Laminate manufacturing apparatus and laminate manufacturing method

Abstract

This laminate manufacturing apparatus (10) is used when a pre-compression laminate (1A), in which a metal base substrate (2), a semi-cured resin composition (3A), a circuit pattern (4) with thickness of at least 0.8 mm, or a circuit body (C) which is a mounting body in which an electronic component is mounted on a circuit pattern (4), are laminated is to be heated and pressurized in a chamber (50). The laminate manufacturing apparatus (10) is provided with a base jig (11) to which the pre-compression laminate (1A) is attached, a film (13) that covers at least the resin composition (3A) and the circuit body (C), and a cover jig (12) that grips the film (13) between the base jig (11) and itself. The base jig (11) comprises an exhaust port (11e) that ventilates the interior of the film (13) that covers the resin composition (3A) and the circuit body (C). The cover jig (12) comprises an opening section (12a) that exposes an entire covering portion (13a) of the film (13) which covers the resin composition (3A) and the circuit body (C).