Camera module and electronic device comprising same

Abstract

According to one embodiment of the present disclosure, a camera module and an electronic device comprising same can be provided. The camera module may comprise: a camera housing including a first sidewall, a second sidewall facing a direction different from that of the first sidewall, and a third sidewall facing a direction different from that of the first sidewall and the second sidewall; a lens assembly including at least one lens and a lens barrel; a first PCB having an image sensor disposed thereon; and a driving member for moving the first PCB in a direction intersecting an optical axis defined as a light movement path between the at least one lens and the image sensor. The driving member can include: a first coil, a first magnet and a second coil sequentially arranged in the direction from the outside to the inside of the camera module at a position corresponding to the first sidewall; and a third coil, a second magnet and a fourth coil sequentially arranged in the direction from the outside to the inside of the camera module at a position corresponding to the second sidewall. Other various embodiments can be applied.

Description

Camera module and electronic device including same

[0001] Various embodiments of the present disclosure relate to a camera module supporting an optical image stabilization (OIS) function and an electronic device including the same.

[0002] As digital camera manufacturing technology has advanced, electronic devices equipped with compact, lightweight camera modules have become commercially available. With camera modules integrated into electronic devices that users typically carry with them (e.g., mobile terminals), users can conveniently utilize a variety of functions, including not only taking photos and videos, but also video calling and augmented reality. Typically, a camera module may include a lens assembly and an image sensor.

[0003] The camera module can perform an image stabilization function for image correction in response to disturbances. Here, disturbances may be, for example, artifacts such as blurring of images acquired through the camera module due to slight hand tremors when a user takes a photo or records a video. The image stabilization function, for example, the shake (or hand shake) correction function, can prevent or mitigate shaking of captured images or videos by moving the lens assembly or image sensor included in the camera module on a plane perpendicular to the optical axis to compensate for limited movement of the electronic device due to a fixed device or the user's grip. To this end, the camera module can include at least one coil and a magnet. The coil to which a current is applied can generate an electromagnetic force through electromagnetic interaction with the magnet, and the camera module can perform the shake correction function using the generated electromagnetic force. Various methods can be applied to correct shake using electromagnetic force, such as lens shift, which moves the lens assembly, image sensor shift, which moves the image sensor, prism shift, which moves the prism, and module tilt, which tilts the camera module.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] A camera module according to one embodiment of the present disclosure may include a camera housing including a first sidewall, a second sidewall facing in a different direction from the first sidewall, and a third sidewall facing in a different direction from the first and second sidewalls; a lens assembly including at least one lens and a lens barrel; a first PCB having an image sensor disposed thereon; and a driving member configured to move the first PCB in a direction intersecting an optical axis defined as an optical travel path between the at least one lens and the image sensor. The driving member may include a first coil, a first magnet, and a second coil sequentially arranged in a direction from the outside to the inside of the camera module at a position corresponding to the first sidewall, and a third coil, a second magnet, and a fourth coil sequentially arranged in a direction from the outside to the inside of the camera module at a position corresponding to the second sidewall.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing; a camera module including a controller; at least one processor; and a memory storing instructions that, when executed by the controller or the at least one processor, cause the following operations of the camera module. The camera module may include a camera housing including a first sidewall, a second sidewall facing in a different direction from the first sidewall, and a third sidewall facing in a different direction from the first sidewall and the second sidewall; a lens assembly including at least one lens and a lens barrel; a first PCB having an image sensor disposed thereon; And the driving member may include a first coil, a first magnet, and a second coil sequentially arranged in a direction from the outside to the inside of the camera module at a position corresponding to the first side wall, and a third coil, a second magnet, and a fourth coil sequentially arranged in a direction from the outside to the inside of the camera module at a position corresponding to the second side wall, configured to move the first PCB in a direction intersecting an optical axis defined by an optical movement path between the at least one lens and the image sensor, and ...

[0007] An electronic device according to one embodiment of the present disclosure may include a housing; a camera module including a controller; at least one processor; and a memory storing instructions that, when executed by the controller or the at least one processor, cause the following operations of the camera module. The camera module may include a camera housing; a first coil, a first magnet, and a second coil sequentially arranged in a direction from the outside to the inside of the camera module corresponding to a first position of the camera housing; and a third coil, a second magnet, and a fourth coil sequentially arranged in a direction from the outside to the inside of the camera module corresponding to a second position of the camera housing. The following operations may include a first OIS operation performed by an interaction between the first coil and the first magnet, and / or performed by an interaction between the first magnet and the second coil; And may include a second OIS operation performed by the interaction between the third coil and the second magnet, and / or performed by the interaction between the second magnet and the fourth coil. Depending on the frequency applied to the camera module, the first OIS operation or the second OIS operation may be performed alone, or the first OIS operation and the second OIS operation may be performed together.

[0008] The above-described aspects or other aspects, configurations and / or advantages of various embodiments of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0010] FIG. 2 is a front perspective view of an electronic device according to one embodiment.

[0011] FIG. 3 is a rear perspective view of an electronic device according to one embodiment.

[0012] FIG. 4 is a perspective view showing the arrangement relationship of a lens assembly and a driving member included in a camera module according to one embodiment.

[0013] FIG. 5 is a perspective view of a camera module according to one embodiment.

[0014] FIG. 6 is an exploded perspective view of a camera module according to one embodiment.

[0015] FIG. 7 is a drawing showing an assembly of some components included in a camera module, viewed from above, according to one embodiment.

[0016] FIG. 8 is a drawing showing a camera module viewed from below, according to one embodiment.

[0017] FIG. 9 is a perspective view of a second carrier and a fourth carrier stacked in a carrier assembly according to one embodiment.

[0018] FIG. 10 is a front view of a carrier assembly in which a second carrier and a fourth carrier are stacked according to one embodiment.

[0019] FIG. 11 is a front view of a second carrier of a carrier assembly according to one embodiment.

[0020] FIG. 12 is a cross-sectional view of a camera module according to one embodiment.

[0021] FIG. 13 is a drawing showing the inside of a camera module according to one embodiment.

[0022] FIG. 14A is a drawing showing a camera module viewed from above, according to one embodiment.

[0023] FIG. 14b is a front view of a second carrier of a carrier assembly according to one embodiment.

[0024] FIG. 15A is a cross-sectional view of a portion of a camera module according to one embodiment.

[0025] FIG. 15b is a cross-sectional view of a portion of a camera module according to one embodiment.

[0026] FIG. 16 is an exploded perspective view of a camera module according to one embodiment.

[0027] FIG. 17 is a drawing showing a camera module viewed from below, according to one embodiment.

[0028] FIG. 18 is a drawing showing the arrangement relationship of the second driving member and the third driving member included in the camera module and the direction of the shake correction operation (inner / outer two-axis driving) according to one embodiment.

[0029] FIG. 19A is a drawing illustrating the arrangement relationship of the second driving member and the third driving member included in the camera module and the direction of the shake correction operation (outer 3-axis / inner 2-axis driving) according to one embodiment.

[0030] FIG. 19b is a drawing illustrating the arrangement relationship of the second driving member and the third driving member included in the camera module and the direction of the shake correction operation (outer 3-axis / inner 2-axis driving) according to one embodiment.

[0031] FIG. 19c is a drawing illustrating the arrangement relationship of the second driving member and the third driving member included in the camera module and the direction of the shake correction operation (outer 2-axis / inner 3-axis driving) according to one embodiment.

[0032] FIG. 19d is a drawing showing the arrangement relationship of the second driving member and the third driving member included in the camera module and the direction of the shake correction operation (outer 2-axis / inner 3-axis driving) according to one embodiment.

[0033] FIG. 20A is a drawing illustrating the arrangement relationship of the second driving member and the third driving member included in the camera module and the direction of the shake correction operation (inner / outer three-axis driving) according to one embodiment.

[0034] FIG. 20b is a drawing showing the arrangement relationship of the second driving member and the third driving member included in the camera module and the direction of the shake correction operation (inner / outer three-axis driving) according to one embodiment.

[0035] FIG. 20c is a drawing illustrating the arrangement relationship of the second driving member and the third driving member included in the camera module and the direction of the shake correction operation (inner / outer three-axis driving) according to one embodiment.

[0036] FIG. 21 is a block diagram showing a signal transmission flow of elements for controlling OIS operation of a camera module according to one embodiment.

[0037] FIG. 22 is a flowchart illustrating various OIS operations according to frequency, according to one embodiment.

[0038] FIG. 23 is a flowchart illustrating various OIS operations according to accessory connection, according to one embodiment.

[0039] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0040] Various embodiments of the present disclosure relate to a camera module supporting an optical image stabilization (OIS) function and an electronic device including the same. As the thickness of the electronic device in which the camera module is mounted decreases, the height (e.g., shoulder height) of the actuator included in the camera module must be reduced. Furthermore, to secure a large correction angle, which is one of the performance indicators of OIS, a longer movement distance of the OIS carrier may be advantageous. The present disclosure may disclose various embodiments that secure a long movement distance while reducing the height (e.g., shoulder height) of the camera module.

[0041] A driving source including a coil and a magnet (e.g., a voice coil motor (VCM) hereinafter referred to as a "VCM") is mainly used as a driving source for a camera module. The VCM can control the position of a lens or image sensor by using the electromagnetic force generated between the coil and the magnet by controlling the current of the coil. Types of VCMs may include a solenoid type that generates a driving force by controlling the gap between the coil and the magnet by generating a force in a direction parallel to the direction in which the coil and the magnet face each other, and a Lorenz type that generates a driving force while maintaining the gap between the coil and the magnet by generating a force in a direction perpendicular to the direction in which the coil and the magnet face each other.

[0042] The camera module can implement the OIS function and the AF (auto focusing) function through the VCM, respectively. According to various embodiments, the AF driving member for driving the AF function and the OIS driving member for driving the OIS function can be implemented as one or a combination of a Lorenz type and a solenoid type. For example, the AF driving member and the OIS driving member can be implemented as a Lorenz type. In another example, the AF driving member and the OIS driving member can be implemented as a solenoid type. In another example, the AF driving member can be implemented as a Lorenz type, and the OIS driving member can be implemented as a solenoid type. In another example, the AF driving member can be implemented as a solenoid type, and the OIS driving member can be implemented as a Lorenz type.

[0043] When the VCM is implemented as a solenoid type, since the distance between the coil and the magnet changes when current is applied to the coil, the electromagnetic force of the VCM can be inversely proportional to the square of the distance between the coil and the magnet. When the VCM is implemented as a Lorentz type, the distance between the coil and the magnet remains constant even when current is applied to the coil, so the electromagnetic force of the VCM can be maintained in the area where the coil and the magnet face each other.

[0044] The present disclosure discloses various embodiments for securing a high movement distance while lowering the shoulder height in a camera module including a solenoid type driving member.

[0045] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary skill in the technical field to which the present disclosure pertains from the description below.

[0046] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0047] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)). The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of an electronic device (101) connected to the processor (120) and perform various data processing or operations.According to one embodiment, as at least a part of data processing or calculation, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in the volatile memory (132), process the commands or data stored in the volatile memory (132), and store the resulting data in the non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0048] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0049] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0050] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0051] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0052] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0053] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0054] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0055] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0056] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0057] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0058] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0059] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0060] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0061] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0062] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0063] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0064] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0065] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0066] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0067] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0068] FIG. 2 is a front perspective view of an electronic device according to one embodiment. FIG. 3 is a rear perspective view of the electronic device according to one embodiment.

[0069] In the detailed description below, the length direction of the electronic device (101) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the length direction, the width direction, and / or the height direction (or thickness direction) may indicate the length direction, the width direction, and / or the height direction (or thickness direction) of the electronic device. In some embodiments, with respect to the direction in which a component is oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawing. For example, referring to FIG. 2, the front of the electronic device (101) or the housing (201) may be defined as the 'surface facing the -Z-axis direction', and the rear side may be defined as the 'surface facing the +Z-axis direction'. According to one embodiment, the arrangement relationship in the height direction of a component or another component, i.e., the reference of up / down, may follow the +Z-axis direction / -Z-axis direction. That is, when a component is said to be arranged on top of another component, it may mean that the component is arranged in the +Z-axis direction with respect to the other component, and when a component is said to be arranged under another component, it may mean that the component is arranged in the -Z-axis direction with respect to the other component. Meanwhile, it should be noted that even if a component is arranged on top or below another component, it does not mean that the entire component is located on top or below all of the components of the other component. For example, a part of a component may be arranged on top of a part of another component, but another part of the component may be arranged below another part of the other component. In one embodiment, when a component is said to be 'viewed from above', it may mean that the component is viewed in the -Z-axis direction from a position spaced apart from the component by a predetermined height.

[0070] In one embodiment, the fact that a component is oriented in a "certain direction" may be understood to include not only that the component is oriented in a "direction identical to the certain direction" but also that the component is oriented in a "direction parallel to the certain direction." It should be noted that when a component is said to overlap (or be stacked) with another component in the following description, the description of the arrangement relationship in the height direction described above may be applied.

[0071] In describing a direction, if 'yin / yang (- / +)' is not indicated, it can be interpreted to include both the + direction and the - direction unless otherwise defined. For example, 'Z-axis direction' can be interpreted to include both the +Z direction and the -Z direction. Similarly, 'X-axis direction' can be interpreted to include both the +X direction and the -X direction, and 'Y-axis direction' can be interpreted to include both the +Y direction and the -Y direction. However, in the XYZ spatial coordinate system illustrated in the drawing, if 'yin / yang (- / +)' is not indicated for an axis, the axis can be interpreted to point in the + direction unless otherwise specified. In describing a direction, pointing toward any one of the three axes of the orthogonal coordinate system can include pointing in a direction parallel to the axis.

[0072] Hereinafter, in the description of the electronic device (101) (or camera module (400; 500)) described below, the term 'first direction' may refer to the X-axis direction or a direction parallel to the X-axis. The above description is based on the rectangular coordinate system described in the drawing for the sake of brevity of description, and it is to be noted that the description of such directions or components does not limit the various embodiments of the present disclosure.

[0073] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a housing (201) including a front surface (201a), a rear surface (201b), and a side surface (201c) surrounding a space between the front surface (201a) and the rear surface (201b). In one embodiment (not shown), the housing (201) may refer to a structure forming a portion of the front surface (201a) of FIG. 2 and the rear surface (201b) and the side surface (201c) of FIG. 3. According to one embodiment, at least a portion of the front surface (201a) may be formed by a substantially transparent front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate). The rear surface (201b) may be formed by a rear plate (211). The rear plate (211) may be formed of, for example, glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface (201c) may be formed of a side bezel structure (or “side member”) (212) that is coupled to the front plate (202) and the rear plate (211) and includes metal and / or polymer. In some embodiments, the front plate (202) and the side bezel structure (212) may be formed as one body and include the same material. Alternatively, the rear plate (211) and the side bezel structure (212) may be formed as one body and include the same material (e.g., a metal material such as glass or aluminum, or a ceramic). In one embodiment, the front surface (201a) and / or the front plate (202) may be interpreted as a part of the display (210). According to one embodiment, the housing (201) may include a front plate (202) and a back plate (211).

[0074] According to one embodiment, the electronic device (101) may include at least one of a display (210), an audio module (203, 204, 205) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (206, 207) (e.g., the camera module (180) of FIG. 1), a key input device (216, 217) (e.g., the input module (150) of FIG. 1), and a connector hole (213, 214) (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the connector hole (214)) or may additionally include other components.

[0075] In one embodiment, the display (210) may be visually exposed through, for example, a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (210) may be exposed through the front plate (202) forming the front surface (201a). In one embodiment, the display (210) may be a flexible display or a foldable display.

[0076] In one embodiment, the surface (or front plate (202)) of the housing (201) may include a screen display area formed by visually exposing the display (210). As an example, the screen display area may include the front surface (201a).

[0077] In one embodiment (not shown), the electronic device (101) may include a recess or opening formed in a portion of a screen display area (e.g., front surface (201a)) of the display (210), and may include at least one of an audio module (205), a sensor module (not shown), a light-emitting element (not shown), and a camera module (206) aligned with the recess or opening. In one embodiment (not shown), the electronic device (101) may include at least one of an audio module (205), a sensor module (not shown), a camera module (206), a fingerprint sensor (not shown), and a light-emitting element (not shown) on a back surface of the screen display area of ​​the display (210).

[0078] In one embodiment (not shown), the display (210) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type pen input device (215) (e.g., a stylus pen).

[0079] In some embodiments, at least a portion of the key input device (216, 217) may be disposed in the side bezel structure (212).

[0080] According to one embodiment, the audio module (203, 204, 205) may include, for example, a microphone hole (203) and a speaker hole (204, 205). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in some embodiments, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (204, 205) may include an external speaker hole (204) and a receiver hole (205) for calls. In some embodiments, the speaker hole (204, 205) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (204, 205) (e.g., a piezo speaker). The audio modules (203, 204, 205) are not limited to the above structure, and may be designed in various ways, such as by mounting only some audio modules or adding new audio modules, depending on the structure of the electronic device (101).

[0081] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to, for example, an internal operating state of the electronic device (101) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front (201a) of the housing (201), and / or a third sensor module (not shown) (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on the rear (201b) of the housing (201). In some embodiments (not shown), the fingerprint sensor may be disposed on the front (201a) (e.g., the display (210)) as well as the rear (201b) of the housing (201). The electronic device (101) may further include at least one sensor module (not shown), for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown). The sensor module (not shown) is not limited to the above structure, and may be designed in various ways, such as by mounting only some sensor modules or adding new sensor modules, depending on the structure of the electronic device (101).

[0082] According to one embodiment, the camera modules (206, 207) may include, for example, a front camera module (206) disposed on the front (201a) of the electronic device (101), a rear camera module (207) disposed on the rear (201b), a flash (208), and / or an IR sensor (209). The camera modules (206, 207) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (208) may include, for example, a light-emitting diode or a xenon lamp. The camera modules (206, 207) are not limited to the above structure, and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0083] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., a dual camera or a triple camera) each having different properties (e.g., an angle of view) or functions. For example, the rear camera module (207) may include a plurality of camera modules including lenses having different angles of view. For example, the plurality of camera modules may include at least one of a wide-angle camera, an ultra-wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). Further, for example, the plurality of camera modules may include an optical zoom camera with adjustable magnification. According to one embodiment, the electronic device (101) may be configured to operate a designated camera module or another camera module among the plurality of camera modules based on a user's selection or under a pre-designated environment. According to one embodiment, the IR camera may be operated as at least a part of a sensor module. For example, the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting a distance to a subject.

[0084] According to one embodiment, the camera module (206, 207) of the present disclosure may include a vertical camera module and / or a folded camera module. The vertical camera module may be a camera module in which the path of light incident on the lens assembly to reach the image sensor is formed in a straight line without being folded. In contrast, the folded camera module may be a camera module in which the path of light incident on the lens assembly to reach the image sensor is folded at least twice. The folded camera module may typically include a reflective and refractive member (e.g., the reflective and refractive member of FIG. 16) that allows light to be reflected and refracted at least once. The reflective and refractive member may include, for example, a prism or a mirror. In terms of distinguishing between a direct-type and a curved camera, whether the path through which light reaches the image sensor is bent may be determined not based on whether the light is bent by each lens included in the lens assembly, but based on whether the light is bent by the reflective and refractive member (e.g., the reflective and refractive member of FIG. 16).

[0085] According to one embodiment, the rear camera module (207) may include a plurality of camera modules (e.g., a dual camera module or a triple camera module), and some of the plurality of cameras (e.g., a wide-angle camera module) may be implemented as a direct-type camera module, and other parts (e.g., a telephoto camera module) may be implemented as a curved-type camera module. According to another embodiment, the front camera module (206) may be implemented as an under-display camera (UDC) module.

[0086] In one embodiment, the key input devices (216, 217) may be disposed on a side surface (201c) of the housing (201). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (216, 217), and the key input devices (216, 217) that are not included may be implemented in other forms, such as soft keys, on the display (210). In some embodiments, the key input devices (216, 217) may include a sensor module (not shown) disposed on the rear surface (201b) of the housing (201).

[0087] According to one embodiment, a light-emitting element (not shown) may be disposed, for example, on the front surface (201a) of the housing (201). The light-emitting element (not shown) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (not shown) may provide, for example, a light source that is linked to the operation of the front camera module (206). The light-emitting element (not shown) may include, for example, a light emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0088] According to one embodiment, the connector holes (213, 214) may include a first connector hole (213) that can accommodate, for example, a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device or a connector (e.g., an earphone jack) for transmitting and receiving audio signals with an external electronic device, and / or a second connector hole (214) that can accommodate a storage device (e.g., a subscriber identification module (SIM) card, a secure digital (SD) memory card). According to one embodiment, the first connector hole (213) and / or the second connector hole (214) may be omitted. The connector holes (213, 214) are not limited to the above structure, and may be designed in various ways, such as by mounting only some connector holes or adding new connector holes, depending on the structure of the electronic device (101).

[0089] A pen input device (215) (e.g., a stylus pen) can be inserted or removed into the interior of the housing (201) through a hole formed on a side of the housing (201) and can include a button to facilitate removal. A separate resonance circuit is built into the pen input device (215) and can be linked with an electromagnetic induction panel (e.g., a digitizer) included in the electronic device (101). The pen input device (215) can include an EMR (electro-magnetic resonance) method, an AES (active electrical stylus), and an ECR (electric coupled resonance) method.

[0090] According to one embodiment, the camera modules (206, 207) and / or the sensor modules (not shown) may be arranged so as to be in contact with the external environment through a designated area of ​​the display (210) and the front plate (202) in the internal space of the electronic device (101). For example, the designated area may be an area in the display (210) where no pixels are arranged. As another example, the designated area may be an area in the display (210) where pixels are arranged. When viewed from above the display (210), at least a portion of the designated area may overlap with the camera modules (206, 207) and / or the sensor modules. As another example, some sensor modules may be arranged so as to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device.

[0091] The electronic device (101) disclosed in FIGS. 2 and 3 has a bar-type or plate-type exterior, but is not limited thereto. For example, the illustrated electronic device may be a part of a rollable electronic device or a foldable electronic device. The term "rollable electronic device" may refer to an electronic device whose display is capable of bending deformation, such that at least a portion thereof is wound or rolled, or can be stored inside a housing (e.g., the housing (210) of FIG. 2). Depending on the user's needs, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside. The term "foldable electronic device" may refer to an electronic device that can be folded so that two different areas of the display face each other or face opposite to each other. Typically, in a portable state, a foldable electronic device has a display that is folded so that two different areas face each other or are in opposite directions, and in an actual use state, a user can unfold the display so that the two different areas form a substantially flat surface. In one embodiment, the electronic device (101) according to various embodiments of the present disclosure may be interpreted to include not only portable electronic devices such as smartphones, but also various other electronic devices such as notebook computers and home appliances.

[0092] The electronic device (101) of the present disclosure may include a camera module (300, 400, 500) described below.

[0093] FIG. 4 is a perspective view showing the arrangement relationship of a lens assembly and a driving member included in a camera module according to one embodiment.

[0094] Referring to FIG. 4, a camera module (300) including an OIS driving member having a solenoid type applied according to one embodiment is disclosed. The camera module (300) of FIG. 4 may include a lens assembly (302) including at least one lens (302a) and a lens barrel (302b) surrounding at least one lens (302a). The camera module (300) may include a carrier assembly for guiding a substrate on which the lens assembly (302) or an image sensor is disposed in a predetermined direction, but in the embodiment illustrated in FIG. 4, it is omitted for convenience of explanation.

[0095] The camera module (300) may include OIS driving members (361, 362). According to one embodiment, the OIS driving members (361, 362) may include a first OIS driving member (361) of a solenoid type that drives the carrier assembly in a first direction (e.g., X-axis direction) and a second OIS driving member (362) of a solenoid type that drives the carrier assembly in a second direction (e.g., Y-axis direction). In addition, the camera module (300) may include an AF driving member (363). According to one embodiment, the AF driving member (363) may be a Lorenz type AF driving member that drives the carrier assembly in a third direction (e.g., Z-axis direction).

[0096] For example, the first OIS driving member (361) may include a first coil (361a) and a first magnet (361b). The second OIS driving member (362) may include a second coil (362a) and a second magnet (362b). The AF driving member (363) may include a third coil (363a) and a third magnet (363b).

[0097] Referring to FIG. 4, a first magnet (361b) may be disposed between a first coil (361a) and a lens assembly (302), a second magnet (362b) may be disposed between a second coil (362a) and a lens assembly (302), and a third magnet (363b) may be disposed between a third coil (363a) and a lens assembly (302). An OIS operation in a first direction (e.g., an X-axis direction) with respect to the lens assembly (302) or the substrate may be implemented by a force acting between the first coil (361a) and the first magnet (361b), and an OIS operation in a second direction (e.g., a Y-axis direction) with respect to the lens assembly (302) or the substrate may be implemented by a force acting between the second coil (362a) and the second magnet (362b). The OIS driving member (361, 362) can operate within a range where the OIS carrier and lens assembly (302) included in the carrier assembly do not interfere with each other.

[0098] As in the embodiment illustrated in FIG. 4, the camera module (300) including the OIS driving member applied with the solenoid type may have difficulty in securing a long movement distance (hereinafter referred to as 'OIS stroke') of the OIS carrier. In other words, the camera module (300) including the OIS driving member applied with the solenoid type may have difficulty in securing a large OIS correction angle. In order to measure the movement distance of the OIS carrier according to the magnetic interaction between the coil and the magnet, the camera module (300) may include at least one sensor (S). The at least one sensor (S) may include, for example, a sensor (S1) disposed inside the coil and a sensor (S2) disposed between the coils. The arrangement of the at least one sensor (S1, S2) will be described in detail below with reference to the embodiments of FIGS. 18 to 20c.

[0099] Hereinafter, various embodiments of the present disclosure can provide a camera module having a structure capable of securing a large OIS stroke while using a solenoid type as an OIS driving member.

[0100] Hereinafter, with reference to FIGS. 5 to 15b, a carrier assembly and a driving member according to various embodiments of the present disclosure will be described, focusing on a camera module (400) having a direct-type optical system. Note that, for example, in the embodiment of FIG. 6, a detailed description of component(s) included in the camera module but not necessary for the description may be omitted.

[0101] FIG. 5 is a perspective view of a camera module according to one embodiment. FIG. 6 is an exploded perspective view of a camera module according to one embodiment. FIG. 7 is a top view of an assembly of some components included in a camera module according to one embodiment.

[0102] The camera module (400) may include a camera housing (401). The camera housing (401) may provide a space for accommodating a plurality of components inside the camera module (400). Referring to FIG. 5, the camera housing (401) may include a first side wall (4011) facing one direction, a second side wall (4012) facing a different direction from the first side wall (4011), and a third side wall (4013) facing a different direction from the second side wall (4012). The camera housing (401) may further include a fourth side wall (4014) facing a different direction from the third side wall (4013). Here, the first side wall (4011) and the second side wall (4012), the first side wall (4011) and the fourth side wall (4014) are substantially perpendicular to each other, the first side wall (4011) and the third side wall (4013) face in opposite directions, and the second side wall (4012) and the fourth side wall (4014) may also face in opposite directions. For example, as illustrated in FIG. 5, the first side wall (4011) may face in the X-axis direction, the second side wall (4012) may face in the Y-axis direction, the third side wall (4013) may face in a direction opposite to the X-axis, and the fourth side wall (4014) may face in a direction opposite to the Y-axis. FIG. 5 illustrates a rectangular camera housing (401) having side walls (4011, 4012, 4013, 4014) facing four different directions. However, this is merely an example for convenience of explanation, and the shape of the camera housing (401) is not limited thereto. For example, the camera housing (501) of FIG. 16, which will be described below, may not only include four side walls, but may also include side walls facing five or more different directions.

[0103] Referring to FIG. 5, the camera housing (401) is a portion that substantially forms the exterior of the camera module (400), and may include a base member (401a) and a cover member (401b). The base member (401a) may be a portion that is combined with the cover member (401b) to form a space in which various components are mounted inside the camera housing (401). The cover member (401b) may serve to shield electromagnetic waves. According to one embodiment, the base member (401a) may be referred to as a 'first camera housing (401a)', and the cover member (401b) may be referred to as a 'second camera housing (401b)'.

[0104] For example, the cover member (401b) may be a shield can. According to one embodiment, if there is a component that generates electromagnetic waves inside the space formed by the camera housing (401), the cover member (401b) may provide a shielding structure for shielding electromagnetic waves. For example, when the driving member (460) includes a VCM (voice coil motor) that generates driving force using an electric field or a magnetic field, the cover member (401b) may shield electromagnetic waves caused by or against the VCM. The camera housing (401) including the electromagnetic shielding structure may prevent an electric field or a magnetic field from entering from the outside of the camera housing (401) and interfering with the VCM, or an electric field or a magnetic field from leaking out from the VCM and interfering with other electronic components in the electronic device (101).

[0105] Referring to FIG. 6, according to one embodiment, the base member (401a) may include a side wall for at least partially surrounding components accommodated within the base member (401a). Additionally or alternatively, the side wall may be formed on the cover member (401b). In this way, the camera housing (401) is not limited to a specific shape and may have various shapes depending on the embodiment.

[0106] Referring to FIGS. 5 and 6 together, the lens assembly (402) may include at least one lens (402a) aligned along an optical axis (OI). The optical axis (OI) may be illustrated as a line (virtual line) connecting the centers of lenses (or centers of multiple lenses when there are multiple lenses) in a drawing of an optical system including the camera module (400). For example, the optical axis may be defined as a light travel path between at least one lens (402a) and the image sensor (403). For another example, the optical axis may be defined as a line passing through a center of curvature of a surface facing the object side of a first lens (e.g., the first lens) from the object side (O) and a center of curvature of a surface facing the image side (I) of a last lens (e.g., the nth lens) from the object side. According to another example, the optical axis (OI) may be defined as a line passing through the center of at least one lens and the center of the image sensor (403), as well as the plurality of lenses. According to one embodiment, the optical axis may be understood as a 'rotational center axis' that does not change in optical performance when rotated around the axis. In addition, in the present disclosure (e.g., the embodiment of FIG. 16), the optical axis (OI) may not necessarily mean a straight line in the Z-axis direction or parallel to the Z-axis, but may also mean an imaginary line that is bent at least once. In the following description, when a component is said to move in the optical axis direction, the 'optical axis direction' may be understood as the direction in which light is incident on the image sensor (403). For example, in the direct-type camera module illustrated in FIG. 5, the 'optical axis direction' may be in the Z-axis direction or parallel to the Z-axis direction for the camera module (400) having the optical axis (OI) extending from the lens assembly (402) to the image sensor (403). For example, in the curved camera module illustrated in FIG. 16 described below, the optical axis direction may include not only a direction parallel to the Z-axis direction but also a direction bent from the Z-axis.

[0107] The image sensor (403) may be disposed on one surface of the first substrate (410). For example, the image sensor (403) may be disposed on a surface of the first substrate (410) facing a third direction (e.g., the Z-axis direction). However, the present invention is not necessarily limited thereto, and the image sensor (403) may be configured to receive light passing through the lens assembly while being disposed on a surface of the first substrate (410) facing in a direction opposite to the third direction. In this case, an opening may be formed in the first substrate (410). The image sensor (403) may include a sensor such as a complementary metal-oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD), for example. The image sensor (403) is not limited thereto, and may include, for example, various elements that convert an image of a subject into an electrical image signal. The image sensor (403) can obtain an image of the subject by detecting brightness information, gradation ratio information, color information, etc. of the subject from light passing through the lens assembly (402).

[0108] The camera module (400) of the present disclosure may correspond to an image sensor shift type camera module. The image sensor shift type may mean that the image sensor (403) moves when performing an OIS operation and / or an AF operation. The position of the image sensor (403) may be variable while being disposed on the first substrate (410). The image sensor (403) of the present disclosure may move in a first direction (e.g., X-axis direction) and / or a second direction (e.g., Y-axis direction) by an OIS driving member. The present disclosure may disclose embodiments in which the image sensor (403) moves when performing an OIS operation. According to one embodiment, the image sensor (403) may move even when performing an AF operation. However, the present disclosure is not necessarily limited thereto, and an embodiment (lens shift type) in which the lens assembly moves instead of the image sensor (403) moves when performing an AF operation may also be included. In the embodiments of FIGS. 5 to 17, the description will be centered on an embodiment in which the image sensor (403) moves in both the OIS operation and the AF operation. According to one embodiment, the first substrate (410) is a printed circuit board (PCB) on which the image sensor (403) is arranged on one surface, and may be parallel to a plane formed by the X-axis and the Y-axis among the spatial coordinate axes illustrated in FIG. 6 (hereinafter, referred to as an “XY plane” for short). A signal obtained from the image sensor (403) through the first substrate (410) may be applied as an electric signal to another component (e.g., the processor (120) of FIG. 1 (e.g., an image signal processor (ISP))) electrically connected to the first substrate (410).For example, when a processor (120) (e.g., an image signal processor (ISP)) is placed on another substrate (e.g., a third substrate) spaced apart from the first substrate (410), information about an image acquired from the image sensor (403) can be transmitted to the processor (e.g., the image signal processor (ISP)) using the first substrate (410).

[0109] The first substrate (410) may be electrically connected to other substrate(s). For example, the first substrate (410) may be connected to another substrate (e.g., the second substrate (470)) disposed inside the camera module (400). The first substrate (410) may also be connected to another substrate (e.g., the third substrate) disposed outside the camera module (400). The first substrate (410) may be connected to other components (e.g., the processor (120) of FIG. 1) disposed outside the camera module (400) via at least one connector. According to one embodiment, the third substrate may be fixed in position with respect to the camera module (400). For example, in a camera module of an image sensor shift type, the first substrate (410) connected to the third substrate disposed outside the camera module may be moved while the third substrate is fixed. At this time, at least one connector and / or flexible printed circuit board is arranged between the first substrate (410) and the third substrate so that the electrical connection between the first substrate (410) and the third substrate can be stably maintained.

[0110] The lens assembly (402) may be at least partially housed within the camera housing (401). At least one lens (402a) may be at least partially housed within the camera housing (401) while being surrounded by a lens barrel (402b). The lens(es) included in the lens assembly (402) may be arranged in an appropriate number according to the specifications required by the camera module (400) or the electronic device (e.g., the electronic device (101) of FIGS. 1 to 3) for externally incident light. The number of lenses included in the lens assembly (402) may not be limited to any particular embodiment. In one embodiment, the lens assembly (402) may be arranged in a form that partially protrudes toward the outside of the camera housing (401) while being at least partially housed within the camera housing (401). In one embodiment, the lens assembly (402) may be fixedly arranged with respect to the camera housing (401).

[0111] Referring to FIG. 5, according to one embodiment, the lens assembly (402) may be arranged in a form that protrudes slightly toward the outside of the camera housing (401) while being at least partially accommodated in the camera housing (401). In the embodiment illustrated in FIG. 5, the lens assembly (402) may be configured to have a fixed horizontal position relative to the camera housing (401) and a variable vertical position. In this state, the lens assembly (402) may focus or guide light emitted from or reflected by a subject into the interior of the camera housing (401).

[0112] Referring to FIG. 6, the camera module (400) may include an image sensor (403), a first carrier (430), a second carrier (440), a third carrier (450), and a driving member (460). According to one embodiment, the camera module (400) may further include a fourth carrier (445). In addition, the camera module (400) may include at least one substrate (e.g., a first substrate (410), a second substrate (470)). According to one embodiment, at least one substrate (e.g., a first substrate (410), a second substrate (470)) may be formed of a flexible printed circuit board (FPCB).

[0113] The camera module (400) of the present disclosure may be a camera module to which an image sensor shift method is applied. The image sensor (403) of the present disclosure may be moved in the X-axis, Y-axis, and / or Z-axis directions by a driving member (460), for example, while being disposed on a first substrate (410). The image sensor (403) may be disposed on the first substrate (410) and may reciprocate along a third direction (e.g., Z-axis direction) or may reciprocate in a direction perpendicular to the third direction (e.g., X-axis direction and / or Y-axis direction) by a carrier assembly (420). A driving member (460) may be disposed around the carrier assembly (420) and / or along the periphery of the carrier assembly (420) to move the image sensor (403) in different directions, respectively. The driving member (460) may include a plurality of driving members (461, 462, 463). The driving member (460) may provide a driving force to allow the image sensor (403) and the first substrate (410) to move independently in each of the three axes of the spatial coordinates shown in FIG. 6.

[0114] According to the embodiment illustrated in FIG. 6, a camera module (400) that performs an OIS operation for image stabilization (or shake correction) by moving a substrate (410) on which an image sensor (403) is disposed can be provided. The camera module (400) of the present disclosure may be referred to as a camera module including an image sensor shift type OIS driving unit. The camera module (400) may include a driving member (460) configured to move a first substrate (410) in a direction intersecting an optical axis defined as an optical movement path between at least one lens (402a) and an image sensor (403).

[0115] Referring to FIG. 6, the driving member (460) may include a first driving member (461) and a second driving member (462). The driving member (460) may be referred to as an OIS driving unit (461, 462) (or position feedback control unit). The first driving member (461) and the second driving member (462) may be referred to as a first OIS driving unit (461) and a second OIS driving unit (462), respectively. The driving member (460) may include a first coil (461a), a first magnet (461b), and a second coil (461c) sequentially arranged in a direction from the outside to the inside of the camera module corresponding to a first position of the camera housing (401) (or corresponding to a first side wall (4011) of the camera housing) as components included in the OIS driving units (461, 462). In addition, the driving member (460) may include a third coil (462a), a second magnet (462b), and a fourth coil (462c) sequentially arranged in a direction from the outside to the inside of the camera module corresponding to a second position of the camera housing (401) (or corresponding to a second side wall (4012) of the camera housing) as components included in the OIS driving units (461, 462).

[0116] In the present disclosure, the interaction between the first coil (461a) and the first magnet (461b), the interaction between the third coil (462a) and the second magnet (462b), the interaction between the first magnet (461b) and the second coil (461c), and the interaction between the second magnet (462b) and the fourth coil (462c) can be implemented in a solenoid manner in which the relative separation distance between each coil and magnet changes in a direction parallel to the direction in which they face each other. That is, the OIS driving unit (461, 462) can be implemented in a solenoid manner.

[0117] The first OIS driving unit (461) included in the camera module (400) may be configured to perform the first OIS operation by interaction between the first coil (461a) and the first magnet (461b), and / or by interaction between the first magnet (461b) and the second coil (461c). The second OIS driving unit (462) included in the camera module (400) may be configured to perform the second OIS operation by interaction between the third coil (462a) and the second magnet (462b), and / or by interaction between the second magnet (462b) and the fourth coil (462c).

[0118] The above first OIS operation (first operation) may include a 1-1 OIS operation performed by an interaction between a first coil (461a) and a first magnet (461b), a 1-2 OIS operation performed by an interaction between a first magnet (461b) and a second coil (461c), or an operation including both the 1-1 OIS operation and the 1-2 OIS operation. In some embodiments, the 1-1 OIS operation may be referred to as a first OIS drive (first driving), and the 1-2 OIS operation may be referred to as a second OIS drive (second driving). The second OIS operation may include a second-first OIS operation performed by an interaction between the third coil (462a) and the second magnet (462b), a second-second OIS operation performed by an interaction between the second magnet (462b) and the fourth coil (462c), or an operation including both the second-first OIS operation and the second-second OIS operation. In some embodiments, the second-first OIS operation may be referred to as a third OIS driving, and the second-second OIS operation may be referred to as a fourth OIS driving.

[0119] Referring to FIG. 6, the driving member (460) may include an AF driving unit (463). The driving member (460) may include a fifth coil (463a) and a third magnet (463b) sequentially arranged in a direction from the outside to the inside of the camera module corresponding to the third position of the camera housing (401) (or corresponding to the third side wall (4013) of the camera housing).

[0120] In the present disclosure, the interaction between the fifth coil (463a) and the third magnet (463b) can be implemented in a Lorenz manner in which the relative separation distance between the coil and the magnet changes in a direction perpendicular to the direction in which they face each other. That is, the AF driving unit (463) can be implemented in a Lorenz manner.

[0121] The camera module (400) can additionally or alternatively perform an AF operation implemented by the interaction between the fifth coil (463a) and the third magnet (463b) in addition to the first OIS operation and the second OIS operation.

[0122] The camera module (400) may include a carrier assembly (420) configured to perform the first OIS operation, the second OIS operation, and the AF operation.

[0123] The camera module (400) may include a carrier assembly (420) that guides the image sensor (403) and the first substrate (410) to reciprocate in a first direction (e.g., X-axis direction) and / or in a second direction (e.g., Y-axis direction) perpendicular to the first direction. In addition, the camera module may include a carrier assembly (420) that guides the image sensor (403) and the first substrate (410) in a third direction (e.g., Z-axis direction) perpendicular to both the first and second directions.

[0124] The carrier assembly (420) may be surrounded by the camera housing (401) and accommodated in the interior space of the camera housing (401). The carrier assembly (420) may include a first carrier (430), a second carrier (440), and a third carrier (450). According to one embodiment, the carrier assembly (420) may include a first carrier (430) coupled to the first substrate (410) and moving relative to the first substrate (410) in a first direction perpendicular to the height direction of the camera housing (401) (e.g., X-axis direction) or in a second direction different from the first direction (e.g., Y-axis direction). Additionally, the carrier assembly (420) may include a second carrier (440) that surrounds at least a portion of the first carrier (430) and moves relative to the camera housing (401) in a first direction (e.g., X-axis direction) that is perpendicular to the height direction of the camera housing (401) or in a second direction (e.g., Y-axis direction) that is different from the first direction. Additionally, the carrier assembly (420) may include a third carrier (450) that surrounds at least a portion of the first carrier (430) and the second carrier (440) and moves relative to the camera housing (401) in a third direction (e.g., Z-axis direction) that is parallel to the height direction of the camera housing (401).

[0125] The first carrier (430) may be positioned closest to the image sensor (403) and the first substrate (410). The first carrier (430) may be laminated on the first substrate (410). Referring to FIG. 6, the first carrier (430) may be positioned on a surface of the first substrate (410) facing a first direction (e.g., the Z-axis direction). According to one embodiment, the first carrier (430) may be fixedly coupled to the first substrate (410) and may move as one body.

[0126] The first carrier (430) may be formed in a plate shape that is generally parallel to the XY plane. The first carrier (430) may have an opening formed in the center and may include a first plate (431) surrounding the opening. According to one embodiment, a filter (not shown) may be disposed in the opening. For example, an IR Cut filter for blocking infrared (IR) may be disposed in the filter, and the IR Cut filter may overlap the image sensor (403) when disposed in the opening. When the first carrier (430) is disposed on the first substrate (310), it may surround at least a portion of the image sensor (403). The first carrier (430) may be formed in a plate shape that is generally parallel to the XY plane, and may be configured to be coupled with the first substrate (410) and move in a direction parallel to at least one of the three axes of the orthogonal coordinate system.

[0127] The second carrier (440) may be disposed between the first carrier (430) and the third carrier (450). In one embodiment, the second carrier (440) includes an opening in which the first carrier (430) may be received. In one embodiment, the first carrier (430) and the second carrier (440) may be disposed on substantially the same plane (e.g., a plane parallel to the XY plane). In one embodiment, the second carrier (440) may have a shape surrounding the first carrier (430). The second carrier (440) may include a second plate (441) having a frame shape. One side of the second plate (441) of the second carrier (440) may face one side of the third carrier (450) (e.g., one side of the third plate (451)), and the other side of the second plate (441) may face a part of the substrate (410) (e.g., the third rigid portion (413) described below).

[0128] Referring to FIGS. 6 and 7 together, the first coil (461a) and the third coil (462a) included in the driving member (460) may be placed in the camera housing (401), the first magnet (461b) and the second magnet (462b) may be placed in the second carrier (440), and the second coil (461c) and the fourth coil (462c) may be placed in the first carrier (430).

[0129] According to one embodiment, the first coil (461a) may be disposed in a first cover opening (4011a) formed in a base member (401a) of the housing (401), and the third coil (462a) may be disposed in a second cover opening (4012a) formed in the base member (401a) of the housing (401). A first magnet (461b) and a second magnet (462b) may be disposed on a second plate (441) of the second carrier (440). According to one embodiment, the second carrier (440) may include a third protruding support portion (442) protruding in a third direction (e.g., in the Z-axis direction) from the second plate (441) to support the first magnet (461b) and the second magnet (462b). In one embodiment, the first magnet (461b) may be arranged to face a first side wall (e.g., 4011) of the camera housing (401), and the second magnet (462b) may be arranged to face a second side wall (e.g., 4012) of the camera housing (402). In one embodiment, the second coil (461c) may be arranged to face a first protruding support portion (432) protruding in a third direction (e.g., in the Z-axis direction) from the first plate (431) of the first carrier (430), and the fourth coil (462c) may be arranged to face a second protruding support portion (433) protruding in a third direction (e.g., in the Z-axis direction) from the first plate (431) of the first carrier (430).

[0130] The third carrier (450) may be disposed on a surface of the second carrier (440) facing the third direction (e.g., the Z-axis direction). According to one embodiment, the third carrier (450) may not be fixedly coupled to the second carrier (440), but may be coupled so that their relative positions can be changed. The third carrier (450) may include a third plate (451) including a surface facing the third direction (e.g., the Z-axis direction), and a side wall (452) extending from the third plate (451) in an opposite direction to the third direction (e.g., the -Z-axis direction). A base member (401a) may be disposed on a third plate (451) of a third carrier (450), and a side wall (452) of the third carrier (450) may be at least partially wrapped by a side wall extending from the base member (401a) and / or the cover member (401b) of the housing (401). In one embodiment, an opening may be formed in one surface of the third carrier (450) (e.g., one surface of the third plate (451)) through which a lens assembly (402) may be at least partially received. In one embodiment, one surface of the third carrier (450) (e.g., one surface of the third plate (451)) may face the base member (401a) of the housing (401). In one embodiment, the third carrier (450) may be configured to substantially enclose other carriers (e.g., the first carrier (430) and the second carrier (440)). In one embodiment, the third carrier (450) may include sidewalls (452), wherein the third carrier (450) may include sidewalls (e.g., 4521, 4522, 4523, 4524) formed at positions corresponding to the sidewalls (e.g., 4011, 4012, 4013, 4014) of the camera housing (401).

[0131] The carrier assembly (420) may be a stacked structure in which a second carrier (440) and a third carrier (450) are stacked, with the first carrier (430) being wrapped by the second carrier (440). According to one embodiment, a guide ball may be placed between the second carrier (440) and the third carrier (450). Accordingly, relative movement between the second carrier (440) and the third carrier (450) included in the carrier assembly (420) may be implemented.

[0132] A first metal member (461d) and a second metal member (462d) may be placed on the third plate (451) of the third carrier (450). The first metal member (461d) and the second metal member (462d) may be placed on the third plate (451) at positions corresponding to the first magnet (461b) and the second magnet (462b), respectively. A magnetic force (e.g., attractive force) may be applied between the first metal member (461d) and the first magnet (461b), and a magnetic force (e.g., attractive force) may be applied between the second metal member (462d) and the second magnet (462b). The second carrier (440) and the third carrier (450) may be configured to move together while being coupled to each other by a magnetic force.

[0133] A third guide ball (B3) may be placed between the third carrier (450) and the camera housing (401). A third recess (453) may be formed on an outer surface of one of the side walls (452) of the third carrier (450) (e.g., 4523), so that the third guide ball (B3) may be accommodated therein. An inner surface recess (406) may also be formed on an inner surface of a side wall (e.g., 4013) of the camera housing (401) corresponding to the surface where the third recess (453) of the third carrier (450) is formed, so that the third guide ball (B3) may be accommodated therein. The third guide ball (B3) may be seated between the third recess (453) of the third carrier (450) and the inner surface recess (406) of the camera housing (401) so as to roll in a ball bearing manner. According to one embodiment, a plurality of third guide balls (B3) may be provided. The carrier assembly (420) can cause the substrate (410) to reciprocate linearly along the third direction (e.g., the Z-axis direction) by using the third guide balls (B3) arranged on the outer surface of the third carrier (450).

[0134] According to one embodiment, the fifth coil (463a) may be disposed in a third cover opening (4013a) formed in a base member (401a) of the housing (401), and the third magnet (463b) may be disposed in a third carrier (450). The third cover opening (4013a) of the camera housing (401) may be formed in a side wall (e.g., 4013) at a position corresponding to the third magnet (463b). The third magnet (463b) may be disposed in one of the side walls (452) of the third carrier (450) (e.g., 4523). The third magnet (463b) may be placed so as to be erected on one of the side walls (452) of the third carrier (450) (e.g., 4523) so as to form a magnetic field in a direction (e.g., Y-axis direction and X-axis direction) intersecting the third direction (e.g., Z-axis direction). The fifth coil (463a) may also be placed so as to be erected on the side wall of the camera housing (401) so as to face the third magnet (463b).

[0135] When current is applied to the fifth coil (463a), the magnetic field formed by the fifth coil (463a) interacts with the magnetic field formed by the third magnet (463b) in a Lorentz manner, thereby moving the third carrier (450) in a direction parallel to the third direction (e.g., the Z-axis direction). The third driving member (463) including the fifth coil (463a) and the third magnet (463b) may be referred to as an AF driving unit.

[0136] The camera module (400) may further include a fourth carrier (445) positioned between the second carrier (440) and the third carrier (450). FIG. 6 illustrates an embodiment further including a fourth carrier (445), which may be referred to as a middle carrier or middle guide. The fourth carrier (445) may include a body (446).

[0137] According to one embodiment, the second carrier (440), the fourth carrier (445), and the third carrier (450) may be stacked with guide balls (B1, B2) positioned between each element. For example, the first guide ball (B1) may be positioned between the second carrier (440) and the fourth carrier (445), and the second guide ball (B2) may be positioned between the fourth carrier (445) and the third carrier (450). Accordingly, relative movement between the carriers (440, 445, 450) included in the carrier assembly (420) may be implemented. The first guide ball (B1) may support the fourth carrier (445) while minimizing friction when the relative position between the second carrier (440) and the fourth carrier (445) changes. A first recess (443) in which a first guide ball (B1) is mounted may be formed in the second carrier (440), and a second recess (447) in which a second guide ball (B2) is mounted may be formed in the fourth carrier (445). The second carrier (440) may guide a linear reciprocating motion of the first substrate (410) on which the image sensor (403) is mounted in a direction parallel to the first direction (e.g., X-axis direction) by using the first guide ball (B1). The second guide ball (B2) may support the third carrier (450) while minimizing friction when the relative positions of the fourth carrier (445) and the third carrier (450) change. The fourth carrier (445) can guide the first substrate (410) on which the image sensor (403) is arranged in a linear reciprocating motion in a second direction (e.g., Y-axis direction) different from the first direction using the second guide ball (B2).

[0138] The first substrate (410) may be divided into a plurality of parts. For example, the first substrate (410) may include a first rigid part (411), a slit part (412) connected to the first rigid part (411), and a second rigid part (413) connected to the slit part (412). The configuration of the first substrate (410) will be described in detail below with reference to the embodiment illustrated in FIG. 8.

[0139] According to one embodiment, the first substrate (410) may include a first vertical substrate (414, 415) extending in a third direction (e.g., in the Z-axis direction) from the first rigid portion (411). The first vertical substrate (414, 415) may be provided to supply current to the second coil (461c) and the fourth coil (462c) disposed on the first carrier (430). For example, when the lens moves to perform an OIS correction operation, a wiring connection structure for supplying current to the second coil (461c) and the fourth coil (462c) may be required. When the image sensor of the present disclosure moves to perform an OIS correction operation, the first vertical substrate (414, 415) is used to supply current to the second coil (461c) and the fourth coil (461d), so there is an advantage of not having a separate wiring connection structure. In FIG. 6, the first vertical substrate (414, 415) is illustrated as a flat structure parallel to the first protruding support portion (432) and the second protruding support portion (433), but it may be implemented in another form (e.g., a soldering structure) if current supply to the second coil (461c) and the fourth coil (461d) is possible. According to one embodiment, if a separate wiring connection structure is provided for current supply to the second coil (461c) and the fourth coil (461d), the first vertical substrate (414, 415) may be omitted.

[0140] In one embodiment, the first substrate (410) may include a first vertical portion (417) that may be arranged at least partially parallel to the sidewall(s) (e.g., 4011, 4012, 4013, 4014) of the camera housing (401). In one embodiment, the first vertical portion (417) may be bent so as to face a plurality of sidewall(s) (e.g., 4011, 4012, 4013, 4014) of the camera housing (401). In one embodiment, to reinforce the rigidity of the bent portion (417') of the first substrate (410), a reinforcing member coupled to the bent portion may be further included.

[0141] The camera module (400) may include a second substrate (470). The second substrate (470) may be connected to the first substrate (410), or may be connected to another external substrate (e.g., a third substrate) without being connected to the first substrate (410). The second substrate (470) may be provided to supply current to the first coil (461a), the second coil (462a), and the third coil (463a) disposed in the camera module (400). The second substrate (470) may be electrically connected to each of the first coil (461a), the second coil (462a), and the third coil (463a). According to one embodiment, the second substrate (470) may include a second vertical substrate (471) disposed along the periphery of the camera housing (401). Additionally, the second substrate (470) may include a horizontal substrate (472) extending in the XY plane direction from one side of the second vertical substrate (471). According to one embodiment, the camera module (400) may have a structure in which the second substrate (470) is arranged to surround an outer surface of a side wall of the base member (401a), and the cover member (401b) is arranged to surround the second substrate (470). For example, in the embodiment of FIG. 6, the first substrate (410) may be arranged between the second substrate (470) and the cover member (401b).

[0142] According to one embodiment, the second substrate (470) may include second vertical portions (e.g., 4711, 4712, 4713, 4714) respectively positioned corresponding to the sidewalls (e.g., 4011, 4012, 4013, 4014) of the camera housing (401). According to one embodiment, the second vertical portions (e.g., 4711) may have a portion therebetween bent when connected to another adjacent second vertical portion. For example, a bent portion may be formed between the 2-1 vertical portion (4711) and the 2-2 vertical portion (4712). In order to reinforce the rigidity of such a bent portion in the second substrate (470), a reinforcing member coupled to the bent portion may be further included.

[0143] In one embodiment, the second substrate (470) may be formed of a flexible printed circuit board (FPCB). In one embodiment, the second substrate (470) may be formed as a single substrate that is indistinguishable from the first substrate (410).

[0144] Referring to FIG. 7, the camera module (400) of the present disclosure may have a structure in which a second carrier (440) for OIS operation is arranged inside a third carrier (450) for AF operation. The camera module (400) of the present disclosure may have a first carrier (430) arranged inside the second carrier (440). When the camera module (400) of the present disclosure is viewed from above, the third carrier (450), the second carrier (440), and the first carrier (430) may be arranged sequentially from the outside to the inside of the camera module (400).

[0145] The first OIS driving unit (461) can perform the first OIS operation by the interaction between the first coil (461a) and the first magnet (461b), and / or by the interaction between the first magnet (461b) and the second coil (461c). The first OIS driving unit (461), with reference to FIG. 7, can be represented by the drawing symbol 'DX' in that it causes movement in a direction parallel to the X-axis direction with respect to the first substrate (410) on which the image sensor (403) is arranged, for example. The first OIS driver (461) may include a first-first OIS driver and a first-second OIS driver, wherein the first-first OIS driver may be represented by the reference numeral 'DX1' in that it causes a primary movement on the outside of the camera housing (401), and the first-second OIS driver may be represented by the reference numeral 'DX2' in that it causes a secondary movement on the inside of the camera housing (401). Depending on the embodiment, the first-first OIS driver may be referred to as a first activator or a first operator, and the first-second OIS driver may be referred to as a second activator or a second operator. It should be noted that the 'first movement' and the 'second movement' are merely used to distinguish the movements, and do not indicate the order of precedence or continuation of the movements. For example, the 1-1 OIS operation by the 1-1 OIS driving unit may be implemented first, and then the 1-2 OIS operation by the 1-2 OIS driving unit may be implemented. Alternatively, the 1-2 OIS operation by the 1-2 OIS driving unit may be implemented first, and then the 1-1 OIS operation by the 1-1 OIS driving unit may be implemented.Alternatively, the 1-1 OIS operation by the 1-1 OIS driving unit and the 1-2 OIS operation by the 1-2 OIS driving unit may be implemented simultaneously or together.

[0146] The 1-1 OIS driving unit may implement the 1-1 OIS operation by the interaction between the first coil (461a) and the first magnet (461b). In the 1-1 OIS operation, when the first coil (461a) is fixed to the camera housing (401) and the camera housing (401) is fixed to the electronic device, when current is supplied to the first coil (461a), the first magnet (461b) may move in the X-axis direction. The 1-2 OIS driving unit may implement the 1-2 OIS operation by the interaction between the first magnet (461b) and the second coil (461c). In the 1-2 OIS operation, when the first magnet (461b) is fixed to the second carrier (440), if current is supplied to the second coil (461c), the second coil (461c) having a relatively smaller mass than the first magnet (461b) can move in the X-axis direction. According to one embodiment, when the 1-1 OIS operation by the 1-1 OIS driving unit and the 1-2 OIS operation by the 1-2 OIS driving unit are performed together, the 1-1 OIS operation can affect the 1-2 OIS operation. For example, even if a current flows through the second coil (461c) and a magnetic force is applied to the first magnet (461b) due to the magnetic flux passing through the center of the second coil (461c), the first magnet (461b) may not move due to the magnetic force caused by the magnetic flux passing through the center of the first coil (461a) due to the current flowing through the first coil (461a).

[0147] The second OIS driving unit (462) can perform the second OIS operation by the interaction between the third coil (462a) and the second magnet (461b), and / or by the interaction between the second magnet (462b) and the fourth coil (462c). The second OIS driving unit (461) can be represented by the drawing symbol 'DY' in that it causes movement in a direction parallel to the Y-axis direction with respect to the first substrate (410) on which the image sensor (403) is arranged, for example, with reference to FIG. 7. The second OIS driving unit (462) may include a second-first OIS driving unit and a second-second OIS driving unit, wherein the second-first OIS driving unit may be represented by the reference numeral 'DY1' in that it causes a primary movement on the outside of the camera housing (401), and the second-second OIS driving unit may be represented by the reference numeral 'DY2' in that it causes a secondary movement on the inside of the camera housing (401). Depending on the embodiment, the second-first OIS driving unit may be referred to as a third activator or a third operator, and the second-second OIS driving unit may be referred to as a fourth activator or a fourth operator. It should be noted that the 'first movement' and the 'second movement' are merely used to distinguish the movements, and do not indicate the order of precedence or continuation of the movements. For example, the 2-1 OIS operation by the 2-1 OIS driving unit may be implemented first, and then the 2-2 OIS operation by the 2-2 OIS driving unit may be implemented. Alternatively, the 2-2 OIS operation by the 2-2 OIS driving unit may be implemented first, and then the 2-1 OIS operation by the 2-1 OIS driving unit may be implemented.Alternatively, the 2-1 OIS operation by the 2-1 OIS driving unit and the 2-2 OIS operation by the 2-2 OIS driving unit may be implemented simultaneously or together.

[0148] The 2-1 OIS driving unit may implement the 2-1 OIS operation by the interaction between the third coil (462a) and the second magnet (462b). In the 2-1 operation, when the third coil (462a) is fixed to the camera housing (401) and the camera housing (401) is fixed to the electronic device, when current is supplied to the third coil (462a), the second magnet (462b) may move in the Y-axis direction. The 2-2 OIS driving unit may implement the 2-2 OIS operation by the interaction between the second magnet (462b) and the fourth coil (462c). In the 2-2 OIS operation, when the second magnet (462b) is fixed to the second carrier (440), if current is supplied to the fourth coil (462c), the fourth coil (462c) having a relatively smaller mass than the second magnet (462b) can move in the Y-axis direction. According to one embodiment, when the 2-1 OIS operation by the 2-1 OIS driving unit and the 2-2 OIS operation by the 2-2 OIS driving unit are performed together, the 2-1 OIS operation can affect the 2-2 OIS operation. For example, even if a current flows through the fourth coil (462c) and a magnetic force is applied to the second magnet (462b) due to the magnetic flux passing through the center of the fourth coil (462c), the second magnet (462b) may not move due to the magnetic force caused by the magnetic flux passing through the center of the third coil (462a) when a current flows through the third coil (462a).

[0149] FIG. 8 is a drawing showing a camera module viewed from below, according to one embodiment.

[0150] Referring to FIG. 8, the first substrate (410) may include a first rigid portion (411) on which an image sensor (e.g., 403) is arranged, a slit portion (412) connected to the first rigid portion (411), and a second rigid portion (413) connected to the slit portion (412). The slit portion (412) may be deformable in a direction parallel to the optical axis or perpendicular to the optical axis. According to one embodiment, the first rigid portion (411) may be coupled to a first carrier (430). For example, the first rigid portion (411) may be attached to a back surface of a first plate (431) of the first carrier (430). The second rigid portion (413) may be coupled to a second carrier (440). For example, the second rigid portion (413) may be attached to the back surface of the second plate (441) of the second carrier (440). When the first rigid portion (411) and the first carrier (430) are coupled, and the second rigid portion (413) and the second carrier (440) are coupled, and the second carrier (440) moves, the slit portion (412) may be partially deformed (e.g., twisted) and then restored to its original state. The slit portion (412) may electrically connect the first rigid portion (411) and the second rigid portion (413), while guiding the position of the first carrier (430) with respect to the second carrier (440). For example, the slit portion (412) is a component that returns to its original state when no external force is applied, such as a spring, and can serve to protect the first substrate (410) from physical impact when the carrier assembly (420) is driven.

[0151] The slit portion (412) of the first substrate (410) may be configured with a plurality of layers, so that signal wiring arrangements for the plurality of layers can be possible. According to one embodiment, the slit portion (412) may be configured in a form that is relatively non-deformable in a direction parallel to a third direction (e.g., Z-axis direction) and relatively easily deformable in a first direction (e.g., X-axis direction) or a second direction (e.g., Y-axis direction). The restriction on deformation in a direction parallel to the third direction (e.g., Z-axis direction) may be implemented by appropriately setting the thickness and material of the slit portion (412). Facilitating deformation in the first direction (e.g., X-axis direction) or the second direction (e.g., Y-axis direction) may be implemented by appropriately setting the number or spacing of slits. For example, at least a portion of the slit portion (412) may be configured to be thick in a direction parallel to a third direction (e.g., a Z-axis direction) and thin in a first direction (e.g., an X-axis direction) or a second direction (e.g., a Y-axis direction).

[0152] The slit portion (412) of the first substrate (410) can electrically connect the first rigid portion (411) on which the image sensor (403) is placed and the second rigid portion (413) on which the second carrier (440) is coupled. The second rigid portion (413) of the first substrate (410) can be connected to a flexible portion (416) configured so that an electrical connection can be stably maintained without causing any restrictions on the operation of the second carrier (440) and / or the third carrier (450).

[0153] FIG. 9 is a perspective view of a second carrier and a fourth carrier stacked in a carrier assembly according to one embodiment. FIG. 10 is a front view of a second carrier and a fourth carrier stacked in a carrier assembly according to one embodiment. FIG. 11 is a front view of a second carrier of a carrier assembly according to one embodiment. FIG. 12 is a cross-sectional view of a camera module according to one embodiment. FIG. 13 is a view showing the inside of a camera module according to one embodiment. FIG. 14A is a view showing a top view of a camera module according to one embodiment.

[0154] Referring to FIGS. 9 to 14A, the carrier assembly (420) may be a stacked structure in which a second carrier (440), a fourth carrier (445), and a third carrier (450) are sequentially stacked, with a first carrier (430) surrounded by a second carrier (440). When the carrier assembly (420) moves by power provided by the driving member (460), the carrier assembly (420) may move relative to the camera housing (401) along a first direction (e.g., X-axis direction), a second direction (e.g., Y-axis direction), and / or a third direction (e.g., Z-axis direction).

[0155] Referring to FIG. 9, a third metal member (463d) may be fixedly disposed on the camera housing (401) corresponding to the position where the third magnet (463b) of the third driving member (463) is disposed. The third magnet (463b) may exert an attractive force on the third metal member (463d). Due to the interaction between the third magnet (463b) and the third metal member (463), even if the third carrier (450) moves in a direction parallel to the third direction (e.g., up / down) with respect to the camera housing (401) during AF operation, the third carrier (450) may not be detached from the camera housing (401).

[0156] According to one embodiment, the body (446) of the fourth carrier (445) may have an approximately 'L' shape. When the fourth carrier (445) is placed on the second carrier (440), the body (446) may be placed at a position that does not interfere with the first magnet (461b) and the second magnet (462b) placed on the second carrier (440). For example, when the first magnet (461b) is placed on the first side of the second carrier (440) having an approximately rectangular shape, and the second magnet (462b) is placed on the second side of the second carrier (440), the body (446) may be placed on the third side and the fourth side of the second carrier (440). In one embodiment, the first arm of the body (446) may be positioned on the third side of the second carrier (440), and the second arm of the body (446) may be positioned on the fourth side of the second carrier (440).

[0157] The carrier assembly (420) can have guide balls (B1, B2) mounted thereon to enable rolling motion in a ball bearing manner for relative movement of the laminated structure of the sequentially laminated second carrier (440) and the fourth carrier (445) and the laminated structure between the fourth carrier (445) and the third carrier (450). A first guide ball (B1) can be arranged between the laminated structure of the second carrier (440) and the fourth carrier (445), and a second guide ball (B2) can be arranged between the fourth carrier (445) and the third carrier (450). In addition, recesses for accommodating the guide balls (B1, B2) can be formed on some surfaces of the carrier(s) included in the carrier assembly (420).

[0158] Referring to FIGS. 9 to 11 together, a first recess (443) may be formed in the second carrier (440), and a second recess (447) may be formed in the fourth carrier (445). The second recess (447) may be formed at an end of the first arm of the body (446), an end of the second arm, and a connection portion between the first arm and the second arm. The second recess (447) may be formed on a surface of the body (446) facing a third direction (e.g., the Z-axis direction), and although not illustrated in the drawing, a fourth recess (not illustrated) may be formed on a surface of the body (446) facing in a direction opposite to the third direction (e.g., the Z-axis direction). The second recess (447) and the fourth recess (not shown) may be formed at corresponding positions on surfaces facing opposite directions with respect to the body of the fourth carrier (445). The second recess (447) and the fourth recess (not shown) may be formed so that the second guide ball (B2) and the first guide ball (B1) can roll while being seated and / or accommodated in each of the second recess (447) and the fourth recess (not shown), respectively. Although not shown separately in the drawing, in the third carrier (350), a separate fifth recess (not shown) may be formed at a position corresponding to the second recess (447) on the surface facing the fourth carrier (445), so that the second guide ball (B2) can be seated and / or accommodated therein. Similarly, in the second carrier (440), a first recess (443) may be formed at a position corresponding to the fourth recess (not shown) on the surface facing the fourth carrier (445).

[0159] Each of the first recesses (443) and the second recesses (447) may be formed in plurality, and according to one embodiment, the plurality of first recesses (443) may all have the same shape, and the plurality of second recesses (447) may also all have the same shape. For example, referring to FIG. 10, the plurality of second recesses (447) may all have a shape in which a V-shaped groove is dug in one direction (e.g., the Y-axis direction). Also, for another example, referring to FIG. 11, the plurality of first recesses (443) may all have a V-shaped groove dug in one direction (e.g., the X-axis direction). The plurality of fourth recesses (not shown) of the fourth carrier (445) may have grooves dug in the same direction as the first recesses (443) of the second carrier (440). And, a plurality of fifth recesses (not shown) of the third carrier (450) may be formed with V-shaped grooves dug in the same direction (e.g., Y-axis direction) as the second recess (447). However, the present disclosure is not limited to the above-described embodiments. According to one embodiment, an embodiment may also be applied in which the V-shaped grooves dug in the first recess (443) and the fourth recess (not shown) face the Y-axis direction, and the V-shaped grooves dug in the second recess (447) and the fifth recess (not shown) face the X-axis direction. The above-described embodiment is for a case in which the fourth carrier (445) is provided as shown in FIGS. 9 to 11.

[0160] FIG. 14b is a front view of a second carrier of a carrier assembly according to one embodiment.

[0161] In one embodiment, the fourth carrier (445) may be omitted. In an embodiment in which the fourth carrier (445) is not provided, as in FIG. 14b, the third guide ball (B3) and the recess for accommodating it (e.g., the second recess (447) and the fourth recess (not shown)) may be omitted. If the fourth carrier (445) is not provided, as in FIG. 14b, the camera module (400) may be configured to perform the OIS operation using only the first guide ball (B1). For example, when the fourth carrier (445) is not provided, the first recess (443) for accommodating the first guide ball (B1) may be formed as a circular groove having a larger diameter than the first guide ball (B1) rather than a V-shaped groove. According to one embodiment, when the first recess (443) is formed as a circular groove having a diameter larger than that of the first guide ball (B1), the second carrier (440) can perform an OIS operation of horizontally moving in a first direction (e.g., X-axis direction) and / or a second direction (e.g., Y-axis direction) via the first guide ball (B1).

[0162] If the fourth carrier (445) is omitted, at least one of the first OIS driving unit (461) or the second OIS driving unit (462) may be configured to enable rotation control (or rolling control). For example, according to the embodiment illustrated in FIG. 14b, the second OIS driving unit (462) may include a third coil (462a) including a third-first coil (4621a) and a third-second coil (4622a) for rotation control (or rolling control). And, additionally, according to the embodiment, as a magnet, it may include a second magnet (462c) including a 2-1 magnet (4621c) and a 2-2 magnet (4622c), and further, it may include a 4th coil (462c) including a 4-1 coil (4621c) and a 4-2 coil (4622c).

[0163] FIG. 15A is a cross-sectional view of a portion of a camera module according to one embodiment. FIG. 15B is a cross-sectional view of a portion of a camera module according to one embodiment.

[0164] FIG. 15a is a cross-sectional view of a portion of a camera module having a solenoid mechanism configured to generate a driving force in a direction parallel to the direction in which a specific coil and a specific magnet face each other, as an OIS driving unit (e.g., a first OIS driving unit (461a)). According to the embodiment illustrated in FIG. 15a, a relative separation distance between a specific coil and a specific magnet can be changed in a direction parallel to the direction in which the specific coil and the specific magnet face each other. For example, a driving force can be generated in a direction parallel to the direction in which they face each other (e.g., the X-axis direction) through an interaction between a first coil (461a) and a first magnet (461b), and a driving force can be generated in a direction parallel to the direction in which they face each other (e.g., the X-axis direction) through an interaction between a first magnet (461b) and a second coil (461c).

[0165] In the embodiments of FIGS. 5 to 14b described above, the first coil (461a), the first magnet (461b), and the second coil (461c) included in the OIS driving unit (e.g., the first OIS driving unit (461a)) may be arranged in a direction from the outside to the inside of the camera module, as illustrated in FIG. 15a. For example, the first coil (461a), the first magnet (461b), and the second coil (461c) may be arranged in the -X-axis direction with reference to FIG. 15a. However, the present invention is not limited thereto, and may be arranged in the +X-axis direction depending on the embodiment. A driving force may be generated in a solenoid manner between the first coil (461a) and the first magnet (461b). In addition, a driving force may also be generated in a solenoid manner between the first magnet (461b) and the second coil (461c). However, it should be noted that according to one embodiment of the present disclosure, the solenoid method described above is not necessarily the only method that can be applied.

[0166] FIG. 15b is a cross-section of a portion of a camera module to which a Lorenz method is applied, which is configured to generate a driving force in a direction perpendicular to the direction in which a specific coil and a specific magnet face each other, as an OIS driving unit (e.g., a first OIS driving unit (461a)). According to the embodiment illustrated in FIG. 15b, the distance between a specific coil and a specific magnet in the direction in which they face each other may not change, but the distance in the direction perpendicular to the direction in which the specific coil and the specific magnet face each other may change. For example, a driving force may be generated in a direction perpendicular to the direction in which they face each other (e.g., the Z-axis direction) and a direction perpendicular to the X-axis direction through the interaction between the first coil (461a) and the first magnet (461b), and a driving force may be generated in a direction perpendicular to the direction in which they face each other (e.g., the Z-axis direction) and a direction perpendicular to the X-axis direction through the interaction between the first magnet (461b) and the second coil (461c). That is, a driving force can be generated between the first coil (461a) and the first magnet (461b) in a Lorentz manner. In addition, a driving force can also be generated between the first magnet (461b) and the second coil (461c) in a Lorentz manner. With respect to the embodiments of FIGS. 5 to 14b described above, the Lorentz manner illustrated in FIG. 15b can be applied within a non-conflicting range.

[0167] Fig. 16 is an exploded perspective view of a camera module according to one embodiment. Fig. 17 is a drawing showing a bottom view of the camera module according to one embodiment.

[0168] In describing the embodiment illustrated in Fig. 16, the same content as that described above through the embodiments of Figs. 4 to 15 may be omitted to the extent of overlap. The embodiments of Figs. 4 to 15 may be applied to the embodiment of Fig. 16 unless otherwise specified.

[0169] The camera module (500) may include a camera housing (501). The camera housing (501) may provide a space for accommodating a plurality of components inside the camera module (500). Referring to FIG. 16, the camera housing (501) is a portion that substantially forms the exterior of the camera module (500) and may include a base member (501a) and a cover member (501b). The base member (501a) may be a portion that is combined with the cover member (501b) to form a space in which various components are mounted inside the camera housing (501). The cover member (501b) may serve to shield electromagnetic waves. According to one embodiment, the base member (501a) may be referred to as a 'first camera housing (501a)', and the cover member (501b) may be referred to as a 'second camera housing (501b)'.

[0170] A cover member (501b) of a camera housing (501) may include a first side wall (5011) facing in one direction, a second side wall (5012) facing in a different direction than the first side wall (5011), and a third side wall (5013) facing in a different direction than the second side wall (5012). The camera housing (501) may further include a fourth side wall (5014) facing in a different direction than the third side wall (5013). In one embodiment, a base member (501a) of the camera housing (501) may include five or more inner side walls facing in different directions. For example, the base member (501a) may include an inner side wall having a shape corresponding to a first vertical portion (517) of the first substrate (510).

[0171] The lens assembly (502) may include at least one lens (502a) aligned along an optical axis (OI) and a lens barrel (502b) for protecting the at least one lens (502a). In the embodiment of FIG. 16, the optical axis (OI) may not necessarily mean a straight line in the Z-axis direction or parallel to the Z-axis, but may also mean an imaginary line that is bent at least once. The lens assembly (502) may be at least partially housed within the camera housing (501). At least one lens (502a) may also be at least partially housed within the camera housing (501) while being surrounded by a lens barrel (502b).

[0172] The image sensor (503) may be arranged on one surface of the first substrate (510). Since the camera module (500) of the present disclosure corresponds to an image sensor shift type, the position of the image sensor (503) may be changed while it is arranged on the first substrate (510). For example, the image sensor (503) of the present disclosure may be moved in a first direction (e.g., X-axis direction), a second direction (e.g., Y-axis direction), and / or a third direction (e.g., Z-axis direction) by a driving member (560).

[0173] The camera module (500) of the embodiment of FIG. 16 may represent a folded camera. The folded camera may further include a reflective and refractive member (504) so ​​that the path of light reaching the image sensor (503) is folded at least twice. According to one embodiment, the reflective and refractive member (504) may be disposed between the lens assembly (502) and the image sensor (503) on the path of light. Referring to FIG. 15, the camera module (500) may further include a supporting member (505). The supporting member (505) may be configured to support at least a portion of the reflective and refractive member. According to one embodiment, the supporting member (505) may protect the reflective and refractive member (504) from external physical impact and prevent the camera housing (501) from being dislodged from its original position or assembled position due to an external impact, such as a drop of the electronic device (101).

[0174] The first substrate (510) may be electrically connected to other substrate(s). For example, the first substrate (510) may be connected to another substrate (e.g., the second substrate (570)) disposed inside the camera module (500). The first substrate (510) may also be connected to another substrate (e.g., the third substrate) disposed outside the camera module (500). At this time, at least one connector and / or flexible printed circuit board may be disposed between the first substrate (510) and the third substrate so that the electrical connection between the first substrate (510) and the third substrate may be stably maintained.

[0175] Referring to FIG. 16, the camera module (500) may include an image sensor (503), a first carrier (530), a second carrier (540), a third carrier (550), and a driving member (560). According to one embodiment, the camera module (500) may further include a fourth carrier (545). In addition, the camera module (500) may include at least one substrate (e.g., a first substrate (510), a second substrate (570)). According to one embodiment, at least one substrate (e.g., a first substrate (510), a second substrate (570)) may be formed of a flexible printed circuit board (FPCB).

[0176] The camera module (500) of the present disclosure may be a camera module to which an image sensor shift method is applied. The image sensor (503) of the present disclosure may be moved in the X-axis, Y-axis, and / or Z-axis directions by a driving member (560), for example, while being disposed on a first substrate (510). The image sensor (503) may be disposed on the first substrate (510) and may reciprocate along a third direction (e.g., the Z-axis direction) or may reciprocate in a direction perpendicular to the third direction (e.g., the X-axis direction and / or the Y-axis direction) by a carrier assembly (520). A driving member (560) may be disposed around the carrier assembly (520) and / or along the periphery of the carrier assembly (520) to move the image sensor (503) in different directions, respectively. The driving member (560) may include a plurality of driving members (561, 562, 563). The driving member (560) may provide a driving force to independently move the image sensor (503) and the first substrate (510) in each of the three axes of the spatial coordinates illustrated in FIG. 16.

[0177] According to the embodiment illustrated in FIG. 16, a camera module (500) that performs an OIS operation for image stabilization (or shake correction) by moving a substrate (510) on which an image sensor (503) is disposed can be provided. The camera module (500) of the present disclosure may be referred to as a camera module including an image sensor shift type OIS driving unit. The camera module (500) may include a driving member (560) configured to move a first substrate (510) in a direction intersecting an optical axis defined as an optical movement path between at least one lens (502a) and an image sensor (503).

[0178] Referring to FIG. 16, the driving member (560) may include a first driving member (561) and a second driving member (562), and may be referred to as an OIS driving unit (561, 562). The first driving member (561) and the second driving member (562) may be referred to as a first OIS driving unit (561) and a second OIS driving unit (562), respectively. The driving member (560) may include a first coil (561a), a first magnet (561b), and a second coil (561c) sequentially arranged in a direction from the outside to the inside of the camera module corresponding to a first position of the camera housing (501) (or corresponding to a first side wall (5011) of the camera housing) as components included in the OIS driving unit (561, 562). In addition, the driving member (560) may include a third coil (562a), a second magnet (562b), and a fourth coil (562c) sequentially arranged in a direction from the outside to the inside of the camera module corresponding to the second position of the camera housing (501) (or corresponding to the second side wall (5012) of the camera housing) as components included in the OIS driving unit (561, 562).

[0179] In the present disclosure, the interaction between the first coil (561a) and the first magnet (561b), the interaction between the third coil (562a) and the second magnet (562b), the interaction between the first magnet (561b) and the second coil (561c), and the interaction between the second magnet (562b) and the fourth coil (562c) can be implemented in a solenoid manner in which the relative separation distance between each coil and magnet changes in a direction parallel to the direction in which they face each other. That is, the OIS driving unit (561, 562) can be implemented in a solenoid manner.

[0180] The first OIS driving unit (561) included in the camera module (500) may be configured to perform the first OIS operation by interaction between the first coil (561a) and the first magnet (561b), and / or by interaction between the first magnet (561b) and the second coil (561c). The second OIS driving unit (562) included in the camera module (500) may be configured to perform the second OIS operation by interaction between the third coil (562a) and the second magnet (562b), and / or by interaction between the second magnet (562b) and the fourth coil (562c).

[0181] The first OIS operation may include a 1-1 OIS operation performed by an interaction between a first coil (561a) and a first magnet (561b), a 1-2 OIS operation performed by an interaction between a first magnet (561b) and a second coil (561c), or an operation including both the 1-1 OIS operation and the 1-2 OIS operation. The second OIS operation may include a 2-1 OIS operation performed by an interaction between a third coil (562a) and a second magnet (562b), a 2-2 OIS operation performed by an interaction between a second magnet (562b) and a fourth coil (562c), or an operation including both the 2-1 OIS operation and the 2-2 OIS operation.

[0182] Referring to FIG. 16, the driving member (560) may include an AF driving unit (563). The driving member (560) may include a fifth coil (563a) and a third magnet (563b) sequentially arranged in a direction from the outside to the inside of the camera module corresponding to the third position of the camera housing (501) (or corresponding to the third side wall (5013) of the camera housing).

[0183] In the present disclosure, the interaction between the fifth coil (563a) and the third magnet (563b) can be implemented in a Lorenz manner in which the relative separation distance between the coil and the magnet changes in a direction perpendicular to the direction in which they face each other. That is, the AF driving unit (563) can be implemented in a Lorenz manner.

[0184] The camera module (500) can additionally or alternatively perform an AF operation implemented by the interaction between the fifth coil (563a) and the third magnet (563b) in addition to the first OIS operation and the second OIS operation.

[0185] The camera module (500) may include a carrier assembly (520) configured to perform the first OIS operation, the second OIS operation, and the AF operation.

[0186] The camera module (500) may include a carrier assembly (520) that guides the image sensor (503) and the first substrate (510) to reciprocate in a first direction (e.g., X-axis direction) and / or in a second direction (e.g., Y-axis direction) perpendicular to the first direction. In addition, the camera module may include a carrier assembly (520) that guides the image sensor (503) and the first substrate (510) in a third direction (e.g., Z-axis direction) perpendicular to both the first and second directions.

[0187] The carrier assembly (520) may be surrounded by the camera housing (501) and accommodated in the interior space of the camera housing (501). The carrier assembly (520) may include a first carrier (530), a second carrier (540), and a third carrier (550). According to one embodiment, the carrier assembly (520) may include a first carrier (530) coupled to the first substrate (510) and moving relative to the first substrate (510) in a first direction perpendicular to the height direction of the camera housing (501) (e.g., X-axis direction) or in a second direction different from the first direction (e.g., Y-axis direction). Additionally, the carrier assembly (520) may include a second carrier (540) that surrounds at least a portion of the first carrier (530) and moves relative to the camera housing (501) in a first direction (e.g., X-axis direction) that is perpendicular to the height direction of the camera housing (501) or in a second direction (e.g., Y-axis direction) that is different from the first direction. Additionally, the carrier assembly (520) may include a third carrier (550) that surrounds at least a portion of the first carrier (530) and the second carrier (540) and moves relative to the camera housing (501) in a third direction (e.g., Z-axis direction) that is parallel to the height direction of the camera housing (501).

[0188] The first carrier (530) may be formed in a plate shape that is generally parallel to the XY plane. The first carrier (530) may have an opening formed in the center and may include a first plate (531) that surrounds the opening. According to one embodiment, a filter (not shown) may be placed in the opening. For example, an IR Cut filter for blocking infrared (IR) may be placed as the filter, and the IR Cut filter may overlap with the image sensor (503) when placed in the opening. The first carrier (530) may be formed in a plate shape that is generally parallel to the XY plane, and may be configured to be coupled with the first substrate (510) and move in a direction parallel to at least one of the three axes of the orthogonal coordinate system.

[0189] The second carrier (540) may be disposed between the first carrier (530) and the third carrier (550). In one embodiment, the second carrier (540) includes an opening in which the first carrier (530) may be received. In one embodiment, the first carrier (530) and the second carrier (540) may be disposed on substantially the same plane (e.g., a plane parallel to the XY plane). In one embodiment, the second carrier (540) may have a shape surrounding the first carrier (530). The second carrier (540) may include a second plate (541) having a frame shape. One side of the second plate (541) of the second carrier (540) may face one side of the third carrier (550) (e.g., one side of the third plate (551)), and the other side of the second plate (541) may face a part of the substrate (510) (e.g., the third rigid portion (513) described below).

[0190] Referring to FIG. 16, the first coil (561a) and the third coil (562a) included in the driving member (560) may be placed in the camera housing (501), the first magnet (561b) and the second magnet (562b) may be placed in the second carrier (540), and the second coil (561c) and the fourth coil (562c) may be placed in the first carrier (530).

[0191] According to one embodiment, the first coil (561a) may be disposed in a first cover opening (5011a) formed in a base member (501a) of the housing (501), and the third coil (562a) may be disposed in a second cover opening (5012a) formed in the base member (501a) of the housing (501). A first magnet (561b) and a second magnet (562b) may be disposed on a second plate (541) of the second carrier (540). According to one embodiment, the second carrier (540) may include a third protruding support portion (542) protruding in a third direction (e.g., in the Z-axis direction) from the second plate (541) to support the first magnet (561b) and the second magnet (562b). In one embodiment, the first magnet (561b) may be arranged to face a first side wall (e.g., 5011) of the camera housing (501), and the second magnet (562b) may be arranged to face a second side wall (e.g., 5012) of the camera housing (502). In one embodiment, the second coil (561c) may be arranged to face a first protruding support portion (532) protruding in a third direction (e.g., in the Z-axis direction) from the first plate (531) of the first carrier (530), and the fourth coil (562c) may be arranged to face a second protruding support portion (533) protruding in a third direction (e.g., in the Z-axis direction) from the first plate (531) of the first carrier (530).

[0192] The third carrier (550) may be disposed on a surface of the second carrier (540) facing in a third direction (e.g., in the Z-axis direction). According to one embodiment, the third carrier (550) may not be fixedly coupled to the second carrier (540), but may be coupled so that their relative positions are changeable. The third carrier (550) may include a third plate (551) including a surface facing in the third direction (e.g., in the Z-axis direction), and a side wall (552) extending from the third plate (551) in an opposite direction to the third direction (e.g., in the -Z-axis direction). A base member (501a) may be placed on a third plate (551) of a third carrier (550), and a side wall (552) of the third carrier (550) may be at least partially wrapped by a side wall extending from the base member (501a) and / or the cover member (501b) of the housing (501). In one embodiment, the third carrier (550) may be configured to substantially wrap other carriers (e.g., the first carrier (530) and the second carrier (540)).

[0193] The carrier assembly (520) may be a stacked structure in which a second carrier (540) and a third carrier (550) are stacked, with the first carrier (530) being wrapped by the second carrier (540).

[0194] A third guide ball (B3) may be placed between the third carrier (550) and the camera housing (501). A third recess (not shown) is formed on the outer surface of one of the side walls (552) of the third carrier (550), so that the third guide ball (B3) may be accommodated therein. An inner surface recess (not shown) may also be formed on the inner surface of a side wall (e.g., 5013) of the camera housing (501) corresponding to the surface where the third recess (not shown) of the third carrier (550) is formed, so that the third guide ball (B3) may be accommodated therein.

[0195] According to one embodiment, the fifth coil (563a) may be disposed in a third cover opening (5013a) formed in a base member (501a) of the housing (501), and the third magnet (563b) may be disposed in a third carrier (550). The third cover opening (5013a) of the camera housing (501) may be formed in a side wall at a position corresponding to the third magnet (563b). The third magnet (563b) may be disposed in one of the side walls (552) of the third carrier (550) (e.g., 5523). The third magnet (563b) may be placed so as to be erected on one of the side walls (552) of the third carrier (550) (e.g., 5523) so as to form a magnetic field in a direction (e.g., Y-axis direction and X-axis direction) intersecting the third direction (e.g., Z-axis direction). The fifth coil (563a) may also be placed so as to be erected on the side wall of the camera housing (501) so as to face the third magnet (563b).

[0196] When current is applied to the fifth coil (563a), the magnetic field formed by the fifth coil (563a) interacts with the magnetic field formed by the third magnet (563b) in a Lorentz manner, thereby moving the third carrier (550) in a direction parallel to the third direction (e.g., the Z-axis direction). The third driving member (563) including the fifth coil (563a) and the third magnet (563b) may be referred to as an AF driving unit.

[0197] The camera module (500) may further include a fourth carrier (545) positioned between the second carrier (540) and the third carrier (550). FIG. 16 illustrates an embodiment further including a fourth carrier (545), which may be referred to as a middle carrier or middle guide. The fourth carrier (545) may include a body (546).

[0198] According to one embodiment, the second carrier (540), the fourth carrier (545), and the third carrier (550) can be stacked with guide balls (B1, B2) positioned between each element. Accordingly, relative movement between the carriers (540, 545, 550) included in the carrier assembly (520) can be implemented. The first guide ball (B1) can support the fourth carrier (545) while minimizing friction when the relative positions between the second carrier (540) and the fourth carrier (545) change. A first recess (e.g., the first recess (443) of FIG. 6) in which a first guide ball (B1) is seated may be formed in the second carrier (540), and a second recess (e.g., the second recess (447) of FIG. 6) in which a second guide ball (B2) is seated may be formed in the fourth carrier (545). The second carrier (540) may guide a linear reciprocating motion of the first substrate (510) on which the image sensor (503) is positioned in a direction parallel to the first direction (e.g., the X-axis direction) using the first guide ball (B1). The second guide ball (B2) may support the third carrier (550) while minimizing friction when the relative position between the fourth carrier (545) and the third carrier (550) changes. The fourth carrier (545) can guide the first substrate (510) on which the image sensor (503) is arranged to reciprocate linearly in a second direction (e.g., Y-axis direction) different from the first direction using the second guide ball (B2). According to one embodiment, the first substrate (510) can include a first vertical portion (517) that can be arranged at least partially parallel to the sidewall(s) (e.g., 5011, 5012, 5013, 5014, 5015, 5016) of the camera housing (501). According to one embodiment, the first vertical portion (517) can be bent so as to face a plurality of sidewalls among the sidewall(s) (e.g., 5011, 5012, 5013, 5014, 5015, 5016) of the camera housing (501).According to one embodiment, in order to reinforce the rigidity of the bent portion (517') ​​of the first substrate (510), a reinforcing member coupled to the bent portion may be further included.

[0199] The camera module (500) may include a second substrate (570). The second substrate (570) may be connected to the first substrate (510), or may be connected to another external substrate (e.g., a third substrate) without being connected to the first substrate (510). The second substrate (570) may be provided to supply current to the first coil (561a), the second coil (562a), and the third coil (563a) disposed in the camera module (500). The second substrate (570) may be electrically connected to each of the first coil (561a), the second coil (562a), and the third coil (563a). According to one embodiment, the second substrate (570) may include a second vertical substrate (571) disposed along the periphery of the camera housing (501). According to one embodiment, the camera module (500) may have a structure in which the second substrate (570) is arranged to surround the outer surface of the side wall of the base member (501a), and the cover member (501b) is arranged to surround the second substrate (570). For example, in the embodiment of FIG. 16, the first substrate (510) may be arranged between the second substrate (570) and the cover member (501b).

[0200] In one embodiment, the second substrate (570) may include second vertical portion(s) (e.g., 5711, 5712, 5713, 5714, 5715, 5716) having a shape corresponding to the base member (501a) of the camera housing (501). In one embodiment, the second vertical portion(s) may have a portion that is bent when connected to another adjacent second vertical portion. For example, a bent portion may be formed between the 2-1 vertical portion (5711) and the 2-2 vertical portion (5712). In order to reinforce the rigidity of such a bent portion in the second substrate (570), a reinforcing member coupled to the bent portion may be further included.

[0201] In one embodiment, the second substrate (570) may be formed of a flexible printed circuit board (FPCB). In one embodiment, the second substrate (570) may be formed as a single substrate that is indistinguishable from the first substrate (510).

[0202] The camera module (500) of the present disclosure may have a structure in which a second carrier (540) for OIS operation is arranged inside a third carrier (550) for AF operation. The camera module (500) of the present disclosure may have a first carrier (530) arranged inside the second carrier (540). When the camera module (500) of the present disclosure is viewed from above, the third carrier (550), the second carrier (540), and the first carrier (530) may be arranged sequentially from the outside to the inside of the camera module (500).

[0203] The first OIS driving unit (561) can perform the first OIS operation by the interaction between the first coil (561a) and the first magnet (561b), and / or by the interaction between the first magnet (561b) and the second coil (561c). The first OIS driving unit (561) can include a 1-1 OIS driving unit and a 1-2 OIS driving unit. For example, the 1-1 OIS operation by the 1-1 OIS driving unit can be implemented first, and then the 1-2 OIS operation by the 1-2 OIS driving unit can be implemented. Alternatively, the 1-2 OIS operation by the 1-2 OIS driving unit can be implemented first, and then the 1-1 OIS operation by the 1-1 OIS driving unit can be implemented. Alternatively, the 1-1 OIS operation by the 1-1 OIS driving unit and the 1-2 OIS operation by the 1-2 OIS driving unit may be implemented simultaneously or together.

[0204] The second OIS driving unit (562) can perform the second OIS operation by the interaction between the third coil (562a) and the second magnet (561b), and / or by the interaction between the second magnet (562b) and the 24th coil (562c). The second OIS driving unit (562) can include a 2-1 OIS driving unit and a 2-2 OIS driving unit. For example, the 2-1 OIS operation by the 2-1 OIS driving unit can be implemented first, and then the 2-2 OIS operation by the 2-2 OIS driving unit can be implemented. Alternatively, the 2-2 OIS operation by the 2-2 OIS driving unit can be implemented first, and then the 2-1 OIS operation by the 2-1 OIS driving unit can be implemented. Alternatively, the 2-1 OIS operation by the 2-1 OIS driving unit and the 2-2 OIS operation by the 2-2 OIS driving unit may be implemented simultaneously or together.

[0205] Referring to FIG. 17, the first substrate (510) may be divided into a plurality of parts. For example, the first substrate (510) may include a first rigid part (511), a slit part (512) connected to the first rigid part (511), and a second rigid part (513) connected to the slit part (512).

[0206] Although not shown, the first substrate (510) may include a first vertical substrate (e.g., the first vertical substrate (414, 415) of FIG. 6) extending in a third direction (e.g., in the Z-axis direction) from the first rigid portion (511). The first vertical substrate may be provided for supplying current to the second coil (561c) and the fourth coil (562c) disposed on the first carrier (530).

[0207] The slit portion (512) may be deformable in a direction parallel to the optical axis or perpendicular to the optical axis. According to one embodiment, the first rigid portion (511) may be coupled with the first carrier (530). For example, the first rigid portion (511) may be attached to the back surface of the first plate (531) of the first carrier (530). The second rigid portion (513) may be coupled with the second carrier (540). The slit portion (512) may electrically connect the first rigid portion (511) and the second rigid portion (513) while protecting the first substrate (510) from physical impact when the carrier assembly (520) moves.

[0208] The slit portion (512) of the first substrate (510) may be configured with a plurality of layers, so that signal wiring arrangements for the plurality of layers may be possible. According to one embodiment, the slit portion (512) may be configured in a form that is relatively non-deformable in a direction parallel to a third direction (e.g., Z-axis direction) and relatively easily deformable in a first direction (e.g., X-axis direction) or a second direction (e.g., Y-axis direction). The restriction on deformation in a direction parallel to the third direction (e.g., Z-axis direction) may be implemented by appropriately setting the thickness and material of the slit portion (512). Facilitating deformation in a direction (e.g., X-axis direction) or a second direction (e.g., Y-axis direction) may be implemented by appropriately setting the number or spacing of slits. For example, at least a portion of the slit portion (512) may be configured to be thick in a direction parallel to a third direction (e.g., a Z-axis direction) and thin in a first direction (e.g., an X-axis direction) or a second direction (e.g., a Y-axis direction).

[0209] The slit portion (512) of the first substrate (510) can be electrically connected to the first rigid portion (511) on which the image sensor (503) is placed and the second rigid portion (513) on which the second carrier (540) is coupled. The second rigid portion (513) of the first substrate (510) can be connected to a flexible portion (516) configured so that the electrical connection can be stably maintained without causing any restrictions on the operation of the second carrier (540) and / or the third carrier (550).

[0210] Hereinafter, the arrangement relationship of the first driving member and the second driving member and the resulting shake compensation operation according to various embodiments will be described through the embodiments of FIGS. 18 to 20c.

[0211] FIG. 18 is a drawing showing the arrangement relationship of the first driving member and the second driving member included in the camera module and the direction of the shake correction operation (inner / outer two-axis driving) according to one embodiment.

[0212] According to the embodiment of FIG. 18, a first driving member (661) (first OIS driving unit (e.g., DX of FIG. 7)) is illustrated, which includes a first coil (661a), a first magnet (661b), and a second coil (661c) sequentially arranged in a direction from the outside to the inside of the camera module inside the camera housing (601). In addition, a second driving member (662) (second OIS driving unit (e.g., DY of FIG. 7)) is illustrated, which includes a third coil (662a), a second magnet (662b), and a fourth coil (662c) sequentially arranged in a direction from the outside to the inside of the camera module inside the camera housing (601).

[0213] The 1-1 OIS driving unit (e.g., DX1 in FIG. 7) may implement the 1-1 OIS operation by interaction between the first coil (661a) and the first magnet (661b), and the 1-2 OIS driving unit (e.g., DX2 in FIG. 7) may implement the 1-2 OIS operation by interaction between the first magnet (661b) and the second coil (661c). The 2-1 OIS driving unit (e.g., DY1 in FIG. 7) may implement the 2-1 OIS operation by interaction between the third coil (662a) and the second magnet (662b), and the 2-2 OIS driving unit (e.g., DY2 in FIG. 7) may implement the 2-2 OIS operation by interaction between the second magnet (662b) and the fourth coil (662c).

[0214] Since the OIS operation of the present disclosure is implemented by controlling the position between a second carrier (e.g., the second carrier (440) of FIG. 6, the second carrier (540) of FIG. 16) and a first carrier disposed inside the second carrier (e.g., the first carrier (430) of FIG. 6, the first carrier (530) of FIG. 16)), a sensor capable of detecting the positions of the second carrier and the first carrier may be required for feedback control of the position. In the embodiment of FIG. 18, a sensor (S) is illustrated disposed inside a coil, which may refer to a sensor (S1) disposed inside a coil of FIG. 4.

[0215] According to the embodiment of FIG. 18, the camera module may include a first-first OIS driving unit (e.g., DX1 of FIG. 7) and a first-second OIS driving unit (e.g., DX2 of FIG. 7) each driving in the X-axis direction, and may include a second-first OIS driving unit (e.g., DY1 of FIG. 7) and a second-second OIS driving unit (e.g., DY2 of FIG. 7) each driving in the Y-axis direction. That is, the embodiment illustrated in FIG. 18 discloses a camera module that drives in two axis directions, both internally and externally. FIG. 19A is a diagram illustrating an arrangement relationship of a first driving member and a second driving member included in a camera module and a direction of a shake correction operation (external three-axis / internal two-axis driving) according to an embodiment. FIG. 19b is a drawing illustrating the arrangement relationship of the first driving member and the second driving member included in the camera module and the direction of the shake correction operation (external 3-axis / internal 2-axis driving) according to one embodiment.

[0216] According to the embodiment of FIGS. 19a and 19b, a first driving member (661) (first OIS driving unit (e.g., DX of FIG. 7)) is illustrated, which includes a first coil (661a), a first magnet (661b), and a second coil (661c) sequentially arranged in a direction from the outside to the inside of the camera module inside the camera housing (601). In addition, a second driving member (662) (second OIS driving unit (e.g., DY of FIG. 7)) is illustrated, which includes a third coil (662a), a second magnet (662b), and a fourth coil (662c) sequentially arranged in a direction from the outside to the inside of the camera module inside the camera housing (601).

[0217] FIG. 19a discloses a camera module including a third coil (662a) including a 3-1 coil (6621a) and a 3-2 coil (6622a), but the arrangement of the remaining coils and magnets is similar to the embodiment of FIG. 18. According to the embodiment of FIG. 19a, the camera module may include a 1-1 OIS driving unit (e.g., DX1 of FIG. 7) and a 1-2 OIS driving unit (e.g., DX2 of FIG. 7) each driving in the X-axis direction, and may include a 2-1 OIS driving unit (e.g., DY1 of FIG. 7) and a 2-2 OIS driving unit (e.g., DY2 of FIG. 7) each driving in the Y-axis direction. Furthermore, the camera module of FIG. 19a may include a 2-1 OIS driving unit including two coils (6621a, 6622a) facing one side of a second magnet (662b).

[0218] In addition, the camera module according to the embodiment illustrated in FIG. 19a may include two sensors (S) corresponding to the two coils (6621a, 6622a), respectively. Here, the two sensors (S) are sensors (S1) disposed inside the coils illustrated in FIG. 4, and the magnetic flux passing through the centers of the two coils (6621a, 6622a) can be measured through the two sensors (S). In various embodiments of the present disclosure, when a plurality of coils are provided, a driver channel (or signal line) for controlling the coils is connected to each of the plurality of coils, and the driver channel (or signal line) may be configured to apply current to each coil under the control of a controller (704) described later in FIG. 21. According to one embodiment, when a magnetic flux passing through the center of a coil is measured through a sensor (S) placed at the center of the coil, a magnetic force can be generated between the coil and a magnet facing it by controlling the direction and / or magnitude of a current flowing through the coil in response to the measured magnetic flux. In the description of the present disclosure, the ability to measure a magnetic flux passing through the center of a coil through a sensor can be understood as enabling control of the coil.

[0219] According to the embodiment illustrated in FIG. 19a, the camera module may be capable of controlling each of the two coils (6621a, 6622a) arranged in the 2-1 OIS driving unit. The camera module may perform rotation control (rolling control) by independently controlling the current applied to each of the two coils (6621a, 6622a).

[0220] FIG. 19a illustrates that the third coil (662a) is separated into two coils (6621a, 6622a) and the first coil (661a) is provided as a single coil. However, unlike what is illustrated in the drawing, it is also possible for the third coil (662a) to be provided as a single coil and the first coil (661a) to be separated into two coils. The description of FIG. 19a above can also be applied to an embodiment in which the third coil (662a) is provided as a single coil and the first coil (661a) is separated into two coils.

[0221] The camera module of Fig. 19a discloses a camera module capable of linear motion along two axes internally and rotational motion along two axes externally. This can be simply referred to as a "camera module capable of external three-axis / internal two-axis operation."

[0222] FIG. 19b discloses a camera module including a first coil (661a) including a first-1 coil (6611a) and a first-2 coil (6612a), and a third coil (662a) including a third-1 coil (6621a) and a third-2 coil (6622a), but the arrangement of the remaining coils and magnets is similar to that of the embodiment of FIG. 19a.

[0223] According to the embodiment of FIG. 19b, the camera module may include a 1-1 OIS driving unit including two coils (6611a, 6612a) facing a first magnet (661b), and a 2-1 OIS driving unit including two coils (6621a, 6622a) facing a second magnet (662b). The embodiment of FIG. 19b discloses a camera module including two sensors (S) in the 2-1 OIS driving unit and one sensor (S) in the 1-1 OIS driving unit. Here, the two sensors (S) arranged in the 2-1 OIS driving unit are arranged at the center of each of the two coils (6621a, 6622a), and the one sensor (S) arranged in the 1-1 OIS driving unit can be arranged between the two coils (6611a, 6612a). Accordingly, the two sensors (S) arranged in the 2-1 OIS driving unit are sensors (S1) arranged inside the coils illustrated in FIG. 4, and can measure the magnetic flux passing through the centers of the two coils (6621a, 6622a), respectively, and the one sensor (S) arranged in the 1-1 OIS driving unit is a sensor (S2) arranged between the coils illustrated in FIG. 4, and can measure the magnetic flux between the first coil (661a) and the first magnet (661b). The 2-1 OIS driving unit can control rotation because it can measure the magnetic flux passing through the centers of the two coils (6621a, 6622a) through the two sensors (S), but the 1-1 OIS driving unit can only measure the magnetic flux of the first magnet (661b) through one sensor (S) placed between the coils, so it may be difficult to control rotation.

[0224] Referring to FIGS. 19A and 19B together, even if multiple coils are provided, if the sensor is not positioned at the center of each of the multiple coils, it may be difficult to control each coil. For example, the embodiment of FIG. 19B is illustrated as including (or separating) the 1-1 OIS driving unit from the embodiment of FIG. 19A in that it includes multiple coils, but may be a 'camera module capable of external 3-axis / internal 2-axis driving' that is driven by substantially the same principle as that of FIG. 19A.

[0225] According to the embodiment of FIGS. 19c and 19d, a first driving member (661) (first OIS driving unit (e.g., DX of FIG. 7)) is illustrated, which includes a first coil (661a), a first magnet (661b), and a second coil (661c) sequentially arranged in a direction from the outside to the inside of the camera module inside the camera housing (601). In addition, a second driving member (662) (second OIS driving unit (e.g., DY of FIG. 7)) is illustrated, which includes a third coil (662a), a second magnet (662b), and a fourth coil (662c) sequentially arranged in a direction from the outside to the inside of the camera module inside the camera housing (601).

[0226] FIG. 19c discloses a camera module including a fourth coil (662c) including a 4-1 coil (6621c) and a 4-2 coil (6622c), but the arrangement of the remaining coils and magnets is similar to the embodiment of FIG. 18. According to the embodiment of FIG. 19c, the camera module may include a 1-1 OIS driving unit (e.g., DX1 of FIG. 7) and a 1-2 OIS driving unit (e.g., DX2 of FIG. 7) each driving in the X-axis direction, and may include a 2-1 OIS driving unit (e.g., DY1 of FIG. 7) and a 2-2 OIS driving unit (e.g., DY2 of FIG. 7) each driving in the Y-axis direction. Furthermore, the camera module of FIG. 19c may include a second-second OIS driving unit including two coils (6621c, 6622c) facing the other surface of the second magnet (662b).

[0227] FIG. 19a discloses a camera module in which the outer 2-1 OIS driving unit includes a plurality of coils (6621a, 6622a) and the inner 2-2 OIS driving unit is composed of a single coil (662c). In contrast, FIG. 19c discloses a camera module in which the outer 2-1 OIS driving unit includes a single coil (662a) and the inner 2-2 OIS driving unit includes a plurality of coils (6621c, 6622c). FIG. 19d discloses a camera module in which, unlike FIG. 19c, the 1-2 OIS driving unit includes a plurality of coils (6611c, 6612c) rather than a single coil. The description of the embodiments of FIGS. 19a and 19b may be applied to the embodiments of FIGS. 19c and 19d. However, it should be noted that the arrangement of the coil and magnet of the present disclosure, and the arrangement of the sensor, are not limited to the above-described embodiments and may vary depending on the embodiment.

[0228] Referring to FIGS. 19a to 19d, the first driving member (first OIS driving unit) and the second driving member (second OIS driving unit) for OIS driving can be driven not only in two axes in the X-axis direction and the Y-axis direction, but also in rotation control (or rolling control) depending on the configuration and arrangement of the coil and the magnet. In each axial direction, since independent configuration and arrangement are possible for the 1-1 OIS driving unit and the 2-1 OIS driving unit closer to the outside of the camera module, and the 1-2 OIS driving unit and the 2-2 OIS driving unit arranged inside the camera module, rotation control (or rolling control) can also be possible by utilizing these characteristics. For example, referring to FIGS. 19c and 19d, the 1-1 OIS driving unit and the 2-1 OIS driving unit, which are closer to the outside of the camera module, can drive in the X-axis direction and the Y-axis direction, respectively, and the 1-2 OIS driving unit and the 2-2 OIS driving unit, which are arranged inside the camera module, can perform rotation control (or rolling control) in addition to driving in the X-axis direction and the Y-axis direction. For example, in order to perform rotation control (or rolling control), a plurality of coils must be arranged in at least one axial direction of the X-axis direction and the Y-axis direction, and each coil must be independently current-controlled. Even if a plurality of coils are arranged, if they are connected in series or in parallel and current is controlled according to a single signal line, rotation control (or rolling control) may be difficult.

[0229] According to one embodiment, among the 1-1 OIS driving unit and / or the 2-1 OIS driving unit control (outer OIS control) close to the outside of the camera module and the 1-2 OIS driving unit and / or the 2-2 OIS driving unit control (inner OIS control) disposed inside the camera module, in the case of an embodiment for controlling the 1-1 OIS driving unit and / or the 2-1 OIS driving unit having a relatively larger mass (e.g., the embodiments of FIGS. 19a and 19b), more power may be consumed. Accordingly, an embodiment for adding rotation control (or rolling control) to the 1-2 OIS driving unit and / or the 2-2 OIS driving unit control (inner OIS control) disposed inside the camera module (e.g., the embodiments of FIGS. 19c and 19d) may have a relatively advantage in terms of lower power consumption.

[0230] According to one embodiment, for example, in the case of an embodiment (the embodiment of FIG. 14b) that does not have the fourth carrier (450) as a middle guide, the first-first OIS driving unit and / or the second-first OIS driving unit close to the outside of the camera module may be implemented to enable rotation control at least as in the embodiments illustrated in FIGS. 19a and 19b. According to one embodiment of the present disclosure, since the first PCB (410) includes a slit portion (412), and this slit portion (412) can affect rotation, in the case of an embodiment (the embodiment of FIG. 14b) that does not have the fourth carrier (450), applying the embodiments of FIGS. 19a and 19b may be more advantageous than applying the embodiments of FIGS. 19c and 19d.

[0231] FIG. 20A is a diagram illustrating an arrangement relationship of a first driving member and a second driving member included in a camera module and a direction of a shake correction operation (inner / outer three-axis drive) according to the arrangement relationship. FIG. 20B is a diagram illustrating an arrangement relationship of a first driving member and a second driving member included in a camera module and a direction of a shake correction operation (inner / outer three-axis drive) according to the arrangement relationship. FIG. 20C is a diagram illustrating an arrangement relationship of a first driving member and a second driving member included in a camera module and a direction of a shake correction operation (inner / outer three-axis drive) according to the arrangement relationship.

[0232] According to the embodiments of FIGS. 20A to 20C, a first driving member (661) (first OIS driving unit (e.g., DX of FIG. 7)) is illustrated, which includes a first coil (661a), a first magnet (661b), and a second coil (661c) sequentially arranged in a direction from the outside to the inside of the camera module inside the camera housing (601). In addition, a second driving member (662) (second OIS driving unit (e.g., DY of FIG. 7)) is illustrated, which includes a third coil (662a), a second magnet (662b), and a fourth coil (662c) sequentially arranged in a direction from the outside to the inside of the camera module inside the camera housing (601).

[0233] According to the embodiment of FIG. 20a, a first coil (661a) including a first-first coil (6611a) and a first-second coil (6612a) may be included, and a second coil (662a) including a second-first coil (6611c) and a second-second coil (6612c) may be included. In addition, a sensor for measuring the central magnetic flux of the coil may be placed at the center of each coil (6611a, 6612a, 6611c, 6612c). Each of the above coils (6611a, 6612a, 6611c, 6612c) is connected to a driver channel (or signal line), and each of the coils (6611a, 6612a, 6611c, 6612c) can be controlled from a controller (e.g., a controller (704) described later in FIG. 21) through each driver channel (or signal line).

[0234] Although the embodiment of FIG. 20a illustrates that the inner coil and the outer coil of the first OIS driving unit each include multiple coils, this can be applied to an embodiment in which the inner coil and the outer coil of the second OIS driving unit each include multiple coils.

[0235] In the embodiments of FIGS. 18 to 20A, the magnets are provided as magnets polarized only inwardly / outwardly, but the embodiments of the present disclosure are not necessarily limited thereto. For example, in the embodiment of FIG. 20B, a magnet (e.g., 661b) polarized leftward / rightwardly along with inwardly / outwardly (or forward / backward) polarization may be provided as the magnet. For example, the camera module according to the embodiment of FIG. 20B may include a first magnet (661b) including a first-first magnet (6611b) and a first-second magnet (6612b). For example, when at least one of the 1-1 OIS driving unit, the 1-2 OIS driving unit, the 2-1 OIS driving unit, and the 2-2 OIS driving unit includes a plurality of coils, if the magnets corresponding to the plurality of coils are provided as a plurality of magnets, the centers of the plurality of coils and the centers of the magnets can be aligned to enable more precise control.

[0236] According to the embodiment of FIG. 20c, a camera module is disclosed, which includes a first coil (661a) including a first-1 coil (6611a) and a first-2 coil (6612a), a second coil (661c) including a second-1 coil (6611c) and a second-2 coil (6612c), a third coil (662a) including a third-1 coil (6621a) and a third-2 coil (6622a), and a fourth coil (662c) including a fourth-1 coil (6621c) and a fourth-2 coil (6622c). According to the embodiment of FIG. 20c, the first-1 OIS driving unit may include a sensor disposed between coils, and the first-2 OIS driving unit may include a sensor disposed at the center of each of a plurality of coils. In addition, according to the embodiment of FIG. 20c, the 2-1 OIS driving unit may have a sensor positioned at the center of each of the plurality of coils, and the 2-2 OIS driving unit may have a sensor positioned between the coils. Accordingly, the embodiment of FIG. 20c may enable inward rotation control through the 1-2 OIS driving unit, and outward rotation control through the 2-1 OIS driving unit.

[0237] Referring to FIGS. 18 to 20c, it can be confirmed that the camera module of the present disclosure can be configured such that the first driving member (the first OIS driving unit (e.g., DX of FIG. 7)) and / or the second driving member (the second OIS driving unit (e.g., DY of FIG. 7)) for driving OIS can be driven not only in two axes in the X-axis direction and the Y-axis direction, but also in rotation control (or rolling control) depending on the configuration and arrangement of the coil and magnet. Referring to the embodiments of FIGS. 18 to 20c, the 1-1 OIS driving unit (e.g., DX1 of FIG. 7)) and the 2-1 OIS driving unit (e.g., DY1 of FIG. 7)) located near the outside of the camera module can perform rotation control in addition to driving in the X-axis direction and the Y-axis direction, respectively, and additionally or alternatively, the 1-2 OIS driving unit (e.g., DX2 of FIG. 7)) and the 2-2 OIS driving unit (e.g., DY2 of FIG. 7)) located inside the camera module can also perform rotation control in addition to driving in the X-axis direction and the Y-axis direction. However, the arrangement of the coil and magnet of the present disclosure, and the arrangement of the sensor, are not limited to the above-described embodiments and may vary depending on the embodiments.

[0238] Hereinafter, with reference to the embodiments of FIGS. 21 to 23, a method for controlling the OIS operation of a camera module of the present disclosure (e.g., a camera module (400) of FIGS. 5 to 15b, and a camera module (500) of FIGS. 16 to 17) and an electronic device including the same (e.g., an electronic device (101) of FIGS. 1 to 3) will be described.

[0239] FIG. 21 is a block diagram illustrating a signal transmission flow of elements for controlling the OIS operation of a camera module according to one embodiment. FIG. 22 is a flowchart illustrating various OIS operations according to frequency according to one embodiment. FIG. 23 is a flowchart illustrating various OIS operations according to accessory connection according to one embodiment.

[0240] An OIS system for controlling OIS operation may basically include an angular velocity sensor (e.g., a gyro sensor) and a controller (704) that calculates the movement amount of the OIS drive unit by calculating the angular velocity sensor value measured by the angular velocity sensor. The controller may also perform AF control, but since the present disclosure mainly refers to only the OIS operation, it may be referred to as an OIS control unit. In addition, the OIS system may control the position of the OIS drive unit with a target value transmitted from the controller (704). Since the OIS drive unit performs feedback control, it may be referred to as a position feedback control unit.

[0241] According to one embodiment, once a processor (701) (e.g., an application processor (AP)) included in an electronic device (e.g., an electronic device (101) of FIGS. 1 to 3) makes settings for a controller (704), the OIS control unit can independently continue to perform OIS operations thereafter.

[0242] According to one embodiment, the controller (704) may be a component integrated into a processor (e.g., AP) included in the electronic device (101), or may be a component (e.g., an integrated circuit (IC)) provided separately from the processor (e.g., AP) included in the electronic device (101).

[0243] According to one embodiment, when an electronic device (101) includes a plurality of camera modules and the plurality of camera modules support an OIS system, the angular velocity sensor values ​​measured by the angular velocity sensor included in the main circuit board may be shared and used by the plurality of camera modules. Alternatively, each camera module may independently mount an angular velocity sensor on the module circuit board.

[0244] In the embodiment of FIG. 21 and below, a single angular velocity sensor (703) (e.g., a gyro sensor) and a controller (704) are depicted as controlling all OIS systems of multiple cameras, but this is not limited thereto.

[0245] Referring to FIG. 21, the controller (704) of the present disclosure may include at least two independent OIS driving units (position feedback control units). Basically, control for a first direction (e.g., X-axis direction) and a second direction (e.g., Y-axis direction) is required, and if rotation control (or rolling control) is included, one more channel may be included. In a camera module according to an embodiment, whether to perform the first OIS operation and / or the second OIS operation may be determined according to a frequency applied to the camera module. In addition, among the first OIS operations, a 1-1 OIS operation by a 1-1 OIS driving unit (DX1) and a 1-2 OIS operation by a 1-2 OIS driving unit (DX2) may be performed separately depending on the frequency applied to the camera module. In addition, among the second OIS operations, the second-1 OIS operation by the second-1 OIS driving unit (DY1) and the second-2 OIS operation by the second-2 OIS driving unit (DY2) can be performed separately depending on the frequency applied to the camera module.

[0246] In the present disclosure, control may be required for the 1-1 OIS driving unit (DX1) and the 2-1 OIS driving unit (DY1) located near the outside of the camera module, and control may be required for the 1-2 OIS driving unit (DX2) and the 2-2 OIS driving unit (DY2) located inside the camera module. In the present disclosure, since two different driving units operate in the same direction (the first direction or the second direction), the movement amount of each driving unit is determined by the controller (704), and after the determination, a target value for each driving unit can be transmitted.

[0247] Referring to FIG. 22, the vibration applied to the electronic device (101) may generally have a small amplitude when it has a high frequency, and may generally have a large amplitude when it has a low frequency.

[0248] In the present disclosure, the 1-1 OIS driving unit (DX1) and the 2-1 OIS driving unit (DY1) located near the outside of the camera module have a large mass and thus may have difficulty operating in response to high frequencies since they move, including the 1-2 OIS driving unit (DX2) and the 2-2 OIS driving unit (DY2) located on the inside of the camera module. Taking this into consideration, the vibration applied to the electronic device (101) may be measured (801) and various modes for OIS operation may be set according to the vibration state (803) to drive the OIS driving unit.

[0249] According to one embodiment, as a first mode (805) for OIS operation, it can be driven only by the 1-2 OIS driving unit (DX2) and the 2-2 OIS driving unit (DY2). In addition, as a second mode (806) for OIS operation, it can be driven only by the 1-1 OIS driving unit (DX1) and the 2-1 OIS driving unit (DY1). In addition, as a third mode (807) for OIS operation, it can be driven together by the 1-1 OIS driving unit (DX1), the 2-1 OIS driving unit (DY1), the 1-2 OIS driving unit (DX2), and the 2-2 OIS driving unit (DY2).

[0250] For example, when the vibration applied to the electronic device (101) has a relatively higher frequency (e.g., mid in FIG. 22), it can be driven only by the 1-2 OIS driving unit (DX2) and the 2-2 OIS driving unit (DY2) arranged on the inside of the camera module having a small mass. When the vibration applied to the electronic device (101) has a relatively low frequency (e.g., low in FIG. 22), it can be driven only by the 1-1 OIS driving unit (DX1) and the 2-1 OIS driving unit (DY1) located near the outside of the camera module. Meanwhile, when the vibration applied to the electronic device (101) has a very high frequency (e.g., high in FIG. 22) or a large OIS movement amount is required (e.g., high displacement mode), the 1-1 OIS driving unit (DX1), the 2-1 OIS driving unit (DY1), the 1-2 OIS driving unit (DX2), and the 2-2 OIS driving unit (DY2) may be driven together.

[0251] The various modes for the OIS operation of the camera module can be configured to be set based on input from the user's mode selection or based on mounting of the electronic device to other electronic devices (e.g., connecting an accessory).

[0252] Referring to FIG. 23, for example, when the camera module is mounted on a drone or mounted on a motorcycle mount, a high displacement mode is required, and in this case, the 1-1 OIS driving unit (DX1), the 2-1 OIS driving unit (DY1), the 1-2 OIS driving unit (DX2), and the 2-2 OIS driving unit (DY2) close to the outside of the camera module can be set to be driven together. When the 1-1 OIS driving unit (DX1), the 2-1 OIS driving unit (DY1), the 1-2 OIS driving unit (DX2), and the 2-2 OIS driving unit (DY2) are driven together, the target values ​​for the 1-1 OIS driving unit (DX1) and the 2-1 OIS driving unit (DY1) and the target values ​​for the 1-2 OIS driving unit (DX2) and the 2-2 OIS driving unit (DY2) can be equally distributed or with weights assigned to one of them. When distribution is performed with weights, a weight can be assigned to a driving unit with lower power consumption based on the same displacement amount. This can be used by obtaining the current consumption data for each driving distance in advance and storing it in the memory (705) as a lookup table of the minimum current condition for each combined driving distance.

[0253] If the input is based on the user's mode selection or the electronic device is not mounted on another electronic device (e.g., connected to an accessory), it can be operated in various modes according to the vibration state as shown in Fig. 22.

[0254] Electronic devices according to various embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0255] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0256] The term "module" used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integrally formed component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0257] Various embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0258] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0259] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0260] According to one embodiment of the present disclosure, a camera module (400; 500) may be provided. The camera module (400; 500) includes a camera housing (401; 501) including a first side wall (4011; 5011), a second side wall (4012; 5012) facing in a different direction from the first side wall, and a third side wall (4013; 5013) facing in a different direction from the first and second side walls; a lens assembly (402; 502) including at least one lens (402a; 502a) and a lens barrel (402b; 502b); a first PCB (410; 510) on which an image sensor (403; 503;) is arranged; And it may include a driving member (460; 560) configured to move the first PCB (410; 510) in a direction intersecting an optical axis defined as an optical movement path between at least one lens (402a; 502a) and the image sensor (403; 503). The driving member (460; 560) may include a first coil (461a; 561a), a first magnet (461b; 561b), and a second coil (461c; 561c) sequentially arranged in a direction from the outside to the inside of the camera module at positions corresponding to the first side wall (4011; 5011), and a third coil (462a; 562a), a second magnet (462b; 562b), and a fourth coil (462c; 562c) sequentially arranged in a direction from the outside to the inside of the camera module at positions corresponding to the second side wall (4012; 5012).

[0261] According to one embodiment, the camera module may include a controller (704) and a memory (702) storing instructions that, when executed by the controller, cause the following operations of the camera module: a first OIS operation performed by an interaction between the first coil (461a; 561a) and the first magnet (461b; 561b), and / or by an interaction between the first magnet (461b; 561b) and the second coil (461c; 561c); and may include a second OIS operation performed by the interaction between the third coil (462a; 562a) and the second magnet (462b; 562b), and / or by the interaction between the second magnet (462b; 562b) and the fourth coil (462c; 562c).

[0262] According to one embodiment, the first OIS operation may include a 1-1 OIS operation performed by an interaction between the first coil (461a; 561a) and the first magnet (461b; 561b), a 1-2 OIS operation performed by an interaction between the first magnet (461b; 561b) and the second coil (461c; 561c), or an operation including both the 1-1 OIS operation and the 1-2 OIS operation. The second OIS operation may include a 2-1 OIS operation performed by interaction between the third coil (462a; 562a) and the second magnet (462b; 562b), a 2-2 OIS operation performed by interaction between the second magnet (462b; 562b) and the fourth coil (462c; 562c), or an operation including both the 2-1 OIS operation and the 2-2 OIS operation.

[0263] According to one embodiment, the interaction between the first coil (461a; 561a) and the first magnet (461b; 561b), the interaction between the first magnet (461b; 561b) and the second coil (461c; 561c), the interaction between the third coil (462a; 562a) and the second magnet (462b; 562b), and the interaction between the second magnet (462b; 562b) and the fourth coil (462c; 562c) can be implemented in a solenoid manner configured to generate a driving force in a direction parallel to the direction in which a specific coil and a specific magnet face each other and / or in a Lorentz manner configured to generate a driving force in a direction perpendicular to the direction in which a specific coil and a specific magnet face each other.

[0264] According to one embodiment, the driving member (460; 560) may include a fifth coil (463a; 463a) and a third magnet (463b; 563b) sequentially arranged in a direction from the outside to the inside of the camera module at positions corresponding to the third side wall (4013; 5013).

[0265] According to one embodiment, the following operations may additionally or alternatively include an AF operation performed by interaction between the fifth coil (463a; 563a) and the third magnet (463b; 563b) with respect to the first OIS operation and the second OIS operation.

[0266] According to one embodiment, the interaction between the fifth coil and the third magnet can be driven in a Lorentz type manner in which the relative separation between the fifth coil and the third magnet changes in a direction perpendicular to the direction in which they face each other.

[0267] According to one embodiment, the first PCB (410; 510) may include a slit portion (412; 512) that is deformable in a direction parallel to the optical axis or in a direction perpendicular to the optical axis.

[0268] According to one embodiment, the first PCB may include a first rigid portion (411; 511) on which the image sensor is arranged, a slit portion (412; 512) connected to the first rigid portion, and a second rigid portion (413; 513) connected to the slit portion.

[0269] According to one embodiment, the camera housing may include a first carrier (430; 530) coupled to the first substrate and movable relative to the first substrate in a first direction perpendicular to the height direction of the camera housing or in a second direction different from the first direction; a second carrier (440; 540) surrounding at least a portion of the first carrier and movable relative to the first substrate in the first direction perpendicular to the height direction of the camera housing or in the second direction different from the first direction; and a third carrier (450; 550) surrounding at least a portion of the first carrier (430; 530) and the second carrier (440; 540) and movable relative to the first substrate in a third direction parallel to the height direction of the camera housing.

[0270] According to one embodiment, the second carrier (440; 540) may be arranged substantially on the same plane as the first carrier (430; 530), include an opening for receiving a first plate (431; 531) of the first carrier (430; 530), and include a second plate (441; 541) coupled with a rigid portion (413; 513) of the first PCB (410; 510).

[0271] According to one embodiment, the first coil (461a; 561a) and the third coil (462a; 562a) may be disposed in the camera housing, the first magnet (461b; 561b) and the second magnet (462b; 562b) may be disposed in the second carrier (440; 540), and the second coil (461c; 561c) and the fourth coil (462c; 562c) may be disposed in the first carrier (430; 440).

[0272] According to one embodiment, a fourth carrier (445) may be further included, positioned between the second carrier (440) and the third carrier (440).

[0273] According to one embodiment, the camera housing may include a second PCB arranged along at least a portion of the perimeter of the camera housing and configured to apply current to the first coil (461a) and the third coil (462a).

[0274] According to one embodiment, whether the first OIS operation and / or the second OIS operation is performed may be determined depending on the frequency applied to the camera module.

[0275] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device (101) may include a housing (201); a camera module (400; 500) including a controller (704); at least one processor (701); and a memory (702) storing instructions that, when executed by the controller or the at least one processor, cause the following operations of the camera module. The camera module (400; 500) may include a camera housing (401; 501) including a first sidewall (4011; 5011), a second sidewall (4012; 5012) facing a different direction from the first sidewall, and a third sidewall (4013; 5013) facing a different direction from the first and second sidewalls. A lens assembly (402; 502) including at least one lens (402a; 502a) and a lens barrel (402b; 502b); a first PCB (410; 510) on which an image sensor (403; 503;) is arranged; And configured to move the first PCB (410; 510) in a direction intersecting an optical axis defined as an optical movement path between the at least one lens (402a; 502a) and the image sensor (403; 503), and including a first coil (461a; 561a), a first magnet (461b; 561b), and a second coil (461c; 561c) sequentially arranged in a direction from the outside to the inside of the camera module at a position corresponding to the first side wall (4011; 5011), and a third coil (462a; 562a), a second magnet (462b; 562b), and a fourth coil (462c; 561c) sequentially arranged in a direction from the outside to the inside of the camera module at a position corresponding to the second side wall (4012; 5012). It may include a driving member (460; 560) including 562c).The above-described following operations may include a first OIS operation performed by interaction between the first coil (461a; 561a) and the first magnet (461b; 561b), and an interaction between the first magnet (461b; 561b) and the second coil (461c; 561c); and a second OIS operation performed by interaction between the third coil (462a; 562a) and the second magnet (462b; 562b), and an interaction between the second magnet (462b; 562b) and the fourth coil (462c; 562c).

[0276] According to one embodiment, the camera module may include a fifth coil (463a; 463a) and a third magnet (463b; 563b) sequentially arranged in a direction from the outside to the inside of the camera module at positions corresponding to the third side wall (4013; 5013). The following operations may additionally or alternatively include an AF operation performed by interaction between the fifth coil (463a; 463a) and the third magnet (463b; 563b) with respect to the first OIS operation and the second OIS operation.

[0277] According to one embodiment, the first PCB (410; 510) may include a first rigid portion (411; 511) on which the image sensor is mounted, a slit portion (412; 512) that can be deformed in a direction parallel to the optical axis or perpendicular to the optical axis, and a second rigid portion (413; 513) connected from the slit portion.

[0278] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device (101) may include a housing (201); a camera module (400; 500) including a controller (704); at least one processor (701); and a memory (702) that stores instructions that, when executed by the controller or the at least one processor, cause the following operations of the camera module. The camera module (400; 500) may include a camera housing (401; 501); a first coil (461a; 561a), a first magnet (461b; 561b), and a second coil (461c; 561c) sequentially arranged in a direction from the outside to the inside of the camera module corresponding to a first position of the camera housing; And may include a third coil (462a; 562a), a second magnet (462b; 562b) and a fourth coil (462c; 562c) sequentially arranged in a direction from the outside to the inside of the camera module corresponding to the second position of the camera housing. The following operations are performed by an interaction between the first coil (461a; 561a) and the first magnet (461b; 561b), and / or a first OIS operation performed by an interaction between the first magnet (461b; 561b) and the second coil (461c; 561c); And a second OIS operation performed by the interaction between the third coil (461a; 561a) and the second magnet (462b; 562b), and / or by the interaction between the second magnet (462b; 562b) and the fourth coil (462c; 562c), wherein the first OIS operation or the second OIS operation may be performed alone, or the first OIS operation and the second OIS operation may be performed together, depending on the frequency applied to the camera module.

[0279] According to one embodiment, the camera module may include a fifth coil (463a; 463a) and a third magnet (463b; 563b) sequentially arranged in a direction from the outside to the inside of the camera module at positions corresponding to the third side wall (4013; 5013). The following operations may additionally or alternatively include an AF operation performed by interaction between the fifth coil (463a; 463a) and the third magnet (463b; 563b) with respect to the first OIS operation and the second OIS operation.

[0280] According to one embodiment of the present disclosure, a camera module (400; 500) may be provided. The camera module (400; 500) includes a camera housing (401; 501) including a first side wall (4011; 5011), a second side wall (4012; 5012) facing in a different direction from the first side wall, and a third side wall (4013; 5013) facing in a different direction from the first and second side walls; a lens assembly (402; 502) including at least one lens (402a; 502a) and a lens barrel (402b; 502b); a first PCB (410; 510) on which an image sensor (403; 503;) is arranged; And a driving member (460; 560) configured to move the first PCB (410; 510) in a direction intersecting an optical axis defined as an optical movement path between the at least one lens (402a; 502a) and the image sensor (403; 503), wherein the driving member (460; 560) includes a first coil (461a; 561a), a first magnet (461b; 561b), and a second coil (461c; 561c) arranged at positions corresponding to the first side wall (4011; 5011), and a third coil (462a; 562a), a second magnet (462b; 562b), and a fourth coil (462c; 561c) arranged at positions corresponding to the second side wall (4012; 5012). 562c) may be included. According to one embodiment, the first coil (461a; 561a), the first magnet (461b; 561b), and the second coil (461c; 561c) may be sequentially arranged in a direction parallel to the optical axis, and additionally or alternatively, the third coil (462a; 562a), the second magnet (462b; 562b), and the fourth coil (462c; 562c) may be sequentially arranged in a direction parallel to the optical axis.

[0281] While this disclosure has been described by way of example and illustration, it should be understood that these various embodiments are illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

In the camera module (400; 500), A camera housing (401; 501) comprising a first side wall (4011; 5011), a second side wall (4012; 5012) facing in a different direction from the first side wall, and a third side wall (4013; 5013) facing in a different direction from the first and second side walls; A lens assembly (402; 502) comprising at least one lens (402a; 502a) and a lens barrel (402b; 502b); A first PCB (410; 510) on which an image sensor (403; 503;) is arranged; and A driving member (460; 560) configured to move the first PCB (410; 510) in a direction intersecting an optical axis defined as an optical path between at least one lens (402a; 502a) and the image sensor (403; 503), The above driving member (460; 560) is A camera module comprising a first coil (461a; 561a), a first magnet (461b; 561b), and a second coil (461c; 561c) sequentially arranged in a direction from the outside to the inside of the camera module at positions corresponding to the first side wall (4011; 5011), and a third coil (462a; 562a), a second magnet (462b; 562b), and a fourth coil (462c; 562c) sequentially arranged in a direction from the outside to the inside of the camera module at positions corresponding to the second side wall (4012; 5012). In the first paragraph, Controller (704) and A memory (702) that stores instructions that, when executed by the controller, cause the following operations of the camera module, The following actions are: A first OIS operation performed by the interaction between the first coil (461a; 561a) and the first magnet (461b; 561b), and / or by the interaction between the first magnet (461b; 561b) and the second coil (461c; 561c); and A second OIS operation, which is performed by the interaction between the third coil (462a; 562a) and the second magnet (462b; 562b), and / or by the interaction between the second magnet (462b; 562b) and the fourth coil (462c; 562c), Camera module. In the second paragraph, The above first OIS operation is, A 1-1 OIS operation performed by the interaction between the first coil (461a; 561a) and the first magnet (461b; 561b), a 1-2 OIS operation performed by the interaction between the first magnet (461b; 561b) and the second coil (461c; 561c), or an operation including both the 1-1 OIS operation and the 1-2 OIS operation, The above second OIS operation is, A camera module comprising a 2-1 OIS operation performed by interaction between the third coil (462a; 562a) and the second magnet (462b; 562b), a 2-2 OIS operation performed by interaction between the second magnet (462b; 562b) and the fourth coil (462c; 562c), or an operation including both the 2-1 OIS operation and the 2-2 OIS operation. In any one of claims 1 to 3, A camera module in which the interaction between the first coil (461a; 561a) and the first magnet (461b; 561b), the interaction between the first magnet (461b; 561b) and the second coil (461c; 561c), the interaction between the third coil (462a; 562a) and the second magnet (462b; 562b), and the interaction between the second magnet (462b; 562b) and the fourth coil (462c; 562c) is implemented in a solenoid manner configured to generate a driving force in a direction parallel to the direction in which a specific coil and a specific magnet face each other and / or in a Lorentz manner configured to generate a driving force in a direction perpendicular to the direction in which a specific coil and a specific magnet face each other. In any one of paragraphs 2 to 4, The above driving member (460; 560) A camera module comprising a fifth coil (463a; 463a) and a third magnet (463b; 563b) sequentially arranged in a direction from the outside to the inside of the camera module at positions corresponding to the third side wall (4013; 5013). In paragraph 5, The following actions are: A camera module including, additionally or alternatively to the first OIS operation and the second OIS operation, an AF operation performed by interaction between the fifth coil (463a; 563a) and the third magnet (463b; 563b). In paragraph 5 or 6, A camera module in which the interaction between the fifth coil and the third magnet is driven by a Lorenz type in which the relative separation between the fifth coil and the third magnet changes in a direction perpendicular to the direction in which they face each other. In any one of claims 1 to 7, A camera module in which the first PCB (410; 510) includes a slit portion (412; 512) that can be deformed in a direction parallel to the optical axis or a direction perpendicular to the optical axis. In paragraph 8, A camera module comprising a first rigid portion (411; 511) on which the image sensor is arranged, a slit portion (412; 512) connected to the first rigid portion, and a second rigid portion (413; 513) connected to the slit portion. In any one of claims 1 to 9, A first carrier (430; 530) coupled to the first substrate and moving relative to the first substrate in a first direction perpendicular to the height direction of the camera housing or in a second direction different from the first direction; A second carrier (440; 540) surrounding at least a portion of the first carrier and moving relative to the first substrate in the first direction perpendicular to the height direction of the camera housing or in the second direction different from the first direction; and A camera module comprising a third carrier (450; 550) surrounding at least a portion of the first carrier (430; 530) and the second carrier (440; 540) and moving relative to the first substrate in a third direction parallel to the height direction of the camera housing. In paragraph 10, The second carrier (440; 540) is arranged on substantially the same plane as the first carrier (430; 530), It includes an opening for accommodating the first plate (431; 531) of the first carrier (430; 530), A camera module comprising a second plate (441; 541) coupled with a rigid portion (413; 513) of the first PCB (410; 510). In claim 10 or 11, A camera module in which the first coil (461a; 561a) and the third coil (462a; 562a) are disposed in the camera housing, the first magnet (461b; 561b) and the second magnet (462b; 562b) are disposed in the second carrier (440; 540), and the second coil (461c; 561c) and the fourth coil (462c; 562c) are disposed in the first carrier (430; 440). In claim 10 or 11, A camera module further comprising a fourth carrier (445) disposed between the second carrier (440) and the third carrier (440). In any one of claims 1 to 13, A camera module comprising a second PCB arranged along at least a portion of the periphery of the camera housing and configured to apply current to the first coil (461a) and the third coil (462a). In the second paragraph, A camera module in which whether the first OIS operation and / or the second OIS operation is performed is determined depending on the frequency applied to the camera module.

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