Semiconductor device and method for manufacturing semiconductor device

Abstract

A semiconductor device according to this embodiment has a circuit board that has a first surface facing a first side and a second surface facing a second side on the reverse side from the first side. The semiconductor device has a chip that is mounted on the first surface. The semiconductor device has a heat transfer member that is bonded to the second surface with a first bonding layer interposed therebetween. The semiconductor device has a heat dissipation member that is bonded to a surface of the heat transfer member, said surface facing the second side, with a second bonding layer interposed therebetween. Each of the first bonding layer and the second bonding layer is a sintered body.