Microphone assembly comprising shielding membrane and molded encapsulating shell

The microphone assembly for facemasks addresses the challenge of protecting voice communication systems from environmental factors by using an acoustically transparent and water-repellent shielding membrane within a molded encapsulating shell, ensuring effective and reliable voice transmission.

WO2025057044A1 Publication Date: 2025-03-203M INNOVATIVE PROPERTIES CO
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Patent Information

Application Number
PCT/IB2024/058754
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-15
Filing Date
2024-09-09
Publication Date
2025-03-20

AI Technical Summary

Technical Problem

Existing microphone assemblies in facemasks, such as those used in self-contained breathing apparatuses (SCBAs), face challenges in effectively receiving and transmitting voice communications while being protected from environmental factors like water and debris.

Method used

The microphone assembly incorporates a shielding membrane that is acoustically transparent and water-repellent, mounted on a printed circuit board, and encased within a molded encapsulating shell with a through-orifice, allowing sound to reach the microphone while maintaining protection.

Benefits of technology

This configuration ensures effective voice communication transmission with minimal sound attenuation and protection against environmental hazards, enhancing the reliability and durability of the microphone assembly in harsh environments.

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Abstract

A microphone assembly including a microphone mounted to a rear side of a printed circuit board so that a sound-receiving port of a housing of the microphone is aligned with a rear opening of a through-passage of the printed circuit board. The microphone assembly also includes a shielding membrane mounted on a front side of the printed circuit board, an area of the shielding membrane being acoustically transparent and occlusively covering a front opening of the through-passage of the printed circuit board. The microphone assembly also includes a molded encapsulating shell that surrounds the printed circuit board and the microphone excepting that a front side the molded encapsulating shell comprises a through-orifice.
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