Light-crosstalk-prevention micro LED display screen using light-absorbing material, and preparation method therefor

Abstract

A light-crosstalk-prevention Micro LED display screen using a light-absorbing material, and a preparation method therefor. The Micro LED display screen comprises: a display screen substrate (1), a plurality of Micro LED pixel units (2) and a light-absorbing material (3), wherein the Micro LED pixel units (2) are periodically arranged on an upper surface of the display screen substrate (1); and the light-absorbing material (3) is attached to an area located on the upper surface of the display screen substrate (1) and located between side walls of the Micro LED pixel units (2). The problem of light crosstalk on a Micro LED display screen substrate (1) is ameliorated.

Description

A light-crosstalk-proof Micro LED display using light-absorbing material and a preparation method thereof Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a light-crosstalk-proof Micro LED display screen using a light-absorbing material and a preparation method thereof. Background Art

[0002] With the rapid development of light-emitting diode (LED) technology in the semiconductor industry, the trend toward miniaturization and integration of LEDs is becoming increasingly evident, leading to the emergence of micro-LEDs (Micro LEDs). By integrating multiple smaller LED pixels onto a large wafer, Micro LEDs can easily produce high-resolution, high-intensity, and high-purity display products.

[0003] In most Micro LED structures, due to their planarity and ductility, light from each pixel unit is mainly emitted from the surface and sides. Since the light emitted from the sides propagates within each pixel unit, severe optical crosstalk occurs, affecting the resolution and color purity of the display, seriously affecting the actual display effect. In the case of multi-color Micro LED pixel units, the crosstalk between different colored light beams is more difficult to control, causing more obvious problems in the manufacturing and application of Micro LEDs. In summary, the proposal and implementation of some methods to reduce optical crosstalk are very necessary and are one of the most critical issues in the development of Micro LEDs.

[0004] Summary of the Invention

[0005] The purpose of the present invention is to provide a light-crosstalk-proof Micro LED display using a light-absorbing material and a preparation method thereof, thereby improving the light crosstalk problem existing on the Micro LED display substrate.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] A light-crosstalk-proof Micro LED display using a light-absorbing material, the Micro LED display comprising: a display substrate, a plurality of Micro LED pixel units, and a light-absorbing material;

[0008] The Micro LED pixel units are periodically arranged on the upper surface of the display screen substrate; the light absorbing material is attached to the area on the upper surface of the display screen substrate and between the side walls of the Micro LED pixel units.

[0009] Optionally, the Micro LED display further includes: a substrate;

[0010] The display screen substrate is arranged on the upper surface of the substrate.

[0011] Optionally, the light-absorbing material includes: black ink.

[0012] Optionally, the upper surface of the Micro LED pixel unit is a 5um×5um square.

[0013] A method for preparing a Micro LED display screen with light-absorbing materials for preventing light crosstalk, for preparing any of the above-mentioned Micro LED display screens with light-absorbing materials for preventing light crosstalk, the method comprising:

[0014] A display screen substrate is fabricated on the upper surface of the substrate; the substrate comprises a plurality of periodically arranged Micro LED pixel units; the plurality of Micro LED pixel units are periodically arranged on the upper surface of the display screen substrate;

[0015] Prepare a stencil; the stencil has the same size as the display substrate, and is provided with openings having the same shape as the upper surface of each Micro LED pixel unit;

[0016] Based on the openings and corresponding Micro LED pixel units, aligning and fixing the stencil with the display substrate to expose the upper surface of each Micro LED pixel unit, and evaporating metal on the upper surface of each Micro LED pixel unit;

[0017] Removing the screen plate, and attaching a light-absorbing material to the upper surface of the display screen substrate using a spraying process;

[0018] Physical and chemical methods are used to remove the metal and light-absorbing material attached to the upper surface of each Micro LED pixel unit.

[0019] Optionally, after removing the metal and light-absorbing material attached to the upper surface of each Micro LED pixel unit by using physical and chemical methods, the method further includes:

[0020] The light absorbing material is cured by a curing process.

[0021] Optionally, the mesh plate is made of stainless steel.

[0022] Optionally, the metal is iron.

[0023] Optionally, the physical and chemical method includes: hydrochloric acid iron removal method.

[0024] Optionally, the curing process includes: UV curing method.

[0025] According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0026] The present invention discloses a light-crosstalk-proof Micro LED display using a light-absorbing material and a preparation method thereof. Through special process steps, the light-absorbing material, which is easy to obtain and transfer, is relatively firmly attached to the display substrate between each Micro LED pixel unit, avoiding contamination of the upper surface of each Micro LED pixel unit. The obtained structure has the effect of suppressing light emission from the sidewall, thereby significantly reducing light crosstalk, and improving the light crosstalk problem existing on the Micro LED display substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] FIG1 is a top view of a Micro LED display screen that uses light-absorbing materials to prevent light crosstalk;

[0029] FIG2 is a top view of the structure after a display screen substrate is manufactured on a substrate;

[0030] Figure 3 is a top view of the screen;

[0031] FIG4 is a top view of the structure after metal deposition;

[0032] FIG5 is a top view of the structure after the screen is removed;

[0033] FIG6 is a top view of the structure after spraying the light absorbing material.

[0034] Explanation of symbols:

[0035] Display substrate—1, Micro LED pixel unit—2, light-absorbing material—3, screen—4, opening—5, metal—6. DETAILED DESCRIPTION

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0037] The purpose of the present invention is to provide a light-crosstalk-proof Micro LED display using light-absorbing materials and a preparation method thereof, aiming to improve the light crosstalk problem existing on the Micro LED display substrate.

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] Figure 1 is a top view of a Micro LED display screen that uses light-absorbing materials to prevent light crosstalk. As shown in Figure 1, the Micro LED display screen that uses light-absorbing materials to prevent light crosstalk in this embodiment includes: a display screen substrate 1, multiple Micro LED pixel units 2, and light-absorbing materials 3.

[0041] The Micro LED pixel units 2 are periodically arranged on the upper surface of the display screen substrate 1 ; the light absorbing material 3 is attached to the area on the upper surface of the display screen substrate 1 and between the sidewalls of the Micro LED pixel units 2 .

[0042] As an optional implementation, the Micro LED display further includes: a substrate.

[0043] The display screen substrate 1 is arranged on the upper surface of the substrate.

[0044] As an optional implementation, the light absorbing material 3 includes: black ink.

[0045] As an optional implementation, the upper surface of the Micro LED pixel unit 2 is a 5um×5um square.

[0046] Example 2

[0047] The method for preparing a light-crosstalk-proof Micro LED display using a light-absorbing material in this embodiment is used to prepare the light-crosstalk-proof Micro LED display using a light-absorbing material in Example 1, and the method includes:

[0048] Step 101: A display screen substrate 1 is fabricated on the upper surface of a substrate; the display screen substrate 1 is composed of a plurality of periodically arranged Micro LED pixel units 2; a plurality of Micro LED pixel units 2 are periodically arranged on the upper surface of the display screen substrate 1.

[0049] Specifically, a display substrate 1 composed of uniformly distributed and periodically arranged Micro LED pixel units 2 is fabricated using a specified substrate. A top view of the structure after fabricating the display substrate 1 on the substrate is shown in Figure 2. Each Micro LED pixel unit 2 has the same shape and size parameters, being a 5μm×5μm square. A large number of Micro LED pixel units 2 are evenly distributed on the rectangular display substrate 1.

[0050] Step 102 : Prepare a stencil 4 ; the size of the stencil 4 is the same as that of the display substrate 1 , and the stencil 4 is provided with openings 5 ​​having the same shape as the upper surface of each Micro LED pixel unit 2 .

[0051] As an optional implementation, the mesh plate 4 is made of stainless steel.

[0052] Specifically, the stencil 4 can cover the entire display substrate 1 and has openings 5 ​​corresponding to the top surface shape of each Micro LED pixel unit 2 on the display substrate 1. The single opening 5 is a 5 μm x 5 μm square. The entire stencil 4 is composed of a solid portion and a large number of openings 5. A top view of the stencil 4 is shown in Figure 3.

[0053] The stencil 4 is made of a metal 6 with stable physical and chemical properties, so that it can cover the display substrate 1 well and the openings 5 ​​just expose the upper surface of each Micro LED pixel unit 2.

[0054] Step 103 : Based on each opening 5 and the corresponding Micro LED pixel unit 2 , align and fix the stencil 4 to the display substrate 1 to expose the upper surface of each Micro LED pixel unit 2 , and evaporate metal 6 on the upper surface of each Micro LED pixel unit 2 .

[0055] As an optional embodiment, the metal 6 is iron so that it can be easily removed by an acidic solution in a subsequent step.

[0056] Specifically, the stencil 4 is aligned and fixed to the display substrate 1 to facilitate vapor deposition. The upper surface of the combined stencil 4 and display substrate 1 exposes the upper surface of the Micro LED pixel unit 2. Common vapor deposition methods can be used to adhere the ends or four sides of the combined unit with adhesive tape to ensure close contact between the display substrate 1 and the stencil 4. Metal 6 can then be vapor-deposited on the upper surface of each Micro LED pixel unit 2 using specialized vapor deposition equipment. A top view of the structure after vapor deposition is shown in Figure 4.

[0057] Step 104 : remove the screen plate 4 and attach the light absorbing material 3 to the upper surface of the display screen substrate 1 by using a spraying process.

[0058] Specifically, as shown in FIG5 , after removing the stencil 4 , it can be observed that the upper surface of each Micro LED pixel unit 2 is covered with metal 6 .

[0059] The light absorbing material 3 is made of black ink. Preferably, black anti-corrosion ink having excellent light absorbing and anti-corrosion effects is used.

[0060] The light-absorbing material 3, for example, black resist ink, is attached by spraying or other processes. The top view of the structure after spraying the light-absorbing material 3 is shown in FIG6 . At this time, the light-absorbing material 3 has been preliminarily transferred to the entire upper surface of the display substrate 1 , but has not yet been completely firmly fixed.

[0061] Step 105 : Using physical and chemical methods to remove the metal 6 and light-absorbing material 3 attached to the upper surface of each Micro LED pixel unit 2 .

[0062] Specifically, although the light-absorbing material 3 has been attached to the display substrate 1, it is not completely firm. In the case of corrosion of the metal 6, a portion of the light-absorbing material 3 blocked by the metal 6 will be removed from the upper surface of the display substrate 1. As an example, the hydrochloric acid iron removal method is adopted here, and the entire display substrate 1 is simply corroded using an acidic solution to remove the metal 6 evaporated in the previous step. Hydrochloric acid does not react physically and chemically with other parts of the display substrate 1, so the light-absorbing material 3 between the side walls of each Micro LED pixel unit 2 is preserved, and the metal 6 on the upper surface of each Micro LED pixel unit 2 is removed, so that the surface is exposed again.

[0063] As an optional implementation, the physical and chemical method includes: a hydrochloric acid iron removal method.

[0064] As an optional implementation manner, after step 105, the method further includes:

[0065] Step 106: Curing the light absorbing material 3 using a curing process.

[0066] As an optional implementation, the curing process includes: UV curing method.

[0067] Specifically, after the preparation steps described above, a top view of a Micro LED display screen using light-absorbing material 3 for light crosstalk prevention is shown in FIG1 . At this point, the display screen substrate 1 is evenly distributed with light-absorbing anti-crosstalk material, i.e., light-absorbing material 3. The required light is emitted from the upper surface of each Micro LED pixel unit 2, giving the display screen a good luminous effect.

[0068] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Reference can be made to the description of the similarities between the various embodiments. For the methods disclosed in the embodiments, since they correspond to the devices disclosed in the embodiments, the description is relatively simple, and the relevant details can be referred to the description of the devices.

[0069] This document uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the device, method, and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. A light-crosstalk-proof Micro LED display using light-absorbing materials, characterized in that: The Micro LED display screen includes: a display screen substrate, a plurality of Micro LED pixel units and a light absorbing material; The Micro LED pixel units are periodically arranged on the upper surface of the display screen substrate; the light absorbing material is attached to a region located on the upper surface of the display screen substrate and between the side walls of the Micro LED pixel units.

2. The light crosstalk prevention Micro LED display using light absorbing materials according to claim 1, characterized in that: The Micro LED display screen further includes: a substrate; The display screen substrate is arranged on the upper surface of the substrate.

3. The light crosstalk prevention Micro LED display using light absorbing materials according to claim 2, characterized in that: The light absorbing material includes: black ink.

4. The light crosstalk prevention Micro LED display using light absorbing materials according to claim 2, characterized in that: The upper surface of the Micro LED pixel unit is a 5um×5um square.

5. A method for preparing a light-crosstalk-proof Micro LED display using a light-absorbing material, for preparing the light-crosstalk-proof Micro LED display using a light-absorbing material as claimed in any one of claims 1 to 4, characterized in that: The method comprises: A display screen substrate is manufactured on the upper surface of the substrate; the substrate is composed of a plurality of Micro LED pixel units arranged periodically; a plurality of Micro LED pixel units are periodically arranged on the upper surface of the display screen substrate; Making a stencil; the size of the stencil is the same as the size of the display substrate, and the stencil is provided with openings having the same shape as the upper surface of each Micro LED pixel unit; Based on each of the openings and the corresponding Micro LED pixel units, aligning and fixing the stencil with the display substrate to expose the upper surface of each of the Micro LED pixel units, and evaporating metal on the upper surface of each of the Micro LED pixel units; The screen is removed, and a light absorbing material is attached to the upper surface of the display screen substrate by a spraying process; Physical and chemical methods are used to remove metal and light-absorbing materials attached to the upper surface of each Micro LED pixel unit.

6. The method for preparing a light-crosstalk-proof Micro LED display using a light-absorbing material according to claim 5, characterized in that: After removing the metal and light absorbing material attached to the upper surface of each Micro LED pixel unit by a physical and chemical method, the method further includes: The light absorbing material is cured by a curing process.

7. The method for preparing a light-crosstalk-proof Micro LED display using a light-absorbing material according to claim 5, characterized in that: The mesh plate is made of stainless steel.

8. The method for preparing a light-crosstalk-proof Micro LED display using a light-absorbing material according to claim 5, characterized in that: The metal is iron.

9. The method for preparing a light-crosstalk-proof Micro LED display using a light-absorbing material according to claim 5, characterized in that: The physical and chemical method comprises: a hydrochloric acid iron removal method.

10. The method for preparing a light-crosstalk-proof Micro LED display using light-absorbing materials according to claim 6, characterized in that: The curing process includes: UV curing method.

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