Substrate thickness measurement device, substrate affixing system, and substrate thickness measurement method

WO2025057508A1 Publication Date: 2025-03-20SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
PCT/JP2024/021248
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-12
Filing Date
2024-06-11
Publication Date
2025-03-20

AI Technical Summary

Technical Problem

During the bonding process of the daughter plate, due to the uneven thickness of the daughter plate, the daughter plates may contact each other when the bonding is completed, affecting the bonding quality.

Method used

A daughter plate thickness measuring device including a detection sensor, a deviation calculation unit, a deviation correction driver, a rotary driver, an upper surface distance measurement sensor and a lower surface distance measurement sensor are designed. The device accurately measures the thickness of the daughter plate by detecting the position of the daughter plate, calculating and correcting the deviation, and rotating the measurement sensor.

Benefits of technology

Accurate measurement of the thickness of the daughter plate is achieved, ensuring that the distance between the daughter plates is appropriate during the bonding process, avoiding contact and improving the bonding quality.

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Abstract

In a pre-alignment unit (PU), an offset correction actuator (1300) corrects positional offset of a substrate (W) relative to a stage (1100). A thickness calculation unit (1912) calculates the thickness of the substrate (W) along the circumferential direction thereof on the basis of a measurement result obtained by a first light source head (1710) measuring the distance to the upper surface (Wa) of the substrate (W), and a measurement result obtained by a second light source head (1720) measuring the distance to the lower surface (Wb) of the substrate (W), while the substrate (W) rotates. The thickness calculation unit (1912) calculates the thickness of the substrate (W) along a transport direction (A) on the basis of a measurement result obtained by the first light source head (1710) measuring the distance to the upper surface (Wa) of the substrate (W), and a measurement result obtained by the second light source head (1720) measuring the distance to the lower surface (Wb) of the substrate (W), while the substrate (W) is transported in the transport direction (A).
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