Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, semiconductor device, and compound

The resin composition, featuring specific resins and compounds, addresses the challenge of moisture resistance in cured products by preventing gaps between metal layers, even in humid conditions.

WO2025057903A1 Publication Date: 2025-03-20FUJIFILM CORP
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Patent Information

Application Number
PCT/JP2024/032227
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-11
Filing Date
2024-09-09
Publication Date
2025-03-20

AI Technical Summary

Technical Problem

Existing resin compositions struggle to provide cured products with excellent moisture resistance, especially in high humidity environments, due to the formation of gaps between the metal layer and the cured product.

Method used

A resin composition comprising at least one resin selected from polyimides, polybenzoxazoles, and their precursors, a compound with a specific structure represented by formula (B-1), a polymerization initiator, and a polymerizable compound, which together form a cured product with enhanced moisture resistance.

Benefits of technology

The proposed resin composition effectively prevents the formation of gaps between the metal layer and the cured product, even in high humidity environments, thereby achieving excellent moisture resistance.

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Abstract

Provided are: a resin composition containing at least one resin selected from the group consisting of polyimides, polybenzoxazoles, and precursors thereof, a compound having a structure represented by formula (B-1), a polymerization initiator, and a polymerizable compound; a cured product obtained by curing the resin composition; a laminate containing a cured product; a method for producing a cured product; a method for producing a laminate; a method for producing a semiconductor device including a method for producing a cured product; a semiconductor device containing a cured product; and a compound represented by formula (B-2).
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