Cooling system and laser
By setting up a mount and condenser in the housing of the cooling system, and using fans to provide airflow and cooling components to provide cooling medium, the problem of large power consumption required for the formation of condensate in the existing cooling system is solved, efficient cooling and drying is achieved, and the service life of the pump source is extended.
WO2025066235A1 Publication Date: 2025-04-03WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD
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Patent Information
- Application Number
- PCT/CN2024/096319
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-27
- Filing Date
- 2024-05-30
- Publication Date
- 2025-04-03
AI Technical Summary
Technical Problem
The existing cooling system requires a large power consumption when condensate is formed, which affects the service life of the pump source.
Method used
A cooling system is designed to achieve cooling of the mounting seat and condenser by providing airflow with a fan, combining the cooling assembly to provide cooling medium to the cooling runner, while reducing the temperature of the condenser to promote the formation of condensed water and achieving a drying effect.
Benefits of technology
It effectively reduces the power consumption of the cooling system, improves the cooling efficiency, extends the service life of the pump source, and realizes drying of the cooling air duct.
✦ Generated by Eureka AI based on patent content.
Abstract
A cooling system (100) and a laser. The cooling system (100) comprises a housing (110), a fan (120), a mounting base (130), a condenser (140) and a cooling assembly (150), wherein the housing (110) comprises a cooling air duct (111); the fan (120) is connected to the housing (110), and is configured to provide an airflow into the cooling air duct (111) and enable the airflow in the cooling air duct (111) to flow from an inlet to an outlet of the cooling air duct (111); the mounting base (130) is connected to the housing (110) and located in the cooling air channel (111), and a first cooling flow channel (131) is provided in the mounting base (130); the condenser (140) is connected to the housing (110) and located in the cooling air channel (111), and a second cooling flow channel (143) is provided in the condenser (140); and an outlet of the cooling assembly (150) is connected to an inlet of the first cooling channel (131) and an inlet of the second cooling channel (143), the cooling assembly (150) is configured to supply a cooling medium to the first cooling channel (131) and the second cooling channel (143), and the temperature of the cooling medium entering the first cooling channel (131) is greater than the temperature of the cooling medium entering the second cooling channel (143).
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