Wiring board and wiring sheet

The wiring board and sheet design with a nickel-boron and gold electroless plating layer addresses resistance and corrosion issues by enhancing corrosion resistance and stability in humid and hot environments, maintaining electrical stability.

WO2025069868A1 Publication Date: 2025-04-03LINTEC CORP
9 Cites 0 Cited by

Patent Information

Application Number
PCT/JP2024/030567
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-28
Filing Date
2024-08-28
Publication Date
2025-04-03

AI Technical Summary

Technical Problem

Existing wiring technologies experience significant changes in resistance value and corrosion issues, particularly in humid and hot environments, due to the use of nickel-phosphorus electroless plating as a base for gold plating, leading to increased contact resistance and corrosion resistance issues.

Method used

A wiring board and sheet design featuring a substrate with a transmittance of 70% or more for near-infrared light, electrodes made of conductive paste, and a layered electroless plating structure comprising a nickel-boron first layer and a gold second layer, with specific thicknesses to enhance corrosion resistance and stability.

Benefits of technology

The proposed design effectively suppresses changes in resistance value and minimizes blistering between the substrate and electrodes, maintaining electrical stability even in humid and hot conditions.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

A wiring board (100) comprises: a substrate (1) having a transmittance of 70% or more of near-infrared light having a wavelength of 1000 nm; and an electrode (21) provided on the substrate (1) and comprising a conductive paste. The surface of the electrode (21) has a first electroless plating layer (22) formed by electroless plating and containing nickel and boron. The surface of the first electroless plating layer (22) has a second electroless plating layer (23) formed by electroless plating and comprising a metal.
Need to check novelty before this filing date? Find Prior Art