Laminate
The laminate structure with varying conductive path diameters addresses handling challenges of anisotropic conductive bonding members by exploiting stress differences for easier transport and installation in electronic components.
WO2025203783A1 Publication Date: 2025-10-02FUJIFILM CORP
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Patent Information
- Application Number
- PCT/JP2024/036597
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-26
- Filing Date
- 2024-10-15
- Publication Date
- 2025-10-02
AI Technical Summary
Technical Problem
Conventional anisotropic conductive bonding members are difficult to handle and transport without damage due to their size adjustment requirements for semiconductor elements, leading to handling challenges.
Method used
A laminate structure comprising a support, adhesive layer, and anisotropically conductive member with varying conductive path diameters on opposing surfaces, allowing for easier handling and transport by exploiting stress differences and warping properties.
Benefits of technology
The laminate structure facilitates easy handling and transport of anisotropic conductive members by minimizing damage, enhancing their usability in electronic component connections.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention provides a laminate having an anisotropic conductive member with excellent handling when diced into individual pieces. This laminate comprises a support, an adhesive layer, and an anisotropic conductive material laminated in that order. The anisotropic conductive member has an insulating base material having electrical insulation properties and a plurality of conducting paths that penetrate through the insulating base material in the thickness direction and are electrically insulated from each other. The plurality of conducting paths are each formed from a conductive material and have different diameters on one side of the insulating base material in the thickness direction and on the other side in the thickness direction such that 0.1 ≤ R ≤ 0.98, where R is the value of small diameter / large diameter, i.e., the ratio of the small diameter to the large diameter out of the diameters of the conducting paths on the one side and the other side.
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