Absorption-type heat pump cooling system, and cooling method using absorption-type heat pump

Abstract

An absorption-type heat pump cooling system according to one embodiment of the present invention comprises: an immersion cooling chamber for cooling an electronic device by using a first refrigerant; a desorption reactor, which receives heat to desorb a second refrigerant; a condenser for condensing the second refrigerant transferred to the desorption reactor; an evaporator for evaporating the condensed second refrigerant; and an adsorption reactor for causing the evaporated second refrigerant to be adsorbed in an adsorbent, wherein the immersion cooling chamber is connected to the desorption reactor or the evaporator so as to supply heat.

Description

Adsorption heat pump cooling system and cooling method using adsorption heat pump

[0001] The present invention relates to an adsorption heat pump cooling system and a cooling method using an adsorption heat pump.

[0002] With the development of the IT industry, public institutions and large corporations are building large-scale IT infrastructures to provide various IT services. For example, servers are installed to support file management, data storage, and program operations, or to enable the sharing of hardware resources such as fax machines, printers, and equipment. Numerous clients, or computer terminals, are connected to these servers via a LAN. Servers connect computers to form a network and provide massive storage space.

[0003] However, if the server is overloaded and overheats, the heat sink or cooling fan may not be able to sufficiently cool the CPU and GPU, which may cause the server to malfunction or crash.

[0004] To address these issues, most Internet data centers install and operate separate temperature and humidity control equipment in the server rooms where server racks are installed. However, large-scale data centers require a large number of temperature and humidity control equipment, and operating them consumes significant costs and energy.

[0005] In addition to these computer servers, storage and network switches used in data centers, and batteries used in various energy storage systems (ESS: Energy Storage Systems) generate a lot of heat during operation, so separate cooling systems must be installed to effectively cool this heat.

[0006] Previously, systems have been introduced that can more efficiently cool the heat generated from heat-generating units, particularly in large-scale data centers. For example, Patent Publication No. 10-2011-9848 (January 31, 2011) describes a data center cooling system that compares the temperature and humidity of the internal and external air within a data center and then introduces external air or circulates internal air accordingly to cool the interior of the data center. However, these cooling systems have relatively low heat transfer efficiency, making them inefficient at cooling data centers and unable to utilize the heat generated within the data center.

[0007] Meanwhile, an adsorption heat pump is a system that utilizes the process of refrigerant adsorption and desorption on an adsorbent inside a reactor. This device utilizes the heat generated during adsorption and desorption to provide cooling and heating. Because the adsorption and desorption processes both release and absorb heat, an adsorption heat pump requires a heat source.

[0008] Based on the technical background described above, the present invention provides an adsorption heat pump cooling system capable of efficiently and stably cooling a data center and a cooling method using an adsorption heat pump.

[0009] An adsorption heat pump cooling system according to one embodiment of the present invention may include an immersion cooling chamber for immersing and cooling a first electronic device module using a first refrigerant, a first heat exchanger connected to the immersion cooling chamber for cooling the first refrigerant, a desorption reactor connected to the first heat exchanger for receiving heat from the first heat exchanger and desorbing a second refrigerant, a condenser for condensing the second refrigerant transferred to the desorption reactor, an evaporator for evaporating the condensed second refrigerant, an adsorption reactor for adsorbing the evaporated second refrigerant to an adsorbent, and a main cooling line connected to the evaporator for cooling a third refrigerant different from the first refrigerant and transferring the cooled third refrigerant to a second electronic device module.

[0010] As described above, the adsorption heat pump cooling system according to one embodiment of the present invention can cool the remaining data center servers using the heat from cooling a portion of the data center servers, and can drive the desorption reactor using an external renewable energy heat source, thereby performing the desorption reaction more reliably and improving energy efficiency.

[0011] FIG. 1 is a schematic diagram illustrating an adsorption heat pump cooling system according to a first embodiment of the present invention.

[0012] Figure 2 is a schematic diagram illustrating an external heat source according to the first embodiment of the present invention.

[0013] Figure 3 is a schematic diagram illustrating an external heat source according to a modified example of the first embodiment of the present invention.

[0014] Figure 4 is a flowchart for explaining a cooling method using an adsorption heat pump according to the first embodiment of the present invention.

[0015] FIG. 5 is a schematic diagram illustrating an adsorption heat pump cooling system according to a second embodiment of the present invention.

[0016] Figure 6 is a flowchart for explaining a cooling method using an adsorption heat pump according to a second embodiment of the present invention.

[0017] Figure 7 is a schematic diagram illustrating an adsorption heat pump cooling system according to a third embodiment of the present invention.

[0018] Figure 8 is a flowchart for explaining a cooling method using an adsorption heat pump according to a third embodiment of the present invention.

[0019] An adsorption heat pump cooling system according to one embodiment of the present invention may include an immersion cooling chamber for immersing and cooling a first electronic device module using a first refrigerant, a first heat exchanger connected to the immersion cooling chamber for cooling the first refrigerant, a desorption reactor connected to the first heat exchanger for receiving heat from the first heat exchanger and desorbing a second refrigerant, a condenser for condensing the second refrigerant transferred to the desorption reactor, an evaporator for evaporating the condensed second refrigerant, an adsorption reactor for adsorbing the evaporated second refrigerant to an adsorbent, and a main cooling line connected to the evaporator for cooling a third refrigerant different from the first refrigerant and transferring the cooled third refrigerant to a second electronic device module.

[0020] An adsorption heat pump cooling system according to one embodiment of the present invention may further include an external heat source that absorbs heat and an external heat transfer line that absorbs heat from the external heat source and transfers heat to the desorption reactor.

[0021] According to one embodiment of the present invention, the external heat source may be formed of a solar thermal collector.

[0022] According to one embodiment of the present invention, the external heat source may include a fuel cell and an exhaust gas heat exchanger that receives exhaust gas discharged from the fuel cell and absorbs heat from the exhaust gas.

[0023] According to one embodiment of the present invention, the first electronic device module may be composed of some servers of one data center, and the second electronic device module may be composed of the remaining servers of the data center.

[0024] An adsorption heat pump cooling system according to one embodiment of the present invention may further include a three-way valve that integrates the fluid heated in the first heat exchanger and the fluid heated from the external heat source and supplies them to the desorption reactor.

[0025] An adsorption heat pump cooling system according to one embodiment of the present invention may further include a second heat exchanger that heats the fluid heated in the first heat exchanger using the fluid heated from the external heat source.

[0026] According to one embodiment of the present invention, the external heat source includes a solar cell panel and a heat absorption chamber disposed below the solar cell panel to absorb heat generated from the solar cell panel, and the external heat transfer line can be connected to the heat absorption chamber.

[0027] According to one embodiment of the present invention, the external heat source includes a plurality of solar cell panels, a light collecting plate that collects light reflected from the solar cell panels, and a heat absorption chamber that is connected to the light collecting plate and absorbs heat generated from the light collecting plate, and the external heat transfer line can be connected to the heat absorption chamber.

[0028] A cooling method using an adsorption heat pump according to another embodiment of the present invention includes an immersion cooling step of immersing a first electronic device module in an immersion cooling chamber using a first refrigerant, a heat collection heat exchange step of collecting heat while cooling the first refrigerant using a first heat exchanger connected to the immersion cooling chamber and absorbing heat from an external heat source to collect heat, a desorption step of transferring the heat collected in the heat collection heat exchange step to a desorption reactor to desorb a second refrigerant, a condensation step of condensing the second refrigerant desorbed in the desorption reactor, an evaporative cooling step of cooling the second electronic device module using cold heat generated during evaporation while evaporating the condensed second refrigerant, and an adsorption step of adsorbing the evaporated second refrigerant in an adsorption reactor, wherein, during evaporation of the second refrigerant, a third refrigerant different from the first refrigerant is cooled, and the third refrigerant can cool the second electronic device module.

[0029] According to another embodiment of the present invention, the external heat source may be formed of a solar thermal collector.

[0030] According to another embodiment of the present invention, the external heat source includes a fuel cell and an exhaust gas heat exchanger that receives exhaust gas discharged from the fuel cell and absorbs heat from the exhaust gas, and the heat collection heat exchange step can mix a heat transfer material heated in the exhaust gas heat exchanger and a heat transfer material heated in the first heat exchanger using a three-way valve and supply the mixture to the desorption reactor.

[0031] According to another embodiment of the present invention, the first electronic device module may be composed of some servers of a data center, and the second electronic device module may be composed of the remaining servers of the data center.

[0032] The heat collection heat exchange step according to another embodiment of the present invention can heat the fluid heated in the first heat exchanger using the fluid heated from the external heat source.

[0033] According to another embodiment of the present invention, the external heat source includes a solar cell panel and a heat absorption chamber disposed below the solar cell panel to absorb heat generated from the solar cell panel, and the heat collection heat exchange step can heat a material stored in the heat absorption chamber using heat generated from the solar cell panel.

[0034] According to another embodiment of the present invention, the external heat source includes a plurality of solar cell panels, a light collecting plate that collects light reflected from the solar cell panels, and a heat absorption chamber connected to the light collecting plate and absorbing heat generated from the light collecting plate, and the heat collection heat exchange step can collect light reflected from the solar cell panels using the light collecting plate to heat the light collecting plate, and heat a material stored in the heat absorption chamber using the heat generated from the light collecting plate.

[0035] The present invention is susceptible to various modifications and embodiments. Specific embodiments are illustrated and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, but rather to encompass all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention.

[0036] The terminology used herein is merely used to describe specific embodiments and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In the present invention, it should be understood that the terms "comprise" or "have" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0037] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Please note that, where possible, identical components are represented by identical reference numerals throughout the drawings. Furthermore, detailed descriptions of well-known functions and configurations that may obscure the gist of the present invention will be omitted. For the same reason, some components in the attached drawings are exaggerated, omitted, or schematically depicted.

[0038] Hereinafter, an adsorption heat pump cooling system according to a first embodiment of the present invention will be described.

[0039] FIG. 1 is a schematic diagram illustrating an adsorption heat pump cooling system according to a first embodiment of the present invention.

[0040] Referring to FIG. 1, the adsorption heat pump cooling system (101) according to the present embodiment may include an immersion cooling chamber (121), a desorption reactor (131), a condenser (132), an evaporator (133), an adsorption reactor (134), a first heat exchanger (135), and an external heat transfer line (152).

[0041] The liquid immersion cooling chamber (121) is a container-shaped chamber having a sealed internal space, and a first electronic device module (125) to be subjected to forced cooling is accommodated therein. The first electronic device module (125) may be formed from some of the servers of the data center (120).

[0042] The liquid immersion cooling chamber (121) is filled with a first refrigerant that cools the first electronic device module (125). Here, various types of the first refrigerant, such as fluorinated ketones, HFE (hydrofluoro ether), and PFC (perfluorinated compound) having electrical insulation properties, can be applied, and the present invention is not limited to a specific refrigerant.

[0043] The first heat exchanger (135) cools the first refrigerant heated in the liquid immersion cooling chamber (121) and receives heat. The first heat exchanger (135) can cool the first refrigerant through heat exchange using air, water, etc.

[0044] A main heat transfer line (154) is installed between the first heat exchanger (135) and the desorption reactor (131), and the heat of the first heat exchanger (135) can be transferred to the desorption reactor (131). In addition, an external heat transfer line (152) is installed in the desorption reactor (131), and the external heat transfer line (152) is connected to an external heat source (160) to supply heat collected from the external heat source (160) to the desorption reactor (131).

[0045] The main heat transfer line (154) and the external heat transfer line (152) are connected via a three-way valve (156). The three-way valve (156) integrates the heat transfer material heated in the first heat exchanger (135) and the heat transfer material heated in the external heat source (160) and supplies them to the desorption reactor (131).

[0046] As illustrated in Fig. 2, the external heat source (160) may be formed of a solar thermal collector or a solar cell panel. In particular, the external heat source (160) includes a solar cell panel (161) and a heat absorption chamber (162) disposed below the solar cell panel (161) to absorb heat generated from the solar cell panel (161), and an external heat transfer line (152) may be connected to the heat absorption chamber (162).

[0047] The heat absorption chamber (162) is installed on the back of the solar cell panel (161) and absorbs heat generated from the solar cell panel (161) while cooling the solar cell panel (161). The heat absorption chamber (162) may be formed with an outlet connected to an external heat transfer line (152) and an inlet connected to a recovery line (153).

[0048] Meanwhile, as illustrated in FIG. 3, the external heat source (160) may include a plurality of solar cell panels (161), a light collecting plate (168) that collects light reflected from the solar cell panels (161), and a heat absorption chamber (167) that is connected to the light collecting plate (168) and absorbs heat generated from the light collecting plate. The light collecting plate (168) includes a curved portion (169) that is curved in an arc shape so as to collect light reflected from the solar cell panels (161), and an external heat transfer line (152) is connected to the heat absorption chamber (167).

[0049] Referring again to FIG. 1, the desorption reactor (131) absorbs heat and desorbs the second refrigerant from the adsorbent. The desorption reactor (131) can absorb heat transferred from the main heat transfer line (154) and the external heat transfer line (152) and desorb the second refrigerant. The desorption reactor (131) may be equipped with a recovery line (153) that discharges water or air to an external heat source (160).

[0050] Here, the second refrigerant may be ammonia or water. The adsorbent may include various materials such as silica gel, zeolite, or porous zirconium composite.

[0051] The condenser (132) condenses the second refrigerant desorbed from the desorption reactor (131) and releases the condensation heat to the outside air.

[0052] The evaporator (133) absorbs external heat and cools while evaporating the second refrigerant condensed in the condenser (132). A main cooling line (157) is installed in the evaporator (133) to cool the third refrigerant and transfer the cooled third refrigerant to the second electronic device module (126). The main cooling line (157) is connected to the second electronic device module (126) and the evaporator (133), supplies the third refrigerant, such as cooling water or cooling air heated in the second electronic device module (126), to the evaporator (133), and recovers the third refrigerant cooled in the evaporator (133). Here, the second electronic device module (126) may be composed of the remaining servers (123) of the data center (120). Therefore, the third refrigerant may be different from the first refrigerant. Specifically, the first electronic device module (125) and the second electronic device module (126) are included in one data center (120), but the first electronic device module (125) is cooled by being immersed in a first refrigerant, and the second electronic device module (126) is cooled by a third refrigerant, so that the first refrigerant and the third refrigerant are physically distinct.

[0053] The adsorption reactor (134) adsorbs a second refrigerant onto the adsorbent, and heat is generated during the adsorption. The adsorption reactor (134) can discharge the heat generated during the adsorption into the outside air.

[0054] The adsorption reactor (134) and the desorption reactor (131) can alternately switch between adsorption and desorption modes by controlling the pipes and valves.

[0055] As described above, according to the present embodiment, the heat generated from some servers (123) of the data center (120) can be used to desorb the second refrigerant and cool the remaining servers (123) of the data center (120). In addition, the heat pump can be stably operated by supplying additional heat to the desorption reactor (131) using a renewable energy heat source such as a solar panel.

[0056] Below, a cooling method using an adsorption heat pump according to the first embodiment of the present invention is described.

[0057] Figure 4 is a flowchart for explaining a cooling method using an adsorption heat pump according to the first embodiment of the present invention.

[0058] Referring to FIGS. 1 to 4, a cooling method using an adsorption heat pump may include an immersion cooling step (S110), a heat collection heat exchange step (S102), a desorption step (S103), a condensation step (S104), an evaporative cooling step (S105), and an adsorption step (S106).

[0059] The immersion cooling step (S110) cools the first electronic device module (125) by supplying a first refrigerant to the immersion cooling chamber (121). The immersion cooling step (S110) cools the first electronic device module (125) by immersion cooling using the first refrigerant, and at this time, the first refrigerant is heated by the first electronic device module (125). The first electronic device module (125) may be composed of some servers (123) of a data center (120).

[0060] The heat collection heat exchange step (S102) is connected to the liquid immersion cooling chamber (121) to collect heat while cooling the first refrigerant and to collect heat by absorbing heat from an external heat source.

[0061] The heat collection heat exchange step (S102) cools the first refrigerant heated in the liquid immersion cooling chamber (121) using the first heat exchanger (135), receives heat, and can cool the first refrigerant through heat exchange using air, water, etc.

[0062] In addition, the heat collection heat exchange step (S102) can heat the material stored in the heat absorption chamber (162) using the heat generated from the solar panel (161). The heat collection heat exchange step (S102) can integrate the heat transfer material heated in the first heat exchanger (135) and the heat transfer material heated in the external heat source (160) using a three-way valve (156) and transfer them to the desorption reactor (131).

[0063] In addition, the heat collection heat exchange step (S102) can collect light reflected from a solar panel (161) using a light collecting plate (168), heat the light collecting plate (168), and heat the heat transfer material contained in the heat absorption chamber (162) using the heat generated from the light collecting plate (168).

[0064] The desorption step (S103) desorbs the second refrigerant from the adsorbent in a desorption reactor (131). The desorption step (S103) absorbs heat transferred from the first heat exchanger (135) and an external heat source and desorbs the second refrigerant from the adsorbent.

[0065] Meanwhile, the condensation step (S104) condenses the second refrigerant desorbed in the desorption reactor (131) and releases heat to the outside air.

[0066] The evaporative cooling step (S105) absorbs external heat and cools the condensed second refrigerant by evaporating it. The evaporative cooling step (S105) cools the second electronic device module (126) by utilizing the cold heat generated during evaporation.

[0067] The evaporative cooling step cools the third refrigerant by evaporating the second refrigerant in the evaporator (133) and transfers the cooled third refrigerant to the second electronic device module (126) to cool the second electronic device module (126). Here, the second electronic device module (126) may be composed of the remaining servers (123) of the data center (120).

[0068] The adsorption step (S106) adsorbs the second refrigerant onto the adsorbent, and releases the heat generated during adsorption to the outside air.

[0069] Below, an adsorption heat pump cooling system according to a second embodiment of the present invention is described.

[0070] FIG. 5 is a schematic diagram illustrating an adsorption heat pump cooling system according to a second embodiment of the present invention.

[0071] Referring to FIG. 5, the adsorption heat pump cooling system (102) according to the second embodiment has the same structure as the adsorption heat pump cooling system according to the first embodiment described above, except for the external heat source (170), so a duplicate description of the same configuration is omitted.

[0072] The external heat source (170) may include a fuel cell (171) and an exhaust gas heat exchanger (172) that absorbs heat from the fuel cell exhaust gas. The fuel cell (171) may be a high-temperature fuel cell such as a solid oxide fuel cell or a molten carbonate fuel cell. The exhaust gas heat exchanger (172) receives the anode exhaust gas and cathode exhaust gas discharged from the fuel cell and heats air or water. An external heat transfer line (152) and a recovery line (153) may be connected to the exhaust gas heat exchanger (172).

[0073] Accordingly, the heat transfer material heated in the exhaust gas heat exchanger (172) can move to the desorption reactor (131) and transfer heat to the desorption reactor (131).

[0074] Below, a cooling method using an adsorption heat pump according to a second embodiment of the present invention is described.

[0075] Figure 6 is a flowchart for explaining a cooling method using an adsorption heat pump according to a second embodiment of the present invention.

[0076] Referring to FIG. 6, the cooling method using an adsorption heat pump according to the second embodiment may include an immersion cooling step (S210), a heat collection heat exchange step (S202), a desorption step (S203), a condensation step (S204), an evaporation cooling step (S205), and an adsorption step (S206).

[0077] The cooling method using an adsorption heat pump according to the second embodiment is performed through the same process as the cooling method using an adsorption heat pump according to the first embodiment described above, except for the heat collection heat exchange step (S202), so a duplicate description of the same configuration is omitted.

[0078] The heat collection heat exchange step (S202) can heat a heat transfer material in an exhaust gas heat exchanger (172) using exhaust gas discharged from a fuel cell. In addition, the heat collection heat exchange step (S202) can mix the heat transfer material heated in the exhaust gas heat exchanger (172) and the heat transfer material heated in the first heat exchanger (135) using a three-way valve (156) and supply the mixture to the desorption reactor (131).

[0079] Below, an adsorption heat pump cooling system according to a third embodiment of the present invention is described.

[0080] Figure 7 is a schematic diagram illustrating an adsorption heat pump cooling system according to a third embodiment of the present invention.

[0081] Referring to FIG. 7, the adsorption heat pump cooling system (103) according to the third embodiment has the same structure as the adsorption heat pump cooling system according to the first embodiment described above, except for the second heat exchanger (137), so a duplicate description of the same configuration is omitted.

[0082] A main heat transfer line (154) is connected to the second heat exchanger (137), and a heat transfer material heated in the first heat exchanger (135) is supplied through the main heat transfer line (154). In addition, an external heat transfer line (152) and a recovery line (153) are connected to the second heat exchanger (137), and a heat transfer material heated in an external heat source (160) is supplied through the external heat transfer line (152).

[0083] The second heat exchanger (137) heats the heat transfer material heated in the first heat exchanger (135) using a heat transfer material heated from an external heat source. Here, the heat transfer material heated by the external heat source (160) may be formed of a liquid such as cooling water, and the heat transfer material heated in the first heat exchanger (135) may be formed of a gas such as air.

[0084] The second heat exchanger (137) has a double-tube structure, and in the inner tube, a heat transfer material heated by an external heat source moves in the first direction, and in the outer tube, a heat transfer material heated in the first heat exchanger can move in the direction opposite to the first direction.

[0085] As described above, according to the present embodiment, when the phases of the material heated by the external heat source (160) and the material heated in the first heat exchanger (135) are different from each other, the heat transfer material heated in the first heat exchanger (135) can be heated using the heat transfer material heated in the external heat source (160) and transferred to the desorption reactor (131).

[0086] Below, a cooling method using an adsorption heat pump according to a third embodiment of the present invention is described.

[0087] Figure 8 is a flowchart for explaining a cooling method using an adsorption heat pump according to a third embodiment of the present invention.

[0088] Referring to FIG. 8, the cooling method using an adsorption heat pump according to the third embodiment may include an immersion cooling step (S310), a heat collection heat exchange step (S302), a desorption step (S303), a condensation step (S304), an evaporation cooling step (S305), and an adsorption step (S306).

[0089] The cooling method using an adsorption heat pump according to the second embodiment is performed through the same process as the cooling method using an adsorption heat pump according to the first embodiment described above, except for the heat collection heat exchange step (S302), so a duplicate description of the same configuration is omitted.

[0090] The heat collection heat exchange step (S302) cools the first refrigerant heated in the liquid immersion cooling chamber (121) using the first heat exchanger (135), receives heat, and can cool the first refrigerant through heat exchange using a heat transfer material such as air or water. In addition, the heat collection heat exchange step (S302) can heat the heat transfer material using heat generated from an external heat source (160).

[0091] In addition, the heat collection heat exchange step (S302) heat-exchanges a heat transfer material heated by an external heat source (160) and a heat transfer material heated by the first heat exchanger (135) using a second heat exchanger (137), and heats the heat transfer material heated by the first heat exchanger (135). Here, the heat transfer material heated by the external heat source (160) may be formed of a liquid such as cooling water, and the heat transfer material heated by the first heat exchanger (135) may be formed of a gas such as air.

[0092] The heat collection heat exchange step (S302) uses a second heat exchanger (137) having a double-tube structure, and the heat transfer material heated by an external heat source can be moved in the first direction through the inner tube, and the heat transfer material heated in the first heat exchanger can be moved in the opposite direction to the first direction through the outer tube.

[0093] Above, one embodiment of the present invention has been described, but a person having ordinary skill in the art will be able to modify and change the present invention in various ways by adding, changing, deleting or adding components, etc., within the scope that does not depart from the spirit of the present invention described in the claims, and this will also be considered to be included within the scope of the rights of the present invention.

Claims

1. An immersion cooling chamber for immersing and cooling a first electronic device module using a first refrigerant; A first heat exchanger connected to the above immersion cooling chamber and cooling the first refrigerant; A desorption reactor connected to the first heat exchanger and receiving heat from the first heat exchanger to desorb the second refrigerant; A condenser for condensing the second refrigerant delivered to the desorption reactor; An evaporator for evaporating the condensed second refrigerant; An adsorption reactor for adsorbing the evaporated second refrigerant onto an adsorbent; and A main cooling line connected to the above evaporator, cooling a third refrigerant different from the first refrigerant, and transmitting the cooled third refrigerant to a second electronic device module; An adsorption heat pump cooling system characterized by including a .

2. In paragraph 1, An adsorption heat pump cooling system further comprising an external heat source that absorbs heat and an external heat transfer line that absorbs heat from the external heat source and transfers heat to the desorption reactor.

3. In paragraph 2, An adsorption heat pump cooling system, characterized in that the external heat source comprises a solar thermal collector.

4. In paragraph 2, An adsorption heat pump cooling system characterized in that the external heat source includes a fuel cell and an exhaust gas heat exchanger that receives exhaust gas discharged from the fuel cell and absorbs the heat of the exhaust gas.

5. In paragraph 1, An adsorption heat pump cooling system, characterized in that the first electronic device module comprises some servers of a data center, and the second electronic device module comprises the remaining servers of the data center.

6. In paragraph 1, An adsorption heat pump cooling system further comprising a three-way valve for integrating the fluid heated in the first heat exchanger and the fluid heated from the external heat source and supplying them to the desorption reactor.

7. In paragraph 1, An adsorption heat pump cooling system characterized by further comprising a second heat exchanger for heating the fluid heated in the first heat exchanger using the fluid heated from the external heat source.

8. In paragraph 1, An adsorption heat pump cooling system characterized in that the external heat source includes a solar cell panel and a heat absorption chamber disposed below the solar cell panel to absorb heat generated from the solar cell panel, and the external heat transfer line is connected to the heat absorption chamber.

9. In paragraph 1, An adsorption heat pump cooling system characterized in that the external heat source includes a plurality of solar cell panels, a light collecting plate that collects light reflected from the solar cell panels, and a heat absorption chamber that is connected to the light collecting plate and absorbs heat generated from the light collecting plate, and the external heat transfer line is connected to the heat absorption chamber.

10. An immersion cooling step of immersing a first electronic device module in an immersion cooling chamber using a first refrigerant; A heat collection heat exchange step of collecting heat while cooling the first refrigerant using a first heat exchanger connected to the above-mentioned liquid immersion cooling chamber, and collecting heat by absorbing heat from an external heat source; A desorption step for transferring the heat collected in the above heat collection heat exchange step to a desorption reactor to desorb the second refrigerant; A condensation step for condensing the second refrigerant desorbed in the desorption reactor; An evaporative cooling step for cooling a second electronic device module by using the heat generated during evaporation while evaporating the condensed second refrigerant; and An adsorption step for adsorbing the evaporated second refrigerant in an adsorption reactor; A cooling method using an adsorption heat pump, characterized in that when the second refrigerant evaporates, a third refrigerant different from the first refrigerant is cooled, and the third refrigerant cools the second electronic device module.

11. In Article 10, A cooling method using an adsorption heat pump, characterized in that the external heat source is comprised of a solar thermal collector.

12. In paragraph 10, The above external heat source includes a fuel cell and an exhaust gas heat exchanger that receives exhaust gas discharged from the fuel cell and absorbs the heat of the exhaust gas. A cooling method using an adsorption heat pump, characterized in that the above heat collection heat exchange step mixes a heat transfer material heated in an exhaust gas heat exchanger and a heat transfer material heated in the first heat exchanger using a three-way valve and supplies the mixture to the desorption reactor.

13. In paragraph 10, A cooling method using an adsorption heat pump, characterized in that the first electronic device module is composed of some servers of a data center, and the second electronic device module is composed of the remaining servers of the data center.

14. In paragraph 13, A cooling method using an adsorption heat pump, characterized in that the above heat collection heat exchange step heats the fluid heated in the first heat exchanger using the fluid heated from the external heat source.

15. In paragraph 10, The above external heat source includes a solar cell panel and a heat absorption chamber disposed below the solar cell panel to absorb heat generated from the solar cell panel, A cooling method using an adsorption heat pump, characterized in that the above heat collection heat exchange step heats a material stored in the heat absorption chamber using the heat generated from the solar cell panel.

16. In paragraph 10, The above external heat source includes a plurality of solar cell panels, a light collector that collects light reflected from the solar cell panels, and a heat absorption chamber that is connected to the light collector and absorbs heat generated from the light collector. A cooling method using an adsorption heat pump, characterized in that the above heat collection heat exchange step collects light reflected from the solar cell panel using a light collector to heat the light collector, and heats a material stored in the heat absorption chamber using the heat generated from the light collector.

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