Integrated circuit

By positioning the flexible integrated circuit with its contact pads outside the footprint and using conductive fluid for connection, the issues of short circuits and reduced yields in flexible integrated circuits are addressed, enhancing the reliability and efficiency of the electronic circuit assembly.

WO2025062127A1 Publication Date: 2025-03-27PRAGMATIC SEMICON LTD
14 Cites 0 Cited by

Patent Information

Application Number
PCT/GB2024/052414
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-20
Filing Date
2024-09-18
Publication Date
2025-03-27

AI Technical Summary

Technical Problem

Flexible integrated circuits (FlexICs) face issues due to their thin and flexible structure, where hard conducting particles in anisotropic conductive adhesives (ACAs) can pierce the external bonding surface and cause short circuits, leading to increased failure rates and reduced manufacturing yields.

Method used

The solution involves arranging the flexible integrated circuit such that its first surface faces the application circuit, with application circuit electrical contact pads located outside the footprint of the flexible integrated circuit. Conductive fluid is deposited across the second surface of the flexible integrated circuit to electrically connect the integrated circuit contact pads to the application circuit contact pads, forming solidified fluid conductors.

Benefits of technology

This arrangement prevents the hard conducting particles from piercing the flexible integrated circuit, reducing the risk of short circuits and increasing manufacturing yields while allowing for efficient electrical connection between the flexible integrated circuit and the application circuit.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

An electronic circuit assembly comprising an application circuit comprising a plurality of application circuit electrical contact pads; and a flexible integrated circuit comprising a first surface, a second surface on an opposite face of the flexible integrated circuit to the first surface, and a plurality of integrated circuit electrical contact pads located on the second surface. The flexible integrated circuit is arranged such that the first surface faces the application circuit and each of the application circuit electrical contact pads is located at least partially outside of a footprint of the flexible integrated circuit. Each of the integrated circuit electrical contact pads is electrically connected to a respective one of the application circuit electrical contact pads by a respective one of a plurality of solidified fluid conductors.
Need to check novelty before this filing date? Find Prior Art