Electrical connection structure of electronic components
TW202632819APending Publication Date: 2026-08-01HIROSE ELECTRIC CO LTD
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- HIROSE ELECTRIC CO LTD
- Filing Date
- 2025-12-02
- Publication Date
- 2026-08-01
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Figure TWG2TA001071349_001 
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Figure TWG2TA001071349_003
Abstract
[Problem] To provide an electrical connection structure for electronic components that can suppress the increase in signal transmission loss even when the distance between the substrate connector and the electronic component increases. [Solution] A connection structure in which a first optical module (1) mounted on a first circuit board (P1) is electrically connected to an ASIC 3 mounted on a second circuit board (P2), and a second optical module (2) mounted on the second circuit board (P2) is electrically connected to the ASIC 3; the connection structure is as follows: the first circuit board (P1) and the second circuit board (P2) are connected by substrate connectors (4, 5, 6), and at the substrate connectors (4, 5), a first relay substrate for cables is directly connected to a first connector and connected to a target connector (7, 8) located away from the second connector through a flat conductor (F), a second relay substrate for cables is directly connected to the second connector and connected to the target connector (7, 8) through a flat conductor (F), and a relay substrate for connectors is directly connected to both the first connector and the second connector.
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