Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, semiconductor device, and compound

The resin composition, featuring polyimide or polybenzoxazole with a specific compound containing an allyl and maleimide group, addresses the issue of adhesion loss after reheating, ensuring superior insulation reliability by maintaining strong metal-layer adhesion.

WO2025057906A1 Publication Date: 2025-03-20FUJIFILM CORP
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Patent Information

Application Number
PCT/JP2024/032244
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-11
Filing Date
2024-09-09
Publication Date
2025-03-20

AI Technical Summary

Technical Problem

The adhesion between metal layers and cured products from resin compositions, particularly after reheating, is not maintained, leading to reduced insulation reliability.

Method used

A resin composition comprising at least one resin selected from polyimide and polybenzoxazole, combined with a specific compound having an allyl group, maleimide group, and aromatic group, which enhances the polymerizable group content and radical reactivity, thereby improving adhesion and insulation reliability.

Benefits of technology

The proposed resin composition ensures excellent insulation reliability even after reheating, by maintaining strong adhesion between metal layers and the cured product, thus enhancing the reliability of insulation properties.

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Abstract

Provided are: a resin composition containing a resin A-1, which is at least one resin selected from the group consisting of polyimides and polybenzoxazoles, and a compound B having an allyl group, a maleimide group, and an aromatic group; a cured product obtained by curing the resin composition; a laminate containing a cured product; a method for producing a cured product; a method for producing a laminate; a method for producing a semiconductor device including a method for producing a cured product; a semiconductor device containing a cured product; and a compound represented by formula (B-1) or formula (B-2).
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