Tamper-detect assemblies including heat sink covers with integrated tamper-detect circuitry

By integrating tamper-detect circuitry within a heat sink cover and direct-bonding it to the heat sink, the tamper-detect assembly achieves effective thermal management and secure tamper detection, addressing the challenges faced by existing solutions.

WO2025061368A1 Publication Date: 2025-03-27INTERNATIONAL BUSINESS MACHINE CORPORATION +1
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Patent Information

Application Number
PCT/EP2024/072447
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-19
Filing Date
2024-08-08
Publication Date
2025-03-27

AI Technical Summary

Technical Problem

Existing tamper-detect assemblies face challenges in providing effective thermal management and secure tamper detection, particularly in compact multi-chip module packages.

Method used

The integration of tamper-detect circuitry within a heat sink cover, which is direct-bonded to the heat sink, provides enhanced thermal transfer and secure tamper detection. This configuration includes multiple direct-bonded ceramic and copper layers for improved heat transfer and eliminates the need for thermal interface materials.

Benefits of technology

This approach enhances thermal transfer to the heat sink, providing a direct-cooling solution that improves the thermal management of tamper-detect assemblies while maintaining robust tamper detection capabilities.

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Abstract

Tamper-detect assemblies and methods of fabrication are provided. A tamper-detect assembly includes a laminate carrier with embedded tamper-detect circuitry within the laminate carrier, and one or more electronic components on the laminate carrier. Further, the tamper-detect assembly includes a heat sink cover. The heat sink cover includes a heat sink and tamper-detect circuitry integrated within the heat sink cover. The heat sink cover is mounted to the laminate carrier and encloses the one or more electronic components between the laminate carrier and the heat sink cover. Together, the embedded tamper-detect circuitry of the laminate carrier and the integrated tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components.
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