Electronic device comprising camera module

Abstract

A camera module according to an embodiment disclosed in the present document comprises: a lens assembly; an AF carrier in which at least a part of the lens assembly is located; a camera housing accommodating the AF carrier; an AF actuator which drives the AF carrier to move in the optical axis direction with respect to the camera housing and has a part disposed on the AF carrier and the camera housing; a first guide groove formed on one surface of the camera housing and extending in the optical axis direction; a second guide groove formed on one surface of the AF carrier and extending in the optical axis direction and facing the first guide groove; at least one first AF ball disposed between the first guide groove and the second guide groove; and a recess formed in any one of the camera housing and the AF carrier and facing the at least one first AF ball. Various other embodiments are possible.

Description

Electronic device including a camera module

[0001] One embodiment disclosed in this document relates to an electronic device including a camera module.

[0002] Various electronic devices, such as smart phones, tablet PCs, portable multimedia players (PMPs), personal digital assistants (PDAs), laptop personal computers, and wearable devices such as wrist watches and head-mounted displays (HMDs), contain cameras and can capture images using cameras.

[0003] As the number of users using electronic devices to take photos and videos increases, the performance of cameras embedded in these devices is also improving. For example, when taking images using a camera embedded in an electronic device, adjusting the focus of the subject or compensating for any camera shake (e.g., hand shake) that may occur during the capture may be necessary to obtain a clear image.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0005] Research is continuously being conducted to reduce the thickness of electronic devices to enhance their aesthetics. The thickness of an electronic device can be related to the thickness of the electronic components within it. Typically, high-performance cameras can be thicker than low-performance cameras due to their structural components. When a high-performance camera is placed within an electronic device, it protrudes toward the back of the device, potentially degrading the device's overall aesthetics. Therefore, there is a growing need to reduce camera thickness while maintaining camera performance.

[0006] Meanwhile, the thickness of the camera can be determined by the height of the camera housing and the height of the AF carrier arranged inside the camera housing. The camera lens is arranged in the AF carrier, and the focus of the subject can be adjusted as the AF carrier moves in the optical axis direction of the lens. An AF ball can be arranged between the AF carrier and the camera housing to guide the movement of the AF carrier in the optical axis direction. The AF ball can move in the optical axis direction of the lens along a guide groove formed in the camera housing and the AF carrier. The optical axis direction driving length of the AF ball can be related to the height of the AF carrier and the camera housing. Therefore, if the height of the AF carrier and the height of the camera housing are reduced without considering the driving length of the AF ball, a problem may occur in the optical axis direction movement of the AF carrier because the driving length of the AF ball is not secured.

[0007] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0008] According to one embodiment of the present disclosure, a camera module may include a lens assembly, an AF carrier in which at least a portion of the lens assembly is positioned, a camera housing accommodating the AF carrier, an AF actuator for driving the AF carrier to move in an optical axis direction with respect to the camera housing, a portion of which is disposed on the AF carrier and the camera housing, a first guide groove formed to extend in the optical axis direction from one surface of the camera housing, a second guide groove formed to extend in the optical axis direction from one surface of the AF carrier and facing the first guide groove, at least one first AF ball disposed between the first guide groove and the second guide groove, and a recess formed in one of the camera housing and the AF carrier and facing the first AF ball.

[0009] According to one embodiment of the present disclosure, an electronic device may include a lens assembly, an AF carrier in which at least a portion of the lens assembly is positioned, a camera housing accommodating the AF carrier, an AF actuator configured to drive the AF carrier to move in an optical axis direction with respect to the camera housing, a portion of which is disposed on the AF carrier and the camera housing, a first guide groove formed to extend in the optical axis direction from one surface of the camera housing, a second guide groove formed to extend in the optical axis direction from one surface of the AF carrier and facing the first guide groove, at least one first AF ball disposed between the first guide groove and the second guide groove, and a recess formed in one of the camera housing and the AF carrier and facing the first AF ball.

[0010] According to one embodiment disclosed in this document, a method for reducing the height of a camera module while maintaining the optical axis driving length of the AF ball can be proposed. For example, the length of the guide groove in which the AF ball is arranged, the optical axis driving length of the AF ball, and the optical axis driving length of the AF carrier can be maintained, while the height of the AF carrier and the height of the camera housing can be reduced. Accordingly, the camera module can be reduced in thickness while maintaining performance, thereby contributing to the slimming of electronic devices.

[0011] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0012] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0013] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0014] FIG. 2 is a block diagram illustrating a camera module according to various embodiments.

[0015] FIG. 3A is a perspective view of a camera module according to one embodiment of the present disclosure.

[0016] FIG. 3b is a front view of a camera module according to one embodiment of the present disclosure.

[0017] FIG. 4a is an assembly diagram of a camera module according to one embodiment of the present disclosure.

[0018] FIG. 4b is an assembly diagram of a camera module including an OIS carrier, an OIS magnet, and an OIS coil according to one embodiment of the present disclosure.

[0019] FIG. 5A is a side view of a camera module according to one embodiment of the present disclosure.

[0020] Figure 5b is an enlarged view of the first rail in Figure 5a.

[0021] FIG. 6 is a comparative drawing of an embodiment in which a recess is not formed in the camera housing and an embodiment in which a recess is formed in the camera housing according to one embodiment of the present disclosure.

[0022] Figures 7a and 7b are views of the recess in the -Z direction of Figure 3a.

[0023] Figure 8 is a cross-sectional view of the camera module taken along line 3b-3b of Figure 3b.

[0024] FIGS. 9A to 9D are drawings of an embodiment in which a recess is formed in a camera housing according to one embodiment of the present disclosure.

[0025] FIGS. 10A to 10C are drawings of an embodiment in which a recess is formed in a camera housing according to one embodiment of the present disclosure.

[0026] FIGS. 11A to 11C are drawings of an embodiment in which a recess is formed in an AF carrier according to one embodiment of the present disclosure.

[0027] In the following description, various embodiments of this document are described with reference to the attached drawings. It should be understood that the various embodiments of this document and the terminology used herein are not intended to limit the technical features described herein to specific embodiments, but rather encompass various modifications, equivalents, or alternatives of the embodiments.

[0028] In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items, unless the context clearly indicates otherwise.

[0029] In this document, phrases such as "A or B," "at least one of A and B," "or at least one of B," "A, B, or C," "at least one of A, B, and C," and "at least one of B or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0030] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0031] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0032] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0033] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0034] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0035] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0036] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0037] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0038] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0039] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0041] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0043] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0045] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0046] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0047] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0048] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0049] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0050] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0051] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0052] FIG. 2 is a block diagram illustrating a camera module (180) according to various embodiments. Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0053] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (230) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (230) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (230) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0054] The image stabilizer (240) can move at least one lens or image sensor (230) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (230) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows at least a portion of the image shake caused by the movement to be captured to be compensated for. According to one embodiment, the image stabilizer (240) can detect such movement of the camera module (180) or the electronic device (101) using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). The memory (250) can at least temporarily store at least a portion of the image acquired through the image sensor (230) for the next image processing task. For example, when image acquisition is delayed due to a shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) may be configured as at least a portion of the memory (130), or as a separate memory that operates independently therefrom.

[0055] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (230) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) for at least one of the components included in the camera module (180) (e.g., image sensor (230)). An image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may include at least one of the processors (120). It may be configured as a separate processor that is configured as a part of the processor (120) or operates independently of the processor (120). If the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display module (160) as is or after undergoing additional image processing by the processor (120).

[0056] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties (e.g., angle of view) or functions. In this case, for example, the plurality of camera modules (180) may include at least one of a wide-angle camera, a telephoto camera, or an IR Camera (time of flight camera, structured light camera). For example, a plurality of camera modules including lenses having different angles of view are configured, and the electronic device may be controlled to change the angle of view variably according to a user's selection. According to one embodiment, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera.

[0057] FIG. 3A is a perspective view of a camera module according to an embodiment of the present disclosure. FIG. 3B is a front view of a camera module according to an embodiment of the present disclosure. FIG. 4A is an assembled view of a camera module according to an embodiment of the present disclosure. FIG. 5A is a side view of a camera module according to an embodiment of the present disclosure. FIG. 5B is an enlarged view of the first rail in FIG. 4B is an assembled view of a camera module including an OIS carrier, an OIS magnet, and an OIS coil according to an embodiment of the present disclosure.

[0058] According to one embodiment of the present disclosure, as illustrated in FIGS. 3A, 3B, 4A, and 4B, a camera module (300) (e.g., the camera module (180) of FIG. 2) may include a lens assembly (310), a shield can (320), an auto focus (AF) carrier (330), a camera housing (350), an AF actuator (360), a flexible printed circuit board (FPCB) (363), a first AF ball (b1), a second AF ball (b2), an infrared (IR) filter (370), and a printed circuit board (390) including an image sensor (380). At least one of the above-described components may be omitted or another component may be added. For example, the camera module (300) may include an OIS (image stabilizer) carrier, a first OIS actuator (e.g., a first OIS magnet (341) and a first OIS coil (342) of FIG. 4B), a second OIS actuator (e.g., a second OIS magnet (343) and a second OIS coil (344) of FIG. 4B), and an OIS ball (b3, b4), as illustrated in FIG. 4B, which will be described later.

[0059] According to one embodiment, as illustrated in FIGS. 3A, 3B, 4A, and 4B, the lens assembly (310) may have at least one lens unit (311) aligned and assembled. The lens assembly (310) may be a lens barrel in which at least one lens unit (311) is assembled. In one embodiment, the lens assembly (310) is fixed to the AF carrier (330) and can move relative to the image sensor (380) in the direction of the optical axis (e.g., the OA direction of FIG. 3A and / or the Z-axis direction of FIG. 4A).

[0060] In one embodiment, the lens assembly (320) may be positioned at least partially (e.g., the lens portion (321)) in the opening (321) of the shield can (320) and exposed to the exterior of the camera module (300).

[0061] According to one embodiment, as illustrated in FIGS. 3A, 3B, 4A, and 4B, the shield can (320) may be positioned outside the camera housing (350) and coupled or fitted to the camera housing (350). According to one embodiment, the shield can (320) may be positioned at the outermost portion of the camera module (300) and surround the AF carrier (330) and the camera housing (350). In one embodiment, the shield can (320) may block or reduce electromagnetic waves generated from the outside, thereby reducing malfunction of the camera module (300). In one embodiment, the shield can (320) may include an opening (321) formed so that the lens unit (311) may be exposed to the outside of the camera module (300).

[0062] According to one embodiment, as illustrated in FIGS. 3A, 3B, 4A, and 4B, the AF carrier (330) may be positioned inside the camera housing (350). In one embodiment, the camera housing (350) may have an open upper surface to allow the AF carrier (330) to be inserted, thereby providing a space in which the AF carrier (330) may be seated. In one embodiment, the camera housing (350) may prevent and protect the AF carrier (330) from being dislodged due to movement.

[0063] In one embodiment, the AF carrier (330) may be positioned at a predetermined distance from one surface of the camera housing (350) so as to move in the direction of the optical axis (e.g., the Z-axis direction of FIG. 3) of the lens unit (311) of the lens assembly (310) to adjust the focus on the subject.

[0064] According to one embodiment, the camera module (300) can adjust the focus by moving the AF carrier (330) under the control of the processor (120). In one embodiment, the AF carrier (330) can move in the optical axis (OA) direction of the lens unit (311) (e.g., the Z-axis direction with reference to FIG. 4A) with respect to the camera housing (350) via the AF actuator (360). In one embodiment, the AF actuator (360) can include an AF coil (362) disposed in the camera housing (350) and an AF magnet (361) disposed in the AF carrier (330). In one embodiment, the AF magnet (361) and the AF coil (362) can be disposed in the AF carrier (330) and the camera housing (350) to face each other, respectively. In one embodiment, the AF magnet (361) may be positioned between the second guide groove (420) and the fourth guide groove (440) on one side of the AF carrier (330). The AF carrier (330) may move in the optical axis direction through an electromagnetic force acting between the AF coil (362) and the AF magnet (361) to perform an AF (auto focus) function that automatically adjusts the focus of the lens (e.g., lens unit (311)) on a subject. For example, the processor (120) may control the AF actuator (330) through a driving circuit (e.g., driver IC) (not shown) of the camera module (300) to move the AF carrier (330) substantially in the optical axis direction to perform the AF function. The lens assembly (310) may be fixed to the AF carrier (330) and may move in the optical axis direction together with the AF carrier (330). Accordingly, the focus of the lens unit (311) on the subject can be adjusted according to the movement of the lens assembly (310).

[0065] According to one embodiment, as illustrated in FIGS. 4A and 4B, a flexible printed circuit board (363) may surround the periphery of the camera housing (350). In one embodiment, the flexible printed circuit board (363) may be electrically connected to an AF coil (362). The AF coil (362) may allow current to flow when a signal is applied through the flexible printed circuit board (363). Accordingly, the AF carrier (330) may move in the optical axis direction (e.g., the Z-axis direction with respect to FIG. 4A) with respect to the camera housing (350) through an electromagnetic force acting between the AF magnet (361) and the AF coil (362).

[0066] According to one embodiment, as illustrated in FIGS. 4A and 4B, the camera module (300) may include a printed circuit board (390) having an image sensor (380) disposed thereon. In one embodiment, an IR filter (370) may be disposed to face the image sensor (380). In one embodiment, the IR filter (370) may be a filter that selectively reflects or absorbs near-infrared wavelengths to block them from entering the image sensor (380). In one embodiment, the image sensor (380) and the IR filter (370) may be located inside the camera housing (350).

[0067] According to one embodiment, the AF actuator (360) may include an AF magnet insert yoke, an AF magnet (361), an AF coil (362), an AF back yoke, and at least one AF magnet detection sensor. In one embodiment, at least a portion of the AF actuator (360) may be disposed in the camera housing (350) and the AF carrier (330). In one embodiment, the AF magnet insert yoke and the AF magnet (361) may be sequentially disposed on one side of the AF carrier. The AF back yoke and the AF coil may be sequentially disposed on one side of the camera housing (350) facing the one side of the AF carrier. For example, the AF magnet (361) and the AF coil (362) may be disposed between the AF magnet insert yoke and the AF back yoke. In one embodiment, the AF magnet insert yoke and the AF back yoke can prevent the magnetic flux of the AF magnet (361) from leaking. In one embodiment, the AF magnet insert yoke and the AF back yoke include a metal material and can maintain the position of the AF carrier (330) in the camera housing (350) through the AF magnet (361) and the magnetic force. For example, since the AF magnet (361) and the AF coil (362) are disposed between the AF magnet insert yoke and the AF back yoke, the electromagnetic force can be concentrated between the AF magnet (361) and the AF coil (362). Therefore, the AF carrier (330) can be coupled to the camera housing (350) through the magnetic force.

[0068] In one embodiment, the AF magnet detection sensor can detect the Z-axis position of the AF magnet (361). For example, the AF magnet detection sensor can be disposed on the AF carrier (330) and detect the Z-axis position of the AF magnet (361) that moves along the optical axis (e.g., the OA of FIG. 3A and / or the Z-axis direction of FIG. 4A) together with the AF carrier (330). In one embodiment, at least one AF magnet detection sensor can be disposed in a hole or the center of the AF coil (362). In one embodiment, the AF magnet detection sensor can be positioned adjacent to the AF coil (362). For example, the AF magnet detection sensor can be disposed on one surface of the camera housing (350) together with the AF coil (362). In one embodiment, at least one AF magnet detection sensor can detect the position of the AF magnet (361). For example, at least one AF magnet detection sensor (415) may include at least one driving IC (not shown). The driving IC (not shown) may control the current passing through the AF coil (362) to change the electromagnetic force between the AF magnet (361) and the AF coil (362), thereby controlling the AF carrier (330) to move along the optical axis direction.

[0069] According to one embodiment, as illustrated in FIG. 4b, the camera module (300) may include an OIS (image stabilizer) carrier, a first OIS actuator (e.g., the first OIS magnet (341) and the first OIS coil (342) of FIG. 4b), a second OIS actuator (e.g., the second OIS magnet (343) and the second OIS coil (344) of FIG. 4b), and an OIS ball (b3, b4) based on the configuration of FIG. 4a. In one embodiment, the OIS carrier (340) may accommodate a lens assembly (310). In one embodiment, the OIS carrier (340) may be disposed on the AF carrier (330) and may be used for an optical image stabilizer function that compensates for image shake by moving in a direction perpendicular to the optical axis (e.g., the optical axis OA of FIG. 3A) with respect to the AF carrier (330) (e.g., the X-axis direction and / or the Y-axis direction with respect to FIG. 3A).

[0070] Referring to FIG. 4B in one embodiment, the stopper (322) may be coupled or fitted to the AF carrier (330). The stopper (322) may prevent the OIS carrier (340) from being detached from the AF carrier (330). In one embodiment, the stopper (322) may include an opening corresponding to the lens assembly (310).

[0071] In one embodiment, referring to FIG. 4b, the middle guide (323) can prevent the OIS carrier (340) and / or the lens assembly (310) from rotating when the OIS carrier (340) moves along the X-axis and / or the Y-axis for shake compensation.

[0072] According to one embodiment, the camera module (300) can move the OIS carrier (340) under the control of the processor (120) to compensate for image shake. In one embodiment, the OIS carrier (340) can move in a direction substantially perpendicular to the optical axis (e.g., in the X-axis direction or the Y-axis direction with reference to FIG. 3A) with respect to the AF carrier (330) via the first OIS actuator and the second OIS actuator. In one embodiment, the first OIS actuator may include a first OIS coil (342) disposed on a surface of the camera housing (350) other than a surface on which the AF coil (362) is disposed, and a first OIS magnet (341) disposed on the OIS carrier (340) to face the first OIS coil (342). The OIS carrier (340) can move in the X-axis direction substantially perpendicular to the optical axis through an electromagnetic force acting between the first OIS coil (342) and the first OIS magnet (341). In one embodiment, the second OIS actuator may include a second OIS coil (344) disposed on one side of the camera housing, excluding the side on which the AF coil (362) and the first OIS coil (342) are disposed, and a second OIS magnet (343) disposed on the OIS carrier (340) to face the second OIS coil (344). The OIS carrier (340) can move in the Y-axis direction substantially perpendicular to the optical axis through an electromagnetic force acting between the second OIS coil (344) and the second OIS magnet (343). In another embodiment, the OIS carrier (340) can move in the Y-axis direction substantially perpendicular to the optical axis through an electromagnetic force acting between the first OIS coil (342) and the first OIS magnet (341). The OIS carrier (340) can move in the X-axis direction substantially perpendicular to the optical axis through an electromagnetic force acting between the second OIS coil (344) and the second OIS magnet (343).Accordingly, the OIS carrier (340) can perform an optical image stabilizer function that corrects image shake through an electromagnetic force acting between the OIS coil and the OIS magnet.

[0073] According to one embodiment, the flexible printed circuit board (363) can be electrically connected to the first OIS coil (342) and the second OIS coil (344). The first OIS coil (342) and the second OIS coil (344) can allow current to flow when a signal is applied through the flexible printed circuit board (363).

[0074] According to one embodiment, at least one OIS ball (b3, b4) may be positioned between the AF carrier (330) and the OIS carrier (340). In one embodiment, each of the plurality of OIS balls (b3, b4) may be a bearing ball. The OIS balls (b3, b4) may guide movement of the OIS carrier (340) along the X axis (e.g., the X axis in FIG. 4B) or the Y axis (e.g., the Y axis in FIG. 4B) when the OIS carrier (340) is moved relative to the AF carrier (330) via an electromagnetic force of the first OIS actuator and / or the second OIS actuator.

[0075] In one embodiment, at least one first OIS ball (b3) may be disposed between the AF carrier (330) and the middle guide (323) to guide the rolling movement of the middle guide (323) in the X-axis or Y-axis direction with respect to the AF carrier (330). In one embodiment, the first OIS ball (b3) may be disposed in a flow groove (not shown) formed in the AF carrier (330) to guide the movement of the middle guide (323) in the X-axis or Y-axis direction.

[0076] In one embodiment, at least one second OIS ball (b4) may be disposed between the OIS carrier (340) and the middle guide (323) to guide the rolling motion of the OIS carrier (340) in the X-axis or Y-axis direction relative to the middle guide (323). In one embodiment, the second OIS ball (b4) may be disposed in a flow groove formed in the middle guide (323) to guide the movement of the OIS carrier (340) in the X-axis or Y-axis direction.

[0077] According to one embodiment, at least one AF ball (b1, b2) (e.g., a first AF ball (b1), a second AF ball (b2)) may be disposed between the AF carrier (330) and the camera housing (350), as illustrated in FIGS. 4A, 4B, 5A, and 5B. In one embodiment, the AF balls (b1, b2) may be bearing balls. In one embodiment, the AF balls (b1, b2) may guide movement of the AF carrier (330) along the optical axis (e.g., the optical axis OA of FIG. 3A) when the AF carrier (330) is moved relative to the camera housing (350) through an electromagnetic force between the AF magnet (361) and the AF coil (362).

[0078] In one embodiment, referring to FIGS. 4A, 4B, and 5A, the AF balls (b1, b2) may include a first AF ball (b1) and a second AF ball (b2). In one embodiment, the first AF ball (b1) may be disposed between a first guide groove (410) formed to extend in the direction of the optical axis (OA) from the camera housing (350) and a second guide groove (420) formed to extend in the direction of the optical axis (OA) from the AF carrier (330). In one embodiment, the first guide groove (410) and the second guide groove (420) may face each other. In one embodiment, the first AF ball (b1) may be disposed on a first rail formed to be surrounded by the first guide groove (410) and the second guide groove (420) and may move in the direction of the optical axis. In one embodiment, the number of first AF balls (b1) may be three, but is not limited thereto.

[0079] In one embodiment, referring to FIGS. 4A, 4B, and 5A, the second AF ball (b2) may be disposed between a third guide groove (430) formed to extend in the direction of the optical axis (OA) from the camera housing (350) and a fourth guide groove (440) formed to extend in the direction of the optical axis (OA) from the AF carrier (330). In one embodiment, the third guide groove (430) and the fourth guide groove (440) may face each other. In one embodiment, the second AF ball (b2) may be disposed on a second rail formed to be surrounded by the third guide groove (430) and the fourth guide groove (440) and may move in the direction of the optical axis. In one embodiment, the number of second AF balls (b2) may be two, but is not limited thereto.

[0080] According to one embodiment, the camera module (300) may be configured such that one of the first rail formed through the first guide groove (410) and the second guide groove (420) to guide the first AF ball (b1) or the second rail formed through the third guide groove (430) and the fourth guide groove (440) to guide the second AF ball is configured as the main rail, and the other is configured as the sub rail. In one embodiment, the AF carrier (330) may be substantially guided in its movement in the optical axis (OA) direction with respect to the camera housing (350) through the first AF ball (b1) disposed on the main rail. In one embodiment, the second AF ball (b2) disposed on the sub rail may assist the movement of the AF carrier (330) in the optical axis (OA) direction with respect to the camera housing (350). In one embodiment, the longer the length of the main rail, the more likely it is that tilting of the AF carrier (330) guided by the first AF ball (b1) disposed on the main rail and / or tilting of the lens assembly (310) disposed on the AF carrier (330) can be prevented. Accordingly, the main rail may be formed to have a relatively longer length than the sub rail.

[0081] The following description assumes that the first rail is the main rail and the second rail is the sub rail. Therefore, the length of the first rail in the optical axis (OA) direction may be longer than the length of the second rail in the optical axis (OA) direction.

[0082] According to one embodiment, as illustrated in FIG. 5A, the first guide groove (410) and the second guide groove (420) may be formed as 'V'-shaped grooves. For example, the first guide groove (410) may be formed as a 'V'-shaped groove on one surface of the camera housing (350). The second guide groove (420) may be formed as a 'V'-shaped groove on one surface of the AF carrier (330). Since the first AF ball (b1) is positioned in the first guide groove (410) and the second guide groove (420) formed as 'V'-shaped grooves, its movement in a direction perpendicular to the optical axis (e.g., the optical axis OA of FIG. 3A) (e.g., the X-axis direction of FIG. 4A) may be restricted.

[0083] According to one embodiment, one of the third guide groove (430) and the fourth guide groove (440) may be formed as a 'V' shaped groove, and the other may be formed as a groove including a plane that makes contact with the second AF ball (b2). In one embodiment, referring to FIG. 5A, the third guide groove (430) may be formed as a groove having a negative 'V' shape on one surface of the camera housing (350), and the fourth guide groove (440) may be formed as a groove including a plane (441) that makes contact with the second AF ball (b2). Conversely, the third guide groove (430) may be formed as a groove including a plane (441) that makes contact with the second AF ball (b2), and the fourth guide groove (440) may be formed as a groove having a negative 'V' shape on one surface of the camera housing (350).

[0084] In one embodiment, the gap between the first guide groove (410) and the second guide groove (420) and the gap between the third guide groove (430) and the fourth guide groove (440) may be different from each other. For example, referring to FIG. 5A, the first gap, which is the gap between the first guide groove (410) and the second guide groove (420), and the second gap, which is the gap between the third guide groove (430) and the fourth guide groove (440), may be different from each other. In one embodiment, a plane (441) located in one of the third guide groove (430) and the fourth guide groove (440) (e.g., the fourth guide groove (440)) may compensate for the difference between the first gap and the second gap.

[0085] Meanwhile, in one embodiment, referring to FIG. 5A, the first guide groove (410) and the third guide groove (430) may be formed on the same surface in the camera housing (350). In one embodiment, the second guide groove (420) and the fourth guide groove (440) may be formed on the same surface in the AF carrier (330).

[0086] According to one embodiment, as illustrated in FIG. 5B, the camera module (300) may include a recess (400) formed in one of the camera housing (350) and the AF carrier (330) and facing the first AF ball (b1). In one embodiment, the first AF ball (b1) may be seated in the recess (400) depending on the driving state of the AF carrier (330) via the AF actuator (360). For example, when the AF function of the camera module (300) is not operated, the first AF ball (b1) may be positioned in the recess (400). Conversely, when the AF carrier (330) moves in the direction of the optical axis (OA) with respect to the camera housing (350) while the AF function of the camera module (300) is operated, the first AF ball (b1) may be in a state where it is away from the recess (400).

[0087] In one embodiment, the recess (400) may be a space in which the first AF ball (b1) is seated. In one embodiment, the recess (400) may be formed in various ways.

[0088] In one embodiment, the recess (400) may be a groove formed in at least one of the camera housing (350) and the AF carrier (330) (e.g., the recess (400) of FIG. 9c).

[0089] In one embodiment, the recess (400) may be a space formed by a partition wall (401) formed on one surface of the camera housing (350) and the AF carrier (330) on which the first AF ball (b1) is seated (e.g., the partition wall (401) of FIGS. 10C and 11C). In one embodiment, the inner surface of the recess (400) may be curved. In one embodiment, the radius of curvature of the inner surface of the recess (400) may be larger than the radius of curvature of the first AF ball (b1) as illustrated in FIG. 6 or may be equal to the radius of curvature of the first AF ball (b1) as illustrated in FIG. 9C. In addition, the recess (400) may be formed in various shapes.

[0090] In one embodiment, referring to FIG. 5b and FIGS. 9a to 10c to be described later, the recess (400) may be a groove formed in a first mounting portion (351) of the camera housing (350). In one embodiment, the first mounting portion (351) may be connected to a first guide groove (410). The first AF ball (b1) is positioned in the recess (400) according to the driving state of the AF carrier (330) and may move in the direction of the optical axis (OA) along the first guide groove (410) and the second guide groove (420). In one embodiment, referring to FIGS. 11a to 11c to be described later, the recess (400) may be a groove formed in a second mounting portion (331) of the AF carrier (330). In one embodiment, the second mounting portion (331) may be connected to a second guide groove (420). The first AF ball (b1) is positioned in the recess (400) depending on the driving state of the AF carrier (330) and can move in the direction of the optical axis (OA) along the first guide groove (410) and the second guide groove (420).

[0091] FIG. 6 is a comparative diagram of an embodiment in which a recess is not formed in the camera housing and an embodiment in which a recess is formed in the camera housing according to one embodiment of the present disclosure. FIGS. 7A and 7B are views of the recess as viewed in the -Z direction of FIG. 3A. FIG. 8 is a cross-sectional view of the camera module taken along line 3b-3b of FIG. 3B.

[0092] According to one embodiment, as illustrated in FIG. 6, when a recess (400) is formed in the first mounting portion (351) of the camera housing (350), the height of the camera module (300) (e.g., length in the Z-axis direction based on FIG. 6) can be reduced by the depth (a) of the recess (400). In one embodiment, referring to FIG. 6, a first height (A') (e.g., length in the Z-axis direction based on FIG. 6) of one side of the AF carrier (330) in which the second guide groove (420) is formed as the recess (400) is formed and / or a second height (B') (e.g., length in the Z-axis direction based on FIG. 6) of one side of the camera housing (350) in which the first guide groove (410) is formed may be reduced by a first length (b) compared to a height (B) of the camera housing (350) of a camera module (300) in which the recess (400) is not formed and / or a height (A) of the AF carrier (330). In one embodiment, the first length (b) may be less than or equal to a depth (a) of the recess (400). Accordingly, the height of the camera module (300) including the recess (400) may be reduced compared to a height of the camera module (300) not including the recess (400).

[0093] According to one embodiment, as shown in FIGS. 11A to 11C to be described later, when a recess (400) is formed in the second mounting portion (331) of the AF carrier (330), the height of the camera module (300) can be reduced by the depth (a) of the recess (400). In one embodiment, when the recess (400) is formed, the second height (B') of the camera housing (350) and / or the first height (A') of the AF carrier (330) can be reduced by a first length (b) less than the height (B) of the camera housing (350) of the camera module (300) in which the recess (400) is not formed and / or the height (A) of the AF carrier (330). In one embodiment, the first length (b) can be less than or equal to the depth (a) of the recess (400). Therefore, in one embodiment, the height of the camera module (300) including the recess (400) may be reduced compared to the height of the camera module (300) not including the recess (400).

[0094] In one embodiment, referring to FIG. 6, the first AF ball (b1) may not fall out between the gap between the AF carrier (330) and the printed circuit board (390) through the end (402) of the curved surface while being seated in the recess (400). In one embodiment, referring to FIG. 10c to be described later, the first AF ball (b1) may not fall out between the gap between the AF carrier (330) and the printed circuit board (390) through the partition wall (401) formed in the first seating portion (351) of the camera housing (350). In one embodiment, referring to FIG. 11c to be described later, the first AF ball (b1) may not fall out between the gap between the AF carrier (330) and the printed circuit board (390) through the partition wall (401) formed in the second seating portion (331) of the AF carrier (330).

[0095] According to one embodiment of the present disclosure, the camera module (300) may include a recess (400). In one embodiment, as the recess (400) is formed in the camera housing (350) and / or the AF carrier (330), the length of the first rail formed through the first guide groove (410) and the second guide groove (420) may be extended by the depth (a) of the recess (400). In addition, compared to a camera module (300) that does not include the recess (400), the second height (B') of the camera housing (350) and / or the first height (A') of the AF carrier (330) may be reduced. For example, a camera module (300) including a recess (400) can reduce the second height (B') of the camera housing (350) and the first height (A') of the AF carrier (330) by the first length (b) compared to a camera module (300) not including the recess (400). The camera module (300) can reduce the second height (B') of the camera housing (350) and / or the first height (A') of the AF carrier (330) by the first length (b) by forming the recess (400) on one surface of the camera housing (350) or the AF carrier (330) while maintaining the length of the first rail, the driving length (X) of the AF carrier (330) in the optical axis (OA) direction, and the driving length (Y) of the first AF ball (b1). Accordingly, the thickness of the electronic device (101) can also be reduced as the overall height of the camera module (300) is reduced compared to the height of the camera module (300) in which the recess (400) is not formed.

[0096] According to one embodiment, the first height (A') of one side of the AF carrier (330) on which the second guide groove (420) is formed may be greater than a value obtained by subtracting the depth (a) of the recess (400) from the sum (C) of the diameters of the plurality of first AF balls (b1) and the optical axis (OA) direction driving length (X) of the AF carrier (330). In one embodiment, the second height (B') of the camera housing (350) on which the first guide groove (410) is formed may be greater than a value obtained by summing the first height (A') of the AF carrier (330) and the optical axis (OA) direction driving length (X) of the AF carrier (330).

[0097] According to one embodiment, as illustrated in FIG. 6, the first AF ball (b1) may be driven in a first rail formed through the first guide groove (410) of the camera housing (350) and the second guide groove (420) of the AF carrier (330). In one embodiment, the driving length (Y) of the first AF ball (b1) may be less than the length of the first rail. For example, the length of the first rail may be greater than or equal to the sum of the driving length (Y) of the first AF ball (b1) and the sum of the diameters (C) of the plurality of first AF balls (b1). In other words, the length of the first guide groove (410) in the direction of the optical axis (OA) and the length of the second guide groove (420) in the direction of the optical axis (OA) may be greater than or equal to the sum of the driving length (Y) of the first AF ball (b1) and the sum of the diameters (C) of the plurality of first AF balls (b1).

[0098] According to one embodiment, as illustrated in FIG. 6, when the driving length (Y) of the first AF ball (b1) is 0.5 times or more the driving length (X) of the AF carrier (330) in the optical axis (OA) direction, a slip (e.g., slipping) shape between the AF carrier (330) and the first AF ball (b1) may not occur. Accordingly, the driving length (Y) of the first AF ball (b1) may be formed to be 0.5 times or more the driving length (X) of the AF carrier (330) in the optical axis (OA) direction.

[0099] According to one embodiment, as illustrated in FIGS. 7A and 7B, a first guide surface (411, 412) may be positioned inside a first guide groove (410). In one embodiment, the first guide surface (411, 412) may include a first-first guide surface (411) and a first-second guide surface (412) that are adjacent to each other. In one embodiment, a second guide surface (421, 422) may be positioned inside a second guide groove (420). In one embodiment, the second guide surface (421, 422) may include a second-first guide surface (421) and a second-second guide surface (422) that are adjacent to each other. In one embodiment, the first-first guide surface (411) and the second-first guide surface (421) may face each other. In one embodiment, the first-second guide surface (412) and the second-second guide surface (422) may face each other.

[0100] In one embodiment, the gap (L) between the first-first guide surface (411) and the second-first guide surface (421) and / or the gap (L) between the first-second guide surface (412) and the second-second guide surface (422) may be smaller than the diameter (D) of the first AF ball (b1). Accordingly, during the process in which the AF carrier (330) moves relative to the camera housing (350) in the direction of the optical axis (OA), contact may not occur between the first-first guide surface (411) and the second-first guide surface (421) and contact may not occur between the first-second guide surface (412) and the second-second guide surface (422). Accordingly, wear due to contact between the first guide surfaces (411, 412) and the second guide surfaces (421, 422) and movement obstruction of the AF carrier (330) due to contact with the camera housing (350) can be prevented.

[0101] In one embodiment not shown in the drawing, a third guide surface may be positioned inside the third guide groove (430). In one embodiment, the third guide surface may include a third-first guide surface and a third-second guide surface that are adjacent to each other. In one embodiment, a fourth guide surface may be positioned inside the fourth guide groove (440). In one embodiment, the fourth guide surface may include a fourth-first guide surface and a fourth-second guide surface that are adjacent to each other. In one embodiment, the third-first guide surface and the fourth-first guide surface may face each other. In one embodiment, the third-second guide surface and the fourth-second guide surface may face each other.

[0102] In one embodiment, the gap between the 3-1 guide surface and the 4-1 guide surface and / or the gap between the 3-2 guide surface and the 4-2 guide surface may be smaller than the diameter of the second AF ball (b2). Accordingly, during the process in which the AF carrier (330) moves relative to the camera housing (350) in the direction of the optical axis (OA), contact may not occur between the 3-1 guide surface and the 4-1 guide surface and contact may not occur between the 3-2 guide surface and the 4-2 guide surface. Accordingly, wear due to contact between the 3rd guide surface and the 4th guide surface and movement obstruction of the AF carrier (330) due to contact with the camera housing (350) can be prevented.

[0103] According to one embodiment, as illustrated in FIG. 8, the camera module (300) may include a structure in which the first AF ball (b1) may be seated in the recess (400). In one embodiment, a diameter (2R') of a virtual circle that comes into contact with one surface of the recess (400), the first guide surface (411, 412) and / or the second guide surface (421, 422) may be greater than or equal to a diameter (D) of the first AF ball (b1). In one embodiment, the diameter (R') of the virtual circle may be a diameter of a largest circle among the virtual circles that come into contact with one surface located at a substantially lowest point in the recess (400) and come into contact with the first guide surface (411, 412) and the second guide surface (421, 422). Accordingly, the first AF ball (b1) can be brought into contact with one side of the recess (400) based on the driving state of the AF carrier (330). At least one first AF ball (b1) can maintain contact with the recess (400). Interference may not occur between the first AF ball (b1) and the first mounting portion (351) during operation of the camera module (300).

[0104] FIGS. 9A to 9D are drawings of an embodiment in which a recess is formed in a camera housing according to an embodiment of the present disclosure. FIGS. 10A to 10C are drawings of an embodiment in which a recess is formed in a camera housing according to an embodiment of the present disclosure. FIGS. 11A to 11C are drawings of an embodiment in which a recess is formed in an AF carrier according to an embodiment of the present disclosure.

[0105] The following FIGS. 9a to 10c are descriptions of an embodiment in which a recess (400) for seating the first AF ball (b1) is formed in the first seating portion (351) of the camera housing (350). FIGS. 11a to 11c are descriptions of an embodiment in which a recess (400) for seating the first AF ball (b1) is formed in the second seating portion (331) of the AF carrier (330).

[0106] According to one embodiment, as illustrated in FIGS. 9A to 9D , the camera housing (350) may include a first mounting portion (351). In one embodiment, the first mounting portion (351) may be a component of the camera housing (350) facing the first AF ball (b1). In one embodiment, the first mounting portion (351) may be connected to the first guide groove (410). In one embodiment, a recess (400) may be formed in the first mounting portion (351) of the camera housing (350). In one embodiment, the first AF ball (b1) may be driven in the direction of the optical axis (OA) along the first guide groove (410) and may be mounted in the recess (400) formed in the first mounting portion (351) based on the driving state of the AF carrier (330).

[0107] In one embodiment, the recess (400) may be formed in various ways. For example, the recess (400) may be a groove formed in the first mounting portion (351). Additionally, the recess (400) may be a space formed by being surrounded by a partition wall (401) formed in the first mounting portion (351).

[0108] In one embodiment, referring to FIGS. 9A to 9D, the recess (400) may be formed with a curved surface on the surface that comes into contact with the first AF ball (b1). Accordingly, the first AF ball (b1) may be seated on the curved surface of the recess (400). In one embodiment, the radius of curvature of the curved surface of the recess (400) may be equal to or greater than the radius of curvature of the first AF ball (b1).

[0109] In one embodiment, referring to FIGS. 10A to 10C, the recess (400) may be formed to be surrounded by a partition wall (401) formed in the first mounting portion (351) of the camera housing (350). In one embodiment, the recess (400) may be formed to have a surface that comes into contact with the first AF ball (b1) as a plane. In this case, the depth (a) of the recess (400) may be the same as the height of the partition wall (401). In one embodiment, the recess (400) may be formed to have a surface that comes into contact with the first AF ball (b1) as a curved surface corresponding to the first AF ball (b1).

[0110] According to one embodiment, as illustrated in FIGS. 11A to 11C, the AF carrier (330) may include a second mounting portion (331). In one embodiment, the second mounting portion (331) may be a component of the camera housing (350) facing the first AF ball (b1). In one embodiment, the second mounting portion (331) may be connected to a second guide groove (420). In one embodiment, a recess (400) may be formed in the second mounting portion (331) of the AF carrier (330). In one embodiment, the first AF ball (b1) may be driven in the direction of the optical axis (OA) along the second guide groove (420) and may be mounted in the recess (400) formed in the second mounting portion (331) based on the driving state of the AF carrier (330).

[0111] In one embodiment, referring to FIGS. 11A to 11C, the recess (400) may be formed to be surrounded by a partition wall (401) formed in the first mounting portion (351) of the AF carrier (330). In one embodiment, the recess (400) may be formed to have a plane surface that comes into contact with the first AF ball (b1). In this case, the depth (a) of the recess (400) may be equal to the height of the partition wall (401).

[0112] In one embodiment, the recess (400) may be formed with a curved surface on the surface that comes into contact with the first AF ball (b1). Accordingly, the first AF ball (b1) may be seated on the curved surface of the recess (400). In one embodiment, the radius of curvature of the curved surface of the recess (400) may be equal to or greater than the radius of curvature of the first AF ball (b1).

[0113] According to one embodiment disclosed in the present document, a method of maintaining the optical axis direction driving length (Y) of the first AF ball (b1) and reducing the height of the camera module (300) can be proposed. For example, the optical axis (OA) direction length of the guide groove (410, 420) in which the first AF ball (b1) is arranged, the optical axis direction driving length (Y) of the first AF ball (b1), and the optical axis direction driving length (X) of the AF carrier (330) can be maintained, while the height (A') of the AF carrier and the height (B') of the camera housing can be reduced. For example, the height (A') of the AF carrier and the height (B') of the camera housing can be reduced by the first length (b). In one embodiment, the first length (b1) can be less than or equal to the depth (a) of the recess (400). Therefore, the camera module (300) can be reduced in thickness while maintaining its performance, thereby helping to slim down the electronic device (101).

[0114] According to one embodiment of the present disclosure, a camera module (300) (e.g., the camera module (180) of FIG. 1) may include a lens assembly (310), an AF carrier (330) in which at least a portion of the lens assembly is positioned, a camera housing (350) accommodating the AF carrier, an AF actuator (360) for driving the AF carrier to move in the direction of the optical axis (OA) with respect to the camera housing, a portion of which is disposed on the AF carrier and the camera housing, a first guide groove (410) formed on one surface of the camera housing and extending in the direction of the optical axis, a second guide groove (420) formed on one surface of the AF carrier and extending in the direction of the optical axis and facing the first guide groove, at least one first AF ball (b1) disposed between the first guide groove and the second guide groove, and a recess (400) formed on one of the camera housing and the AF carrier and facing the first AF ball.

[0115] Additionally, the camera housing may include a first mounting portion (351) connected to the first guide home and facing the first AF ball and having the recess formed therein.

[0116] Additionally, the AF carrier may include a second mounting portion (331) connected to the second guide groove and facing the first AF ball and having the recess formed therein.

[0117] Additionally, the first AF ball can be brought into contact with the recess based on the driving state of the AF carrier.

[0118] Additionally, the gap (L) between the first guide surface located in the first guide groove and the second guide surface located in the second guide groove and facing the first guide surface may be smaller than the diameter (D) of the first AF ball.

[0119] In addition, when the first AF ball is in contact with one side of the recess, the diameter (2R') of an imaginary circle whose radius is the distance between the center of the first AF ball and one side of the recess may be larger than the diameter (D) of the first AF ball.

[0120] Additionally, the driving distance (Y) of the first AF ball in the optical axis direction in the first guide groove and the second guide groove may be 0.5 times or more the driving distance (X) of the AF carrier in the optical axis direction with respect to the camera housing.

[0121] In addition, the length of the first guide groove and the second guide groove in the optical axis direction may be greater than the sum of the driving distance (X) of the AF carrier in the optical axis direction and the driving distance (Y) of the first AF ball in the optical axis direction.

[0122] In addition, the first height (A') of one side of the AF carrier on which the second guide groove is formed may be equal to or greater than a value obtained by subtracting the depth (a) of the recess in the optical axis direction from the sum (C) of the diameters of the first AF ball and the driving distance (X) of the AF carrier in the optical axis direction.

[0123] In addition, the second height (B') of one side of the camera housing where the first guide groove is formed may be greater than the sum of the first height (A') of one side of the AF carrier and the driving distance (X) of the AF carrier in the optical axis direction.

[0124] In addition, it may include a third guide groove (430) formed on the same surface as the surface on which the first guide groove is formed in the camera housing, a fourth guide groove (440) formed on the same surface as the surface on which the second guide groove is formed in the AF carrier, and at least one second AF ball (b2) disposed between the third guide groove and the fourth guide groove.

[0125] Additionally, the length of the first guide groove and the second guide groove in the optical axis direction may be formed longer than the length of the third guide groove and the fourth guide groove in the optical axis direction.

[0126] In addition, the AF actuator may include an AF magnet (361) positioned between the second guide groove and the fourth guide groove on one side of the AF carrier, and an AF coil (362) disposed in the camera housing and facing the AF magnet.

[0127] Additionally, it may further include an opening (321) in which the lens assembly is located, and a shield can (320) covering the camera housing.

[0128] In addition, the lens assembly may be accommodated, and an OIS carrier (340) disposed in the AF carrier and moving in a direction perpendicular to the optical axis with respect to the camera housing, the OIS carrier (340) may be driven to move in a direction perpendicular to the optical axis with respect to the camera housing, and a portion may further include an OIS actuator disposed between the OIS carrier (340) and the camera housing and at least one OIS ball disposed between the OIS carrier (340) and the camera housing.

[0129] Additionally, the OIS actuator may include an OIS magnet disposed on one surface of the OIS carrier (340) and an OIS coil disposed on the camera housing and facing the OIS magnet.

[0130] According to one embodiment of the present disclosure, an electronic device (101) may include a lens assembly (310), an AF carrier (330) in which at least a portion of the lens assembly is positioned, a camera housing (350) for accommodating the AF carrier, an AF actuator (360) for driving the AF carrier to move in the direction of the optical axis (OA) with respect to the camera housing, a portion of which is disposed on the AF carrier and the camera housing, a first guide groove (410) formed on one surface of the camera housing and extending in the direction of the optical axis, a second guide groove (420) formed on one surface of the AF carrier and extending in the direction of the optical axis and facing the first guide groove, at least one first AF ball (b1) disposed between the first guide groove and the second guide groove, and a recess (400) formed in one of the camera housing and the AF carrier and facing the first AF ball. More generally, the present application relates to an electronic device including at least one camera module as described above.

[0131] Additionally, the first AF ball can be brought into contact with the recess based on the driving state of the AF carrier.

[0132] Additionally, the gap (L) between the first guide surface located in the first guide groove and the second guide surface located in the second guide groove and facing the first guide surface may be smaller than the diameter (D) of the first AF ball.

[0133] In addition, when the first AF ball is in contact with one side of the recess, the diameter (2R') of an imaginary circle whose radius is the distance between the center of the first AF ball and one side of the recess may be larger than the diameter (D) of the first AF ball.

[0134] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0135] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0136] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0137] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0138] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0139] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0140] It will be appreciated that the present invention contemplates and encompasses embodiments based on any combination of two or more of the disclosed embodiments, as well as embodiments comprising any combination of the features disclosed herein. That is, the absence of an explicit indication that two features or two embodiments can be combined does not imply that such a combination is not envisioned, but rather that such a combination is intended to be included herein.

Claims

1. In an electronic device (101) including a camera module (180, 330), The above camera module, Lens assembly (310); AF carrier (330) to which the above lens assembly is fixed; A camera housing (350) accommodating the above AF carrier; An AF actuator (360) that drives the AF carrier to move in the optical axis (OA) direction with respect to the camera housing, some of which are disposed on the AF carrier and the camera housing; A first guide groove (410) formed extending in the direction of the optical axis on one side of the camera housing; A second guide groove (420) formed to extend in the direction of the optical axis on one side of the AF carrier and facing the first guide groove; At least one first AF ball (b1) arranged between the first guide groove and the second guide groove and guiding movement of the AF carrier in the optical axis direction with respect to the camera housing; and An electronic device comprising a recess (400) formed in one of the camera housing and the AF carrier and facing at least one of the first AF balls in the optical axis direction.

2. In paragraph 1, The above camera housing, An electronic device including a first fixing portion (351) connected to the first guide home and facing at least one of the first AF balls and having the recess formed therein.

3. In paragraph 1, The above AF carrier, An electronic device including a second fixing portion (331) connected to the second guide home and facing at least one of the first AF balls and having the recess formed therein.

4. In paragraph 1, The above first AF ball, An electronic device that comes into contact with the recess based on the driving state of the AF carrier.

5. In any one of paragraphs 1 to 4, An electronic device in which a gap (L) between a first guide surface located in a first guide groove and a second guide surface located in the second guide groove and facing the first guide surface is smaller than a diameter (D) of the first AF ball.

6. In any one of paragraphs 1 to 5, An electronic device in which a diameter (2R') of an imaginary circle in contact with a first guide surface located in the first guide groove and a second guide surface located in the second guide groove and facing the first guide surface is larger than a diameter (D) of the first AF ball.

7. In any one of paragraphs 1 to 6, The driving distance (Y) of the first AF ball in the optical axis direction in the first guide groove and the second guide groove is, An electronic device having a driving distance (X) of the AF carrier in the optical axis direction relative to the camera housing of at least 0.5 times.

8. In any one of paragraphs 1 to 7, An electronic device in which the length of the first guide groove and the second guide groove in the optical axis direction is greater than the sum of the driving distance (X) of the AF carrier in the optical axis direction and the driving distance (Y) of the first AF ball in the optical axis direction.

9. In any one of paragraphs 1 to 8, The first height (A') of one side of the AF carrier on which the second guide groove is formed is An electronic device having a value greater than or equal to the sum of the diameters (C) of the first AF ball and the driving distance (X) of the AF carrier in the optical axis direction minus the depth (a) of the recess in the optical axis direction.

10. In paragraph 9, The second height (B') of one side of the camera housing on which the first guide groove is formed is An electronic device having a value greater than or equal to the sum of the first height (A') of one side of the AF carrier and the driving distance (X) in the optical axis direction of the AF carrier.

11. In any one of paragraphs 1 to 10, A third guide groove (430) formed to extend in the direction of the optical axis on the same surface as the surface on which the first guide groove is formed in the camera housing; A fourth guide groove (440) formed in the AF carrier extending in the direction of the optical axis on the same surface as the surface on which the second guide groove is formed; and An electronic device comprising at least one second AF ball (b2) disposed between the third guide groove and the fourth guide groove.

12. In paragraph 11, The length of the first guide groove and the second guide groove in the optical axis direction is, An electronic device formed longer than the length of the third guide groove and the fourth guide groove in the optical axis direction.

13. In any one of paragraphs 10 to 12, The above AF actuator, An electronic device including an AF magnet (361) positioned between the second guide groove and the fourth guide groove on one side of the AF carrier, and an AF coil (362) disposed in the camera housing and facing the AF magnet.

14. In any one of paragraphs 1 to 13, An electronic device further comprising a shield can (320) comprising an opening (321) in which the lens assembly is positioned and covering at least a portion of the camera housing.

15. In any one of paragraphs 1 to 14, An OIS carrier (340) that accommodates the lens assembly and is arranged in the AF carrier and moves in a direction perpendicular to the optical axis with respect to the camera housing; An OIS actuator that drives the OIS carrier (340) to move in a direction perpendicular to the optical axis with respect to the camera housing, some of which are disposed on the OIS carrier (340) and the camera housing; and Further comprising at least one OIS ball disposed between the OIS carrier (340) and the camera housing; The above OIS actuator, An electronic device including an OIS magnet arranged on one side of the OIS carrier (340) and an OIS coil arranged in the camera housing and facing the OIS magnet.

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