System and method for a wet chemical treatment of a substrate surface

The system uses a radiation source and wave-guide module to guide electromagnetic radiation for in-situ detection, addressing interference issues in wet chemical processes and enabling precise endpoint detection.

WO2025195955A1 Publication Date: 2025-09-25SEMSYSCO GMBH
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Patent Information

Application Number
PCT/EP2025/057183
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-20
Filing Date
2025-03-17
Publication Date
2025-09-25

AI Technical Summary

Technical Problem

Existing end-point detection systems for wet chemical processes, such as etching, are inadequate due to interference effects from varying chemical concentrations and temperatures, requiring complex and difficult control of wet chemical layer thickness, and are not compatible with harsh chemical environments.

Method used

A system and method utilizing a radiation source, distribution body with jet holes, and a wave-guide module to guide electromagnetic radiation and its reflection for in-situ detection by a sensor element, eliminating the need for horizontal chemical spin-systems and complex thickness control.

Benefits of technology

Enables accurate and real-time control of wet chemical processes, allowing precise endpoint detection without interference effects, enhancing process control and efficiency.

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Abstract

The disclosure relates to a system for a wet chemical treatment of a substrate surface and a method for a wet chemical treatment of a substrate surface. The system for a wet chemical treatment of a substrate surface comprises a radiation source configured to provide a first electromagnetic radiation. The system further comprises a distribution body comprising at least jet holes, wherein the jet holes are configured to distribute a wet chemical relative to the substrate surface. The system further comprises at least a wave-guide module, wherein the wave-guide module is configured to guide the first radiation from the radiation source through the distribution body. The system further comprises a sensor element configured to detect a second radiation, which is the reflection of the first radiation at the substrate surface. The wave-guide module is further configured to guide also the second radiation through the distribution body and to the sensor.
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