Method and apparatus for digital manufacturing of objects using operational micropixelation and dynamic density control

Abstract

To relate to a stator for an electric motor.SOLUTION: A manufacturing apparatus includes a build surface that receives layers of material for production of a three-dimensional solid representation of a digital model, and an imaging component for bonding respective portions of a build material into cross sections that represent portions of data contained in the digital model. An imaging component may be a programmable planar light source utilizing a micro-pixelation system and a refractive pixel shifting mechanism, or other imaging system. The apparatus may include a system for controlling a density of a printed part. An object may be a powder composite part using either a variety of powder feedstocks or plastic parts. The object may be further post-processed to produce high precision metal or ceramic component.SELECTED DRAWING: Figure 9

Description

Cross - reference to related applications ,

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[0004]

[0001] This application claims priority to U.S. Provisional Patent Application No. 62 / 817,431, filed Mar. 12, 2019, the disclosure of which is hereby incorporated by reference in its entirety.

Technical Field

Technical Field

[0002] The subject matter disclosed herein generally relates to solid - freeform fabrication of objects. More specifically, the subject matter disclosed herein relates to systems, devices, and methods for solid - freeform fabrication of objects from combinations of one or more types of materials, including metals, plastics, ceramics, and composite materials.

Background Art

[0003] The embodiments described herein generally relate to devices and methods for solid - freeform fabrication of objects from metals, plastics, ceramics, and composite materials including combinations of one or more types of materials.

[0004] Solid - freeform fabrication (SFF), 3D printing (3DP), direct digital manufacturing (DDM), and additive manufacturing (AM), also known as solid imaging, are widely adopted methods for prototyping both visually demonstrative and functional parts. In some cases, this is also a cost - effective means of production. There are a variety of means for producing components based on digital models, all of which have reduced the time and cost required for a complete design cycle. As a result, the pace of innovation in many industries has been improved.

[0005] Generally, SFF is achieved in a layer - surface manner, where the digital model is sliced horizontally The slices are divided, and each slice is generated as a 2D image on the build surface. Next, manufacturing involves the aggregation of thin layers that collectively constitute a three-dimensional object represented by a digital model. To generate aggregates. CNC (Computer Numerically Controlled) machining, injection molding, and other processes. In contrast to traditional manufacturing techniques such as [method name], SFF significantly reduces production time and costs. Therefore, it has been widely adopted for research and development purposes where small-scale production using traditional methods is extremely expensive. In addition, SFF devices generally require less specialized knowledge to operate compared to CNC machines. It does not require setup. The cost of individual parts manufactured from CNC machines is generally high, and this is due to setup. This is because the time required increases, and the cost of machine operation rises. Parts manufactured by CNC are Often, they have stronger and more detailed features than parts manufactured with SFF, and these are some of the characteristics. This would be desirable for the following applications. The SFF technique provides the resolution and functionality of CNC-produced parts. Until production becomes feasible, the use of SFF in parts manufacturing will likely remain restricted.

[0006] Powder injection molding (PIM) allows for the manufacture of high-precision parts using materials that were previously impossible to produce with other molding methods. This is a mass production technique that has been widely adopted as a means of achieving this. It involves blending powder with a resin binder and then injection molding. The raw material is formed and then injected into a mold in the same way as in plastic injection molding. The manufactured parts are These are powder composite components called "green" components, and green components are called debinding agents. The parts are subjected to a process that removes most of the binder, and the resulting parts are called "brown" parts. Next, the brown area is heat-treated to sinter the powder particles together. The parts shrink, and the voids between the powder particles are removed. The final result is an almost perfect density. It is a component that achieves a density exceeding 99.5% depending on the composition of the powder supply material used. Further post-processing may be used for this purpose.

[0007] Some of the most common techniques for SFF are stereolithography (SLA), selective deposition. This includes modeling (SDM), fusion precipitation modeling (FDM), and selective laser sintering (SLS). These approaches depend on the type of material they can use and the way the layers are produced. and changes in the resolution and quality of the parts generated thereafter. Typically, layers It is produced by bulk material deposition or selective material deposition. Bulk deposition for layer production In techniques that use the method, layer imaging is typically performed using thermal, chemical, or optical processes. Achieved by Seth. One technique is a binder jet, which is an inkjet Using a printhead, the binder is deposited onto the powder bed, and in the PIM process, This generates parts similar to the green parts described above. These green parts are used to manufacture the final parts. Therefore, post-processing can be done using the same method. Unfortunately, the company that manufactures green parts... Due to the imperfections of the process, the final components manufactured through this process have particular surface finishes. When this happens, it often fails to meet the tolerances required for high-precision applications. Furthermore, The precision and speed of the mixture injection process are limited. [Overview of the project] [Problems that the invention aims to solve]

[0008] We manufacture components for various applications (e.g., plastic, metal, and ceramic parts). Embodiments of devices and related methods for solid freeform fabrication are disclosed in this specification. **Means for Solving the Problem**

[0009] In some embodiments, the SFF methods and apparatuses disclosed herein include a surface for receiving layers of material to fabricate a three-dimensional solid representation of a digital model, means for depositing the necessary layer(s) of build material, and means for imaging the build material into a cross-sectional image representing the data included in the digital model. In one embodiment, the build material is composed of particulate material and a photocurable resin material. By bonding these materials on the build surface, the rheological constraints of the above-described apparatuses that have been used for manufacturing powder composite parts are overcome. In other embodiments, the build material is a photocurable resin material for manufacturing polymer members. [[ID=二十二]]In other embodiments, the materials are mixed prior to the build process, and the density of the mixture is changed during the build process, so that the characteristics of the printed parts may be optimized.

[0010] In addition, in some embodiments, the methods and apparatuses described below may utilize one of the build materials as particulate material (e.g., ceramic, plastic, or metal). Parts generated from this apparatus may be processed after the build process promotes bonding between adjacent particles. The processing includes, but is not limited to, heat treatment, chemical treatment, and pressure treatment, and combinations thereof. The results of this manufacturing process and the processing process are dense metal parts, dense ceramic parts, dense plastic parts, porous metal parts. , perforated ceramic parts, perforated plastic parts, dense composite plastic parts, and This includes, but is not limited to, composite components containing one or more types of materials.

[0011] Material deposition of particulate materials is carried out by multiple means - diffusion by blade mechanism, powder weighing system and Diffusion by a combination of lathe mechanisms, and by a combination of powder weighing system and roller mechanism This includes diffusion, electrostatic deposition on the transport surface, and subsequent deposition on the build surface. Not limited to - can be achieved by. Injection of photocurable materials (e.g., resins) is specialized The injection build platform allows for the injection of components during the build process through the main body. This can be achieved. Other material deposition methods and in-situ material mixing methods will be described below.

[0012] In addition, methods for producing layers of slurry mixtures of powder and binder include spray deposition and pump system deposition. The supply of the material by means of a m, or other methods of supplying a viscous fluid may be included. The formation of the layer is Furthermore, the conditions can be adjusted by the blade, the image generation window of the film, or the film reinforced by the solid surface. Other methods for controlling the thickness and uniformity of the layers may be included.

[0013] Layer image generation involves multiple means—for example, a reflective pixel shift system is used to determine the effective resolution of the projection system. This includes programmable area light sources (such as DLP projectors) used to increase the power, This may be achieved by a microlens system. By making these changes, the resolution of the image generation process can be further improved.

[0014] Furthermore, in one embodiment, the object is photocurable according to digital data representing a given three-dimensional object. A solid free-form manufacturing apparatus capable of producing materials using resin is provided.

[0015] In other embodiments, SF can produce composite objects composed of particulate material and photocurable resin material. Device F will be provided.

[0016] In other embodiments, an SFF apparatus is provided that utilizes a bulk deposition method to generate layers of material.

[0017] In another embodiment, a composite layer of materials is formed by bonding a particulate material and a photocurable resin material. A fast-forward (FF) device will be provided.

[0018] In other embodiments, enabling interchangeability of material components allows for the use of a wide range of material combinations. An SFF device that makes this possible is provided.

[0019] In another embodiment, an SFF apparatus is provided that realizes the generation of a composite layer by in-situ injection of a powder layer. ru.

[0020] In another embodiment, an SFF apparatus is provided that uses an injection platform to perform in-situ bonding of materials. It will be done.

[0021] In other embodiments, SFF devices utilize micropixelation to achieve improved resolution. A place will be provided.

[0022] In other embodiments, SFF devices utilize pixel shifting means to achieve resolution improvement. A place will be provided.

[0023] In other embodiments, the object produced by the SFF apparatus is subjected to thermal, chemical, or mechanical treatment. This process can improve the internal bonding of the material components.

[0024] In other embodiments, a feedback system is used to optimize the rate of material deposition. obtain.

[0025] In other embodiments, the build process is used to increase the particle loading density within the printed component. Mixed feedstocks that are modified during the process may be used.

[0026] In other embodiments, printed parts undergo surface quality treatment before heat treatment to achieve high final density. It may be chemically treated to improve it.

[0027] Further features of the present invention can be more easily understood from the following detailed description of the invention in conjunction with the accompanying drawings. This will become clear. [Brief explanation of the drawing]

[0028] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. [Figure 1] This is an elevation perspective view of a machine for manufacturing solid freeform shapes according to one embodiment of the subject matter of this disclosure. [Figure 2] Figure 1 is a perspective view of the machine from below. [Figure 3] This is a perspective view of the machine in the second configuration shown in Figure 1. [Figure 4] Figure 3 is a cross-sectional view of the machine. [Figure 5] This is a cross-sectional view of the machine in the third configuration shown in Figure 3. [Figure 6] This is an elevation perspective view of another embodiment of the machine shown in Figure 1. [Figure 7] Figure 6 is a cross-sectional view of the machine. [Figure 8] This is an enlarged cross-sectional view of the machine in Figure 6 during the manufacturing process. [Figure 9] Figure 6 is a schematic diagram of the components constructed by the machine. [Figure 10] Figure 1 is an elevation perspective view of a first configuration of a micromirror array used in a potential embodiment of the machine. [Figure 11] Figure 10 is an elevation perspective view of the micromirror array in the second configuration. [Figure 12] This is a schematic diagram of a micropixelation and pixel shifting system that may be used in a potential embodiment of the machine shown in Figure 1. [Figure 13] This is a schematic diagram of the reflected beam guidance system. [Figure 14] This is a schematic diagram of a refractive beam guidance system. [Figure 15] Figure 14 is a schematic diagram of an alternative embodiment of the system. [Figure 16] Figure 8 is an elevation perspective view of one embodiment of the system. [Figure 17] Figure 16 is a front perspective view of the system. [Figure 18] This is an elevation perspective view of the system in the second configuration shown in Figure 16. [Figure 19] This is an elevation perspective view of the system in the third configuration shown in Figure 16. [Figure 20] Figure 16 is an elevation perspective view of a first configuration of a micro-LED array used in a potential embodiment of the image generation system shown in Figure 16. [Figure 21] Figure 20 is an elevation perspective view of the second configuration of the microLED array. [Figure 22] Figure 16 is an elevation perspective view of an LCD mask image generation system used in a potential embodiment of the image generation system. [Figure 23] This is a top view of a pixel projected using a pixel-shift image generation system. [Figure 24] This is a top view of the pixels in Figure 23 in the second configuration. [Figure 25] This is a top view of the pixels in Figure 23 in the third configuration. [Figure 26] This is a top view of the pixels in Figure 23 in the fourth configuration. [Figure 27] Figure 16 is a top view of the pixels projected by the system. [Figure 28] This is another top view of the pixels projected by the system in Figure 16. [Figure 29]Figure 12 is an elevation perspective view of another embodiment of the micromixing system. [Figure 30] Figure 29 is a perspective view of the system from below. [Figure 31] This is a top view of the micropixel rasterization path. [Figure 32] This is a top view of the second micropixel rastering path. [Figure 33] This is a top view of the third micropixel rastering path. [Figure 34] This is an elevation perspective view of a second embodiment of a machine for manufacturing solid free-form shapes according to embodiments of the subject matter of this disclosure. [Figure 35] Figure 34 is a cross-sectional view of the machine. [Figure 36] This is a schematic diagram of the first step of a transport process that may be used by the machine shown in Figure 34. [Figure 37] This is a schematic diagram of the second step of the transport process that can be used by the machine shown in Figure 34. [Figure 38] This is a schematic diagram of the third step of the transport process that may be used by the machine shown in Figure 34. [Figure 39] This is a schematic diagram of the fourth step of the transport process that may be used by the machine shown in Figure 34. [Figure 40] This is an elevation perspective view of a third embodiment of a machine for manufacturing solid free-form shapes according to embodiments of the subject matter of this disclosure. [Figure 41] This is an enlarged view of the machine shown in Figure 40. [Figure 42] Figure 40 is an elevation perspective view of a material deposition system that may be used in the machine. [Figure 43] Figure 42 is a perspective view from below of the material deposition system. [Figure 44] Figure 40 is a schematic diagram of the first step of a transport process that may be used by the machine. [Figure 45] This is a schematic diagram of the second step of the transport process that can be used by the machine shown in Figure 40. [Figure 46]This is a schematic diagram of the third step of the transport process that may be used by the machine shown in Figure 40. [Figure 47] Figure 40 is a schematic diagram of the first step of an alternative material handling process that can be used by the machine shown. [Figure 48] Figure 40 is a schematic diagram of the second step of an alternative material handling process that can be used by the machine shown. [Figure 49] This is an elevation perspective view of a fourth embodiment of a machine for manufacturing solid free-form shapes according to embodiments of the subject matter of this disclosure. [Figure 50] Figure 49 is a front view of a material deposition system that may be used by the machine. [Figure 51] Figure 50 is an elevation perspective view of the material deposition system. [Figure 52] This is a schematic flowchart illustrating a material handling process that can be used in one or more of the earlier embodiments of the subject matter of this disclosure. [Figure 53] Figure 34 is an elevation perspective view of an object that can be manufactured by the machine shown. [Figure 54] This is a top view of an image that can be used to manufacture the first layer of the object shown in Figure 53. [Figure 55] This is a top view of an image that can be used to manufacture the second layer of the object in Figure 53. [Figure 56] Figure 34 is a top view of the first step in a method for modulating resin flow within an object manufactured by the machine shown. [Figure 57] Figure 34 is a top view of the second step in a method for modulating resin flow within an object manufactured by the machine shown. [Figure 58] This is a top view of the third step in a method for modulating resin flow within an object manufactured by the machine shown in Figure 34. [Figure 59] Figure 34 is a top view of a method for modulating the resin flow around an object manufactured by the machine. [Figure 60] Figure 34 is an elevation perspective view of a first embodiment of a material deposition system for use in the machine shown. [Figure 61]Figure 60 is an enlarged cross-sectional view of a second embodiment of the material deposition system. [Figure 62] Figure 34 is an elevation perspective view of an alternative embodiment of a build surface used in the machine. [Figure 63] Figure 34 is an elevation perspective view of a second embodiment of a material deposition system for use in the machine shown in Figure 34. [Figure 64] This is an elevation perspective view of a third embodiment of a material deposition system for use in the machine shown in Figure 34. [Figure 65] Figure 64 is an elevation perspective view of the imaging array depicted in the system. [Figure 66] Figure 65 is a perspective view of the imaging array from below. [Figure 67] Figure 65 is a perspective view of the imaging array in the second configuration. [Figure 68] Figure 65 is a top view of the pixels projected by the imaging array. [Figure 69] Figure 65 is a top view of the pixels projected by the second configuration of the imaging array. [Figure 70] This is a cross-sectional view of the gas phase module depicted in the system shown in Figure 64. [Figure 71] This is an elevation perspective view of a fourth embodiment of a material deposition system for use in the machine shown in Figure 34. [Figure 72] This is a schematic diagram of the first step of a transport process that can be used by the machine shown in Figure 71. [Figure 73] This is a schematic diagram of the second step of the transport process that can be used by the machine shown in Figure 71. [Figure 74] This is a schematic diagram of the third step of the transport process that can be used by the machine shown in Figure 71. [Figure 75] This is a schematic diagram of the fourth step of the transport process that can be used by the machine shown in Figure 71. [Figure 76] This is an elevation perspective view of a fifth embodiment of a material deposition system for use in the machine shown in Figure 34. [Figure 77]This is a bottom-up perspective view of a microdroplet deposition system, as depicted in the system shown in Figure 76. [Figure 78] This is a cross-sectional view of the material deposited by the system shown in Figure 76. [Figure 79] This is an elevation perspective view of a part that can be manufactured by any of the aforementioned systems. [Figure 80] Figure 79 is a schematic cross-sectional view of the powder particle distribution and possible curing patterns in the first step of the manufacturing process of the component. [Figure 81] Figure 79 is a schematic cross-sectional view of the powder particle distribution in the second step of the manufacturing process of the component. [Figure 82] This is an elevation perspective view of a component and support structure that can be constructed by one or more of the aforementioned systems. [Figure 83] This is an elevation perspective view of an array of components and support structures that can be constructed by one or more of the aforementioned systems. [Figure 84] This is an elevation perspective view of the array of components and support structures in the second configuration, as shown in Figure 83. [Figure 85] This is a schematic flowchart illustrating the process for integrating the support structure into the printing and sintering processes. [Figure 86] This is a schematic flowchart illustrating the process of debinding printed components. [Figure 87] This is a schematic flowchart illustrating a method for post-processing printed parts. Detailed description of the drawing

[0029] 3D lithography (SLA) manufacturing is a method of producing three-dimensional objects using photopolymer resins and A polymerization source of radiation is used. Figures 1 to 5 show a system (100) that implements this concept. In this embodiment, the build platform (102) is a vat (104) containing resin (110) It is lowered inside. Image (105) shows that a portion of the resin (110) is solidified to form a layered solid component (112). To achieve this, the projection unit (106) projects the image onto the resin (110) through the window (108). After the set layer has hardened at least partially, the platform (102) moves upward, and the tree This allows the grease (110) to flow under the component (112) and provide material for the next layer.

[0030] This system generally uses any photopolymer resin material or photopolymer resin. It can be used to process mixtures with powder. In some cases, this method This allows for the manufacture of powder composite materials, and then these powder composite materials are post-processed to produce poly The binder can be removed, and the powder raw material can be sintered to form a solid component. The powder material in question... Generally, this is any combination of metal, ceramic, or sinterable material. That's fine.

[0031] When powder composite components are manufactured, and the resin material has high viscosity, There are speed limitations to this process, which are presented by the fluidity of the material. Figure 5 shows the part being constructed. The build tank (104) is moved in order to apply shear force to the product (112) and the resin (110) inside the tank (104) This shear action helps separate the most recently hardened layer from the window (108), and also, To generate the next layer, additional material is forced to flow beneath part (112).

[0032] Figures 6-8 show alternative embodiments of this system, and the build platform (102 ) is pumped to the perforated build surface and the parts (114) being built or sucked from there. It has internal fluid pathways for the fluid being injected. In one embodiment, part (114) It is constructed using a component (114) having a perforated internal structure in the same manner as described above. The resin (110) is pumped through the build platform (102) and parts (114). This can then be collected in the build tank (114). The pressure from this excess resin supply source is released as the layer hardens. Afterward, it can be helped to separate part (114) from the build window (108). Final solid part To manufacture it, part (114) is post-cured and then placed inside after the build process is complete. Any remaining resin (110) can be solidified. Fluid connection to protruding features To maintain, the support structure (116) has a hollow overall structure, The tension of the printed part (114) may be constructed under any protruding feature of the part (114) It may have a perforated surface that allows fluid communication to the protruding features.

[0033] Figure 9 shows a method in which the systems shown in Figures 6-8 can be used to manufacture high-density powder composite components. This shows that, typically, in slurry-based systems, density is limited. The load increases density, which improves the quality of the final part sintered from the printed powder composite. While it is possible to add more powder, increasing the amount of powder also increases the slurry viscosity, reducing the manufacturing process. To speed up the process, a low-viscosity slurry is used to create a high density that can be sintered. The degree portion may be manufactured.

[0034] The powder (118) is suspended in the resin (110) to form a slurry. When a new layer is formed, The resin (110) is drawn in through the component (117) being constructed. This is done as the resin is removed. The powder load rate was increased, and the powder (118) filled into the part was suspended in the original slurry. The powder (118) in the part (117) will be packed more densely than the resin (110) A hardened grid structure that allows the powder (118) to flow through the material (117) while fixing it in place. (119) is held in place by the powders together, which are eventually sintered to form the final solid part. Additional components for constructing perforated parts that allow liquid resin to flow while bonding I will explain the method further.

[0035] One of the most common image generation systems for curing resin materials is shown in Figures 10 and 11. This is a digital micromirror device (DMD) as shown. Actuator within the DMD array By applying an electric charge, the individual mirrors (122) reflect from these mirrors (122). The light may be rotated so that it is included in the final image or is discarded by the absorber. These systems can harden all layers of the material simultaneously, significantly increasing production speed. In that respect, it has a significant advantage over laser-based systems, but the build area and There are limitations to the accuracy. Generally, images from DMD systems have each pixel of an arbitrary width, even number of pixels. It can focus to within a fraction of a micron. However, the system is available It is limited by the number of pixels it can handle. Most high-resolution chips have an average resolution of about 1000x2000 pixels. There is a ray. If a pixel size of 10 microns is desired, this corresponds to an image generation area of ​​1 cm × 2 cm. It generates a 10-micron resolution, which is a surface finish currently unavailable from 3D printers. It is converted to a functional level, which is very desirable for printed parts, but a 1cm x 2cm bit The available area is insufficient for many applications. There are several ways to circumvent this limitation. Using multiple projectors, and / or moving projectors around the build area Move the image to perform multiple exposures, and the sum of these exposures constitutes the final image of the build region. Moving the projector to generate an image requires a very precise mechanical operating system. It is necessary and slows down the production process.

[0036] When using multiple projectors, the image generated by each projector is less The effective build area is only valid if it is the same size as the lateral dimensions of the projection unit itself. The range increases. Otherwise, there will be significant gaps between the images generated by the projector. This occurs. In the case of a small number of projectors, to produce images that are aligned with each other, While there are more sophisticated options for using LAR and other optical elements, generally speaking, this is... It is not scalable to larger production areas. An array of projectors is used. Often, here, each projector generates a small image, but the array completes the build area. It is operated collectively to generate multiple images in order to visualize the whole. It has more extreme problems requiring a variable operating system, and still suffers from the problem of reduced production speed. They will possess it.

[0037] The ideal configuration is an array of projection units, where each projection unit occupies the space occupied by the projection unit. Generate an image that is at least the same size as the physical footprint, and each projection unit The accuracy achieved by the system matches the target component accuracy. Generally, systems with these characteristics... Even a single projection unit can significantly improve the precision and speed of optical 3D printing systems. This will constitute a significant improvement.

[0038] Figure 12 shows the elements of a system that achieves this goal. Figure 12 shows a single pixel of this system. This is a schematic diagram of the optical behavior. The light source (124) is either in the "on" or "off" position. A rotatable pixel (122) is illuminated, and the excitation light from this pixel (122) illuminates the pixel (122) When in the "on" position, it forms an image on the microlens (126). This creates the image of the pixels. As seen on the image generation surface (130), it is focused to a size smaller than its nominal size. The amount by which the focused image is smaller than the nominal size is due to the limit of the light source's resolution. Depending on the application requirements, such as situations where the desired resolution of the object shape to be rendered is not achieved. They can be selected. In some embodiments, for example, each light source is generated The illuminated area covered by the image is less than the sum of the sizes of the individual pixel areas. Both are 20% smaller, but those skilled in the art will know that a larger or smaller reduction in image size is possible in image generation. You will be aware that this can be selected to adjust the system's final resolution.

[0039] However, in this configuration, the size of the pixel image is too small to produce a complete image. It would be too small, and such pixels would be too small to completely cover the image generation surface (130). It must be possible to shift by a precise increment. For this purpose, a refractive pixel shift element is used. (128) is used. When the refractive pixel shift element (128) rotates, the pixel image shifts horizontally. It is shifted. The clockwise rotation of the refractive pixel shift element (128) shifts the pixel image to the left. This causes a directional shift, while the counterclockwise rotation of the refractive pixel shift element (128) is, This causes a horizontal shift of the pixel image to the right.

[0040] In most image processing systems, the size of a pixel is approximately equal to the pixel pitch in the image. In other words, it is the distance between the centers of adjacent pixels. Ignoring losses from the cap, projection from such a device with a pixel spacing of 50 microns The shadowed pixel array will have pixels with a width of 50 microns. For the purpose of clarification. This type of pixel image would be called a "saturated" pixel image. Pixel shift is... Also known as pixelation, this is done to improve the effective resolution of pixel-based image generation systems. This is a common method. Typically, this involves projecting multiple images to different positions. This is thus achieved. Here, the positional shift between subsequent images in the series is greater than the width of one pixel. They are small. In the case of projection systems for viewing images, these overlap to create a smoother image. Then, a slightly more precise composite image is formed. A projection system for curing reactive materials. In the case of M, these overlapping images have smoother features than what is possible with a static pixel array. It can generate [this].

[0041] Conventional pixel shift systems typically use mirrors or to shift the image. Using the microactuators within the DMD itself, these systems subdivide the pixels. It has a limited degree to which it can do so, and does not fundamentally change the size of the pixels, which is many This requires the edges of an image defined by overlapping pixel images. When curing of photosensitive materials is required, it is undesirable for high-precision image formation applications. This can generate a gradient in light intensity at the edges of the image. This behavior is more relevant in the context of Figures 23-26. This will be discussed in detail.

[0042] The system described herein offers several advantages over conventional pixel shift systems. It has several advantages. Firstly, the pixel size is significantly smaller than the pixel pitch. Despite the large pixel pitch relative to the cell size, saturation of smaller pixels occurs. This means that the curing response of the irradiated material behaves as if an array had been used. This allows for a larger total image generation area. Secondly, the pixel shift system , a refractive element is used to shift the pixel image. This configuration is a reflection system or microphone It has much higher inherent precision compared to those requiring a rotary actuator. The deflection of the excigent beam from the stem is twice the rotation of the reflective element in the system. Therefore, when an angular accuracy of 1 degree is required for beam placement, in order to properly control this... This requires a rotation system with an angular accuracy of 0.5 degrees. Typically, the beam on the imaging plane. To control the placement with an accuracy of less than 1 micron, an angular accuracy of the micron degree is required. There are times when achieving this is difficult.

[0043] Figures 13 and 14 illustrate this difference in accuracy. A reflected beam guidance system like the one shown in Figure 13... In the first position (1 48) At position (146), the first excitation beam is generated, and at position (150), the second excitation beam is generated (144 ) is generated. These excigent beams (144, 146) then strike the imaging plane (130) In this system, the angular deflection of the exigent beam (144,146) is controlled by the reflecting element (148,1 50) This results in twice the angular deflection. As mentioned earlier, this is a negative factor for the accuracy of the operating system. This increases the burden. By comparison, Figure 14 shows a refractive beam guidance system, where the beam Instead of deflecting the beam by a certain angle, it is offset laterally by a specific distance. The beam (152) strikes the refractive elements (158, 160), and the incident surface and the coolant surface of the coolant elements (158, 160) The refracted and displaced refrigerant beam (154,156) is generated and strikes the image plane (130). The stem provides much better actuator movement relative to beam movement for precise control. It provides a ratio. The refractive system has a rotation of 0.1 degrees or more of the refractive element on the order of 1 micron or less. It may be configured to cause directional translation. This relationship depends on the given thickness and refraction. This can be adjusted by using a refractive element of the ratio, but generally, submicron particles The level of angular accuracy required for accel shifting is equivalent to that of a standard galvanometer or other rotating actuator. This can be easily achieved by [something].

[0044] Finally, the hardening response of many reactive materials is nonlinear, and doubling the radioactivity intensity does not necessarily mean that It is understood that the required exposure time can be reduced by more than double. In this way, Using high intensity actually means that the dose required to achieve a significant hardening response is not actually This reduces energy consumption and increases the overall speed of the manufacturing process. To add. Any pixel shift system, and the mechanical operation of the shift system itself Although there will be some time loss in the control process, this system will significantly reduce the incident radiation. By concentrating the process, the curing time can be reduced to a sufficient extent to compensate for this loss. Several configurations So, the velocity obtained by concentrating the incident radiation is controlled by the motion of the refractive shift element. This is more than just compensation for the losses incurred, and the aforementioned accuracy and scalability gains Along with the signal, it can generate a net gain to the overall speed.

[0045] The refractive pixel shift system shown in Figure 14 above uses a single plate (158,160) The incident beam (152) was then shifted. This is appropriate for monochromatic light sources, but generally... Furthermore, optical materials have a refractive index that changes at different wavelengths, which means that this device can perform other In order for all factors to remain constant, the incident beam (152) is used in different amounts depending on its wavelength. This means shifting the refraction. In order to fully characterize the optical refractive response of a material, refraction The rate-wavelength curve must be determined. The fact that this curve is not a flat line is therefore This causes chromatic aberration in conventional optical systems. Typically, this occurs when two reference wavelengths are used. It has different refractive index-wavelength curves that can be calibrated to have the same refractive effect for the same object. This is overcome by using a chromatic doublet lens system. A triad is a similar system that uses three lenses instead and is calibrated with three reference wavelengths. A system of higher complexity may be used, but is rarely necessary.

[0046] Furthermore, even when using a monochromatic light source, a refractive panel is used as the shift mechanism. It is also necessary to note that there are certain constraints. In the case of practically paraxial rays, the rotation angle and beam The relationship with displacement is substantially linear; however, this relationship becomes nonlinear with respect to non-paraxial rays. Considering this, the ideal implementation of an image generation system using this shift mechanism is: It is constrained to collect only the paraaxial rays from the image source. This can, in some cases, affect the system's concentration. This can reduce light efficiency and overall light output, and in order to mitigate these drawbacks, Other modifications can be made to specific embodiments.

[0047] A similar approach may be taken here, as shown in Figure 15. This example involves erasing two colors. This shows a double refractive pixel shift system. In this system, the primary shift window (160) is the incident pixel shift window. The window (152) is shifted by a quantity D1. Next, the second shift window (170) exits from the first window (160). The beam (164) is shifted back by an amount D2. Therefore, the total displacement D is the difference between D1 and D2. The system may be calibrated so that D is the same at two reference wavelengths. Generally, for any target displacement D, both windows (16) that produce this displacement for both reference wavelengths There will be an appropriate angular rotation for 0,170. Therefore, the wavelengths around these wavelengths Chromatic aberration in the vector region is minimized. This approach uses achromatic triads. Alternatively, it can be generalized to the design of more complex systems, but is not necessary depending on the application.

[0048] Generally, previous systems for reducing chromatic aberration were based on the X and Y directions on the target build surface. It can be applied to pixels that shift in both directions, and the light source is dichroic or polychromatic. This is useful in such cases, and may be necessary to maximize the optical output of the image generation system. ru.

[0049] Figures 16-19 show two refractive shifts driven by two rotary actuators (202, 206). The elements (204, 208) are focused both vertically and horizontally on the imaging plane (130). This demonstrates the implementation of this system by moving a pixel image (212). For simplicity, this In the figure, only a path of 5 pixels is shown. This imaging surface (130) is generally, It may also be a window (108) inside a build tank (104) within a teleorisography system (100), Or it may be any other surface containing a material that substantially changes its state in response to irradiation. , or simply any surface useful for generating high-resolution images. Other optical elements may be used to improve the system, but the optical elements shown herein It may include substantially the minimum set of elements to produce the desired effect.

[0050] In this system, the projection unit (106) projects pixels onto the microlens array (210). It casts a shadow. The image projected onto the microlens array (210) is generally saturated in close proximity. It is an array of pixels. The microlens array (210) converts this saturated image into an unsaturated image. Converted, here the pixel image (212) is the pixel pitch in the image projected onto the image generation surface (130). It can be any quantity smaller than that. For example, in many SFF systems, it is 50 microns or larger. The pixel size is used, which roughly matches the size of the projection unit that generates the image. This is to generate images of this size. Multiple images of this size are placed without gaps between adjacent images. It can be generated by an array of projection units that completely image the large build region. However, if a 10-micron precision is required for a specific build process, this conventional The image generation system is insufficient. The microlens array (210) has a pixel pitch It is possible to use something that generates a 5:1 reduction in pixel size. In this way, A 10-micron pixel is generated with a 50-micron spacing between the centers of adjacent pixels. That's good too.

[0051] The rotational operation of the horizontal shift actuator (206) is controlled by the rotation of the horizontal refraction pixel shift element (208). This generates a shift, which will result in a horizontal shift of the pixel image (212). The rotation operation of the tutor (202) generates a rotation of the vertical refraction pixel shift element (204), and this This results in a vertical shift of the pixel image (212). Essentially, this system is It behaves similarly to a laser imaging system, where the laser beam generates The spot can be moved around the image-generating surface to trace out the image. The spot size is focused to be very small in order to generate a high-resolution image. This is possible. The key difference is that this system can image large areas very quickly. This effectively has millions of focused beams moving in tandem. In addition, the previous Using the specification in the example, the luminosity on the image generation surface is a system having a saturated pixel array. The ratio may be increased by more than 25 times. 25 separate steps are required to fully image the target area. Exposure is required, but this increase in light intensity results in a net increase in imaging speed. In addition, The fact that peak luminosity is achieved at the image-generating surface suggests that this system is holographic. It can also be made to be advantageous for its intended use.

[0052] Generally, in any of the aforementioned systems, the array pitch is larger than the size of each light source. An array of illumination light sources can be used. Alternative embodiments of the potential source are shown in Figures 20-22. Figure 20 shows an array of micro-LEDs (214), while Figure 21 shows the optimal optical efficiency of the device. To illustrate, we show such an array having a corresponding array of microlenses (215). Figure 22 depicts a light source (216) shining through an LCD mask (217), with individual apertures forming a grid. They are spaced apart internally. Images of these apertures are transferred by the projection optical system (218). A pixel image (219) can be generated on the display surface, similar to the system described above. Furthermore, refractive pixel shift is used to generate a high-resolution finished image of the display area. It's okay.

[0053] A more detailed analysis of the shortcomings of conventional pixel shift is demonstrated in Figures 23-26. Therefore, these images show that the pixel saturation array is in both the vertical and horizontal directions, and the pixels This depicts a system where the width is shifted by half. The behavior of complex subpixelization is as follows: This can be extrapolated from the analysis. Figure 23 shows four pixels (232, 234, 2) projected onto the image generation surface (230). The set of 36, 238) is shown. The line (240) indicates the ideal boundary of the cured area, and the cured part is at line (240). It is located on the right side. This analysis is primarily used for image shaping to cure reactive materials. Other pixels not shown in the diagram are also used in this array for purposes related to the application and to simplify the analysis. It is understood that this is done. In these figures, four different projection images correspond to four different The pixel positions are shown. Each image shows the energy required to harden the target material. - Delivered 25% of the dose, and in all four images, only the exposed areas of the material were completely cured. It will have the following: above and below the four pixels shown (232, 234, 236, 238) there will be other pixels. Knowing that this exists, all materials to the right of the flight path (240) will actually receive the appropriate radiation dose. It can be inferred that... However, some pixels (232, 236) are shown in Figures 23 and 25. They are divided into regions within the target region (244, 248) and the target region (242 It illuminates the area outside of (246). The effect of this is that the entire boundary (240) is illuminated at half the width of the pixel. This is irradiation of the area to the left of the target boundary (240), extending along the line. The dosage is as required. This is 50% of the hardening dose, but this depends on the properties of the material in question, as the material may still be partially hardened. It can be hardened. In this case, the pixel shift distance was half the pixel width. For generalization This is called a situation with a 2:1 sub-pixel ratio. At higher sub-pixel ratios, The energy dose gradient is more complex, ranging from 100% energy dose to 0% energy dose. Because it includes, it becomes smoother than in this case. In general, any saturation pixel array A pixelation system always has an energy dose gradient.

[0054] In contrast, Figures 27 and 28 show micro-reactives within an image generation system that uses pixel shifting. This demonstrates the effect of introducing a 252-pixel array. As mentioned above, this takes a saturated pixel array (252) and This is then converted to an unsaturated pixel array (252). These figures show the result of reducing the pixel size by 5:1. The system is drawn, and the pixel shift is necessary because these micropixels are all necessary It can reach a position (254) and enable complete imaging of the target region. Essentially, This system behaves like 25 times the number of projection units as the nominally available pixels. Furthermore, this amplification of accuracy can be much higher, potentially improving accuracy by several orders of magnitude. We will refer to this technique as micropixelation.

[0055] As shown in Figure 28, multiple exposures at different shift positions are performed by the saturation array of pixels. It is possible to generate images similar to those that are produced. This is because, before exposing each image, a shift system It may be necessary to activate the system and allow it to sink to a new position, which is required for image generation. This could slow down the process. Alternative techniques for imaging using this system are needed. Let me explain further.

[0056] The key elements of the projection unit (106) in the previous embodiment are the light source (124) and the micro- This was Ra's array (122). This is generally schematically shown in Figures 29 and 30, and Figures 20-20. As mentioned in 1, it can replace an array of micro-LEDs. In addition, raster When a pattern is used during the image generation process, pixels that do not have equal height and width may occur. Having an image can be beneficial. If the primary motion during rasterization is horizontal, the pixels To reduce the blur introduced into the image by turning it on or off while it is running. In some cases, it is useful to have pixels whose width is reduced relative to their height. Therefore, a microlens (221) with astigmatism characteristics can be used. This schematic diagram Next, the expression LED (220) illuminates the primary surface (222) of the expression lens (221). Then, the micro LED (22 The light from (0) exits the secondary plane (223) of the microlens (221) and reaches the imaging plane (224). In this case, the curvature of the secondary lens surface (223) is greater than the curvature of the primary lens surface (222) and is not equal to 1. It generates a pixel image with an aspect ratio. The array of astigmatic micropixels is a refractive pixel. Used in conjunction with a shift mechanism or other pixel operating mechanism to generate images over arbitrarily large surfaces. That's good too.

[0057] Using any of the aforementioned systems is also possible on the image generation surface (130) This provides an opportunity to determine the optimal path for shifting the pixel image (212). In the previous example, it was possible to generate an image of a 50-micron wide area using 10-micron pixels. Figures 31-33 show several options for implementing this, and micro Pixel (262) crosses pixel region (260). Pixel region (260) is micro-pixelated. This is understood to mean the area occupied by pixel (262) if it is not done. The simplest option. This starts the micropixel (262) at the upper left corner of its pixel domain (260) and moves to the upper right corner. Move it across, move it down by 10 microns, and then return it to the left side of that domain (260). Then, by shifting the image, the pre- and post-processing rasterization patterns are traced, as shown in Figure 31. Other possibilities shown in Figures 32 and 33 include rasterizing diagonally and spiral patterns. To move or to provide substantially appropriate irradiation for a particular purpose It may include other patterns of intent. Micropixels are turned on or off during operation. This may be done to increase the speed of the image generation process.

[0058] Generally, a combination of standard pixel shift and micropixelization can also be used. Yes, it's possible. The image can be subdivided into areas smaller than the nominal pixel size projected by each light source. Each light source (as defined earlier, unsaturated image) also utilizes a pixel shift system. Lighting source in a grid pattern having a pitch dimension larger than the size of the source that can generate it It would be advantageous to have a system with an array of such arrays. The smaller each light source, the better the result. While this method results in higher image resolution, achieving high resolution directly from the image generation source is not possible. This requires a driver system that can render an extremely large number of pixels simultaneously. This presents the challenge of reducing the number of pixels. By using a micropixelization device, Simultaneous rendering is required, and high resolution is achieved through sequential image rendering. The degree to which pixel shift is used to achieve this is generally determined by the application, specifically by the micro-pixel shift. The resolution can be finer than what is inherently achieved by the celeration process itself. For example, micro-LE The D chip is manufactured with 10µm pixels spaced at a 30µm pitch, and the projection optics are chip If this results in a 4:1 increase in linear image size from the projection surface, then this is due to 1 at the image generation surface. This will result in 40µm pixels on a 20µm pitch. If a resolution of 10µm is desired, then 10 Multiple exposures shifted by µm are used, which, as mentioned earlier, affects the edges of the image. This generates an energy dose gradient. However, the energy gradient becomes less severe, The image will be generally sharper than if the 120um pixels were shifted in 10um increments. Furthermore, this resolution is naturally achievable if the pixels within the micro-LED array are 2.5 μm wide. Although this was possible, the power output from the LED is roughly proportional to the chip area, so this This would result in a net output of approximately 1 / 16th the optical power of a device using 10µm pixels. Therefore, for a specific purpose, in order to balance the sharpness of the image with the overall lighting intensity, It is possible to use a combination of micropixelization and conventional subpixelization. .

[0059] Alternative SFF systems for the digital production of parts are shown in Figures 34 and 35. The processes carried out in the stem involve three important steps: powder precipitation, powder injection, and irradiation. The steps include: The powder weighing module (302) is used for the first step. Often, the injection platform (304) may be used for a second step, and the projection unit The meter (106) may be used for the third step. The powder weighing module (302) is In general, any system that can deposit a controlled amount of powder to produce a flat layer It can be made into a . The injection platform (304) has a perforated top surface (306) and a powder deposition module. It includes a resin channel (308) for supplying resin to the powder deposited by the rubbing (302). In this system, the combination of capillary action and the applied pumping pressure is used to pulverize the resin. The next layer is provided. The resin is cured by the projection unit (106) to bond the powder together. The powder composite components may be produced by desorption and sintering. The material may then be post-processed to produce a nearby solid object made from the powder raw material.

[0060] Figures 36-39 illustrate this process in more detail. The first layer of powder (310) is injected into the injection platform. After being deposited on the home (304), resin is provided (312) for injecting powder (310). In terms of type, this resin (312) combines the powder layer (310) without interfering with further layers of powder. Injecting enough to bind. A second layer (314) of powder is deposited on top of the first layer (310). This allows the resin level (312) to be raised by additional injection. The process can be repeated until the build process is complete.

[0061] Figures 40-43 show alternatives to achieve the goal of high-speed manufacturing of high-density powder composite components. Several systems using the approach are depicted. Next, the dry powder into which the resin is injected... Instead of depositing, a low-density slurry is deposited onto the build platform, and that The density of the slurry is determined by exposing it to an image, hardening a portion of the slurry, and then binding the powder within it together. Increase it before doing so. Figure 40 shows one system for carrying out this process.

[0062] In this system, the material deposition module (302) crosses the build platform (304) It is mounted so that it can be done. The fixed rollers (318, 326) are each fixed roller (318 Using films (320, 328) connected to 326), material is attached to both sides of the material deposition module (302). These films (320, 328) are attached to the leveling rollers (322, 324). It passes around and is wound onto reels (314, 316) that automatically retract. Thus, the material pile As the stacking module (302) crosses the platform, one reel distributes the film. The other side pushes it back. The slurry material is placed by the material deposition module (302). It can be deposited on the platform (304), and then the slurry is flattened by the film. The layers are planarized and maintained flat by the tension within the film. Alternative embodiment (shown in the illustration) (zu) simply use a recoating blade on either side of the material deposition system (302) , flatten the slurry layer. In this case, the hardening treatment makes it possible for the hardening treatment to occur. To achieve this, an image-forming unit projects the image through a film, transmitting the appropriate amount of light at the relevant wavelength. It may start with an image from knit(106).

[0063] Another layer production system is shown in Figures 42-43. Depending on the layer thickness, it can produce flat layers. Therefore, it may be difficult to use the above tensioned film system. Film tension This is unsuitable for controlling layer variations over a large area, especially when the layer in question is particularly thin. In some cases, this may be the case. In the system shown in Figures 42-43, the film (336) has a layered distribution and flat During the flattening process, a vacuum pressure is applied through the pores (338) in the rigid block (334). The film (336) is held on the rigid block (334). In Figure 43, this film (336) is held on the rigid block The back (334) has been removed to show details. The film (336) is a round film mount. It is held in place at both ends by (330,332). This assembly is a material deposition module (30 2) The slurry material deposited by this method can be flattened and distributed all at once. Once this is done, the vacuum source is turned off, the rigid block (334) is retracted, and the film (336) is passed through. This enables image formation of slurry materials.

[0064] Figures 44-48 show schematic diagrams of the material handling method described in the previous system. Similar to the M, perforated build platforms allow for both the platform and the components being built. This will be used to construct a perforated section that allows fluid to flow through it. In this system, a low-density blend of powder (310) and resin (312) is built up on the build surface (304). It is deposited there. Excess resin (312) is removed, increasing the effective powder packing density of the slurry, In order to densify the powder (310) thereafter, slurry is passed through the porous build surface (304). - Apply vacuum pressure. Apply vacuum pressure to the fluid output of the build platform (304). This is one option, but generally, the upper area of ​​the build region and the build platform (304) Any means of creating a pressure difference between the lower / inner region and the lower / inner region is sufficient to produce the desired effect. It would take minutes. For example, positive pressure can be applied to a sealed build area. In extreme cases... As shown in Figure 46, all excess resin (312) is absorbed by the contact points between the powder particles (310). It may be removed so that it is only visible in certain areas. In this case, the lattice image generation technique described later is used. It is not necessary, and this fluid discharge process essentially leaves a porous structure, so the fluid paths within the component are It remains usable even when using solid-hardened images. As has been done, in order to manufacture a complete object, multiple layers of material are manufactured in a similar manner, It can be densified, then sintered to remove the binder, and then metal or ceramic It is possible to manufacture adjacent solid objects made of materials. Furthermore, this type of deposition process It can be increased by ultrasonic stirring. The ultrasonic stirring source is a recoater blade, phi Reinforcement mechanism for film, or build surface (304) or other source That's good too.

[0065] In Figures 44-46, the slurry is exposed to an open atmosphere, but in many of the aforementioned systems, A film is used to flatten the lee, and image formation is performed through this film. To carry out the processes described in Figures 44-46, the material deposition system is as described above. A recoated blade will likely be used. Furthermore, the slurry will be deposited in an open atmosphere. In some cases, this can be done to densify the slurry without applying vacuum pressure. Yes. If the slurry contains viscosity reducing agents (VRAs), the build region will allow the evaporation of such components. It may be heated to accelerate the process. In this case, the VRA is used to increase the deposition rate. It may be an organic solvent that reduces the viscosity of the Lie, and then the deposited material layer Evaporation may occur to promote field densification.

[0066] Figures 47 and 48 show that a film (340) is used to flatten and distribute the slurry material layer. The approach described is as follows: The densification of the layers is essentially the same as described above, but the main difference is The film can limit the discharge of resin after the powder has solidified. This resistance can be detected by the printing system, indicating that powder compaction has occurred. It can be used to make a determination. This feedback mechanism identifies this process. While it may be useful depending on the implementation, the film is cured before another layer can be generated. These pieces must be peeled from the material, which can reduce the print speed. The advantages of each process depend heavily on the specific implementation for a particular use.

[0067] Figure 49 shows a system that utilizes an alternative approach for manufacturing powder composite material components. The feed reel (344), guide rollers (348, 350), and feed reel (342) are used in the fill The film (346) is positioned to supply the build surface (304). The film (346) is generally small A blend of at least one monomer and at least one photoinitiator, and one or more plasticizers. Furthermore, although it is solid at room temperature, it melts when exposed to a heated build platform (304). The process involves the possible addition of meltable powdered raw materials. In contact with the build platform (304). At least a portion of the film (346) may melt, but the rest of the film (346) remains solid. As a result, the delivery reel (342) picks up the unused film (346) and additional The film (346) can be drawn into the build area, allowing for the construction of additional layers. The manufacturing of parts using the film is similar to what was described earlier, particularly in Figures 44-48. Even if only a portion melts, the process proceeds according to Figures 44-46. Higher density is advantageous. It is possible, but at least partially, a phase transition would occur for the purpose of generating a photodefinable three-dimensional object. The emergence of solid raw materials is itself a novel system. Manufactured in this way The part has excess material that was removed while it was at a high temperature to keep the uncured material in a liquid state. It can dissolve unmodified (e.g., unpolymerized) materials, but does not affect polymerized materials. It is exposed to a solvent that does not affect it. An exemplary monomer for this purpose is norbornene. This is a solid at room temperature, has a viscosity of approximately 0.75 mPa*s at 50°C, and when polymerized, has a viscosity of approximately 300°C. It can have a glass transition temperature of acrylate or epoxide or Other polymerizable monomers are solid under normal storage conditions for materials, but at some temperature, ideally... It is typically used in combination with a non-reactive component that becomes a fluid when the temperature rises within the range of 60-100°C. It is possible. For example, paraffin wax is solid at 25°C but not at 100°C. It is always a low-viscosity liquid. High molecular weight polyethylene glycol and polypropylene glycol Coal is also a viable option for this type of material blend. Generally, storage It is a solid at storage temperature, a liquid at higher operating temperatures, and contains photopolymerizable monomer components. Any material can be considered an embodiment of the subject matter, as described herein. In such systems, the binder formulation is generally used as a non-reactive diluent, PI system, in an amount of less than 70% by weight. It can be understood that the composition contains at least 2% by weight of one or more of the components used, and the remainder of the composition is , which may be one or more monomers or oligomers that can be polymerized by a PI system, where, The mixture is solid at a first storage temperature below 35°C, and at a second operating temperature above 35°C for 20 minutes. It has a viscosity of less than 00 cps. Such bonding is intended for the production of metal or ceramic components. When raw materials formulated from the agent are generally processed using in-situ densification as described above, 45% of the raw materials remain unprocessed. It is understood that the powder has a full volume load, and here, after in-situ densification, the volume load exceeds 45%. If this is achievable, or if in-situ densification is not used, a volume powder load exceeding 40% This is achievable.

[0068] It is also possible to use a double membrane system as shown in Figure 49. One layer is oxygen permeable. It may be a transparent polymer film, and other layers may be made of the aforementioned photopolymerizable material. In this case, the process is similar to the system shown in Figures 47-48, and the transparent film is It is used as an image generation window where the molding material is hardened by incident irradiation.

[0069] Figures 50-51 show alternative embodiments of the system in Figure 49, including feeding and discharging. Instead of using a roller, this system is heated by two feed rollers (364, 366). A single load is loaded with a thicker film (360) that is supplied to the built-up surface (304). Use the reel (362). The molten pool (368) is where the film (360) builds the surface (304). It is formed when it comes into contact with the slurry (370). The blade (372) generates a uniform layer of slurry (370). Therefore, it is used to level the molten pool (368). The use of solid feed material is generally It can be easily switched to other materials and is more effective than a liquid slurry during storage. A build material can be provided that can keep the film in a suspended state. Although described as a solid raw material, it is generally possible to use pellets or other shape factors. It may be advantageous, but the principle of operation remains the same.

[0070] Furthermore, the powder supply material consists of metal powder having a solid coating of a binder material. By doing so, a system with the same advantages as those described in Figures 50-51 can be implemented. This is possible. The binder material may generally be of the type described above, and here it is It undergoes a phase change before being irradiated to initiate the polymerization process, resulting in excess unpolymerized material. The material may be removed by the solvent, presumably while the temperature is high. Coated powder The use of the end product has the advantage of enabling the use of electrostatic powder deposition, which is generally The material has a non-conductive property, or at least a coating that has a non-conductive property. It is limited to the powder materials to be processed. Further, the coating thickness is such that when the powder is deposited on the heated build bed surface and the binder material melts, the layer solidifies under the weight of the powder and no further densification is required. In an alternative configuration, a thicker coating can be used and densification can also be carried out. By increasing the particle size in the raw material in this way, aggregation can be reduced and the rheological properties of the raw material can be improved. and the layer solidifies under the weight of the powder when the binder material melts, and no further densification is required. In an alternative configuration, a thicker coating can be used and densification can also be carried out. By increasing the particle size in the raw material in this way, aggregation can be reduced and the rheological properties of the raw material can be improved. and the rheological properties of the raw material can be improved.

[0071] FIG. 52 shows a generalized version of the manufacturing process shown in many of the various embodiments of the figures described above. To overcome the inherent viscosity / velocity limitations of conventional slurry-based SLA manufacturing, a slurry is deposited to create a layer of material, and then the density of this deposited material is changed by any of several methods including, but not limited to, evaporation of one or more components of the slurry, removal of some of the liquid component of the slurry by suction, or removal of a substantial majority of the liquid component of the slurry by suction. Following the density change, an image is projected onto the build area and at least a portion of the slurry is selectively altered to solidify the liquid component of the slurry, and this process is repeated to manufacture the part in layers. removal of some of the liquid component of the slurry by suction, or removal of a substantial majority of the liquid component of the slurry by suction. and this process is repeated to manufacture the part in layers. Following the density change, an image is projected onto the build area and at least a portion of the slurry is selectively altered to solidify the liquid component of the slurry,

[0072] FIG. 53 shows a member (400) that can be manufactured using one or more of the systems described above. FIGS. 54 and 55 show curing patterns (404, 406) that can be used to bond the powders together to form the member (400) and also to form a lattice structure that allows the resin to flow into the next layer of powder. In some cases, more or less resin is allowed to flow into subsequent layers. Therefore, it is desirable to change the lattice structure of the assembled object during the assembly process. There is a problem. Figures 56-58 show one way to do this. Figure 56 shows the build surface (40 2) The projected grid structure (408) is shown. Figure 57 shows the resin acceleration zone (410), and this zone Within this zone, it is desirable to increase the flow of resin to the subsequent layer. Figure 58 shows this zone. The modified grid pattern (412) is shown, which allows for increased resin flow within (410). Generally, Local changes to the grid pattern within a given layer are not reflected in the build process before it begins. This process is performed during the process but before the problematic layer is manufactured, or during the process of manufacturing the problematic layer. It is possible.

[0073] Figure 59 shows an additional imaging method that can control fluid flow during the build process. This shows that adding flow limiting features (414) to the area outside the component being constructed allows for fluid flow This is responsible for adjusting the fluid flow across the build area so that it becomes more uniform across this area. It can fulfill its role. The fluid flows through the porous powder composite component in the aforementioned system. Even in the case of misalignment, it is desirable to adjust the fluid flow rate to optimize uniformity, and a flow rate limiting mechanism (4 14) is one way to achieve this end. Generally, a flow limiting mechanism (414) This reduces the effective area through which fluid can flow without being interconnected, and the connection As a result, additional material is generated and then removed during the cleaning process after the build process is complete. It is necessary that the flow limiter is within a given layer and from one layer to the next. As long as they are strictly relative prime, any geometric shape of the flow limiter is acceptable to this flow limiter. This is possible for the method of simulation. In this way, during the cleaning process, It washes away relatively easily, because during the cleaning process the cleaning process This is because it behaves effectively as an unbonded material, and because, The bonding process is sufficient to produce a material with a bond volume that has some significant structural integrity. This is because it is not given a proper structure.

[0074] Furthermore, Figure 59 shows a method commonly used to contain fluid flow within the print area as a whole. This includes a possible boundary feature (416). This boundary feature (416) is present when injected after dry powder precipitation. This allows the fluid flow to be restricted to excess powder, causing a low-density slurry to precipitate, and then In cases of densification caused by a pressure gradient, the role is to provide separate channels during layer densification. It can accomplish, or generally control the flow to the target build area or sub-area of ​​that area. It can be used to limit the size of a part or component as it is being constructed. Because it is constructed in the same way as in existing powder layer fusion systems, the build platform Powder deposition in the associated build region as the system is present with the housing piston There are no edge effects that disrupt the image.

[0075] Figures 60-78 show multiple systems for material transport that can improve the aforementioned system. This shows the components and related parts. Generally, it produces a flat layer that meets the requirements of the SFF system. The weighing powder used for production may or may not be achievable in a single module. Figure 60 shows a powder weighing system (502) and a powder weighing system for producing a flat layer. A system using a pair of rollers (530 , 532) that can be used to condition the powder deposited by the hopper (502) is shown. By having two rollers (530, 532), the powder can be adjusted regardless of the direction in which the assembly is moving relative to the shaping surface (520), and the material transport process can be facilitated.

[0076] FIG. 61 shows a system for powder deposition that can be used in any of the aforementioned systems that require deposition of a layer of powder. Generally, there are several design constraints to consider in a powder deposition system, related to speed, reliability, quality, and potential adverse effects on the parts and the machine itself being built. In the aforementioned systems, a powder metering system has been used in combination with rollers to generate a layer of powder. However, if the powder is metered and supplied too quickly, the powder can aerosolize when gravity-fed onto the build surface. FIG. 61 shows an exit shroud (504) of a powder metering system (�02) that restricts the flow of aerosolized powder (506) when deposited on the build surface (520), generates a flat layer (508) of powder that has already been partially conditioned, and can then be further compressed by rollers (530) to generate a uniform layer (510) of powder having a high density. By using such a shroud (504), while increasing the allowable speed at which the system operates, the powder (506) can be prevented from escaping the build area and interfering with other mechanical and / or electrical systems. The advantages of this shroud (504) are the presence of a ledge for pre-conditioning the layer of powder (508), and that the deposited powder (506) is completely enclosed by the shroud. ​​​​​​​​​​​ This derives from two aspects. This provides containment on one side, but generally constructs powder Leaving it exposed to the environment allows for a greater degree of aerosolization, unlike a regular doctor It is different from a blade. The complete enclosure has the function of pre-adjustment, potentially aerosol Combine with a greater degree of containment of the processed powder.

[0077] Figure 62 shows another improvement over the aforementioned system, enabling better powder containment. The modified construction platform (520) uses aerosolized powder on the platform. A vent (522) that can draw in the surrounding environment to prevent it from escaping from the room, and a given layer It has a powder collection pocket (524) for collecting any excess powder that accumulates. These further improvements control where powder is permissible in the overall manufacturing system, Therefore, any damage that may occur due to the ingress of powder into the system's operating / control elements is prevented. Stop.

[0078] In some cases, materials that are inherently fibrous or contain non-spherical particles are used. It is possible. For example, some ceramics can be manufactured using elongated particles. Furthermore, the orientation of these particles in the manufactured component generates specific anisotropic mechanical properties. This may be desirable in some cases. Figure 63 shows how to adjust the layers of material and align the elongated particles. This shows a system better suited to this class of material, where raised rollers (534, 536) are used. Generally, they are designed to interact with and align with ridges, comb-like projections, or elongated particles. Any roller composed of other mechanisms may be used here.

[0079] Figure 64 shows the imaging unit (106) and / or injection platform (5) shown in the previous figure. This describes a far more sophisticated material handling system that eliminates the need for 04). In the stem, the powder weighing system (502) deposits the powder, and the rollers (530, 532) adjust the powder layer. Then, the vapor-phase resin modules (540, 542) inject resin into the powder, and the micro-LED array (550, 552) This hardens the resin and binds the powdered raw materials. This system facilitates the production process. Therefore, it is symmetrical, similar to the previous system. The material deposition is to the right of the build surface (520). When moving, the primary roller (530), primary gas-phase resin module (540), and primary micro-LED Array (550) is used. When the material deposition system moves to the left relative to the build surface (520) k, secondary roller (532), secondary gas-phase resin module (542), and secondary micro-LED array (552) This is used. In this way, the material deposition module has a delay between the fabrication of successive layers. Alternatively, the build surface (520) may be traversed from front to back without accompanying this movement.

[0080] Figures 65-67 show the primary micro-LED array (550) in more detail. Micro-LED array (550) It consists of an array of micro-LEDs (554) and an array of micro-lenses (556). As shown above, each LED can generate a spot that is substantially smaller than the LED itself. Each row of microLEDs is shifted laterally by at most one spot width relative to the row before it, and the row The number is such that the entire construction domain can be image-generated. This is projected by this system. The image is shown in Figure 68. Each row is coupled with the movement of the entire array across the platform. The lateral shift replaces the shift effect of the aforementioned refractive pixel shift system. In addition, this system optimizes resolution and hardening response using the aforementioned astigmatic optical system. You may use this. Figure 69 shows an array of astigmatism micro-LEDs according to this embodiment. This shows the resulting image.

[0081] Figure 70 shows the primary gas-phase resin module (540). This module vaporizes the liquid resin. The vapor is then converted and absorbed by a layer of powder, where the resin condenses. It then returns to a liquid state, and is irradiated to bind the powdered raw materials together. Steam delivery By using the system, the amount of resin required by the process can be reduced, and the material It may be possible to accelerate the entire material processing process. In this embodiment, the resin supply line The (544) transports the resin into the module (540). The resin then uniformly coats the vaporizing element (549). To do this, the central resin channel (546) is distributed to multiple channels (548). The vaporized elements are Generally, the resin in contact with ultrasonic vibrations, thermal energy, or vaporized elements (549) is brought into close proximity. It can be activated by other means that convert it from a liquid state to a near-vapor state. The vapor is subjected to a voltage applied to the vaporization element (549) and a voltage applied to the secondary charged element to which the vapor is exposed. Exposure to voltage, electron gun or other charge source, or electrostatic attraction of vapor droplets to the construction area The constructed area may be electrostatically charged by any other available means to cause it to be charged. Generally, it can be electrically grounded or otherwise electrically operated to achieve a desired behavior. It can generate.

[0082] Figure 71 shows the results from either the primary powder weighing system (502) or the secondary powder weighing system (503). A material precipitation system in which a gas-phase resin module (540) precipitates resin before the powder is precipitated. An alternative configuration is shown. The powder layer is formed by the primary roller (330) depending on the direction of movement of the material deposition system. Alternatively, it can be adjusted by either of the secondary rollers (532). In this configuration, The resin vapor phase is deposited on the build surface (520) before the powder, and the resin vapor phase is combined before the powder layer is applied. This is done to form a liquid film. Then, the resin uses the weight of the powder and the force of the rollers (530, 532) The powder is then impregnated in a bottom-up manner, facilitating the injection process.

[0083] Figures 72-75 show in more detail the process carried out in the system shown in Figure 71. As the film is deposited on the build surface (520), followed by the first layer of powder (592), Then the resin (590) is injected. Generally, the thickness of the resin film (590) is such that the powder layer (592) is substantially... The thickness of the powder layer (592) is greater than the thickness of the powder layer (592) so that only enough resin (590) necessary for bonding is provided. It is also practically thin. After part of the layer hardens, an additional resin (594) is deposited, followed by a second layer of powder. (596) is deposited and the resin level is raised so that it can be injected. This is part of the construction process. This process may be repeated with further precipitation of the resin and powder until completion is achieved.

[0084] Figure 76 shows a configuration similar to that of Figure 71, in that resin precipitation occurs before powder precipitation. The key difference is that a resin microdroplet deposition array (560) is used instead of a gas-phase resin module (540). It is used. The resin microdroplet deposition array (560) is shown in detail in Figure 77. The array of microdroplet dispensers (562) is positioned so that the system crosses the build surface (520). It is used to precipitate resin droplets when depositing resin in a given area. It provides some control over the amount of fat, thus controlling the depth of the resin in a specific region of the construction area. This can be controlled to produce uneven amounts of injection in a given powder layer. By effectively enabling this type of printing, the vertical print resolution has been improved. This may be useful for limiting irradiation in that area and thus limiting the curing depth of the resin binder. Therefore, printing a sublayer on top of a normal layer is relatively easy, Printing a sublayer at the bottom of a normal layer is typically impossible. The system makes it possible to achieve this type of curing behavior. Figure 78 shows such a process. The results show that the resin boundary (580) changes across the build surface (520) at different levels. The powder particles (570) are bound together. This depiction is a schematic of the process, and also a construction plan. Most powders used in processing have a maximum particle size that is generally smaller than the thickness of the powder layer. When it is recognized that there is a different particle size distribution, this changing resin boundary (580) is Generally, this is translated into similarly changing boundaries for printed components.

[0085] When there are limitations on the droplet size that can be achieved with conventional microdroplet deposition systems, vapor deposition occurs during deposition. A fine droplet consisting of a suspension of resin droplets in a carrier medium is precipitated, and the resin droplets are combined. It may be advantageous to combine them into a film. For example, droplet ejection systems are typically This can be limited to droplets on the order of picoliters, but the suspension on the order of femtoliters It may be possible to generate droplets in the turbid liquid. In this way, a microdroplet deposition system This allows for the creation of thinner resin films than those possible with direct deposition.

[0086] The previous diagram shows a method for producing fractional layers. This involves the binder composition, Controlling the curing atmosphere and the wavelength of light used to cure the binder material Therefore, it can also be achieved by other means. Generally, light with shorter wavelengths overcomes oxygen inhibition. Due to its superior ability to adhere, it is more effective in curing on the surface of photosensitive materials. Therefore, the upper part of the layer is cured by short-time exposure to high-intensity, short-wavelength UV light. This can be achieved by longer exposure to lower-intensity, longer-wavelength UV light. Furthermore, the layer can be cured without hardening the upper part. In addition, a fluorescent catalyst is used as a binder. It is added to composites to increase the hardening depth and enable selective hardening of material layers at various depths. It is possible.

[0087] Coumarin dyes are particularly effective in the UV and blue regions of the spectrum, and It has a high quantum yield, as well as both absorption and emission peaks below 500 nm. Using a photoinitiator, fluorescent dye, and monochromatic or multichromatic image generation system that is sensitive to this, Many configurations are possible, each with its own beneficial effect. In the simplest case, a photoinitiator is used. A formulation comprising a (PI) system, a fluorescent dye, and a monomer system, where the PI system is a fluorescent dye It is sensitive in both the absorption and emission regions of the spectrum. When used, it is particularly useful as a binder for powdered raw materials with very high volume loading rates. When used, it provides a direct view of all areas that need to be hardened in a given layer. The lines are not accessible, and the fluorescent dyes are not accessible to further areas of the binder that would otherwise be inaccessible. It acts as a means to access. In this way, fluorescent dyes are used as optical catalysts. By doing so, the effective optical penetration depth during the hardening process can be increased, thereby improving the material The exposure time required to bond the material layers together can also be reduced. (As described herein) In systems such as those described above, the formulation generally contains less than 0.25% by weight of a fluorescent dye, or PI system. It may be understood that the composition contains at least 2% by weight of one or more of the components used, and the remainder of the composition is It may be one or more monomers or oligomers that can be polymerized by a PI system.

[0088] Another configuration involves at least two wavelength regions where polymerization can occur, with absorption between these two regions. It contains a fluorescent dye having a peak, and a PI system having an emission peak in the long-wavelength region of the PI system. It is a binder. Shorter wavelength PI generally results in free radioactive materials on the surface of the binder material. In this system, it is not significantly affected by the oxygen-inhibiting effect that is common in the L system. , less than the absorption region of the fluorescent dye, but the first of at least two wavelength regions of the PI system Exposure to short wavelengths within the wavelength range causes polymerization on the surface of the material layer, and this exposure The timing may be controlled so that only the top layer hardens. Furthermore, the fluorescent dye Exposure to wavelengths within the absorption band is used to cure the material in the bottom section of the layer. On the other hand, oxygen inhibition prevents polymerization in the upper section of the layer. In this way, Polymerization of the fractionated layers can be achieved. In a system such as that described herein, The formulation generally contains less than 0.25% by weight of a fluorescent dye that can be excited at a first wavelength, and substantially at a first wavelength. At least 0.1 wt% is insensitive to the target and sensitive to a second wavelength shorter than the first wavelength. The first photoinitiator is sensitive to a third wavelength longer than either the first or second wavelength, and fluorescence At least 0.1% by weight of a second photoinitiator substantially contained within the emission band of the dye, and PI It can be understood that the system contains at least one monomer or oligomer that can be polymerized by the system. ru.

[0089] Another method to achieve fractional layer control is to use PI systems and monomers having multiple functional groups. This includes the use of a cationic system. For example, it may be polymerized by ring-opening polymerization or other means. Polymerizable by free radicals with epoxides, oxetanes, or other monomers. Acrylate monomers or mixtures of other monomers are free radical and cationic types. It can be used in combination with a PI system containing both PIs. In this system, the cationic PI is If the sensitivity is at short wavelengths, and the sensitivity of free radical PI is at longer wavelengths, please refer to the previous section. Similar behavior can be achieved. Exposure to short wavelengths initiates polymerization on the surface of the layer. Exposure to long wavelengths can be used for curing beneath the surface of the layer. It has an absorption band at wavelengths longer than the absorption region of cationic PI, and the absorption region of free radical PI. The hardening of the bottom region of the layer can also be accelerated by using a fluorescent dye that has an internal light-emitting band. Hive having both acrylate functional groups and epoxide functional groups (or other similar groups) The Lid monomer can also be used in this context.

[0090] Figures 79-87 show how to process printed parts in various ways to improve such parts. Several methods for doing so are described. Figures 79-81 show how to improve the surface finish. This shows a method for manufacturing powder composite parts that can be sintered after printing. In many of these methods, the geometry is more important than the nominal tolerance based on the powder particle size within the print. To provide finer control over the target shape, it is possible to provide imaging resolution. Yes. Figure 79 shows one purpose (600) in which this behavior can be observed. Figure 80 shows this object (600) The cross-section is used to bind the powder (602) together to print this object (600). This is shown along with possible curing patterns (604). As can be seen from this figure, several powder particles (60 2) protrudes beyond the surface of the object defined by the hardened pattern (604). In this case, The boundary of the curing pattern (604) can act as a mask, and the part is the surface of part (600). Electropolishing can be used to remove the portion of powder particles (602) that protrudes beyond the surface. The results of this process are shown in Figure 81, but in some cases the optical definition of part (600) The surface itself may be porous, and therefore, in order to prevent penetration into the part (600), An electrolytic agent with appropriate viscosity and surface tension characteristics must be selected. (Material to be removed) The amount is minimal and well masked, so this process is quick and has minimal additional cost. This can be done at an additional manufacturing cost.

[0091] Figure 82 shows a part (610) that can be manufactured by any of the aforementioned systems, and This shows a support structure (612) which can be manufactured separately from or in connection with the component (610). The portion (610) includes a protrusion that will deform significantly if not supported during sintering. Support structure (61 2) The upper surface (614) is covered with a sintering inhibitory solution and positioned below the overhang of the part (610). By doing so, the support structure (612) supports the overhang of the component (610) during sintering. This can be aided in. By using an oxidizing agent on the upper surface (614) of the support structure (612), this table The surface (614) is oxidized to prevent adhesion to the part (610) during sintering, while preventing deformation of the part (610). This can also be prevented.

[0092] Figures 83-84 show the automated cleaning and sintering of parts printed through any of the methods described above. This shows a method to improve the process. Figure 83 shows a batch printing in combination with a support structure (630). The array of printed parts (620) is shown. Figure 84 shows the removal of excess construction material from the parts after printing. An additional support structure (632) is shown which can be used to assist during the process. After the printing process is complete, there is uncured material surrounding the printed part. This can be removed by washing in a solvent bath. In the system shown in Figure 84, 2 The support structures (630, 632) do not adhere to the part (620) and hold the part (620) in place during cleaning. It can act as a rack and also perform simple pick-and-place automation. The sintering system allows them to be moved to a different rack for sintering. Maintain their positions. In addition, the lower support structure (630) is processed in the manner shown in Figure 82. In such cases, it may be used as a support during sintering, and generally, it can be used for post-processing many parts simultaneously. To facilitate this, any non-adhesive support structure may be printed in association with the array of parts. Therefore, manufacturing efficiency improves.

[0093] Figure 85 shows a schematic flowchart of the process used in Figure 82, and the support structure is 1 They may be printed integrally with or independently of one or more parts, and bond to the parts during sintering. It is processed to suppress and used as a support during the sintering process. This is the pre This effectively increases the types of geometric shapes that can be produced by the sintering and firing method. It is possible.

[0094] Figure 86 shows additional methods for post-processing printed parts. Traditionally, unsintered parts are The parts are prepared for sintering by removing a substantial portion of the binder material. They are then treated thermally, with a solvent, or by a catalytic process. However, especially binder materials If some of the components have higher volatility than other components in the binder, exposure to vacuum pressure may cause This may allow for the removal of some of the binder. In this case, a high-speed, low-temperature system for desorption can be provided. This method is This is particularly applicable to the aforementioned systems in which perforated parts are manufactured, and the perforations are incorporated into the parts. The structure allows for the rapid release of volatile binder material without distortion or breakage of the component. .

[0095] Figure 87 shows additional methods for post-processing printed parts. The system can potentially use a wide variety of binder formulations, but multiple It may be advantageous to use a specific blend of Ip monomers and multiple curing treatments. In particular, at least one monomer in the formulation is obtained by a photopolymerization process (primary monomer). It can be polymerized by another monomer (secondary monomer), and another monomer (primary monomer) can be polymerized by a thermal process, The polymer formed by curing the polymer (primary polymer) hardens the secondary monomer. The polymer formed by this process (secondary polymer) is not water-soluble, and the secondary polymer - is water-soluble in solvents that have the ability to decompose cleanly in an inert or reducing atmosphere. In such cases, this can be used with various reactive metal powders to manufacture sintered metal parts. One such example is using an acrylate system as the first monomer / polymer, and the second Olefin-based monomers can be used as the second monomer / polymer. The solvent debinding agent is One option for removing the primary polymer in such formulations is the secondary polymer. - To favorably create any formulation that can remove the primary polymer without adversely affecting it. It can be used. This is especially useful for metals that cannot be exposed to oxygen during sintering. Interestingly, the easiest materials to photopolymerize are those that involve processing metals in a sintering process. If it cannot be decomposed in a typical atmosphere such as an inert or reducing atmosphere There is.

[0096] While this specification describes specific combinations of systems, any combination of the subsystems described above is also possible. This can be carried out for a similar purpose, according to any of the methods or systems described above. Any system providing powder deposition, powder injection, and irradiation is an embodiment of the subject matter. It can be understood as follows.

[0097] This subject matter may be implemented in other forms without deviating from its purpose and essential characteristics. Therefore, the embodiments described are illustrative and limiting in all respects. It should not be considered that this subject matter has been described in relation to a particular preferred embodiment. However, other embodiments that are obvious to those skilled in the art are also within the scope of this subject matter.

Claims

1. A method for manufacturing a three-dimensional object, The steps include forming a build material on a build surface based on a solid mixture of powder material and binder material, The forming step includes supplying the build material to the build surface and changing the phase of the binder material, wherein the solid mixture has a film comprising the powder material and the binder material. A step of selectively irradiating the build material to change the physical state of a part of the build material, A method of having.

2. A method according to claim 1, wherein the supplying step is simultaneous with the step of changing the phase of the binder material, before the step of changing the phase of the binder material, or a combination of simultaneous with the step of changing the phase and before the step of changing the phase.

3. A method according to claim 1 or 2, The film has multiple layers, One layer has a non-reactive and semi-transparent image-generating window. method.

4. A method according to any one of claims 1 to 3, wherein the step of changing the state of the binder material comprises the step of generating a molten pool controlled within a uniform layer from the film on the build surface.

5. A method according to any one of claims 1 to 4, wherein the solid mixture comprises particles of the powder material, each of which is coated within the binder material.

6. A method according to any one of claims 1 to 5, comprising the step of increasing the powder loading density of the build material after changing the phase of the binder material.

7. A method according to claim 5, wherein the step of changing the state of the binder material is to increase the powder loading density of the build material.

8. A method according to any one of claims 1 to 7, comprising the step of removing the unchanged portion of the build material after irradiation of the build material.

9. A system for manufacturing three-dimensional (3D) objects, A material deposition system configured to form a build material on a build surface by supplying a build material based on a solid mixture of powder material and binder material to a build surface and changing the phase of the binder material, The system comprises an image generation system configured to selectively irradiate the build material to change the physical state of a portion of the build material, The solid mixture has a film containing the powder material and the binder material. system.

10. The system according to claim 9, wherein the supply step is simultaneous with the step of changing the phase of the binder material, before the step of changing the phase of the binder material, or a combination of simultaneous with the step of changing the phase and before the step of changing the phase.

11. The system according to claim 9 or 10, The film has multiple layers, One layer has a non-reactive and semi-transparent image-generating window. system.

12. A system according to any one of claims 9 to 11, wherein the step of changing the phase of the binder material comprises the step of generating a molten pool controlled within a uniform layer from the film on the build surface.

13. A system according to any one of claims 9 to 12, wherein the solid mixture comprises particles of the powder material, each coated within the binder material.

14. A system according to any one of claims 9 to 13, wherein the material deposition system is further configured to increase the powder loading density of the build material after changing the phase of the binder material.

15. A system according to claim 13, wherein the step of changing the state of the binder material is to increase the powder loading density of the build material.

16. A system according to any one of claims 9 to 15, wherein the system is configured to remove the unchanged portion of the build material after irradiation of the build material.

17. A method for manufacturing a three-dimensional object, The steps include forming a build material on a build surface based on a solid mixture of powder material and binder material, The forming step includes supplying the build material to the build surface and changing the phase of the binder material, wherein the solid mixture has pellets comprising the powder material and the binder material. A step of selectively irradiating the build material to change the physical state of a part of the build material, A method of having.

18. The method according to claim 17, wherein the supplying step is simultaneous with the step of changing the phase of the binder material, before the step of changing the phase of the binder material, or a combination of simultaneous with the step of changing the phase and before the step of changing the phase.

19. A method according to claim 17 or 18, comprising the step of increasing the powder loading density of the build material after changing the phase of the binder material.

20. A system for manufacturing a three-dimensional (3D) object, A material deposition system configured to form a build material on a build surface by supplying a build material based on a solid mixture of powder material and binder material to a build surface and changing the phase of the binder material, The system comprises an image generation system configured to selectively irradiate the build material to change the physical state of a portion of the build material, The solid mixture comprises pellets containing the powder material and the binder material. system.

21. The system according to claim 20, wherein the supply step is simultaneous with the step of changing the phase of the binder material, before the step of changing the phase of the binder material, or a combination of simultaneous with the step of changing the phase and before the step of changing the phase.

22. The system according to claim 20 or 21, wherein the material deposition system is further configured to increase the powder loading density of the build material after changing the phase of the binder material.

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