Proximity doping for silicon structures
Patent Information
- Application Number
- PCT/US2024/042494
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-08-15
- Filing Date
- 2024-08-15
- Publication Date
- 2025-03-27
AI Technical Summary
Conventional doping methods for photovoltaic cells, such as LPCVD, APCVD, and PECVD, face challenges due to toxic and hazardous dopant precursors, high equipment costs, and the need for additional processing steps like masking and etching, which increase costs and complexity.
The proposed proximity doping method involves forming a multilayer structure with an oxide layer and amorphous silicon on a substrate, followed by the deposition of a spin-on-dopant on another substrate. The two structures are then stacked with the spin-on-dopant near the amorphous silicon, and heat is applied to transform the structure into a polysilicon doped structure, reducing the number of processing steps and equipment required.
This method reduces the number of equipment and processing steps needed, lowers costs by eliminating the need for hazardous precursors and additional removal steps, and achieves uniform doping and passivation, enhancing the efficiency and stability of photovoltaic cells.