38, and the strain detected by the sensor 5 increases. As a result, the sensor 5 can detect the strain of the object with high accuracy.

[0080] The groove 38 is formed from a third opposing surface 38a and a side surface 38b. The side surface 38b may be connected to the first opposing surface 34a, the second opposing surface 34b, and the third opposing surface 38a. The side surface 38b may extend in the direction along the z-direction. The side surface 38b may be inclined with respect to the z-direction.

[0081] As shown in Figure 19, the third opposing surface 38a may be the surface located furthest back from the first opposing surface 34a in the z-direction within the groove 38. In other words, the third opposing surface 38a may be the surface closest to the mounting surface 33a in the z-direction within the opposing surface 34.

[0082] As described above, in a plan view of the opposing surface 34, the sensor 5 is positioned on the second opposing surface portion 34b. In a plan view of the opposing surface 34, the side portion 34c of the recess H1 is formed to surround the sensor 5. That is, the width w1 of the recess H1 in the x direction is greater than the width w3 of the sensor 5 in the x direction, and the width k1 of the recess H1 in the y direction is greater than the width k3 of the sensor 5 in the y direction.

[0083] On the other hand, the groove 38 extends thinly in a certain direction, for example, the width w2 of the groove 38 in the x direction is shorter than the width k2 of the groove 38 in the y direction. As shown in Figure 20, in a plan view of the opposing surface 34, the groove 38 may be positioned in the center of the width w1 of the recess H1 in the x direction. In a plan view of the opposing surface 34, the groove 38 may be positioned in the center of the width w3 of the sensor 5 in the x direction. The width w2 of the groove 38 in the x direction may be smaller than the width w1 of the recess H1 in the x direction, and may also be smaller than the width w3 of the sensor 5 in the x direction. The width w2 of the groove 38 in the x direction may be 1 / 3 or less of the width w3 of the sensor 5 in the x direction. Multiple grooves 38 may be provided on the opposing surface 34, and multiple grooves 38 may be arranged at equal intervals in the x direction.

[0084] The width k2 of the groove 38 in the y-direction may be greater than the width k3 of the sensor 5 in the y-direction, and may also be greater than the width k2 of the recess H1 in the y-direction.

[0085] (Modified example of the fifth embodiment) Figure 21 is an exploded perspective view of the housing 3 according to the first modification in the fifth embodiment. Figure 22 is a partially enlarged plan view showing the internal structure of the sensor module 1 according to the first modification in the fifth embodiment. As shown in Figures 21 and 22, the third opposing surface portion 38a may be arranged on the same plane as the second opposing surface portion 34b.

[0086] From a different perspective, in the z-direction, the distance between the third opposing surface 38a and the mounting surface 33a may be the same as the distance t2 between the second opposing surface 34b and the mounting surface 33a. In other words, as shown in Figure 22, a pair of fourth notches n4 may be provided on the side surface 34c of the recess H1. The pair of fourth notches n4 may be arranged to sandwich the sensor 5 in the y-direction.

[0087] (Second modified example of the fifth embodiment) Figure 23 is an exploded perspective view of the housing 3 according to the second modification in the fifth embodiment. Figure 24 is a partially enlarged plan view showing the internal structure of the sensor module 1 according to the second modification in the fifth embodiment. As shown in Figures 23 and 24, the width k2 of the groove 38 in the y direction may be the same as the width k1 of the recess H1 in the y direction.

[0088] In a plan view of the opposing surface 34, the groove 38 may be surrounded by the side surface 34c of the recess H1. Therefore, the width k2 of the groove 38 in the y-direction may be smaller than the width k1 of the recess H1 in the y-direction.

[0089] (Third modified example of the fifth embodiment) Figure 25 is an exploded perspective view of the housing 3 according to the third modification in the fifth embodiment. Figure 26 is a partially enlarged plan view showing the internal structure of the sensor module 1 according to the third modification in the fifth embodiment. As shown in Figures 25 and 26, a recess H1 may not be formed on the opposing surface 34, and a groove 38 may be formed. A sensor 5 may be provided on the groove 38.

[0090] (Sixth Embodiment) <System Configuration> Next, a system 100 according to the sixth embodiment will be described.

[0091] Figure 27 is a perspective view of the system 100 according to the sixth embodiment. Figure 28 is a side view of the system 100 according to the sixth embodiment. The system 100 includes a sensor module 1 according to the first embodiment and a cutting tool 2. The cutting tool 2 may be, for example, a cutting tool.

[0092] The cutting tool 2 has a shank portion 21, an insert portion (cutting tip) 22, a fixing portion 23, and a base plate 24. The shank portion 21 may be cylindrical, or it may be a rectangular parallelepiped as shown in Figures 27 and 28. Specifically, the shank portion 21 has a first side surface 21a, a second side surface 21b, a third side surface 21c, a fourth side surface 21d, a first end surface 21e, and a second end surface 21f. As shown in Figures 27 and 28, the direction perpendicular to the first end surface 21e is defined as the X direction. The X direction may be substantially the same as the x direction. The direction perpendicular to the first side surface 21a is defined as the Y direction. The Y direction may be substantially the same as the y direction. The direction perpendicular to the second side surface 21b is defined as the Z direction. The Z direction may be substantially the same as the z direction. In other words, the shank portion 21 extends in the X direction. The second end face 21f is located opposite the first end face 21e in the X direction.

[0093] The shank portion 21 is attached to the turret of the machine tool. Specifically, the cutting tool 2 is fixed in place by the turret gripping the first side surface 21a and the third side surface 21c from the Y direction.

[0094] As shown in Figure 28, the second side surface 21b has a first region 21b1 and a second region 21b2. In the Z direction, the second region 21b2 is located further away from the fourth side surface 21d than the first region 21b1. The second region 21b2 is connected to the second end surface 21f.

[0095] A retaining portion 25, which is a recess for holding the insert portion 22, is formed at the boundary between the second end face 21f and the second side surface 21b of the second region 21b2. The insert portion 22 and the base plate 24 are arranged in the retaining portion 25. The insert portion 22 is stacked on top of the base plate 24.

[0096] A fixing portion 23 is positioned on the first side surface 21a near the second end surface 21f. The fixing portion 23 fixes the insert portion 22. The insert portion 22 is held in place by being sandwiched between the base plate 24 and the fixing portion 23.

[0097] The insert portion 22 has a first flank surface 22a, a second flank surface 22b, a corner flank surface 22c, and a rake surface 22d. The first flank surface 22a extends in the direction in which the second side surface 21b extends. The second flank surface 22b extends in the direction in which the second end surface 21f extends. The rake surface 22d extends in the direction in which the first side surface 21a extends. The corner flank surface 22c is located between the first flank surface 22a and the second flank surface 22b. The first flank surface 22a is the main flank surface. The second flank surface 22b is the secondary flank surface.

[0098] The sensor module 1 according to the first embodiment only needs to be attached to the shank portion 21, and the mounting surface 33a of the housing 3 may be attached to, for example, the first side surface 21a, the second side surface 21b, the third side surface 21c, and the fourth side surface 21d. The mounting surface 33a and the shank portion 21 may be mechanically fixed using screws or the like. The mounting surface 33a and the shank portion 21 may be simply fixed using adhesive. The shank portion 21 and the housing 3 may be fixed using magnets, fixed by fitting, fixed using clamps and vises, fixed by welding the mounting surface 33a and the shank portion 21, fixed by joining the mounting surface 33a and the shank portion 21 by friction stir welding or the like, or fixed by other fastening means.

[0099] The mounting surface 33a may be a polished surface. Specifically, in the housing 3, the surface roughness of the mounting surface 33a may be smaller than the surface roughness of the outer wall surface 33b and the surface roughness of the top surface 33c. The surface roughness (arithmetic mean roughness Ra) of the mounting surface 33a is, for example, 25 μm or less. In this way, the mounting surface 33a and the shank portion 21 can be easily fixed using an adhesive.

[0100] For measuring surface roughness, we will use the "SURFCOM 2800E" manufactured by Tokyo Seimitsu Co., Ltd. When measuring surface roughness, the measurement length and cutoff value will conform to the JIS (Japanese Industrial Standards) B0601:2001 standard. However, if the object to be measured is small and the standard measurement length cannot be secured, the measurement length will be set to a settable value, and the cutoff value will be set to 1 / 5 of the set measurement length, and the surface roughness will be measured.

[0101] The sensor 5 is positioned at one end of the internal space of the housing 3, which extends in the x-direction. Therefore, if the insert portion 22 is located at one end of the cutting tool 2, which extends in the x-direction, the sensor 5 can be positioned near the insert portion 22. Specifically, the sensor module 1 may be attached to the shank portion 21 such that the cable 8 is positioned near the first end face 21e in the x-direction, and the sensor 5 is positioned near the insert portion 22. From a different perspective, the sensor 5 may be positioned closer to the insert portion 22 than the cable 8 in the x-direction. In this way, physical quantities of the cutting tool 2 can be measured with high accuracy. The physical quantities to be measured may be, for example, strain, temperature, or acceleration generated in the shank portion 21. Furthermore, since the cable 8 is positioned away from the insert portion 22, the cable 8 can avoid interference with the insert portion 22 and with the workpiece.

[0102] <System Operation> Next, the operation of system 100 will be described. The cutting tool 2 processes a workpiece (material to be cut) by, for example, bringing the insert portion 22 into contact with the rotating workpiece. At this time, the sensor 5 detects the strain generated in the shank portion 21 via the housing 3. The signal containing information such as the strain detected by the sensor 5 is transmitted to the wireless communication unit 6, and from the wireless communication unit 6 it is transmitted to the outside of the housing 3. This signal is received and analyzed outside the housing 3 to determine the state of the cutting tool 2, which is the object being processed.

[0103] If the sensor 5 has a strain sensor, the rigidity of the housing portion 32 of the housing 3 may be less than or equal to the rigidity of the object. In this way, the strain generated in the shank portion 21 can be accurately detected by the sensor 5. In other words, the material of the housing 3 may be changed depending on the material of the object. The material of the housing 3 may be the same as the material of the object.

[0104] (Seventh Embodiment) <System Configuration> Next, the system 100 according to the seventh embodiment will be described. Figure 29 is a perspective view of the system 100 according to the seventh embodiment. The system 100 according to the seventh embodiment differs from the system 100 according to the sixth embodiment in that the sensor module 1 according to the second embodiment is attached to the cutting tool 2 which is the object, and is otherwise substantially the same as the system 100 according to the sixth embodiment. This makes it possible to attach a sensor module 1 that has been miniaturized in the x-direction to the shank portion 21, even when the width of the cutting tool 2 in the X-direction is small.

[0105] (Eighth embodiment) <System Configuration> Next, the system 100 according to the eighth embodiment will be described. Figure 30 is a perspective view of the system 100 according to the eighth embodiment. The system 100 according to the eighth embodiment differs from the system 100 according to the sixth embodiment in that a recess H2 into which the sensor module 1 is embedded is formed on the second side surface 21b, and is otherwise substantially the same as the system 100 according to the sixth embodiment.

[0106] The recess H2 is formed to open into the first region 21b1 of the second side surface 21b. The recess H2 is recessed from the second side surface 21b toward the fourth side surface 21d (along the Z direction). In a plan view of the second side surface 21b, the recess H2 extends along the X direction.

[0107] By embedding the sensor module 1 in the recess H2, the volume of the sensor module 1 protruding from the side of the shank portion 21 can be reduced. In this way, the sensor module 1 can avoid interference with the workpiece, interference with the machining tool, and interference with chips scattered during machining.

[0108] The shape of the recess H2 may be the same as the shape of the sensor module 1, or it may be larger than the sensor module 1. The depth of the recess H2 in the Z direction may be less than, the same as, or greater than the thickness of the sensor module 1 in the Z direction.

[0109] The shape of the recess H2 and the position in which the recess H2 is provided may be changed to suit the shape of the sensor module 1, the shape of the object, and the physical quantity to be measured. The recess H2 may be formed not only on the second side surface 21b of the shank portion 21, but also on the first side surface 21a, the third side surface 21c, the fourth side surface 21d, or the first end surface 21e.

[0110] The sensor module 1 may be powered by an externally located power source, a battery may be built into the recess H2, or the power supply module 11 may be housed in the internal space of the sensor module 1.

[0111] After embedding the sensor module 1 in the recess H2, the recess H2 may be covered with a cover member. In this way, even if chips and coolant generated during heavy cutting or other processes are scattered, the sensor module 1 can be protected from strong impacts caused by such chips and coolant.

[0112] After embedding the sensor module 1 in the recess H2, it is not necessary to cover the recess H2 with a cover member. In this way, it is not necessary to perform additional processing on the shank portion 21 for installing the cover member, and the sensor module 1 can be easily attached to the shank portion 21.

[0113] (Ninth Embodiment) <System Configuration> Next, the system 100 according to the ninth embodiment will be described. Figure 31 is an exploded perspective view of the system 100 according to the ninth embodiment. Figure 32 is a perspective view of the system 100 according to the ninth embodiment. The system 100 according to the ninth embodiment differs from the system 100 according to the eighth embodiment in that a fifth notch n5 into which the sensor module 1 is embedded is formed on the second side surface 21b and the third side surface 21c, and is otherwise substantially the same as the system 100 according to the eighth embodiment.

[0114] The fifth notch n5 is formed to open into the first region 21b1 of the second side surface 21b and the third side surface 21c. The fifth notch n5 is recessed from the third side surface 21c toward the first side surface 21a (along the Y direction). In a plan view of the third side surface 21c, the fifth notch n5 extends along the X direction.

[0115] The fifth notch n5 essentially has the same effect as the recess H2 in the system 100 according to the eighth embodiment, and by embedding the sensor module 1 in the fifth notch n5, the volume of the sensor module 1 protruding from the side surface of the shank portion 21 can be reduced. In this way, the sensor module 1 can avoid interference with the workpiece, interference with the machining equipment, and interference with chips scattered during machining.

[0116] Furthermore, during machining, the distortion caused by bending resulting from the main component force acting on the cutting tool 2 (in the system 100 according to the ninth embodiment, the force acting in the direction along the first side surface 21a to the third side surface 21c) can be measured with high accuracy.

[0117] The shape of the fifth notch n5 may be the same as the shape of the sensor module 1, may be larger than the sensor module 1, or may be smaller than the sensor module 1, with a part of the sensor module 1 protruding from the fifth notch n5. The depth of the fifth notch n5 in the Y direction may be less than, the same as, or greater than the thickness of the sensor module 1 in the Z direction.

[0118] The shape of the fifth notch n5 and the position in which the fifth notch n5 is provided may be changed to suit the shape of the sensor module 1, the shape of the object, and the physical quantity to be measured. The fifth notch n5 may be formed on multiple surfaces of the shank portion 21, including the second side surface 21b and the third side surface 21c, as well as any of the first side surface 21a, the fourth side surface 21d, and the first end surface 21e.

[0119] As shown in Figure 32, the fifth notch n5 opens into the second side surface 21b. Therefore, when the sensor module 1 is embedded in the fifth notch n5, a portion of the outer wall surface 33b is exposed from the fifth notch n5. A sixth notch n6 may be provided in the area of ​​the outer wall surface 33b that is exposed from the fifth notch n5. The sixth notch n6 is formed to reach the inner wall surface 35 from the outer wall surface 33b. The cable 8 may be inserted through the sixth notch n6. In this way, even if the first side surface 21a and the third side surface 21c are gripped by the turret from the Y direction, the cable 8 can be connected to a power source located outside the housing 3 without interfering with the turret. Note that a power source such as a power supply module 11 including a battery may be housed in the internal space of the housing 3.

[0120] Furthermore, since a sixth notch n6 is provided in the area exposed from the fifth notch n5 on the outer wall surface 33b, even if the first side surface 21a and the third side surface 21c are gripped by the turret from the Y direction, information such as strain detected by the sensor 5 can be transmitted wirelessly to the outside from the sixth notch n6 of the housing 3.

[0121] After embedding the sensor module 1 in the sixth notch n6, the sixth notch n6 may be covered with a cover member. In this way, even if chips and coolant generated during heavy cutting are scattered, the sensor module 1 can be protected from strong impacts caused by such chips and coolant.

[0122] After embedding the sensor module 1 in the sixth notch n6, it is not necessary to close the sixth notch n6 with a cover member. In this way, it is not necessary to perform additional processing on the shank portion 21 for installing the cover member, and the sensor module 1 can be easily attached to the shank portion 21.

[0123] Next, the effects and benefits of the sensor module 1 related to this disclosure will be explained. To understand the state of an object such as a cutting tool, it is necessary to install a sensor 5 on the object. For example, if a cavity is created inside the shank portion 21 and the sensor 5 is embedded therein, the rigidity of the cutting tool 2 may decrease. In particular, if a cavity is created near the insert portion 22, the rigidity of the cutting tool 2 may decrease significantly. Therefore, it has been difficult to attach the sensor 5 to an object such as a cutting tool 2 in order to measure the physical quantities of the cutting tool 2 using the sensor 5 near the insert portion 22.

[0124] The sensor module 1 according to this disclosure comprises a sensor 5 and a housing 3. The housing 3 houses the sensor 5. The housing 3 has a mounting surface 33a and an opposing surface 34. The mounting surface 33a is attached to an object. The opposing surface 34 is located opposite the mounting surface 33a. The sensor 5 is provided on the opposing surface 34. This allows the sensor module to be easily attached to an object. Furthermore, the sensor 5 can be attached to an object, such as a cutting tool 2, without reducing the rigidity of the object.

[0125] According to the sensor module 1 of this disclosure, the sensor 5 may have a strain sensor. This makes it possible to measure the strain of an object.

[0126] The sensor module 1 according to this disclosure may include a substrate 4 electrically connected to the sensor 5. As a result, the sensor 5 receives power via the substrate 4. Furthermore, information detected by the sensor 5 can be transmitted to the wireless communication unit 6 via the substrate 4.

[0127] The sensor module 1 according to this disclosure may be provided on a substrate 4 and include a terminal 7 for supplying power to the sensor 5. This allows power to be supplied to the sensor 5 from a power source such as a power supply module 11 located outside the housing 3 via the terminal 7.

[0128] The sensor module 1 according to this disclosure may include a power supply module 11 electrically connected to terminal 7. This allows power to be supplied from the power supply module 11 to the sensor 5 via terminal 7.

[0129] According to the sensor module 1 of this disclosure, the power supply module 11 may be housed in the housing 3. This eliminates the need for a cable 8 to extend outside the housing 3. Furthermore, even when there are strict space limitations for mounting the sensor module 1, the sensor module 1 can be easily attached to the object. In addition, if the object to which the sensor module 1 is attached is a cutting tool such as a cutting tool, interference between the cable 8 and the insert portion 22, or interference between the cable 8 and the workpiece, is eliminated.

[0130] The sensor module 1 according to this disclosure may include a cable 8 connecting the terminal 7 and the power supply module 11. The cable 8 may be located on the substrate 4, or at a position further away from the substrate 4 when viewed from the sensor 5. This allows the sensor 5 to be positioned near the insert portion 22 if the object to which the sensor module 1 is attached is, for example, a cutting tool 2 such as a cutting tool. Furthermore, because the cable 8 is located away from the insert portion 22, the cable 8 can avoid interference with the insert portion 22 and with the workpiece.

[0131] According to the sensor module 1 of this disclosure, the sensor 5 may be arranged between the opposing surface 34 and the substrate 4. This allows for miniaturization of the sensor module 1.

[0132] The sensor module 1 according to this disclosure may include a protective member 9 that covers the sensor 5. This protects the sensor 5. The protective member 9 can also be used to bond and fix the housing portion 32 and the lid portion 31 of the housing 3.

[0133] According to the sensor module 1 of this disclosure, the protective member 9 may be made of resin. This allows the information detected by the sensor 5 to be transmitted wirelessly to the outside of the housing 3.

[0134] According to the sensor module 1 of this disclosure, the sensor 5 may be positioned on the opposing surface 34 at the position with the shortest distance from the mounting surface 33a. If the sensor 5 is a strain sensor, this will result in the closest possible distance from the sensor 5 to the object, allowing the sensor 5 to accurately detect the strain of the object. If the sensor 5 is a temperature sensor, this will also result in the closest possible distance from the sensor 5 to the object, allowing the sensor 5 to accurately detect temperature changes of the object.

[0135] According to the sensor module 1 of this disclosure, a recess H1 may be provided on the opposing surface 34. A sensor 5 may be placed in the recess H1. If the sensor 5 is a strain sensor, the distance from the sensor 5 to the object will be reduced, allowing the sensor 5 to accurately detect the strain of the object. If the sensor 5 is a temperature sensor, the distance from the sensor 5 to the object will be minimized, allowing the sensor 5 to accurately detect temperature changes of the object. Furthermore, the recess H1 serves as a marker for where to attach the sensor 5. The sensor module 1 of this disclosure may be a sensor unit having a sensor 5, or it may be a sensor device.

[0136] According to the sensor module 1 of this disclosure, a groove H2 may be provided on the opposing surface 34. The sensor 5 may be placed on the groove H2. This causes stress concentration in the groove H2, increasing the strain detected by the sensor 5. As a result, the sensor 5 can accurately detect the strain of the object.

[0137] The system 100 according to this disclosure comprises a sensor module 1 according to the above embodiment and an object. The object is an element involved in machining or plastic deformation. This allows for the measurement of physical quantities of the element involved in machining or plastic deformation. As a result, the state of the element involved in machining or plastic deformation, which is the object, can be determined from the measured physical quantities. Note that the object is not limited to a cutting tool 2. The object may be, for example, an element involved in machining, and the element involved in machining may be, for example, a component of a machine tool such as a cutting tool, turret, spindle, tool post, table, and chuck, or it may be a workpiece, or it may be anything else that affects machining. Furthermore, the object may be, for example, an element involved in plastic deformation, and the element involved in plastic deformation may be, for example, a mold, punch, die, base of a forging machine, and frame, or it may be anything else that affects plastic deformation. The system 100 according to this disclosure may have, for example, a turret in addition to the sensor module 1 according to the above embodiment.

[0138] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The basic scope of this disclosure is indicated by the claims rather than the embodiments described above, and all modifications within the meaning and scope of the claims are intended to be included. [Explanation of symbols]

[0139] 1 Sensor module, 2 Cutting tool, 3 Housing, 4 Circuit board, 5 Sensor, 6 Wireless communication unit, 7 Terminal, 8 Cable, 9 Protective member, 11 Power supply module, 21 Shank part, 21a First side, 21b Second side, 21b1 First area, 21b2 Second area, 21c Third side, 21d Fourth side, 21e First end face, 21f Second end face, 22 Insert part, 22a First relief face, 22b Second relief face, 22c Corner relief face, 22d Rake face, 23 Fixing part, 24 Base plate, 25 Holding part, 31 Lid part, 32 Storage part, 33a Mounting surface, 33b Outer wall surface, 33c Top surface, 34 Opposing surface, 34a First opposing surface part, 34b Second opposing surface part, 34c, 38b Side parts, 35 36 Inner wall surface, 37 Bottom surface, 37 Stepped section, 37a Mounting surface, 37b Side wall surface, 38 Groove section, 38a Third opposing surface section, 41 Connector, 42 Wiring, 51 Base plate, 52 Metal thin film pattern (metal thin film resistor), 52a Electrode section, 53 Protective layer, 54 Lead, 100 System, h Through hole, n1 First notch, n2 Second notch, n3 Third notch, n4 Fourth notch, n5 Fifth notch, n6 Sixth notch, H1, H2 Recess, k1, k2, k3, w1, w2, w3, k1 Width, t1, t2 Distance.

Claims

1. A housing having a mounting surface to be attached to an object containing elements involved in machining or plastic deformation, and an opposing surface located opposite to the mounting surface, A sensor provided on the opposing surface within the housing and attached to the mounting surface measures the physical quantity of the object, The housing includes a substrate that is disposed within the housing and electrically connected to the sensor, The sensor includes at least one of a strain sensor, an acceleration sensor, and a temperature sensor. The housing includes a first region where the sensor is arranged, and a second region adjacent to the first region along the mounting surface where the substrate is arranged, which is a sensor module.

2. The sensor module according to claim 1, wherein the substrate is arranged in the second region such that it does not overlap with the sensor arranged in the first region.

3. The housing further includes a stepped portion having a mounting surface on which the substrate is mounted, The sensor module according to claim 1, wherein the substrate is mounted on the mounting surface of the stepped portion, and is positioned in the second region such that a portion of the substrate overlaps with the sensor positioned in the first region.

4. A housing having a mounting surface to be attached to an object including an element involved in machining or plastic deformation, and a facing surface located opposite to the mounting surface, A sensor provided on the opposing surface within the housing and attached to the mounting surface measures the physical quantity of the object, The housing includes a substrate that is disposed within the housing and electrically connected to the sensor, The sensor includes at least one of a strain sensor, an acceleration sensor, and a temperature sensor. The substrate is provided with terminals for supplying power to the sensor. A sensor module further including a power supply module electrically connected to the aforementioned terminals.

5. The sensor module according to claim 4, wherein the power supply module is housed in the housing.

6. The system further includes a cable connecting the terminal and the power supply module, The sensor module according to claim 4, wherein the cable is located on the substrate or at a position further away from the substrate than the sensor.

7. A housing having a mounting surface to be attached to an object including an element involved in machining or plastic deformation, and a facing surface located opposite to the mounting surface, A sensor provided on the opposing surface within the housing and attached to the mounting surface measures the physical quantity of the object, The housing includes a substrate that is disposed within the housing and electrically connected to the sensor, The sensor includes at least one of a strain sensor, an acceleration sensor, and a temperature sensor. The opposing surface is provided with a recess, A sensor module in which the sensor is positioned in the recess.

8. A housing having a mounting surface to be attached to an object including an element involved in machining or plastic deformation, and a facing surface located opposite to the mounting surface, A sensor provided on the opposing surface within the housing and attached to the mounting surface measures the physical quantity of the object, The housing includes a substrate that is disposed within the housing and electrically connected to the sensor, The sensor includes at least one of a strain sensor, an acceleration sensor, and a temperature sensor. The opposing surfaces are provided with grooves, The sensor is a sensor module positioned on the groove.

9. The aforementioned substrate further includes a wireless communication unit, The sensor module according to any one of claims 1 to 8, wherein the housing includes a transparent portion that transmits radio waves from the wireless communication unit.

10. The sensor module according to any one of claims 1 to 8, further comprising a protective member covering the sensor.

11. The sensor module according to any one of claims 1 to 8, wherein the sensor is positioned on the opposing surface at the position with the shortest distance from the mounting surface.

12. A sensor module according to any one of claims 1 to 8, A system including the object to which the sensor module is attached.

Images