Molding object transport mechanism, resin molding apparatus, and method for manufacturing resin molded products

Abstract

To provide a molding object transfer mechanism that enables the design of a molding die to accommodate a larger molding object or a more complex resin molding shape for the molding object.SOLUTION: A molding object transfer mechanism 13 is for passing a molding object W to a molding die 14 with a clamping mechanism 2 that holds the molding object W. The molding object transfer mechanism 13 includes a placing unit 4 on which the molding object W slides and is placed and a first operation unit 6 for operating the clamping mechanism 2 that is provided above a passage area R of the molding object W sliding towards the placing unit 4.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an object to be molded transfer mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product.

Background Art

[0002] In a conventional resin molding apparatus, as shown in Patent Document 1, there is a conceivable one using a substrate transfer device that receives a substrate from a substrate supply device and transfers it to a mold device. This substrate transfer device is configured such that the substrate pushed out from the substrate magazine of the substrate supply device slides and is placed thereon, and has a structure in which both side edges of the substrate pushed out from the substrate magazine are slidably fitted.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] On the other hand, in recent years, the size of the substrate as an object to be molded has been increasing, and the number of electronic components fixed to the substrate has also been increasing. When molding such a substrate with a resin material, the difference in the amount of thermal expansion between the molded resin material and the substrate becomes large, the amount of warpage of the substrate increases, and there is a risk of poor adsorption of the substrate in the mold (for example, the upper mold).

[0005] In addition, the resin molding shape of the electronic components fixed to the substrate has become complicated, and when the substrate is pulled downward during脱模 from the release film covering the cavity of the mold (for example, the lower mold), the force increases, and there is a risk of poor adsorption of the substrate in the mold (for example, the upper mold).

[0006] In order to eliminate the above-mentioned poor adsorption, it is conceivable to provide a clamp mechanism for holding the peripheral portion of the object to be molded in the mold (for example, the upper mold).

[0007] However, in the aforementioned substrate transport device, the substrate is pushed out of the substrate magazine and slid onto the mold, and it is not possible to provide a structure for operating the clamping mechanism installed on the mold in the area where the substrate slides. Therefore, the position of the clamping mechanism installed on the mold is restricted, making it difficult to sufficiently eliminate substrate suction problems in the mold.

[0008] Therefore, the present invention has been made to solve the above problems, and its main objective is to provide a molding object transport mechanism that enables the design of a molding die that can accommodate the increasing size of the molded object or the increasing complexity of the resin molding shape of the molded object. [Means for solving the problem]

[0009] In other words, the molding object transport mechanism according to the present invention is a molding object transport mechanism that transfers a molding object to a mold having a clamping mechanism for holding the molding object, and is characterized by comprising a mounting section on which the molding object slides and is placed, and an operating section provided above the passage area of ​​the molding object that slides toward the mounting section, for operating the clamping mechanism. [Effects of the Invention]

[0010] According to the present invention configured in this manner, it is possible to provide a moldable object transport mechanism that enables the design of molds to accommodate larger molded objects or more complex resin molding shapes for molded objects. [Brief explanation of the drawing]

[0011] [Figure 1] This diagram schematically shows the configuration of a resin molding apparatus according to one embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view showing the open mold and the substrate transport mechanism at the transfer position in the same embodiment. [Figure 3] This is a schematic view from below showing the configuration of the upper type of the same embodiment. [Figure 4] This is a schematic cross-sectional view showing the substrate transport mechanism for the pre-molded substrate storage section and receiving position of the same embodiment. [Figure 5] This is a schematic plan view showing the configuration of the substrate transport mechanism of the same embodiment. [Figure 6] This is a schematic cross-sectional view showing the configuration of the guide section and support member in the substrate transport mechanism of the same embodiment. [Figure 7] This is a schematic cross-sectional view showing the state in which the clamp portion is released by the substrate transport mechanism of the same embodiment. [Figure 8] This is a schematic cross-sectional view showing the state in which the mounting portion of the substrate transport mechanism of the same embodiment is raised and the substrate before molding is in contact with the upper mold. [Figure 9] This is a schematic cross-sectional view showing the state after the substrate transport mechanism of the same embodiment has transferred the unmolded substrate to the upper mold. [Modes for carrying out the invention]

[0012] Next, the technology according to the present invention will be described in more detail with examples. However, the present invention is not limited to the following technologies.

[0013] The molding object transport mechanism of Technology 1 according to the present invention is a molding object transport mechanism that transfers a molding object to a mold having a clamping mechanism for holding the molding object, and is characterized by comprising a mounting section on which the molding object slides and is placed, and an operating section provided above the passage area of ​​the molding object that slides toward the mounting section, for operating the clamping mechanism.

[0014] With this object - to - be - molded article conveying mechanism, since an operation part for operating the clamping mechanism of the mold is provided above the passage area of the object - to - be - molded article that slides toward the placing part, the operation part can be provided regardless of the sliding movement of the object - to - be - molded article. For this reason, a clamping mechanism for holding the rear end part in the sliding direction of the object - to - be - molded article can be provided in the mold. As a result, it becomes possible to design a mold corresponding to the enlargement of the object - to - be - molded article or the complication of the resin - molding shape of the object - to - be - molded article.

[0015] The object - to - be - molded article conveying mechanism of Technology 2 according to the present invention further includes a guide part provided adjacent to the placing part for guiding the object - to - be - molded article that slides toward the placing part in addition to the configuration of Technology 1 described above, and the operation part is provided above the passage area of the object - to - be - molded article in the guide part. With this configuration, since the guide part is provided, the sliding of the object - to - be - molded article toward the placing part can be guided and it can be surely placed. Also, since the operation part is provided above the passage area of the object - to - be - molded article in the guide part, a design can be made that does not interfere with the transfer of the object - to - be - molded article from the placing part to the mold.

[0016] As an aspect of operations such as opening the clamping mechanism by the object - to - be - molded article conveying mechanism and the specific transfer operation mode of the object - to - be - molded article to the mold, the object - to - be - molded article conveying mechanism of Technology 3 according to the present invention further includes a base member provided such that the placing part can move up and down and on which the operation part is provided in addition to the configuration of Technology 1 or 2 described above. By moving the base member up and down, the operation part operates the clamping mechanism, and by moving the placing part up and down with respect to the base member, the object - to - be - molded article is transferred to the mold.

[0017] As a specific embodiment for providing the operation part above the passage area of the object - to - be - molded article, the object - to - be - molded article conveying mechanism of Technology 4 according to the present invention is characterized in that, in addition to any one of the configurations of Technologies 1 to 3 described above, the operation part is provided on a support member provided around the passage area.

[0018] The object to be molded transfer mechanism according to the technology 5 of the present invention, in addition to the configuration of the technology 4 described above, the support member has a pair of leg portions provided on both sides of the passage region, and a beam portion provided above the passage region and bridging the pair of leg portions, and the operation portion is provided on the beam portion. With this configuration, since the support member has a pair of leg portions and a beam portion, the mechanical strength of the support member can be increased, and the clamp mechanism can be stably operated.

[0019] As a specific embodiment of the object to be molded transfer mechanism, the object to be molded transfer mechanism according to the technology 6 of the present invention, in addition to the configuration of any one of the technologies 1 to 5 described above, the clamp mechanism has a rear end side clamp portion that holds the rear end portion in the sliding direction of the object to be molded, and the operation portion presses and releases the rear end side clamp portion.

[0020] The object to be molded transfer mechanism according to the technology 7 of the present invention, in addition to the configuration of the technology 6 described above, the object to be molded has a rectangular shape in a plan view, the clamp mechanism further has a front end side clamp portion that holds the front end portion in the sliding direction of the object to be molded, and both end side clamp portions that hold both end portions orthogonal to the sliding direction of the object to be molded, and the object to be molded transfer mechanism further includes a second operation portion that presses and releases each of the front end side clamp portion and the both end side clamp portions. With this configuration, all four sides of the rectangular object to be molded can be clamped, and it is possible to eliminate the poor holding of the object to be molded in response to the enlargement of the object to be molded or the complication of the resin molding shape on the object to be molded.

[0021] Further, the resin molding apparatus according to the present invention includes a mold having a clamp mechanism for holding an object to be molded, and an object to be molded transfer mechanism having a configuration of any one of the technologies 1 to 7 described above. This resin molding apparatus allows for the use of molds that accommodate larger molded objects or more complex resin molding shapes, thereby eliminating poor retention of molded objects and improving the quality of resin molded products.

[0022] Furthermore, a method for manufacturing a resin molded product using the resin molding apparatus of the above-described technology 8, comprising a resin molding step of transporting the object to be molded to the molded mold by the object transport mechanism and performing resin molding, and a discharge step of dischargeing the resin-molded object from the mold, is also an embodiment of the present invention. This resin molding apparatus allows for the use of molds that accommodate larger molded objects or more complex resin molding shapes, thereby eliminating poor retention of molded objects and improving the quality of resin molded products.

[0023] <One Hundred Ideas> An embodiment of the resin molding apparatus according to the present invention will be described below with reference to the drawings. Please note that all of the following diagrams are simplified and simplified for clarity. The same components are denoted by the same symbols, and explanations are omitted as appropriate.

[0024] <Basic configuration of resin molding apparatus 100> The resin molding apparatus 100 of this embodiment manufactures a resin molded product P by resin molding using a resin material to encase electronic components (not shown) fixed to a substrate W, which is the object to be molded.

[0025] Examples of substrates include metal substrates, resin substrates, glass substrates, ceramic substrates, circuit boards, semiconductor substrates, lead frames, silicon wafers, and glass wafers. Examples of electronic components include semiconductor chips, resistors, capacitors, and other electronic elements, or electronic components in which at least one of these electronic elements is encapsulated in resin. Examples of resin materials include granular resins, sheet resins, tablet resins, and granular resins.

[0026] As shown in Figure 1, the resin molding apparatus 100 comprises a substrate supply / storage module A, two resin molding modules B, and a resin material supply module C as its components. Each component (each module A to C) is detachable and interchangeable with respect to the other component.

[0027] The substrate supply and storage module A includes a pre-molded substrate supply unit 11 for supplying pre-molded substrates W, a molded substrate storage unit 12 for storing molded substrates W (resin molded products P), and a substrate transport mechanism 13 for transporting the pre-molded substrates W and resin molded products P. The pre-molded substrate supply unit 11 includes a pre-molded substrate storage unit 111 for storing the pre-molded substrates W, and a substrate extrusion unit 112 for pushing the pre-molded substrates W from the pre-molded substrate storage unit 111 toward the substrate transport mechanism 13. The pre-molded substrates W slide toward the substrate transport mechanism 13 by the substrate extrusion unit 112. In the following, the sliding direction of the pre-molded substrates W toward the substrate transport mechanism 13 by the substrate extrusion unit 112 will be referred to as the X direction, the direction perpendicular to the X direction in the horizontal plane will be referred to as the Y direction, and the direction perpendicular to both the X and Y directions will be referred to as the Z direction.

[0028] The substrate transport mechanism 13, which is a mechanism for transporting the object to be molded, transports the unmolded substrate W from the substrate supply / storage module A to the resin molding module B, and supplies the unmolded substrate W to the molds 14 and 15 in the resin molding module B. After the resin molding of the unmolded substrate W, the substrate transport mechanism 13 receives the resin molded product P from the molds 14 and 15 in the resin molding module B and transports it to the substrate supply / storage module A. The substrate transport mechanism 13 is configured to be movable in the X and Y directions within the substrate supply / storage module A and each of the resin molding modules B. In addition, the substrate transport mechanism 13 is configured to be movable in the Z direction within the resin molding module B.

[0029] The substrate transport mechanism 13 may also be configured as a pre-molded substrate transport mechanism (loader) that transports the pre-molded substrate W from the substrate supply / storage module A to the resin molding module B, and a resin molded product transport mechanism (unloader) that transports the resin molded product P from the resin molding module B to the substrate supply / storage module A.

[0030] Each resin molding module B includes an upper mold 14, which is a first mold for holding the substrate W; a lower mold 15, which is a second mold with a cavity 15a formed therein; and a clamping mechanism (not shown) for clamping the upper mold 14 and the lower mold 15. By clamping these together, the electronic components fixed to the substrate W are resin-encapsulated by resin molding using a resin material.

[0031] The resin material supply module C includes a resin supply unit 16, such as a dispenser, that supplies liquid resin to the cavity 15a of the lower mold 15, and a resin transport mechanism 17 that transports the resin supply unit 16 from the resin material supply module C to the resin molding module B. The resin supply unit 16 has a resin discharge unit 18 at its tip that discharges liquid resin. The resin transport mechanism 17 is configured to be movable in the X and Y directions within the resin material supply module C and each resin molding module B. The resin material supply module C may supply resins in other forms, such as granular resin, sheet resin, tablet resin, or granular resin, in addition to supplying liquid resin.

[0032] <Characteristics and configuration of resin molding apparatus 100> Furthermore, in the resin molding apparatus 100 of this embodiment, the upper mold 14, which is the first molding die, and the substrate transport mechanism 13 have a configuration that can accommodate larger substrates W or more complex resin molding shapes.

[0033] Specifically, as shown in Figures 2 and 3, the upper mold 14 is configured to hold the pre-molding substrate W, which has a rectangular shape in plan view, by adsorption using the adsorption mechanism 141, and to hold the four sides of the pre-molding substrate W by clamping using the clamp mechanism 2.

[0034] As shown in Figure 2, the adsorption mechanism 141 has a plurality of adsorption holes 141a that open to the mold surface of the upper mold 14, and a suction channel 141b that communicates with the plurality of adsorption holes 141a and to which a suction source (not shown) is connected.

[0035] As shown in Figures 2, 3, and 7-9, the clamping mechanism 2 includes a rear-end clamping portion 21 that holds the rear end of the unmolded substrate W in the sliding direction (X direction) toward the substrate transport mechanism 13, a front-end clamping portion 22 that holds the front end in the same sliding direction, and end-end clamping portions 23 and 24 that hold both ends perpendicular to the sliding direction. The number of clamping portions 21-24 provided on each side may be one or multiple.

[0036] Each clamping section 21 to 24 has a clamping piece 202 that is rotatably supported on the upper mold 14 by an axis 201, and an elastic member 203 that presses the tip of the clamping piece 202 toward the upper mold 14 around the axis 201. Each of these clamping sections 21 to 24 is released by pressing the rear end of the clamping piece 202.

[0037] As shown in Figures 2, 4 to 9, the substrate transport mechanism 13 transports and transfers the unmolded substrate W to the upper mold 14, which has a clamping mechanism 2 for holding the substrate W. In this embodiment, the substrate transport mechanism 13 receives the unmolded substrate W extruded from the unmolded substrate storage section 111 and transports the unmolded substrate W to the upper mold 14 for transfer.

[0038] This substrate transport mechanism 13 is configured to allow the clamping mechanism 2 to be opened by operating each of its clamping parts 21 to 24 when transferring the substrate W before molding to the upper mold 14.

[0039] Specifically, as shown in Figures 2, 4 to 9, the substrate transport mechanism 13 includes a base member 3, a mounting section 4 on which the unmolded substrate W slides and is placed, a guide section 5 provided adjacent to the mounting section 4 and guiding the substrate W as it slides toward the mounting section 4, a first operating section 6 for operating the rear end clamp section 21, and a second operating section 7 for operating the clamp sections 22 to 24 other than the rear end clamp section 21.

[0040] The base member 3 moves between a receiving position (see Figure 4) where the unmolded substrate W is received from the unmolded substrate storage section 111, and a transfer position (see Figure 2) where the unmolded substrate W is transferred to the upper mold 14, which is located between the opened upper mold 14 and lower mold 15. The base member 3 also moves up and down between the opened upper mold 14 and lower mold 15 (see Figure 7).

[0041] The mounting section 4 is on which the unmolded substrate W is slid and placed, and is provided so as to be movable up and down relative to the base member 3. Here, the mounting section 4 is formed with recesses (not shown) along the sliding direction so that the mounting surface of the unmolded substrate W faces downward, so that the electronic components of the unmolded substrate W do not come into contact with it. Specifically, the mounting section 4 has sliding surfaces on which both side edges perpendicular to the sliding direction of the unmolded substrate W slide.

[0042] The mounting section 4 moves up and down between a mounting position (see Figures 4 and 7) where the unmolded substrate W is slid and placed, and a raised position (see Figure 8) above the mounting position where the unmolded substrate W is transferred to the upper mold 14. Here, the mounting section 4 is moved up and down by a lifting drive unit 8. The lifting drive unit 8 may be, for example, a ball screw mechanism or an air cylinder.

[0043] The guide section 5 is through which the unmolded substrate W slides, and is fixedly mounted to the base member 3. Here, similar to the mounting section 4, the guide section 5 has recesses (not shown) along the sliding direction to prevent contact with the electronic components of the unmolded substrate W. Specifically, the guide section 5 has a sliding surface on which both side edges perpendicular to the sliding direction of the unmolded substrate W slide. This substrate sliding surface of the guide section 5 is at the same height as, or slightly higher than, the substrate mounting surface of the mounting section 4 in the mounting position. The substrate sliding surface of the guide section 5 ensures that the unmolded substrate W, pushed out from the unmolded substrate storage section 111, is stably placed on the mounting section 4.

[0044] The first operating section 6 is provided on the base member 3 and presses against the rear end clamp section 21 to release it. As shown in Figures 2, 4 to 9, it is provided above the passage area R of the substrate W as it slides toward the mounting section 4. In this embodiment, the first operating section 6 has a pin shape that contacts the rear end clamp section 21.

[0045] Specifically, the first operating section 6 is provided above the passage area R of the unmolded substrate W in the guide section 5. In this embodiment, the first operating section 6 is provided on a support member 9 provided around the passage area R of the unmolded substrate W in the guide section 5. As shown in Figures 5 and 6, this support member 9 has a pair of legs 9a and 9b provided on both sides of the passage area R, and a beam section 9c provided above the passage area R, spanning the pair of legs 9a and 9b. The first operating section 6 is provided on the beam section 9c corresponding to the rear end clamp section 21. In this embodiment, the pair of legs 9a and 9b are fixed to the base member 3, but they may also be fixed to the guide section 5.

[0046] The second operating section 7 is provided on the base member 3 and presses against the front end clamp section 22 and the end end clamp sections 23 and 24 to release them. In this embodiment, the second operating section 7 is provided in correspondence with the front end clamp section 22 and the end end clamp sections 23 and 24 (see Figure 5) and has a pin shape that contacts the front end clamp section 22 and the end end clamp sections 23 and 24, respectively.

[0047] <An example of operation of the substrate transport mechanism 13 and the resin molding apparatus 100> Next, an example of the operation of the resin molding apparatus 100 will be described with reference to Figures 1, 2, 4, and 7-9. The operation described below is performed, for example, by a control unit CTL provided in the resin material supply module C, which controls each part of the resin molding apparatus 100. The control unit CTL is a dedicated or general-purpose computer having a CPU, internal memory, input / output interface, AD converter, etc.

[0048] (1) Substrate supply process before molding In the substrate supply and storage module A, the base member 3 is moved to a receiving position to receive the unmolded substrate W from the unmolded substrate storage section 111 (see Figure 4). At this receiving position, the mounting section 4 on the base member 3 is in a lowered position (the position where the unmolded substrate W is placed). In this state, when the unmolded substrate W is pushed out from the unmolded substrate storage section 111, the unmolded substrate W slides through the guide section 5 and then slides onto the mounting section 4. Here, since the first operating section 6 is provided above the passage area R in the guide section 5, the first operating section 6 and the support member 9 do not come into contact with the unmolded substrate W.

[0049] When the unmolded substrate W is placed on the mounting section 4, the base member 3 is moved to a transfer position located between the upper mold 14 and the lower mold 15 (see Figure 2). At this transfer position, the base member 3 is raised, and the rear ends of the clamp pieces 202 of each clamp section 21 to 24 are pushed by the first operating section 6 and the second operating section 7, thereby releasing each clamp section 21 to 24 (see Figure 7).

[0050] After each clamp section 21-24 is released, the mounting section 4 is raised relative to the base member 3, bringing the unmolded substrate W on the mounting section 4 into contact with the mold surface of the upper mold 14 (see Figure 8). As a result, the unmolded substrate W is held in place by suction on the mold surface of the upper mold 14.

[0051] Subsequently, the mounting section 4 is lowered relative to the base member 3, and the base member 3 is also lowered (see Figure 8). As a result, the first operating section 6 and the second operating section 7 separate from the clamp pieces 202 of the clamp sections 21-24, and the four sides of the unmolded substrate W are held between the upper mold surface and the clamp sections 21-24. After that, the substrate transport mechanism 13 is returned to a predetermined standby position.

[0052] (2) Resin supply process Next, the resin supply unit 16, which is in a predetermined standby position, is moved to the resin molding module B by the resin transport mechanism 17 and supplied to the cavity 15a of the opened lower mold 15. A release film F (see Figure 2, etc.) is already attached to the cavity 15a of the lower mold 15. After that, the resin supply unit 16 is returned to the predetermined standby position by the resin transport mechanism 17.

[0053] (3) Resin molding process After the above process, in resin molding module B, the upper mold 14 and lower mold 15 are clamped by the mold clamping mechanism with a predetermined clamping pressure and heated. After a predetermined time has elapsed, the mold clamping mechanism lowers the lower mold 15 to open the upper mold 14 and lower mold 15.

[0054] (4) Process for unloading molded substrates Next, the substrate transport mechanism 13 is moved to receive the molded resin product P from the opened upper mold 14. At this time, the suction holding and clamping of the upper mold 14 by the clamping part 21 are released. Then, the substrate transport mechanism 13, which has received the molded resin product P, is moved to the substrate supply and storage module A. Finally, the molded resin product P is transferred from the substrate transport mechanism 13 to the molded substrate storage section 12 and stored.

[0055] <Effects of this embodiment> According to the resin molding apparatus 100 of this embodiment, a first operating section 6 for operating the rear end clamping section 21 of the clamping mechanism 2 of the upper mold 14 is provided above the passage area R of the pre-molding substrate W that slides toward the mounting section 4. Therefore, the first operating section 6 can be provided regardless of the sliding movement of the pre-molding substrate W. For this reason, the upper mold 14 can be provided with a rear end clamping section 21 that holds the rear end of the pre-molding substrate W in the sliding direction. As a result, it is possible to design a molding die that can accommodate larger pre-molding substrates W or more complex resin molding shapes for the object to be molded.

[0056] <Other modified embodiments> However, the present invention is not limited to the embodiments described above.

[0057] For example, in the above embodiment, the substrate was directly placed from the pre-molded substrate storage section 111 to the substrate transport mechanism 13. However, if an intermediate section such as an intermediate table is provided between the pre-molded substrate storage section 111 and the substrate transport mechanism 13, the substrate may be slid onto the substrate transport mechanism 13 from the intermediate section.

[0058] Furthermore, although the support member in the above embodiment had a gate-like shape consisting of a pair of legs and a beam, it is acceptable as long as the first operating section 6 is provided above the passage area R. For example, it may have a cantilever shape consisting of a leg provided on one side of the passage area R and a beam with one end connected to the leg.

[0059] Furthermore, although the substrate transport mechanism 13 had a guide portion 5 in the above embodiment, the substrate transport mechanism 13 may also be configured without a guide portion 5. In this case, it is also conceivable to provide a guide mechanism on the pre-molded substrate storage portion 111 side to guide the pre-molded substrate W.

[0060] Furthermore, although the substrate transport mechanism 13 in the above embodiment was configured to transport one unmolded substrate W, it may also be configured to transport two or more unmolded substrates W. In this case, the substrate transport mechanism 13 will have a mounting section 4, a guide section 5, a first operating section 6, and a second operating section 7 on the base member 3, corresponding to each of the multiple unmolded substrates W.

[0061] Furthermore, it goes without saying that the present invention is not limited to the embodiments described above, and various modifications are possible without departing from its spirit. [Explanation of Symbols]

[0062] 100...Resin molding equipment W... Molding object 14...Molding mold (upper mold) 2. Clamping mechanism 21...Rear end clamp section 22...Front end clamp section 23, 24... Clamp sections at both ends 13. Substrate transport mechanism (molding object transport mechanism) 3. Base component 4. Mounting section R...passage area 5. Guide section 6...1st operation section (operation section) 7...Second operation section 9. Support member 9a, 9b... Legs 9c...beam part

Claims

1. A molding object transport mechanism that transfers a molding object to a mold having a clamping mechanism for holding the molding object, A mounting section on which the object to be molded slides and is placed, A molding object transport mechanism comprising an operating section for operating the clamping mechanism, provided above the passage area of ​​the molding object which slides toward the mounting section.

2. The system further includes a guide portion provided adjacent to the mounting portion, which guides the object to be molded as it slides toward the mounting portion described above, The molding object transport mechanism according to claim 1, wherein the operating section is provided above the passage area of ​​the molding object in the guide section.

3. The mounting portion is provided to be movable up and down, and the base member further comprises the operating portion, By moving the base member up and down, the operating unit operates the clamp mechanism. The molding object transport mechanism according to claim 1, wherein the above-described mounting portion is moved up and down relative to the base member to transfer the molding object to the molding die.

4. The molding object transport mechanism according to claim 1, wherein the operating unit is provided on a support member provided around the passage area.

5. The support member has a pair of legs provided on both sides of the passage area and a beam provided above the passage area, The molding object transport mechanism according to claim 4, wherein the operating unit is provided on the beam.

6. The clamping mechanism has a rear end clamp portion that holds the rear end of the object to be molded in the sliding direction, The molding object transport mechanism according to claim 1, wherein the operating part presses and releases the rear end clamping part.

7. The object to be molded has a rectangular shape in plan view. The clamping mechanism further comprises a front end clamping portion that holds the front end of the object to be molded in the sliding direction, and end end clamping portions that hold both ends of the object to be molded perpendicular to the sliding direction, The molding object transport mechanism according to claim 6, further comprising a second operating part for pressing and releasing the front end clamp portion and the end end clamp portions, respectively.

8. A mold having a clamping mechanism for holding the object to be molded, A resin molding apparatus comprising a molding object transport mechanism according to any one of claims 1 to 7.

9. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 8, A resin molding process in which the object to be molded is transported to the molded die by the object transport mechanism and resin molding is performed, A method for manufacturing a resin molded product, comprising a discharge step of dischargering the resin-molded object from the mold.

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