Facilities and methods for surface treatment of long products intended for wire drawing.

Abstract

The invention relates to a facility (5) for treating moving elongated products (3) made of metal having a surface covered with an oxide layer, comprising a peeling assembly (7) with a group (11, 11a, 11b) of lasers (13) distributed around the elongated product (3), and a control device (9) for obtaining information about the elongated product (3), the control device (9) being configured to determine operating parameters to be prescribed in the peeling assembly (7) for peeling off the oxide layer and for ablating a metal layer of a given thickness and to obtain a given roughness in the elongated product (3) by comparing them with experimental results previously recorded in the control device (9) and by prescribing the operating parameters to the peeling assembly (7).

Description

[Technical Field]

[0001] The present invention relates to a facility and method for treating the surface of a long product for the purpose of drawing the long product after the long product has been exposed to an oxidizing atmosphere for some of its chemical elements, such as during residence time in a heat treatment furnace. [Background technology]

[0002] In the following text, the field of wire and strip stainless steel of all classifications (austenitic, ferritic, austenitic-ferritic, etc.) is considered a privileged example of the application of the present invention. However, this is not limiting, and it should be understood that the present invention can be applied to other metals that have similar technical problems to those faced in stainless steel wire and strip stainless steel, specifically to various grades of carbon steel and, in particular, special alloys such as iron alloys.

[0003] Such elongated products are typically manufactured by a series of processes that include heating a semi-finished product (specifically, a billet), hot rolling it to produce an elongated product, wrapping the elongated product around a crown, and then annealing the crown in a furnace under a reducing atmosphere or a gas furnace under an oxidizing atmosphere.

[0004] The resulting elongated products are intended to be drawn using wire drawing dies to improve the dimensional accuracy and mechanical properties of the elongated products.

[0005] The series of processes performed before wire drawing, more specifically hot rolling and annealing, will result in the formation of an oxide layer on the surface of the elongated product if they are not carried out under a completely reducing or inert atmosphere. The oxide has a composition that varies substantially depending on the composition of the base metal and the state of its formation. Most commonly, in the case of stainless steel, oxides of the elements Fe, Cr, Mn, and Si are dominant, and in grades containing the aforementioned elements, oxides of the elements Ni, Nb, and Cu are also dominant.

[0006] These undesirable oxides should be removed before drawing, specifically to prevent them from becoming embedded in the surface of the long product during the drawing process, resulting in an insufficient surface finish.

[0007] It should be understood that the undesirable oxide layer referred to herein is not a thin layer based on Cr oxide (the so-called "passivation layer") that spontaneously forms on the surface of stainless steel in air at ambient temperature and protects the stainless steel from oxidation. The oxide layer that causes the problem and that we wish to eliminate is the layer that forms during the residence time of the product at high temperatures in an oxidizing atmosphere. When such a layer is removed, the surface of the stainless steel is exposed, and the protective passivation layer of Cr oxide quickly and spontaneously forms again, allowing the stainless steel to return to normal use conditions.

[0008] Furthermore, before wire drawing is performed, the long product requires a surface preparation step intended to adjust the surface roughness of the product. This roughness adjustment provides good adhesion for the soap deposited on the surface of the long product immediately before wire drawing, thereby facilitating the drawing process.

[0009] Conventionally, undesirable oxide layers have been removed using chemical stripping methods, electrolytic stripping methods, or a series of these stripping methods.

[0010] Chemical stripping is carried out in one or more baths of hydrofluoric acid, hydrochloric acid, sulfuric acid, or nitric acid. Electrolytic stripping is typically carried out in a bath of sodium sulfate or a bath of an acid (nitric acid or sulfuric acid).

[0011] Chemical stripping is the most radical method for removing unwanted oxides. Stripping is carried out on long products when forming the crown or when moving. Chemical stripping is also used to change the surface roughness of long products so that the products can be drawn more easily.

[0012] However, chemical stripping has many drawbacks.

[0013] Specifically, chemical stripping consumes large amounts of acid, and in addition, there is little possibility of recovering part of the acid for subsequent use.

[0014] The infrastructure required for the implementation of chemical stripping, namely, the baths for continuous stripping and their auxiliary equipment, is expensive and bulky.

[0015] Such facilities use dangerous products, more specifically, hydrofluoric acid. Its liquid and solid pollution discharges (sludge containing oxides mixed with stripping liquid) need to be stored and reprocessed in accordance with strict regulations that will only become more stringent in the future, which is costly. The heated acid bath also emits acid vapors that need to be neutralized. Nitric acid is also a source of NO emissions that need to be captured and treated. X emission source.

[0016] The presence of hexavalent chromium dissolved in the stripping liquid also means a high risk to human health and the environment, and the concentration of hexavalent chromium in the liquid and human exposure are measured and monitored.

[0017] Furthermore, the stripping time can be very long, on the order of several tens of minutes for grades of steel with high corrosion resistance.

[0018] The peeling of long products in the form of a crown reduces the scale of the peeling facility but may result in non-uniform peeling of the products. In fact, the coating of the coil and the link holding the crown can prevent the peeled product from reaching a specific area of the product, and the innermost coil is exposed less to the peeled product than the outer coils.

[0019] Therefore, in at least some cases, the possibility of replacing chemical or electrolytic peeling of long products by a method using lasers has been studied.

[0020] Specifically, documents CN210816759U, CN210647767U, CN108405652A, and KR101735006B1 describe facilities for peeling a moving metal wire using a plurality of lasers distributed around the metal wire. More specifically, the lasers are regularly arranged around the circumference of a circle whose center is occupied by the wire being processed.

[0021] Such a solution is not entirely satisfactory. In fact, this solution alone cannot provide complete peeling of the oxide layer. Furthermore, replacing chemical peeling by laser treatment does not make it possible to solve the problem of wire roughness, and the peeling solutions proposed by the said documents provide wire roughness that is not necessarily suitable for wire drawing. Therefore, the roughness can be adjusted by chemical peeling, and in such cases, as mentioned above, the problems associated with chemical peeling will not be solved.

Prior Art Documents

Patent Documents

[0022]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

[0023] Therefore, the object of the present invention is to propose a facility and method for processing long metal products that makes it possible to provide long products suitable for wire drawing without additional work and to eliminate the aforementioned drawbacks of chemical stripping. [Means for solving the problem]

[0024] Therefore, the subject of the present invention is a facility for processing a moving metal long product in preparation for the wire drawing step, wherein the long product has at least one surface covered with a layer of oxide, and the facility is - A peeling assembly comprising at least one group of multiple lasers distributed around a moving elong product, each laser configured to emit a beam onto the surface to peel off the surface of the moving elong product, and each laser intended for processing relevant portions of the surface of the elong product, - A control device that acquires information about a long product while it is moving, the information including the speed at which the long product is moving and at least one characteristic dimension of the long product in a plane perpendicular to the axis of movement of the long product. Equipped with, The control device is - To obtain the removal of an oxide layer from the surface of a long product, to ablate a metal layer of a predetermined thickness from the surface of a long product, and to determine the operating parameters to be applied to the delamination assembly in order to obtain a predetermined roughness on the surface of the long product by comparing it with experimental results previously recorded in the control device, - The operation parameters are given to the peel-off assembly. This facility is characterized by being configured to do so.

[0025] According to one embodiment, the lasers of that group of lasers or each of the lasers of each group are evenly distributed around the elongated product as it moves.

[0026] According to one embodiment, the operating parameters include the radiant intensity of the lasers of the group or each of the groups, and / or the laser / material interaction time at each location on the surface of the elongated product.

[0027] Preferably, the peel-off assembly comprises a distribution system configured to shape the laser beams emitted by the group or multiple lasers in each group so that the laser beams cover the entire surface of the elongated product during its movement, or to move the laser beams across the surface of the elongated product.

[0028] According to one embodiment, the distribution system includes an optical device configured to convert, for each laser in at least one group, each beam emitted by the associated laser into a bandwidth that affects a portion of the surface of a long product.

[0029] In the variation, the distribution system includes a scanning device configured to move the beam generated by the relevant laser across the surface of a long product at a predetermined scanning speed and scanning pitch, for each laser in at least one group, such that the beam emitted by each laser affects a portion of the surface of the long product.

[0030] Preferably, the operating parameters include the scanning speed and scanning pitch of the scanning device.

[0031] According to one embodiment, a portion of the surface of the elongated product is defined by two straight lines on the surface of the elongated product that are parallel to the axis of movement.

[0032] Preferably, the peeling assembly comprises a first group of multiple first lasers distributed around a moving elongated product and a second group of multiple second lasers distributed around the moving elongated product, each second laser being downstream of each first laser in the first group with respect to the axis of movement.

[0033] Generally, the first laser is configured to etch an oxide layer on the surface of a long product and ablate a metal layer of a predetermined thickness on the surface of the long product, while the second laser is configured to impart a predetermined roughness to the surface of the long product.

[0034] Preferably, the first laser is a continuous-emission laser, and the second laser is a continuous-emission laser or a laser configured to emit a pulsed beam, specifically a nanosecond laser.

[0035] A further subject of the present invention is a method for processing a moving metal elong product in preparation for a wire drawing step using a processing facility according to the present invention, wherein the elong product has at least one surface covered with a layer of oxide, - A step of acquiring information about a long product while it is moving, using a control device, wherein the information includes the speed at which the long product is moving and at least one characteristic dimension of the long product in a plane that crosses the axis of movement of the long product. - A step in which the control device determines, according to information about the moving long product, the operating parameters given to the delamination assembly for obtaining the delamination of an oxide layer on the surface of the long product, for ablating a metal layer of a predetermined thickness on the surface of the long product, and for obtaining a predetermined roughness on the surface of the long product by comparison with experimental results previously recorded in the control device, - A step of control by a control device for the peeled assembly to provide the aforementioned operating parameters to the peeled assembly. - Steps of emitting a laser beam onto the surface of a moving long product by the peeling assembly, according to the operating parameters determined by the control device, using a laser. This method includes [something].

[0036] According to one embodiment, during the radiation step, the laser beam is emitted by lasers evenly distributed around a moving elongated product.

[0037] Preferably, during the emission step, the laser beam is shaped or moved across the surface of the elongated product by the distribution system of the delamination assembly, and controlled by a control device in such a way that the laser beam emitted by the group or multiple lasers in each group covers the entire surface of the elongated product as the elongated product moves.

[0038] According to one embodiment, the distribution system includes an optical device that, for each laser in at least one group, converts each beam emitted by the associated laser into a flake that affects a portion of the surface of a long product.

[0039] In the variant, the distribution system includes a scanning device that moves the beam generated by the relevant laser across the surface of a long product according to a scanning speed and scanning pitch determined and controlled by a control device, so that for each laser in at least one group, the beam emitted by each laser affects a portion of the surface of the long product.

[0040] For example, a scanning device moves a beam along a first direction that forms an angle with respect to the axis of movement that falls between 0° and 90°, such as 45°, and along a second direction perpendicular to the first direction. The two directions are, for example, perpendicular and parallel to the axis of movement, or each forms a non-zero angle with respect to the axis of movement.

[0041] According to one embodiment, a portion of the surface of a long product is defined by two lines on the surface of the long product that are parallel to each other, specifically parallel to the axis of movement.

[0042] Preferably, the peel assembly comprises a first group of multiple first lasers distributed around a moving elong product and a second group of multiple second lasers distributed around a moving elong product, each second laser being downstream of each first laser in the first group with respect to the axis of movement, and the radiation step includes emitting laser beams onto the surface of the moving elong product by the lasers of the first group and the lasers of the second group.

[0043] Generally, the first laser exfoliates the oxide layer on the surface of the long product and ablates a metal layer of a predetermined thickness on the surface of the long product, and then the second laser imparts a predetermined roughness to the surface of the long product.

[0044] A further subject of the present invention is a long metal product for wire drawing, wherein the long product has a periodic roughness pattern on its surface, and the width of the periodic pattern is between 5 μm and 1 mm.

[0045] Generally, the width of the periodic patterns falls between 5 μm and 200 μm.

[0046] According to one embodiment, the periodic pattern consists of periodic streaks including a regular alternation of protruding lines and grooves, or a pattern including a regular alternation of peaks and valleys along first and second singular directions.

[0047] Generally, the average height between ridges and grooves, or between peaks and valleys, falls within the range of 0.2 μm to 500 μm.

[0048] Long products specifically refer to wire or strip materials.

[0049] Long products will be drawn without undergoing surface preparation treatment by chemical or mechanical stripping.

[0050] The present invention will be better understood by reading the following description, which is given with reference to the attached drawings. [Brief explanation of the drawing]

[0051] [Figure 1] This is a schematic diagram showing an overview of a laser peeling facility according to an embodiment of the present invention. [Figure 2] This figure shows an example of laser arrangement around a moving product according to one embodiment. [Modes for carrying out the invention]

[0052] The processing facilities described in detail and illustrated by example are basically described with reference to the processing of moving stainless steel wires that have been annealed in the form of crowns.

[0053] The processing facility according to the described invention may be incorporated into a continuous processing line having more or fewer devices than those described, or it may be the subject of a separate facility specifically dedicated to such processing.

[0054] Furthermore, equipment that does not have a primary metallurgical role and, in all cases, does not itself intervene in the execution of the process carried out by the present invention, and which is normally present in such a line, is not shown. Specifically, this includes straightening machines and wire guides for moving long products, as well as wire storage units that serve as "buffers" between several pieces of equipment, each requiring different speeds of product movement.

[0055] The illustrated continuous line initially includes facility 1 for unwinding the crown 2 of a hot-rolled stainless steel long product 3.

[0056] The long product 3 is, for example, a strip or a wire.

[0057] The strip material has, for example, a width that falls between 1 mm and 8 mm, and a thickness that falls between 0.1 mm and 3 mm.

[0058] The wire material has a diameter that falls between, for example, 1 mm and 14 mm.

[0059] The long product 3, specifically the wire or strip material, has a weight that falls between, for example, 10 kg and 1000 kg.

[0060] The long product 3 includes a layer of oxide on its surface with a thickness generally ranging from 0.2 μm to 30 μm.

[0061] Long product 3 typically moves at speeds of up to 15 m / s.

[0062] According to the embodiment shown in Figure 1, the processing facility 5 is located in the line downstream of the unwinding facility 1 and upstream of the wire drawing facility 6. In this embodiment, the unwinding facility 1, the processing facility 5, and the wire drawing facility 6 are arranged in a continuous line.

[0063] The processing facility 5 comprises a peeling assembly 7 and a control device 9.

[0064] The delamination assembly 7 is intended to delaminate an oxide layer from the surface of the elongated product 3, ablate a metal layer of a predetermined thickness from the surface of the elongated product 3, and treat the surface of the elongated product 3 to obtain a predetermined roughness. More specifically, the delamination assembly 7 is configured to uniformly treat the surface of the elongated product 3 so that the surface condition of the elongated product 3 is uniform across the entire surface.

[0065] The delamination assembly 7 is intended to delaminate the oxide layer by ablation, sublimation, or evaporation of the oxide.

[0066] The layer of metal to be ablated lies beneath the oxide layer. Ablation of a metal layer of a predetermined thickness on the surface of the long product 3 allows for the acquisition of a better quality surface at the end of the process. In fact, the metal beneath the oxide layer generally contains surface defects, internal oxides, and areas with a different chemical composition from the core of the metal, which should be removed.

[0067] The thickness of the ablated metal layer typically ranges from 5 μm to 50 μm. For example, for a long product made from nickel alloy 625, the thickness ranges from 10 μm to 15 μm.

[0068] Obtaining a predetermined roughness on the surface of the long product 3 optimizes the adhesion of the soap used for drawing the wire, thereby resulting in improved wire drawing performance.

[0069] The desired roughness depends on the metal's composition, dimensions, and desired wire drawing performance.

[0070] Roughness is evaluated by measurement along the transverse direction of a long product using a contact probe, according to the standard NF EN ISO 4287:1998.

[0071] For example, for a grade with low roughness (specifically type 625), the cutoff frequency λc = 0.8 mm (or Ra) 0.8 The roughness Ra (measured by ) is less than 1.4 μm.

[0072] For grades with larger indentations in topography or relief (specifically, grade 286), the cutoff frequency λc = 2.5 mm (or Ra) 2.5 The roughness Ra (measured by ) is less than 6 μm and generally greater than 1.4 μm.

[0073] The delamination assembly 7 comprises at least one group 11 of multiple lasers 13 intended to be distributed around the elongated product 3 during the movement of the elongated product 3. The lasers are, for example, intended to correspond to the central axis of the elongated product during the movement of the elongated product, and thereafter to the axis A of movement. d It is located around an axis that is called [name of axis].

[0074] Each laser 13 is intended to process a portion of the surface of the elongated product 3. Specifically, each portion assigned to a given laser 13 is defined by two straight lines on the surface of the elongated product parallel to the direction of movement.

[0075] Each portion generally extends through the length of the long product 3.

[0076] Specifically, when the long product 3 is a strip, the portion assigned to each laser 13 is a piece of a predetermined width on the surface of the product (therefore, the width is equal to the distance between two straight lines defining the portion).

[0077] If the long product 3 is a wire, the portion assigned to each laser 13 is a portion of the surface of the wire 3 defined by two straight lines parallel to the direction of movement, where the two straight lines are the axis of movement A d And, β i It forms a given angle represented by .

[0078] A portion of the set of lasers 13 in the same group 11 covers the entire surface of the product. Thus, in the case of wire, angle β i The sum of these is 360° or more.

[0079] Preferably, the sum of the surface areas of the portions assigned to the lasers 13 in the same group 11 is greater than the surface area of the surface of the elongated product. In such a case, each portion assigned to a laser 13 partially overlaps the portions assigned to two other lasers 13. Thereby, it is possible to prevent or minimize the difference in surface state that may exist between the central region of a portion and the region located at the periphery of the portion that may receive a laser output smaller than the output received by the central region of the portion. The overlap of a portion by another portion actually allows the overlapping regions of the two portions that are respectively located at the periphery of each portion processed by the two lasers 13.

[0080] Preferably, the portions assigned to the lasers 13 are of equal dimensions. For example, when the elongated product 3 is a wire rod, the angles β i associated with the lasers of group 11 are equal to each other. For example, the lasers 13 of group 11 are regularly distributed around the wire rod 3, and the angles β i associated with the lasers 13 of group 11 are equal to each other.

[0081] In the illustrated example, the peeling assembly 7 comprises two groups, namely a first group 11a of a plurality of first lasers 13 distributed around the moving elongated product 3 and a second group 11b of a plurality of second lasers equally distributed around the moving elongated product 3.

[0082] The second lasers of the second group 11b are downstream of the first lasers of the first group 11a with respect to the direction of movement. More specifically, each second laser is arranged downstream of all the first lasers with respect to the direction of movement.

[0083] Each group 11 of lasers is intended to process the surface of the elongated product.

[0084] According to one embodiment, each group 11 of lasers is intended to treat the entire surface of a long product. In such an embodiment, the entire surface of the long product is intended to be treated sequentially by the lasers of the first group 11a, then by the lasers of the second group 11b, and, where appropriate, by the lasers of each additional group.

[0085] In one modification, at least one group of lasers 11 is intended to treat only a portion of the surface of the elongated product. In another modification, the combined groups of lasers 11 are intended to treat the entire surface of the elongated product.

[0086] The laser groups 11, 11a, 11b, or each of the groups 11, 11a, 11b, comprises at least three lasers 13. In one embodiment, the laser groups comprise the same number of lasers. In a variation, the number of lasers 13 differs from group to group.

[0087] Each laser 13 is D1, ..., D i , ..., D n The laser beam is intended to be emitted along the main radiation direction represented by , where n is the number of lasers 13 in groups 11, 11a, and 11b.

[0088] If the long product 3 is a wire, the main radial directions are D1, ..., D i , ..., D n This is the center of the wire, i.e., the axis of movement A. d Everything is oriented toward it.

[0089] Preferably, within each group 11, 11a, and 11b, the laser 13 controls the axis of movement of the wire 3. d It is equidistant from.

[0090] For example, the laser groups 11, 11a, 11b, or each of the groups 11, 11a, 11b, have their centers on the axis of motion A dIt consists of lasers 13 distributed around the same circle belonging to the same region. Next, the main radiation directions D1, ..., D i , ..., D n They converge at a single point, along the axis of movement A. d They intersect at this point.

[0091] In the deformation, the lasers 13 of the same group 11, 11a, and 11b are not distributed around the circle, but along the axis of movement A d Around at least two circles centered on, or when the spiral axis is the axis of movement A d It is distributed around a circular spiral.

[0092] Preferably, the surface area of ​​the portion of the surface intended to be treated by the different lasers 13 of groups 11, 11a, and 11b is the same.

[0093] In one embodiment, the surface area of ​​the portion of the surface intended to be treated by each laser 13 in a group is equal for each group. In a variation, the area of ​​the portion of the surface intended to be treated by each laser 13 in a group is different for each group.

[0094] The laser 13 is preferably distributed regularly around the long product.

[0095] For example, the lasers are distributed such that the primary radiation direction of each laser in groups 11, 11a, and 11b forms a non-zero angle called the spacing angle α with the primary radiation directions of the other two lasers in groups 11, 11a, and 11b, and the angle α is the same regardless of which lasers are considered in group 11.

[0096] In such cases, for wires, the angle α is defined by two straight lines that define the portion assigned to each laser 13, and the axis of movement A d The angle formed is less than or equal to β. When angle α is smaller than angle β, the parts partially overlap each other.

[0097] Specifically, when the number of lasers in groups 11, 11a, and 11b is equal to three, angle α is equal to 120°. When the number of lasers in groups 11, 11a, and 11b is equal to six, angle α is equal to 60°.

[0098] According to one embodiment, the spacing angle α is equal for each group.

[0099] In the deformation, the spacing angle α of the lasers in one group 11a, 11b is different from the spacing angle α of the lasers in at least one other group 11b, 11a.

[0100] Furthermore, according to one embodiment, the lasers 13 of different groups 11a and 11b move along axis A d They cannot be aligned with each other along a direction parallel to it. For example, in the case of two groups 11a and 11b, the laser of the first group 11a and the laser 13 of the second group 11b are aligned along axis A of movement. d They cannot be aligned along a direction parallel to each other. As a result, the primary radiation direction of each laser 13 in the first group 11a forms a non-zero angle called a phase shift angle with the primary radiation direction of the laser in the second group 11b, and the phase shift angle is smaller than the spacing angle α between the lasers of the first and second groups.

[0101] For example, if the laser spacing angle of the first group 11a and the laser spacing angle of the second group 11b are the same, the phase shift angle is equal to half of the spacing angle.

[0102] Such a phase shift prevents a given region of the surface of the long product 3 from being positioned in the central region of a portion assigned to the laser 13 of the first group 11a, and in the central region of a portion assigned to the laser 13 of the second group 11b, or conversely, from being positioned in the peripheral regions of the two portions, thereby providing a surface of more uniform quality.

[0103] In the example shown in Figure 2, the group of lasers 11 comprises six lasers evenly distributed around the wire 3, with the center at the axis of motion A.d They are distributed around the same circle. Therefore, the main radiation direction D of each laser 13 i The main emission direction D of the two other lasers 13 in group 11. i-1 , D i+1 This forms a fixed angle of 60°.

[0104] Lasers 13 in the same group 11, 11a, and 11b are preferably identical. Laser 13 is preferably a laser that operates in the near-infrared range, that is, a laser with wavelengths between 1000 nm and 1100 nm.

[0105] Laser 13 is, for example, a fiber laser.

[0106] The laser 13 is preferably suitable for selectively emitting a continuous beam or a pulsed beam. The pulsed beam has a pulse duration, for example, on the order of nanoseconds, microseconds, or milliseconds.

[0107] Laser 13 includes, for example, an Nd:YAG laser and / or a YLS laser.

[0108] If the delamination assembly 7 comprises two groups 11a and 11b of lasers, the first group 11a of lasers is intended to delaminate an oxide layer on the surface of the elongated product 3 by, for example, ablating at least a portion of a metal layer of a predetermined thickness on the surface of the elongated product 3, and the second group 11b of lasers is intended to finish the ablation of the metal layer of a predetermined thickness while imparting a predetermined roughness to the surface of the elongated product 3.

[0109] In such cases, the lasers of the first group 11a preferably operate in a different mode from the lasers of the second group 11b. In fact, the lasers of the first group 11a are configured to effectively exfoliate the oxide layer and optionally partially adjust the roughness on the surface of the exfoliated wire, while the lasers of the second group 11b are configured to adjust the roughness on the surface of the exfoliated wire and, where appropriate, to finish the exfoliation.

[0110] For example, the lasers in the first group 11a are YLS lasers configured to operate in continuous mode, while the lasers in the second group 11b are Nd:YAG lasers configured to operate in pulsed mode, specifically with pulse durations on the order of nanoseconds.

[0111] In the variation, the lasers of the first group 11a and the lasers of the second group 11b are identical. For example, the lasers of the first group 11a and the second group 11b are lasers that operate in pulse mode, specifically Nd:YAG lasers, or lasers that operate in continuous mode, specifically YLS lasers. In such cases, the lasers of the first group are preferably configured with different operating parameters from those of the lasers of the second group, for example, in terms of intensity or frequency.

[0112] The peeling assembly 7 preferably includes a mechanical or optical distribution system for each laser 13 that can cover a portion of the surface of the elongated product assigned to the laser.

[0113] More specifically, the distribution system is intended to shape the laser beams emitted by each group of lasers 13 and / or move the laser beams across the surface of the elongated product 3 in such a manner that the laser beams emitted by each group of lasers cover the entire surface of the elongated product 3 during the movement of the elongated product 3.

[0114] For example, in the case of a wire, the angle β associated with different lasers 13 of groups 11, 11a, and 11b i However, angle β i The distribution system is configured such that the entire surface of wire 3 is covered by the laser, meaning that the sum of the angles is 360° or more.

[0115] Specifically, the distribution system is intended to shape the laser beams emitted by the lasers of each group 11, 11a, and 11b, and / or to create a scan of the surface of the elongated product 3 by the laser beams in such a manner that the laser beam emitted by each laser covers a portion allocated to the laser.

[0116] The distribution system is an optical system 15 configured to shape the beams coming from each laser 13 in such a way that, once formed, the beam covers a portion allocated to each laser 13.

[0117] Such a system includes, for example, an optical device 15 (Figure 2) configured to convert the spot of the beam emitted by each laser 13 into a flap perpendicular to the direction of movement of the elongated product 3. The flap has a length equal to the width of the portion assigned to each laser (i.e., the distance between two straight lines on the surface of the elongated product defining the portion).

[0118] The width of each flake along the direction of movement varies depending on the speed of the wire's movement. The flake widths range from 20 μm to 200 μm, and are typically on the order of 50 μm.

[0119] In this method, the entire surface of the long product 3 can be treated with a limited number of lasers 13.

[0120] Each optical device comprises, for example, lenses, spherical mirrors, and / or cylindrical mirrors that adjust the shape and dimensions of the laser beam.

[0121] In such embodiments, the laser 13 is preferably a laser with a high average power or high pulse power so as to maintain a sufficiently high energy density throughout the entire portion associated with each laser.

[0122] In variations, the distribution system is an optical and mechanical scanning system.

[0123] Such a scanning system includes, for example, optical and mechanical devices suitable for shaping the beam generated by each laser 13 in order to concentrate the output of the laser 13 and to move the shaped beam across the surface of the moving elongated product 3 in such a manner that the beam affects the entire portion assigned to the laser 13.

[0124] More specifically, the optical and mechanical devices move the beam generated by the laser 13 across the surface of the elongated product 3 so that each laser can affect a portion of the surface assigned to it.

[0125] For example, optical and mechanical devices are configured to move a beam along first and second scanning directions that are orthogonal to each other, specifically along a series of parallel lines. Thus, scanning is performed along the first direction for each line, and then along the second direction to move from one line to the next.

[0126] The first and second scanning directions form angles with respect to the axis of motion that fall between 0° and 90°. For example, the directions may be parallel and perpendicular to the axis of motion, or perpendicular and parallel to the axis of motion, or each form a non-zero angle with respect to the axis of motion, such as approximately 45°.

[0127] Optical and mechanical devices are configured to produce such scans at scan speeds and scan pitches suitable for the desired processing, as described below.

[0128] For example, the beams from each laser 13 scan a portion associated with the laser along a line parallel to the first direction of scanning, and these lines are offset from each other according to a selected scanning pitch.

[0129] Such optical and mechanical systems may, for example, include at least one galvanometer mirror and further include a polygonal wheel.

[0130] Such embodiments do not require the use of a laser with the same power output as in the optical system 15, because the magnitude of the collisions of each beam generated by the laser is small.

[0131] Preferably, the peeling assembly 7 comprises a casing 17 in which groups 11, 11a, 11b of lasers 13 and a distribution system are housed. Naturally, the casing 17 has two openings in two opposing walls so that the elongated product 3 can be moved through the casing 17. The casing 17 is made of, for example, stainless steel.

[0132] The use of such a containment 17 protects not only external elements but also the operator from laser radiation.

[0133] Preferably, the walls of the enclosure 17 are equipped with active and / or passive safety systems for interrupting the laser in case of a problem (e.g., overheating or failure of the enclosure). For example, the enclosure has a double wall containing a fluid whose pressure or height is continuously measured.

[0134] Furthermore, cameras are preferably installed inside the enclosure to monitor the smooth progress of the process.

[0135] The control device 9 is intended to control the stripping assembly 7 in order to provide the stripping assembly 7 with operating parameters for stripping the entire oxide layer over the entire surface of the long product 3, ablating the metal layer on the surface of the long product 3, obtaining a metal layer of a predetermined thickness, and obtaining a predetermined roughness on the surface of the long product 3 at the end of the process.

[0136] The control device 9 specifically includes a memory device, a computing device, and a human / machine interface.

[0137] Therefore, the control device 9 is suitable for acquiring information about the long product 3 while it is in motion.

[0138] This information specifically includes the speed at which the elongated product 3 moves within the processing facility 5. Knowledge of this speed is necessary to adjust the operating parameters of the delamination assembly 7 so that each position on the wire surface is exposed to laser radiation for an appropriate period of time.

[0139] Such information further comprises at least one characteristic dimension of the elongated product 3 in a plane transverse to the direction of movement of the elongated product 3. The dimension is, for example, the diameter of the wire for a wire. If the elongated product is a strip, the characteristic dimension is, for example, the width and thickness of the strip. Such dimensions provide information about the scale of the surface to be processed and allow the laser radiation emitted by the delamination assembly 7 to be precisely focused on the surface to be processed.

[0140] Such information preferably refers to the axis of movement A in a plane perpendicular to the axis. d This includes the position of the axis of movement A. d Axis A d It is possible that the position in a plane orthogonal to the laser beam may change, which may require focusing the laser 13 and / or changing the distribution of the laser beam in order to ensure the desired surface condition.

[0141] The information acquired by the control device 9 is, for example, input by the operator via the interface of the control device 9 and recorded in the storage device.

[0142] In the deformation or addition, the processing facility 5 includes a system for determining, specifically measuring, the speed of movement of the elongated product 3, and / or the position of the elongated product 3 within the peeled assembly 7, specifically the axis of movement A d A system for determining or measuring the position is provided. In such cases, information about the moving long product is supplied to the control unit in real time by the determination system.

[0143] The control device 9 is also configured to obtain desired processing parameters for the long product 3 to be processed.

[0144] The processing parameters specifically include the desired roughness of the long product 3 at the end of the processing.

[0145] The processing parameters preferably include parameters relating to the thickness of the oxide layer to be ablated and / or the thickness of the metal layer to be ablated on the surface of the elongated product 3.

[0146] Processing parameters are either input by an operator via the interface of the control device 9 and recorded in the control device 9's storage device, or they are automatically input depending on the product being processed.

[0147] In addition, at least some of the processing parameters, more specifically, the desired roughness of the elongated product 3 at the end of processing, are provided by the wire-drawing facility 6, which allows for real-time adjustment of the surface condition of the wire to facilitate wire-drawing.

[0148] The control device 9 is configured to determine operating parameters to be given to the delamination assembly 7, and more specifically to the lasers of laser groups 11, 11a, and 11b, in order to obtain the delamination of an oxide layer on the surface of the elong product 3, to ablate a metal layer of a predetermined thickness on the surface of the elong product 3, and to obtain a predetermined roughness on the surface of the elong product 3. The thickness of the metal layer and the predetermined roughness are parameters that have been acquired in advance by the control device 9, as described above.

[0149] For this purpose, the control device 9 is suitable for recording in its storage device experimental reference data, which allows the computer to determine the operating parameters to be given to the peeled assembly 7 according to desired processing parameters and information regarding the moving long product.

[0150] Operating parameters include, for example, the radiant intensity of the laser 13, the operating mode of the laser 13 (continuous beam or pulsed beam), and the duration of the laser / material interaction (corresponding to the duration for which the laser beam affects the surface of the product).

[0151] In fact, regardless of the speed of movement, each portion of the surface should have been processed and received the energy density requested and given by the control device 9. The energy density is a function of the laser / material interaction time and the output density of the laser beam.

[0152] For lasers in continuous mode, the laser / material interaction time, which depends on the speed of movement, depends on the settings of the distribution system. For example, if the distribution system includes an optical device 15 for at least a specific laser 13, the laser / material interaction time is adjusted by changing the width of the flakes formed from the laser spot by the optical device 15.

[0153] If the distribution system includes a scanning system for at least a specific laser 13, the laser / material interaction time is adjusted by changing the scanning speed and scanning pitch.

[0154] For pulsed lasers, the laser / material interaction time, which is dependent on the speed of movement as with continuous lasers, depends on the settings of the distribution system. For example, if the distribution system includes an optical device 15 for at least a specific laser 13, the laser / material interaction time is adjusted by changing the width of the flakes formed from the laser spot by the optical device 15. If the distribution system includes a scanning system for at least a specific laser 13, the laser / material interaction time is adjusted by changing the scanning speed and scanning pitch.

[0155] For pulsed lasers, the laser / material interaction time can be further adjusted by changing the pulse duration and frequency of the pulsed beam.

[0156] The operating parameters may include, depending on the case, the width of the flake formed by the optical device 15, the scanning speed, the scanning pitch, and / or the pulse duration and frequency of the pulsed beam.

[0157] For example, the radiation intensity of the laser 13 is selected such that it increases as the speed of movement of the long product 3 increases and / or as the thickness of the metal layer being ablated increases.

[0158] Furthermore, as the travel speed increases, the pulse frequency also increases to ensure that a given portion is properly processed by the laser 13 relating to it.

[0159] Furthermore, the scanning speed is selected to be higher the faster the long product is moved.

[0160] Generally, when the thickness of the metal layer being ablated is small, a high travel speed is selected, and therefore a high scanning speed is used.

[0161] As previously mentioned, the operating parameters are also selected to obtain a surface with a predetermined roughness.

[0162] The desired roughness can be obtained by adapting the operating mode of the laser 13, for example by selecting a pulse mode, and by adapting the laser / material interaction time on the surface of the elongated product 3 in such a way that the laser impact generates craters with dimensions and spacing on the surface of the elongated product 3, or imparts the desired surface roughness.

[0163] When the distribution system is an optical and mechanical scanning system, roughness is adjusted, for example, by selecting the scanning pitch as a function of the laser beam width.

[0164] For example, if the beam width is 75 μm, the beam from each laser scans a portion along a line equal to 75 μm in width, forming grooves of that width. If the scanning pitch is selected to be 75 μm or less, specifically 25 μm, scanning a portion of the surface will create a surface with very little roughness. On the other hand, if the scanning pitch is selected to be larger than the beam width, for example, 100 μm, ridges will exist between each groove, resulting in greater roughness on the surface of the product.

[0165] The operating parameters of lasers in the same group 11, 11a, and 11b are generally identical to each other. More specifically, this is the case when portions of the surface processed by laser 13 are the same size and the laser is located at the same distance from the portion being processed.

[0166] On the other hand, if the peel-off assembly 7 comprises two or more groups, the operating parameters generally differ for each group.

[0167] Specifically, since the delamination assembly 7 comprises two groups, the operating parameters of the laser for the first group 11a are preferably selected to effectively delaminate the oxide layer, and the operating parameters of the laser for the second group 11b are selected to impart a desired roughness to the surface of the delaminated elongated product.

[0168] For example, the lasers of the first group 11a are configured to operate in continuous mode, and the laser output is selected to exfoliate the entire oxide layer, while the lasers of the second group 11b are configured in pulsed mode, and the pulse duration and, where appropriate, the scanning pitch are selected so that the pulse collisions produce a desired roughness on the surface of the long product 3.

[0169] The control device 9 will control the peeled assembly 7 according to the operating parameters determined in this manner.

[0170] The control device 9 is configured to determine operating parameters before peeling, preferably during the process, and more specifically, following the detection of changes in one or more parameters relating to the moving long product or desired processing parameters.

[0171] For example, if the speed of movement is continuously determined by a system for determining the speed of movement, or determined at a specific time and supplied to the control device 9, the control device 9 is configured to determine new operating parameters in the event of a change in the speed of movement and to apply those new operating parameters to the detached assembly 7.

[0172] Also, axis A of movement d If the position is determined continuously or over a specific period of time by a system for determining that position and supplied to the control device 9, the control device 9 is configured to determine new operating parameters in the event of a change in the position and to apply those new operating parameters to the delamination assembly 7.

[0173] In other examples, if a long product is directly pulled at the exit of the peel assembly 7, and if it is found that the pull-out of the long product is insufficient, the desired roughness may be changed to increase the pull-out. The control device 9 is configured to accept the new desired roughness, determine new operating parameters suitable for obtaining the new roughness, and apply the new operating parameters to the peel assembly 7.

[0174] Here, a method for processing the long product 3 according to one embodiment is described. The processing method is preferably carried out using the processing facility 5, as previously described in this specification.

[0175] In this example, we consider a facility 5 in which the delamination assembly 7 is equipped with two groups of lasers sequentially along the direction of product movement.

[0176] Furthermore, it is taken into consideration that the long product 3 is a wire, and that each group of lasers 11a, 11b comprises six lasers 13 evenly distributed around the wire 3, with their centers located around a circle whose centers are occupied by the center of the wire 3.

[0177] As a result, each laser 13 of each group 11a and 11b controls the axis A of movement of the wire 3. d It is intended to extend between two parallel lines and process a portion of the surface of a wire that defines an angle β of at least 60° with the axis.

[0178] The processing method is carried out, for example, after the annealing process performed on the long product 3 in the form of a crown.

[0179] The processing method is performed on the moving long product 3, following the unwinding of the long product 3.

[0180] The method includes the step of obtaining parameters or information relating to the moving long product and desired processing parameters using the control device 9.

[0181] As previously described, parameters relating to the moving elongated product include the properties of the elongated product 3 (e.g., wire or strip), the speed at which the elongated product 3 moves within the processing facility 5, and / or the characteristic dimensions of the elongated product 3 in a plane traversing the direction of its movement. Such information is entered, for example, by the operator via the interface of the control device 9, or is automatically entered and recorded in the storage device when the elongated product 3 is brought into the facility.

[0182] In deformation or addition, information regarding the moving elongated product is determined by a system for detecting the speed of movement of the elongated product 3, and / or a system for detecting the position of the elongated product 3 within the decomposed assembly.

[0183] The desired processing parameters for the elongated product 3 include the desired roughness of the elongated product 3 at the end of processing, and preferably include parameters relating to the thickness of the oxide layer to be ablated and / or the thickness of the metal layer to be ablated on the surface of the elongated product 3.

[0184] Processing parameters are input by the operator, for example, via the interface of the control device 9, and recorded in the storage device of the control device 9.

[0185] The method then includes the step of the control device 9 determining operating parameters to be given to the lasers of groups 11, 11a, and 11b in order to obtain etching of an oxide layer on the surface of the elong product 3, to ablate a layer of metal of a predetermined thickness on the surface of the elong product 3, and to obtain a predetermined roughness on the surface of the elong product 3.

[0186] These operating parameters are determined from experimental reference data recorded in the memory of the control device 9.

[0187] Operating parameters include, for example, the radiant intensity of the laser 13, the mode of operation of the laser 13 (continuous beam or pulsed beam), and, where appropriate, the pulse duration and pulse frequency of the pulsed beam.

[0188] If the distribution system is an optical and mechanical scanning system, the operating parameters include, for each laser 13, the scanning parameters of the portion of the laser assigned to the laser 13, specifically, the scanning speed and scanning pitch.

[0189] Next, the control device 9 transmits the operation parameters determined in this manner to the delamination assembly 7.

[0190] Next, the peeling assembly 7 processes the surface of the long product 3 according to the operating parameters.

[0191] More specifically, each laser 13 emits a laser beam in a selected operating mode with an output controlled by the control device 9.

[0192] If the operating mode of at least one group 11, 11a, 11b of lasers 13 is pulse mode, each laser 13 emits a laser pulse whose duration and frequency are controlled identically by the control device 9.

[0193] Furthermore, if at least one of the laser distribution systems 13 in groups 11, 11a, and 11b is a scanning system, the scanning system creates a scan of the laser beams emitted by each laser according to the scanning speed and scanning pitch controlled by the control device 9.

[0194] During the movement of the elongated product 3 through the delamination assembly 7, each laser 13 of each group 11, 11a, and 11b emits a laser beam to process a portion of the product surface assigned to that laser 13, according to operating parameters provided by the control device 9.

[0195] As the elongated product 3 is moving, at the end of the process, the portion processed by each laser 13 extends along the entire length of the elongated product 3 (different continuous areas of each portion moving in front of the peeled-off assembly) in the direction of movement.

[0196] If the delamination assembly comprises a first group of first lasers and a second group of second lasers, the surface is treated sequentially by the lasers of the first group and then by the lasers of the second group.

[0197] According to one embodiment, each group 11 of lasers processes the entire surface of the elongated product. In such an embodiment, the entire surface of the elongated product is processed sequentially by the lasers of the first group 11a, then by the lasers of the second group 11b, and, where appropriate, by the lasers of each additional group.

[0198] In deformation, at least one group 11 of lasers treats only a portion of the surface of the elongated product. In such deformation, the combined groups 11 of lasers treat the entire surface of the elongated product.

[0199] At the end of the process, the long product 3 is free of oxides on its surface. Specifically, the long product 3 is free of oxides resulting from the retention of the product at high temperatures in an oxidizing atmosphere (specifically, during annealing).

[0200] Furthermore, the long product 3 has a distinctive roughness profile that differs from the long product 3 obtained by chemical stripping.

[0201] The roughness profile refers to the profile obtained from the primary profile by suppressing elongated wavelength components by applying a filter of profile λc to suppress wavelength components larger than λc (specifically, ripple components), as described in the standard NF EN ISO 4287:1998. In this case, wavelength components smaller than λc = 2.5 mm are considered.

[0202] More specifically, after delamination in the bathtub, the long product has a granular surface with an irregular, non-periodic pattern on its surface.

[0203] On the other hand, the surface of the elongated product 3 processed according to the present invention has a periodic roughness profile, that is, a periodic roughness pattern on its surface.

[0204] The roughness pattern forms the profile elements in the roughness profile (as defined in the standard NF EN ISO 4287:1998).

[0205] As specified in NF EN ISO 4287:1998, the roughness profile is determined from the surface profile resulting from the intersection of the actual surface with a given cutting plane, the mean of which the cutting plane is parallel to the actual surface and has the appropriate orientation.

[0206] The width of the periodic pattern ranges from 5 μm to 1 mm, for example, from 5 μm to 200 μm.

[0207] For example, the pattern is a periodic stripe that includes a regular alternation of protruding lines (or ridges) and grooves.

[0208] The grooves correspond to the areas on the surface of the elongated product 3 that receive the highest energy density of the laser 13, while the protruding lines correspond to the areas on the surface of the elongated product 3 that receive the lowest energy density of the laser 13.

[0209] The grooves and lines extend, for example, along a direction parallel to the central axis of the elongated product 3, along a direction perpendicular to the central axis of the elongated product 3, or along a direction oblique to the central axis of the elongated product (specifically, forming a 45° angle with the central axis).

[0210] For example, if the distribution system is an optical and mechanical scanning system, the orientation of the lines and grooves corresponds to the scanning direction of the laser beam (i.e., the first scanning direction defined above). Therefore, the direction between the grooves (i.e., the second scanning direction) is equal to the scanning pitch.

[0211] Referring to the previous example, if the beam width is 75 μm and the scanning pitch is equal to 100 μm, the groove will have a width of approximately 75 μm, and the protruding line (or ridge) will have a width of approximately 25 μm.

[0212] Generally, the distance between grooves (corresponding to the width of the periodic pattern) ranges from 5 μm to 1 mm, for example, from 5 μm to 200 μm. Naturally, the distance between grooves refers to the distance between each groove and its adjacent grooves.

[0213] In deformation, the periodic pattern is formed by a regular alternation of peaks and valleys along the first and second singular directions.

[0214] The first and second directions are, for example, orthogonal to each other, specifically, parallel to the central axis of the elongated product 3 and orthogonal to the central axis, respectively.

[0215] In other examples, at least one of the first and second directions is neither parallel nor perpendicular to the central axis of the elongated product 3. In all cases, the periodic pattern is observed in the roughness profile in the form of periodic profile elements, where each pattern consists of peaks and valleys.

[0216] For example, the height of profile elements, such as the average height between ridges and grooves, or the average height between peaks and valleys, generally falls between 0.2 μm and 500 μm.

[0217] To measure the distance between profile elements and the height of the profile elements, a suitable cutting plane is selected, as previously described, by first viewing the surface of the product, for example by imaging, specifically by optical microscopy, scanning electron microscopy, or using a roughness meter.

[0218] For example, if the periodic pattern consists of grooves and protruding lines parallel to the central axis of the elongated product 3, a cutting plane perpendicular to the central axis will be selected. On the other hand, if the lines and grooves are perpendicular to the central axis of the elongated product 3, a cutting plane parallel to the central axis will be selected.

[0219] If the periodic pattern is an alternating pattern of peaks and valleys along a first and second direction, it is preferable to select two cutting planes parallel to the first and second directions, respectively, and the average width and height in each of those directions are evaluated.

[0220] Preferably, the waste generated by the peeling of oxides and the metal removed by the peeling assembly 7 are recovered by a dust extraction system and a fume extraction system.

[0221] Preferably, during processing, the operating parameters are recalculated by the control device 9 in the event of a change in parameters relating to the long product while it is moving, or in the event of a change in desired processing parameters.

[0222] For example, if the speed of movement is continuously determined by a system for determining the speed of movement, or determined at a specific time and supplied to the control device 9, then a change in the speed of movement will result in the calculation of new operating parameters suitable for the new speed of movement, and these new operating parameters will be applied to the detached assembly 7.

[0223] Furthermore, axis A of movement dIf the position is determined continuously or over a specific period of time by a system for determining the position and supplied to the control device 9, the control device 9 determines new operating parameters for the event of change in that position and applies the new operating parameters to the delamination assembly 7.

[0224] In other examples, if a long product is directly pulled at the exit of the peel assembly 7, and if it is found that the pull-out of the long product is insufficient, the desired roughness may be changed to increase the pull-out. The new roughness is supplied to the control device 9, which results in the calculation of new operating parameters suitable for obtaining the new roughness, and the new operating parameters are applied to the peel assembly 7.

[0225] Furthermore, other examples show that in the event of a laser malfunction within a group, the operating parameters are recalculated to take such malfunctions into account.

[0226] Therefore, the facilities and methods according to the present invention are provided to process efficiently and quickly without using harmful products, ensuring that the oxide layer present on the elongated product is stripped away to remove surface defects, internal oxides, and / or areas containing chemical compositions different from the composition of the metal core material on the metal surface beneath the oxide layer, and that the surface of the elongated product is roughened without additional operation to allow the elongated product to be pulled out.

[0227] While the facilities and methods have been described in more detail with reference to wire materials, they are also suitable for processing other types of long products such as strip materials.

[0228] For example, to process a strip having two main surfaces and two surfaces extending along the thickness of the strip, one or more groups of lasers can be used, each comprising at least one laser positioned opposite each of the main surfaces, the at least one laser positioned opposite each of the surfaces extending along the thickness of the strip. [Explanation of symbols]

[0229] 1. Dispensing facility 2 Crown 3. Long products, wires, long metal products, long stainless steel products 5. Processing facilities 6. Line extension facilities 7. Detachable Assembly 9 Control device 11 Laser Groups 11a First group 11b Second group 13 Lasers, Laser Distribution Systems 15 Optical systems, optical devices 17. Encircling body A d axis of movement D Main radiation direction α interval angle β angle

Claims

1. A facility (5) for processing a moving metal elong product (3) in preparation for a wire drawing step, wherein the elong product (3) has at least one surface covered with a layer of oxide, and the facility (5) A delamination assembly (7) comprising at least one group (11, 11a, 11b) of a plurality of lasers (13) distributed around the moving elongated product (3), wherein each laser (13) is configured to emit a beam onto the surface of the moving elongated product (3) to delaminate the surface, and each laser (13) is intended for the processing of the relevant portion of the surface of the elongated product (3), A control device (9) configured to acquire information about the long product (3) while it is moving, wherein the information includes the speed of movement of the long product (3) and the axis of movement of the long product (A d A control device (9) and a control device (9) including at least one characteristic dimension of the elongated product (3) in a plane orthogonal to ) Equipped with, The control device (9) is To obtain the peeling of the oxide layer on the surface of the elongated product (3), to ablate a metal layer of a predetermined thickness on the surface of the elongated product (3), and to obtain a predetermined roughness on the surface of the elongated product (3) by comparing it with experimental results previously recorded in the control device (9), the operating parameters to be given to the peeling assembly (7) are determined. The operation parameters are given to the peel-off assembly (7) A facility (5) characterized by being configured to do so.

2. The processing facility (5) according to claim 1, characterized in that the lasers (13) of the laser group (11, 11a, 11b) or each of the laser groups (11, 11a, 11b) are evenly distributed around the moving elongated product (3).

3. The processing facility (5) according to claim 1 or 2, wherein the operating parameters include the radiant intensity of the lasers (13) of the group (11, 11a, 11b) or each of the groups (11, 11a, 11b), and / or the laser / material interaction time at each position on the surface of the elongated product (3).

4. The processing facility (5) according to any one of claims 1 to 3, wherein the peeled assembly (7) is configured to shape the beam emitted by the plurality of lasers (13) in the group (11, 11a, 11b) or in each of the groups (11, 11a, 11b) so that the beam covers the entire surface of the elongated product (3) during the movement of the elongated product (3), or comprises a distribution system configured to move the beam across the surface of the elongated product (3).

5. The processing facility (5) according to claim 4, wherein the distribution system comprises an optical device (15) configured to convert each beam emitted by the relevant laser (13) for each laser (13) of at least one group (11, 11a, 11b) into a band affecting a portion of the surface of the elongated product (3).

6. The processing facility (5) according to claim 4 or 5, wherein the distribution system comprises a scanning device configured to move the beam generated by the relevant laser (13) across the surface of the elongated product (3) according to a predetermined scanning speed and scanning pitch, for each laser (13) of at least one group (11, 11a, 11b) such that the beam emitted by each laser (13) affects a portion of the surface of the elongated product (3).

7. The processing facility (5) according to claim 6, wherein the operating parameters include the scanning speed and the scanning pitch of the scanning device.

8. The processing facility (5) according to any one of claims 5 to 7, wherein the portion of the surface of the elongated product (3) is defined by two parallel lines on the surface of the elongated product (3).

9. The peeling assembly (7) comprises a first group (11a) of multiple first lasers distributed around the moving elongated product (3) and a second group (11b) of multiple second lasers distributed around the moving elongated product (3), each second laser having a axis (A) of movement d A processing facility (5) according to any one of claims 1 to 8, located downstream of each of the first lasers in the first group (11a) with respect to the above.

10. The processing facility (5) according to claim 9, wherein the first laser is configured to ablate a layer of metal of a predetermined thickness on the surface of the elongated product (3) to remove the oxide layer on the surface of the elongated product (3), and the second laser is configured to impart the predetermined roughness to the surface of the elongated product (3).

11. The processing facility (5) according to claim 9 or 10, wherein the first laser is a continuous-emission laser, and the second laser is a continuous-emission laser, or a laser configured to emit a pulsed beam, specifically a nanosecond laser.

12. A method for processing a moving metal elong product (3) in preparation for a wire drawing step, using a facility (5) according to any one of claims 1 to 11, wherein the elong product (3) has at least one surface covered with a layer of oxide, A step of acquiring information about the long product (3) while it is moving by the control device (9), wherein the information includes the speed of movement of the long product (3) and the axis of movement of the long product (3) (A d A step of acquisition including at least one characteristic dimension of the elongated product (3) in a plane that crosses over ) A step by which the control device (9) determines, according to the information regarding the moving long product (3), the operating parameters given to the delamination assembly (7) for obtaining the delamination of the oxide layer on the surface of the long product (3), for ablating a metal layer of a predetermined thickness on the surface of the long product (3), and for obtaining a predetermined roughness on the surface of the long product (3) by comparison with experimental results previously recorded in the control device (9); A step of controlling the peeling assembly (7) by the control device (9) for providing the aforementioned operating parameters to the peeling assembly (7) and Steps of radiation by the peeling assembly (7) onto the surface of the moving elongated product (3) using the laser (13) in accordance with the operating parameters determined by the control device (9) and Methods that include...

13. A long metal product (3) for wire drawing, wherein the long product (3) has a periodic roughness pattern on its surface, the width of the periodic pattern is between 5 μm and 1 mm, and the periodic pattern consists of periodic ridges including a regular alternation of protruding ridges and grooves, or a pattern including a regular alternation of peaks and valleys along first and second singular directions.

14. The metal elongated product (3) according to claim 13, wherein the width of the periodic pattern is between 5 μm and 200 μm.

15. A long metal product (3) according to claim 13 or 14, wherein the average height between the ridge and the groove, or the average height between the peak and the valley, is between 0.2 μm and 500 μm.

16. The long product (3) according to any one of claims 13 to 15, characterized in that the long product (3) is a wire or a strip.

17. The long metal product (3) according to any one of claims 13 to 16, characterized in that the long product (3) is drawn without undergoing surface preparation treatment by chemical or mechanical stripping.

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