Arrangement for heat sinks in a multilevel converter

WO2025061430A1 Publication Date: 2025-03-27SIEMENS AG
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Patent Information

Application Number
PCT/EP2024/074046
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-20
Filing Date
2024-08-28
Publication Date
2025-03-27
Patent Text Reader

Abstract

A converter has a plurality of phase sections (1) which each have two DC voltage connections (2, 3), one AC voltage connection (4) and, between the AC voltage connection (4) and each of the DC voltage connections (2, 3), a series circuit each comprising a plurality of semiconductor switches (8). The phase sections (1) also have capacitors (9) which are each connected to two node points (10) between two semiconductor switches (8) of the respective phase section (1). As seen from the AC voltage connection (4) to the respective DC voltage connection (2, 3), the number of semiconductor switches (8) between the respective node point (10) and the respective DC voltage connection (2, 3) is the same. A dedicated heat sink (11) is associated with each of the semiconductor switches (8), the heat sink having a contact face (12) bearing directly against the respective semiconductor switch (8) and the respective semiconductor switch (8) being cooled by means of the heat sink. The respective heat sink (11) is arranged in a housing (13) which consists of an insulating material and by way of which the respective heat sink (11) is mechanically and electrically isolated from the other heat sinks (11).
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