System and method for a wet chemical treatment of a substrate surface
The system uses a radiation source and wave-guide module to guide electromagnetic radiation for in-situ detection, addressing interference issues in wet chemical processes and enabling precise endpoint detection.
Patent Information
- Application Number
- PCT/EP2025/057183
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-20
- Filing Date
- 2025-03-17
- Publication Date
- 2025-09-25
AI Technical Summary
Existing end-point detection systems for wet chemical processes, such as etching, are inadequate due to interference effects from varying chemical concentrations and temperatures, requiring complex and difficult control of wet chemical layer thickness, and are not compatible with harsh chemical environments.
A system and method utilizing a radiation source, distribution body with jet holes, and a wave-guide module to guide electromagnetic radiation and its reflection for in-situ detection by a sensor element, eliminating the need for horizontal chemical spin-systems and complex thickness control.
Enables accurate and real-time control of wet chemical processes, allowing precise endpoint detection without interference effects, enhancing process control and efficiency.