Metrology integrated with vacuum processing

The integration of a high-sensitivity metrology system within a vacuum chamber addresses the need for precise in-vacuum measurements of semiconductor wafers, achieving sub-angstrom sensitivity and preventing oxidation and contamination.

WO2025071746A1 Publication Date: 2025-04-03TOKYO ELECTRON LTD +1
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Patent Information

Application Number
PCT/US2024/039741
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-29
Filing Date
2024-07-26
Publication Date
2025-04-03

AI Technical Summary

Technical Problem

There is a need for an in-vacuum high-sensitivity metrology solution to measure thin films and patterned structures on semiconductor wafers during or after deposition, etching, and other semiconductor processes, without breaking the vacuum to avoid oxidation and contamination.

Method used

A system integrated with a vacuum chamber, featuring a wafer chuck, a rotational stage, illumination optics with an illumination corrector lens, and collection optics with a collection corrector lens, which allows for broadband ellipsometric measurements by directing light through slanted side windows and adjusting the optical spot's position on the wafer.

Benefits of technology

This solution enables sub-angstrom sensitivity measurements of nanometer-thick films, allowing for precise process control during semiconductor manufacturing without exposing the wafer to air, thus preventing oxidation and contamination.

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Abstract

A system includes a vacuum chamber having a wafer chuck therein and side windows slanted relative to the wafer chuck. A wafer stage is positioned below the wafer chuck and configured to rotate the wafer chuck and move the wafer chuck vertically. Illumination optics, including an illumination corrector lens, are configured to receive light and direct the light through an illumination vacuum window of the side windows to an optical spot on the wafer. Collection optics, including a collection corrector lens, are configured to receive the light from the optical spot through a collection vacuum window of the side windows and direct the light to a detector. A transfer module is configured to move the illumination optics and the collection optics parallel to the illumination vacuum window and the collection vacuum window respectively. The illumination corrector lens and the collection corrector lens are configured to reduce chromatic aberration.
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