Module

Abstract

A module 1 comprises the following in the thickness direction: an encapsulated body 100 in which a circuit board 110 and an electronic component 120 are encapsulated by an encapsulating resin 140, with a conductor 130 exposed on a part of the surface; and a redistribution layer 200 provided on the surface of the encapsulated body 100 and having an insulating layer 210 and a redistribution conductor 220 connected to the conductor 130. The redistribution conductor 220 includes a connecting conductor 230 provided inside the insulating layer 210 and connected to the conductor 130, and an input / output electrode 240 provided in a first region E1 on the surface of the insulating layer 210 on the side opposite to the encapsulated body 100 and connected to the connecting conductor 230. The connecting conductor 230 includes an inclined extension part 230c extending in a direction inclined with respect to the thickness direction. When viewed in a cross section along the thickness direction, the cross-sectional shape of the inclined extension part 230c is a stepped shape with a plurality of steps.

Description

module 【0001】 This invention relates to a module. 【0002】 Patent Document 1 discloses a module comprising a substrate, a first component mounted on one main surface of the substrate, a sealing resin layer sealing the one main surface and the first component, a resin block provided on the other main surface of the substrate, an intermediate layer provided on the other main surface of the substrate and having a plurality of first columnar conductors, and a redistribution layer laminated on the intermediate layer on the side of the substrate opposite to the other main surface, wherein the resin block has a second component inside and is fixed to the other main surface of the substrate by a fixing conductor provided on the side of the resin block that is on the other main surface of the substrate, the first component is connected to the redistribution layer via the first columnar conductors, and the second component has an external electrode on the side of the redistribution layer and the external electrode is connected to the redistribution layer. 【0003】 International Publication No. 2019 / 111874 【0004】 According to the module described in Patent Document 1, in a package-on-package module having a redistribution layer, it is possible to prevent misalignment of components and provide a module that ensures flatness by using a resin block containing components. 【0005】However, if the module described in Patent Document 1 is subjected to thermal shock, stress may occur in the rewiring layer due to the difference in thermal expansion coefficients between the resin layer and the wiring electrodes. Specifically, if the module described in Patent Document 1 is subjected to thermal shock, the resin layer in the rewiring layer may expand and contract due to thermal shock, causing strain on the wiring electrodes, and consequently, stress may occur due to the strain of the resin layer. In this way, if stress occurs in the module described in Patent Document 1 due to the strain of the resin layer, the above-mentioned stress may concentrate at the interface between the resin layer and the wiring electrodes, which may cause delamination between the resin layer and the wiring electrodes. If delamination occurs between the resin layer and the wiring electrodes in the module described in Patent Document 1, for example, moisture may penetrate into the rewiring layer from the delamination site, which may reduce the reliability of the electrical characteristics of the module described in Patent Document 1. 【0006】 The present invention was made to solve the above problems and aims to provide a module that can suppress delamination between the insulating layer and the connecting conductor in the redistribution layer even when subjected to thermal shock. 【0007】 The module of the present invention comprises a sealing body in which a circuit board and electronic components are sealed with sealing resin, with a conductor exposed on a part of its surface, and a rewiring layer provided on the surface of the sealing body, having an insulating layer and a rewiring conductor connected to the conductor, wherein the rewiring conductor includes a connecting conductor provided inside the insulating layer and connected to the conductor, and input / output electrodes provided in a first region on the surface of the insulating layer opposite to the sealing body and connected to the connecting conductor, wherein the connecting conductor includes an inclined extension portion extending in a direction inclined with respect to the thickness direction, and when viewed in cross-section along the thickness direction, the cross-sectional shape of the inclined extension portion is a multi-step stepped shape. 【0008】 According to the present invention, it is possible to provide a module that can suppress delamination between the insulating layer and the connecting conductor in the redistribution layer even when subjected to thermal shock. 【0009】Figure 1 is a schematic cross-sectional view showing an example of a module according to Embodiment 1 of the present invention. Figure 2 is a schematic cross-sectional view showing an example of the process of forming the first layer of the rewiring conductor in the manufacturing method of the module shown in Figure 1. Figure 3 is a schematic cross-sectional view showing an example of the process of forming the first layer of the insulating layer in the manufacturing method of the module shown in Figure 1. Figure 4 is a schematic cross-sectional view showing an example of a process after Figure 3 in the process of forming the first layer of the insulating layer in the manufacturing method of the module shown in Figure 1. Figure 5 is a schematic cross-sectional view showing an example of the process of forming the second layer of the rewiring conductor in the manufacturing method of the module shown in Figure 1. Figure 6 is a schematic cross-sectional view showing an example of the process of forming the second layer of the insulating layer in the manufacturing method of the module shown in Figure 1. Figure 7 is a schematic cross-sectional view showing an example of the process of providing a recess in the insulating layer in the manufacturing method of the module shown in Figure 1. Figure 8 is a schematic cross-sectional view showing an example of a module according to Embodiment 2 of the present invention. Figure 9 is a schematic cross-sectional view showing an example of a modified module of Embodiment 2 of the present invention. Figure 10 is a schematic cross-sectional view showing an example of a module according to Embodiment 3 of the present invention. Figure 11 is a schematic plan view showing an example of the third region of the insulating layer shown in Figure 10, viewed from the thickness direction. 【0010】 The modules of the present invention will be described below. However, the present invention is not limited to the configuration described below, and may be modified as appropriate without departing from the spirit of the invention. Furthermore, a combination of several of the preferred configurations described below also constitutes the present invention. 【0011】 In this specification, unless otherwise specified, terms describing relationships between elements (e.g., "parallel," "perpendicular," etc.) and terms describing the shape of elements mean not only their literal, exact form, but also a range that is substantially equivalent, for example, a range that includes differences of a few percent. 【0012】[Module] The module of the present invention comprises a sealing body in which a circuit board and electronic components are sealed with sealing resin, with a conductor exposed on a part of its surface, and a rewiring layer provided on the surface of the sealing body, having an insulating layer and a rewiring conductor connected to the conductor, wherein the rewiring conductor includes a connecting conductor provided inside the insulating layer and connected to the conductor, and input / output electrodes provided in a first region on the surface of the insulating layer opposite to the sealing body and connected to the connecting conductor, wherein the connecting conductor includes an inclined extension portion extending in a direction inclined with respect to the thickness direction, and when viewed in cross-section along the thickness direction, the cross-sectional shape of the inclined extension portion is a multi-step shape. 【0013】 In conventional modules, when thermal shock is applied, stress may occur in the redistribution layer due to the difference in thermal expansion coefficients between the insulating layer and the redistribution conductor. Specifically, when thermal shock is applied to a conventional module, the insulating layer in the redistribution layer expands and contracts due to thermal stress, causing strain on the redistribution conductor, and consequently, stress may occur due to the strain in the insulating layer. In this way, when stress occurs in a conventional module due to the strain in the insulating layer, the above stress concentrates at the interface between the insulating layer and the redistribution conductor, which may cause delamination between the insulating layer and the redistribution conductor. 【0014】 In contrast, the module of the present invention includes a rewiring conductor which is provided inside the insulating layer and connected to the conductor, and input / output electrodes which are provided in a first region on the surface of the insulating layer opposite to the sealant and connected to the connecting conductor. Furthermore, in the module of the present invention, the connecting conductor includes an inclined extension portion which extends in a direction inclined with respect to the thickness direction, and when viewed in cross-section along the thickness direction, the cross-sectional shape of the inclined extension portion is a multi-step shape. 【0015】In the module of the present invention, even if stress is generated due to distortion of the insulating layer when thermal shock is applied, the connecting conductor includes an inclined extension portion, and furthermore, the cross-sectional shape of the inclined extension portion has multiple stepped shapes, so that the above-mentioned stress is less likely to concentrate at the interface between the insulating layer and the connecting conductor. In this way, in the module of the present invention, since stress caused by distortion of the insulating layer is less likely to concentrate at the interface between the insulating layer and the connecting conductor, delamination between the insulating layer and the connecting conductor, in particular delamination between the insulating layer and the inclined extension portion is suppressed. 【0016】 Based on the above, the module of the present invention makes it possible to realize a module that can suppress delamination between the insulating layer and the connecting conductor in the redistribution layer even when subjected to thermal shock. In the module of the present invention, since delamination between the insulating layer and the connecting conductor in the redistribution layer is suppressed even when subjected to thermal shock, for example, the intrusion of moisture into the redistribution layer from between the insulating layer and the connecting conductor is suppressed, thereby improving the reliability of the electrical characteristics of the module of the present invention. 【0017】 The following describes embodiments of the module of the present invention. 【0018】 The embodiments shown below are illustrative, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. Except for Embodiment 1, descriptions of matters common to Embodiment 1 will be omitted, and the differences will be described mainly. In particular, similar effects and advantages due to similar configurations will not be mentioned sequentially for each embodiment. 【0019】 The drawings shown below are schematic representations, and their dimensions, aspect ratios, and scales may differ from those of the actual product. 【0020】 <Embodiment 1> Figure 1 is a schematic cross-sectional view showing an example of a module according to Embodiment 1 of the present invention. 【0021】 (Module configuration) The module 1 shown in Figure 1 has a sealing body 100 and a redistribution layer 200 in the thickness direction (vertical direction in Figure 1). 【0022】 (Sealing body) The sealing body 100 is formed by sealing the circuit board 110 and electronic components 120 with sealing resin 140. 【0023】 In the encapsulation body 100, it is sufficient that at least a portion of the circuit board 110 and at least a portion of the electronic component 120 are sealed with the sealing resin 140. In other words, in the encapsulation body 100, the entire circuit board 110 may be covered with the sealing resin 140, or a portion of the circuit board 110 may be exposed from the sealing resin 140 without being covered. Also, in the encapsulation body 100, the entire electronic component 120 may be covered with the sealing resin 140, or a portion of the electronic component 120 may be exposed from the sealing resin 140 without being covered. In the example shown in Figure 1, a portion of the circuit board 110 is covered (sealed) with the sealing resin 140, and the entire electronic component 120 is covered (sealed) with the sealing resin 140. 【0024】 The circuit board 110 has a first main surface 110a and a second main surface 110b that are opposite to each other in the thickness direction. 【0025】 The circuit board 110 has a first electrode 111, a second electrode 112, and a third electrode 113 on its first main surface 110a. 【0026】 The circuit board 110 is, for example, a multilayer substrate in which an insulating layer (not shown) and a conductive layer (not shown) are stacked in the thickness direction. 【0027】 In the circuit board 110, the conductive layer is connected to each of the first electrode 111, the second electrode 112, and the third electrode 113 on a one-to-one basis (independently). 【0028】 Furthermore, in the circuit board 110, adjacent conductor layers in the thickness direction may be connected via via conductors that penetrate at least one insulating layer in the thickness direction. 【0029】 The insulating material constituting the insulating layer is not particularly limited and may be, for example, a low-temperature sintered ceramic (LTCC) material. Low-temperature sintered ceramic material is a ceramic material that can be sintered at a firing temperature of 1000°C or less. The type of low-temperature sintered ceramic material constituting the insulating layer is not particularly limited and may be, for example, SiO ２ -BaO-Al ２ O ３- MnO-based glass ceramic materials, SiO ２ -BaO-Al ２ O ３ -MnO-TiO ２ -MgO-ZrO ２ It may also be a ceramic material such as a glass-ceramic material. 【0030】 The conductive material constituting the conductive layer (and via conductor) is not particularly limited and may be, for example, a conductive material that can be fired simultaneously with the low-temperature sintered ceramic material. The conductive material that can be fired simultaneously with the low-temperature sintered ceramic material may be, for example, a metallic material such as copper, silver, or an alloy containing at least one of these metals. 【0031】 As described above, the circuit board 110 may be a low-temperature fired ceramic substrate having an insulating layer containing a low-temperature sintered ceramic material and a conductive layer (and via conductors) containing a conductive material that can be fired simultaneously with the low-temperature sintered ceramic material. 【0032】 The electronic component 120 includes a first electronic component 121 and a second electronic component 122. 【0033】 The first electronic component 121 has an external terminal 121a on its mounting surface (bottom surface in Figure 1) on the circuit board 110 side. The first electronic component 121 may have, for example, a Cu pillar bump as its external terminal 121a. 【0034】 The external terminal 121a of the first electronic component 121 is connected to the first electrode 111 of the circuit board 110. As a result, the first electronic component 121 is mounted (for example, flip-chip mounted) on the first main surface 110a of the circuit board 110. 【0035】 In the example shown in Figure 1, only one first electronic component 121 is mounted on the first main surface 110a of the circuit board 110, but multiple first electronic components 121 may be mounted on the first main surface 110a of the circuit board 110. 【0036】The type of the first electronic component 121 is not particularly limited, and for example, it may be an integrated circuit (IC: Integrated Circuit). The type of the integrated circuit as the first electronic component 121 is not particularly limited, and for example, it may be SOI (Silicon On Insulator), HBT (Heterojunction Bipolar Transistor) IC, GaAs IC, Si IC, SiC IC, or the like. 【0037】 As an electronic component other than an integrated circuit, the first electronic component 121 may be, for example, a SAW (Surface Acoustic Wave) filter. 【0038】 The second electronic component 122 has a first external electrode 122a and a second external electrode 122b. 【0039】 The first external electrode 122a and the second external electrode 122b of the second electronic component 122 are each connected to the second electrode 112 of the circuit board 110 one-to-one (independently) via the solder 150. Thereby, the second electronic component 122 is mounted on the first main surface 110a of the circuit board 110. 【0040】 In the example shown in FIG. 1, only one second electronic component 122 is mounted on the first main surface 110a of the circuit board 110, but a plurality of second electronic components 122 may be mounted on the first main surface 110a of the circuit board 110. 【0041】 The type of the second electronic component 122 is not particularly limited, and for example, it may be a chip capacitor, or may be an electronic component other than a chip capacitor (for example, a chip component other than a chip capacitor). 【0042】 Electronic components other than the first electronic component 121 and the second electronic component 122 may be mounted on the first main surface 110a of the circuit board 110. 【0043】 A part of the surface of the sealing body 100 has a conductor 130 exposed. In the example shown in FIG. 1, the conductor 130 penetrates the sealing resin 140 in the thickness direction, and thus is exposed from a part of the surface of the sealing body 100, specifically, a part of the surface of the sealing resin 140. 【0044】The conductor 130 is connected to the third electrode 113 of the circuit board 110 at the end facing the circuit board 110, and to a rewiring conductor (connecting conductor) described later at the end opposite to the circuit board 110. 【0045】 The conductive material constituting the conductor 130 is not particularly limited and may be a metallic material such as copper, silver, or an alloy containing at least one of these metals. 【0046】 The shape of the conductor 130 is not particularly limited; for example, it may be columnar or have a shape other than columnar. 【0047】 The resin constituting the sealing resin 140 is not particularly limited and may be a thermosetting resin such as epoxy resin, for example. 【0048】 The sealing resin 140 may further contain a filler in addition to the resin. 【0049】 The type of filler contained in the sealing resin 140 is not particularly limited, and may be, for example, silica, alumina, silicon nitride, aluminum hydroxide, barium titanate, titania, etc. 【0050】 The shape of the filler contained in the sealing resin 140 is not particularly limited and may be spherical, plate-shaped, or flaky, for example. Among these, the shape of the filler contained in the sealing resin 140 is preferably spherical. 【0051】 The average particle size of the filler contained in the sealing resin 140 is not particularly limited, but is preferably 5 μm or more and 15 μm or less, more preferably 7 μm or more and 13 μm or less, and even more preferably 9 μm or more and 11 μm or less. 【0052】 The average particle size of the filler contained in the sealing resin 140 is determined as follows. First, an image of the cross-section of the sealing resin 140 along the thickness direction is obtained using an electron microscope, as shown in Figure 1. Then, using image analysis software, the equivalent circle diameter is calculated from the cross-sectional area of ​​each of the at least 100 fillers exposed in the cross-section of the sealing resin 140. The average value of the obtained equivalent circle diameters of at least 100 fillers is then determined as the average particle size of the filler contained in the sealing resin 140. 【0053】 The filler content in the sealing resin 140 is not particularly limited, but it is preferably 70% by weight or more and 98% by weight or less when the total amount of the sealing resin 140 is considered to be 100% by weight. 【0054】 (Redistribution layer) The redistribution layer 200 is provided on the surface of the encapsulant 100. Specifically, the redistribution layer 200 is provided on the surface of the encapsulant 100 opposite to the circuit board 110. 【0055】 The rewiring layer 200 includes an insulating layer 210 and a rewiring conductor 220. 【0056】 The insulating layer 210 is preferably in contact with the sealing resin 140. 【0057】 The insulating layer 210 preferably contains a resin. 【0058】 The resin contained in the insulating layer 210 may be a thermosetting resin or a thermoplastic resin. Examples of the resin contained in the insulating layer 210 may be epoxy resin, polyimide resin, polyamide-imide resin, polyamide resin, phenolic resin, formaldehyde resin, melamine resin, acrylic resin, aromatic polyester resin, polyphenylene sulfide resin, polyether resin, polyetheretherketone resin, etc. Among these, the resin contained in the insulating layer 210 is preferably epoxy resin, polyimide resin, or polyamide-imide resin. 【0059】 The resin content in the insulating layer 210 is not particularly limited, but is preferably 45% by weight or more and 75% by weight or less, and more preferably 50% by weight or more and 70% by weight or less, when the total amount of the insulating layer 210 is considered to be 100% by weight. 【0060】 The insulating layer 210 may further contain a filler in addition to the resin. 【0061】 The type of filler included in the insulating layer 210 is not particularly limited, and may be, for example, silica, alumina, silicon nitride, aluminum hydroxide, etc. Among these, silica is preferred as the filler included in the insulating layer 210. 【0062】 The shape of the filler contained in the insulating layer 210 is not particularly limited and may be spherical, plate-shaped, or flaky. Among these, the shape of the filler contained in the insulating layer 210 is preferably spherical. 【0063】 The average particle size of the filler contained in the insulating layer 210 is not particularly limited, but is preferably 1.0 μm or more and 10.0 μm or less, and more preferably 1.0 μm or more and 8.0 μm or less. 【0064】 The average particle size of the filler contained in the insulating layer 210 is determined as follows. First, an image of the cross-section of the insulating layer 210 along its thickness direction is obtained using an electron microscope, as shown in Figure 1. Then, using image analysis software, the equivalent circle diameter is calculated for each of the at least 100 fillers exposed in the cross-section of the insulating layer 210, based on their cross-sectional area. The average value of the obtained equivalent circle diameters of at least 100 fillers is then determined as the average particle size of the filler contained in the insulating layer 210. 【0065】 The amount of filler contained in the insulating layer 210 is not particularly limited, but is preferably 15% by weight or more and 40% by weight or less, and more preferably 20% by weight or more and 35% by weight or less, when the total amount of the insulating layer 210 is considered to be 100% by weight. 【0066】 The total content of resin and filler in the insulating layer 210 is preferably 65% ​​by weight or more, more preferably 75% by weight or more, and particularly preferably 100% by weight, when the total amount of the insulating layer 210 is considered to be 100% by weight. 【0067】 The maximum thickness of the insulating layer 210 is not particularly limited, but is preferably 5 μm or more and 50 μm or less, more preferably 10 μm or more and 40 μm or less, and even more preferably 15 μm or more and 30 μm or less. The maximum thickness of the insulating layer 210 usually coincides with the maximum thickness of the redistribution layer 200. 【0068】 The insulating layer 210 may have a single-layer structure or a multi-layer structure. 【0069】In the example shown in Figure 1, the insulating layer 210 has a two-layer structure including a first insulating portion 210a and a second insulating portion 210b. The insulating layer 210 may also have a multi-layer structure of three or more layers. 【0070】 When the insulating layer 210 has a multilayer structure, if the constituent materials of adjacent insulating layers 210 are different, the interfaces (boundaries) between these insulating layers 210 tend to be more clearly visible compared to a configuration where the constituent materials of adjacent insulating layers 210 are the same. 【0071】 The rewiring conductor 220 is connected to the conductor 130. 【0072】 The rewiring conductor 220 includes a connecting conductor 230 and input / output electrodes 240. 【0073】 The connecting conductor 230 is provided inside the insulating layer 210 and connected to the conductor 130. 【0074】 Preferably, the connecting conductor 230 includes a surface-extended portion 230a that extends along the surfaces of the conductor 130 and the sealing resin 140. In this case, the surface-extended portion 230a will be connected to the conductor 130. 【0075】 Preferably, the connecting conductor 230 further includes a connecting extension 230b that is connected to the surface extension 230a and extends to a different layer from the surface extension 230a. In the example shown in Figure 1, the connecting conductor 230 includes a connecting extension 230b that extends to the left from the surface extension 230a and a connecting extension 230b that extends to the right from the surface extension 230a. Furthermore, in the example shown in Figure 1, of these connecting extensions 230b, the connecting extension 230b that extends to the left from the surface extension 230a extends toward the input / output electrode 240 and is connected to the input / output electrode 240. 【0076】 The input / output electrodes 240 are provided in a first region E1 on the surface of the insulating layer 210 opposite to the sealant 100 and connected to the connecting conductor 230. In the example shown in Figure 1, the input / output electrodes 240 are exposed on a portion of the surface of the redistribution layer 200 in the first region E1 of the insulating layer 210. Furthermore, in the example shown in Figure 1, the input / output electrodes 240 are connected to a connecting extension portion 230b of the connecting conductor 230 that extends to the left from the surface extension portion 230a. 【0077】 The rewiring conductor 220 is not particularly limited in type, and for example, the connecting conductor 230 and the input / output electrodes 240 preferably contain a conductive filler and a resin, respectively. In this case, the flexibility of the rewiring conductor 220 is easily improved, so that even if the module 1 is subjected to thermal shock, the rewiring conductor 220 can more easily mitigate the thermal expansion and contraction of the insulating layer 210. As a result, even if the module 1 is subjected to thermal shock, the rewiring conductor 220 is less likely to deteriorate and can function sufficiently as wiring. 【0078】 The conductive filler contained in the rewiring conductor 220 is not particularly limited in type and may be a metal filler such as silver filler, copper filler, or nickel filler. Among these, the conductive filler contained in the rewiring conductor 220 is preferably silver filler. 【0079】 The shape of the conductive filler contained in the rewiring conductor 220 is not particularly limited and may be spherical, plate-shaped, or flaky. Among these, the shape of the conductive filler contained in the rewiring conductor 220 is preferably spherical. 【0080】 The average particle size of the conductive filler contained in the rewiring conductor 220 is not particularly limited, but is preferably 0.1 μm or more and 1.0 μm or less, and more preferably 0.2 μm or more and 0.8 μm or less. In this case, the flexibility of the rewiring conductor 220 is easily improved, so that even if the module 1 is subjected to thermal shock, the rewiring conductor 220 can easily sufficiently mitigate the thermal expansion and contraction of the insulating layer 210. As a result, even if the module 1 is subjected to thermal shock, the rewiring conductor 220 is less likely to deteriorate. 【0081】The average particle size of the conductive filler contained in the rewiring conductor 220 is determined as follows. First, an image of the cross-section of the rewiring conductor 220 along its thickness direction is obtained using an electron microscope, as shown in Figure 1. Then, using image analysis software, the equivalent circle diameter is calculated from the cross-sectional area of ​​each of the at least 100 conductive fillers exposed in the cross-section of the rewiring conductor 220. The average value of the obtained equivalent circle diameters of at least 100 is then defined as the average particle size of the conductive filler contained in the rewiring conductor 220. 【0082】 The content of conductive filler in the rewiring conductor 220 is not particularly limited, but is preferably 85% by weight or more and 99% by weight or less, and more preferably 87% by weight or more and 97% by weight or less, when the total amount of the rewiring conductor 220 is considered as 100% by weight. 【0083】 The resin contained in the rewiring conductor 220 is not particularly limited in type and may be a thermosetting resin or a thermoplastic resin. Examples of the resin contained in the rewiring conductor 220 include polyester resin, phenolic resin, formaldehyde resin, melamine resin, epoxy resin, acrylic resin, polyamide resin, polyamide-imide resin, polyphenylene sulfide resin, polyether resin, polyimide resin, polyetheretherketone resin, etc. Among these, the resin contained in the rewiring conductor 220 is preferably polyester resin. 【0084】 The resin content in the rewiring conductor 220 is not particularly limited, but is preferably 1% by weight or more and 10% by weight or less, and more preferably 3% by weight or more and 8% by weight or less, when the total amount of the rewiring conductor 220 is considered as 100% by weight. 【0085】 The total content of conductive filler and resin in the rewiring conductor 220 is preferably 86% by weight or more, more preferably 93% by weight or more, and particularly preferably 100% by weight, when the total amount of the rewiring conductor 220 is considered to be 100% by weight. 【0086】 The following describes the main effects and benefits exhibited by Module 1. 【0087】 In conventional modules, when thermal shock is applied, stress may occur in the redistribution layer due to the difference in thermal expansion coefficients between the insulating layer and the redistribution conductor. Specifically, when thermal shock is applied to a conventional module, the insulating layer in the redistribution layer expands and contracts due to thermal stress, causing strain on the redistribution conductor, and consequently, stress may occur due to the strain in the insulating layer. In this way, when stress occurs in a conventional module due to the strain in the insulating layer, the above stress concentrates at the interface between the insulating layer and the redistribution conductor, which may cause delamination between the insulating layer and the redistribution conductor. 【0088】 In contrast, in module 1, as shown in Figure 1, the connecting conductor 230 includes an inclined extension portion 230c that extends in a direction inclined with respect to the thickness direction. In the example shown in Figure 1, the connecting extension portion 230b of the connecting conductor 230 includes the inclined extension portion 230c. Furthermore, in module 1, as shown in Figure 1, when viewed in cross-section along the thickness direction, the cross-sectional shape of the inclined extension portion 230c is a multi-step shape. In the example shown in Figure 1, the cross-sectional shape of the inclined extension portion 230c is a two-step shape. 【0089】 In module 1, even if stress is generated due to distortion of the insulating layer 210 when thermal shock is applied, the connecting conductor 230 includes an inclined extension portion 230c, and furthermore, the cross-sectional shape of the inclined extension portion 230c is a multi-stage stepped shape, so that the above stress is less likely to concentrate at the interface between the insulating layer 210 and the connecting conductor 230. In this way, in module 1, the stress caused by distortion of the insulating layer 210 is less likely to concentrate at the interface between the insulating layer 210 and the connecting conductor 230, so that delamination between the insulating layer 210 and the connecting conductor 230, in particular delamination between the insulating layer 210 and the inclined extension portion 230c is suppressed. 【0090】Based on the above, module 1 makes it possible to realize a module that can suppress delamination between the insulating layer 210 and the connecting conductor 230 in the redistribution layer 200 even when thermal shock is applied. In module 1, since delamination between the insulating layer 210 and the connecting conductor 230 in the redistribution layer 200 is suppressed even when thermal shock is applied, for example, moisture penetration into the redistribution layer 200 from between the insulating layer 210 and the connecting conductor 230 is suppressed, thus improving the reliability of the electrical characteristics of module 1. 【0091】 The stepped shape of the inclined extension portion 230c is not particularly limited as long as it has multiple stepped shapes; it may have two stepped shapes, or three or more stepped shapes. 【0092】 The cross-sectional contour of the inclined extension portion 230c, specifically the contour of the step of the inclined extension portion 230c, may consist of at least one of a straight line and a curve. In other words, the cross-sectional contour of the inclined extension portion 230c, specifically the contour of the step of the inclined extension portion 230c, may consist of a straight line, a curve, or both a straight line and a curve. 【0093】 The cross-sectional shape of the inclined extension portion 230c can be confirmed by observing the cross-section along the thickness direction of the connecting conductor 230, as shown in Figure 1, using an optical microscope. 【0094】 (Method of manufacturing the module) Module 1 is manufactured, for example, by the following method. 【0095】 (Process of forming the first layer of the rewiring conductor) Figure 2 is a schematic cross-sectional view showing an example of the process of forming the first layer of the rewiring conductor in the manufacturing method of the module shown in Figure 1. 【0096】 First, a sealed body 100 is prepared in which a circuit board 110 and electronic components 120 are sealed with a sealing resin 140, and a conductor 130 is exposed on a part of the surface. 【0097】 Then, in the process shown in Figure 2, a conductive paste containing a conductive filler and a resin is applied along the surfaces of the conductor 130 and the sealing resin 140, preferably by a screen printing method, so as to connect to the conductor 130. 【0098】 Subsequently, the conductive paste coated along the surfaces of the conductor 130 and the sealing resin 140 is subjected to heat treatment to form the surface-extended portion 230a of the connecting conductor 230 that constitutes the first layer of the rewiring conductor 220. 【0099】 When forming the surface extension portion 230a, it is preferable to use a silver paste containing silver filler and resin as the conductive paste applied during the formation process. 【0100】 (Process of forming the first insulating layer) Figure 3 is a schematic cross-sectional view showing an example of the process of forming the first insulating layer in the method for manufacturing the module shown in Figure 1. Figure 4 is a schematic cross-sectional view showing an example of a process that follows Figure 3 in the process of forming the first insulating layer in the method for manufacturing the module shown in Figure 1. 【0101】 First, in the process shown in Figure 3, an insulating paste containing resin and, if necessary, further containing filler, is applied to the surface of the sealant 100 (sealing resin 140) and the surface extending portion 230a, preferably by a screen printing method, so that a portion of the surface extending portion 230a is exposed from the insulating paste. The insulating paste applied in this manner is designated as the first portion 210aa. The first portion 210aa is provided with a first hole Taa through which a portion of the surface extending portion 230a is exposed. 【0102】 It is preferable to use an insulating paste containing epoxy resin as the insulating paste constituting the first portion 210aa. 【0103】 Next, in the process shown in Figure 4, an insulating paste containing resin and, if necessary, further containing filler, is applied to the surface of the first portion 210aa, preferably by a screen printing method, such that the portion surrounding the first hole Taa in the first portion 210aa is exposed from the insulating paste. The insulating paste applied in this manner is designated as the second portion 210ab. The second portion 210ab is provided with a second hole Tab that overlaps with the first hole Taa and has a larger hole diameter than the first hole Taa. 【0104】It is preferable to use an insulating paste containing epoxy resin as the insulating paste constituting the second portion 210ab. The insulating paste constituting the second portion 210ab may be the same as the insulating paste constituting the first portion 210aa, or it may be different from the insulating paste constituting the first portion 210aa. 【0105】 Subsequently, by heat treatment of the insulating paste constituting the first portion 210aa and the insulating paste constituting the second portion 210ab, the first layer of the insulating layer 210 is formed, and the first insulating portion 210a, composed of the first portion 210aa and the second portion 210ab, is formed. 【0106】 Of the cross-sectional contour of the first insulating portion 210a, the contour of the portion along the holes (first hole Taa and second hole Tab) extends in a direction inclined with respect to the thickness direction and has a stepped shape with multiple steps (two steps in Figure 4). Therefore, in the following "step of forming the second layer of the rewiring conductor," when the connecting extension portion 230b of the connecting conductor 230 is formed along the surface of the first insulating portion 210a, an inclined extending portion 230c is obtained as part of the connecting extension portion 230b, which extends in a direction inclined with respect to the thickness direction and has a stepped shape with multiple steps (two steps in this case). 【0107】 (Process of forming the second layer of the rewiring conductor) Figure 5 is a schematic cross-sectional view showing an example of the process of forming the second layer of the rewiring conductor in the manufacturing method of the module shown in Figure 1. 【0108】 In the process shown in Figure 5, first, a conductive paste containing a conductive filler and a resin is applied along the surface of the first insulating portion 210a, preferably by a screen printing method. 【0109】 Subsequently, by heat treatment of the conductive paste coated along the surface of the first insulating portion 210a, the connecting extension portion 230b of the connecting conductor 230 and the input / output electrodes 240, which constitute the second layer of the rewiring conductor 220, are formed. At this time, as part of the connecting extension portion 230b, an inclined extension portion 230c is formed which extends in a direction inclined with respect to the thickness direction and has a stepped shape with multiple stages (in this case, two stages). 【0110】It is preferable to use a silver paste containing silver filler and resin as the conductive paste applied when forming the connecting extension portion 230b (inclined extension portion 230c) and the input / output electrode 240. The conductive paste applied when forming the connecting extension portion 230b (inclined extension portion 230c) and the input / output electrode 240 may be the same as the conductive paste applied when forming the surface extension portion 230a, or it may be different from the conductive paste applied when forming the surface extension portion 230a. 【0111】 As described above, a rewiring conductor 220 is formed, which includes a connecting conductor 230 including a surface-extending portion 230a and a connecting-extending portion 230b (inclined-extending portion 230c), and input / output electrodes 240. 【0112】 (Process for forming the second insulating layer) Figure 6 is a schematic cross-sectional view showing an example of the process for forming the second insulating layer in the manufacturing method of the module shown in Figure 1. 【0113】 In the process shown in Figure 6, first, an insulating paste containing resin and, if necessary, further containing filler, is applied to the entire surface of the first insulating portion 210a and the rewiring conductor 220, preferably by a screen printing method. 【0114】 Subsequently, the first insulating portion 210a and the insulating paste applied to the surface of the rewiring conductor 220 are subjected to heat treatment to form the second insulating portion 210b, which constitutes the second layer of the insulating layer 210. 【0115】 When forming the second insulating portion 210b, it is preferable to use an insulating paste containing epoxy resin. The insulating paste used when forming the second insulating portion 210b may be the same as the insulating paste used when forming the first insulating portion 210a, or it may be different from the insulating paste used when forming the first insulating portion 210a. 【0116】 As a result, an insulating layer 210 including the first insulating portion 210a and the second insulating portion 210b is formed. 【0117】(Step of creating a recess in the insulating layer) Figure 7 is a schematic cross-sectional view showing an example of the step of creating a recess in the insulating layer in the manufacturing method of the module shown in Figure 1. 【0118】 In the process shown in Figure 7, the second insulating portion 210b is patterned to create a recess 250 that penetrates the second insulating portion 210b in the thickness direction so as to reach the input / output electrode 240. As a result, the input / output electrode 240 is exposed from the bottom of the recess 250. Thus, the input / output electrode 240 connected to the connecting conductor 230 is located in the first region E1 (the bottom of the recess 250) on the surface of the insulating layer 210 opposite to the sealant 100. 【0119】 When patterning the second insulating portion 210b, for example, a photolithography method is used. 【0120】 Module 1 is manufactured through the above process. 【0121】 <Embodiment 2> In the module of Embodiment 2 of the present invention, a recess is provided in a second region, which is located directly above the connecting conductor and is different from the first region, on the surface of the insulating layer opposite to the sealant. 【0122】 Figure 8 is a schematic cross-sectional view showing an example of a module according to Embodiment 2 of the present invention. 【0123】 In module 2 shown in Figure 8, a recess 210S is provided in a second region E2, which is located directly above the connecting conductor 230 and is different from the first region E1, on the surface of the insulating layer 210 opposite to the sealant 100. 【0124】 In conventional modules, thermal shock can cause stress due to distortion of the insulating layer, which may lead to delamination between the insulating layer and the re-distributed conductor. 【0125】In contrast, in module 2, even if stress is generated due to distortion of the insulating layer 210 when thermal shock is applied, the above-mentioned stress is relieved because a recess 210S is provided in the insulating layer 210 as described above. Specifically, in module 2, a recess 210S is provided in the second region E2 of the insulating layer 210 located directly above the connecting conductor 230 of the rewiring conductor 220. Therefore, when thermal shock is applied, the stress caused by distortion of the insulating layer 210, particularly the stress generated between the insulating layer 210 and the connecting conductor 230, is relieved. In this way, in module 2, the stress generated between the insulating layer 210 and the connecting conductor 230 is relieved, and thus delamination between the insulating layer 210 and the connecting conductor 230 is suppressed. In module 2, even when thermal shock is applied, delamination between the insulating layer 210 and the connecting conductor 230 in the rewiring layer 200 is suppressed. For example, moisture penetration into the rewiring layer 200 from between the insulating layer 210 and the connecting conductor 230 is suppressed, thus improving the reliability of the electrical characteristics of module 2. 【0126】 The recess 210S of the insulating layer 210 is located on the surface of the insulating layer 210 opposite to the sealant 100, directly above the connecting conductor 230, and is provided in at least a part of a region different from the first region E1. Of the regions described above, the region in which the recess 210S of the insulating layer 210 is provided is the second region E2. In other words, the second region E2 in which the recess 210S of the insulating layer 210 is provided is located on the surface of the insulating layer 210 opposite to the sealant 100, directly above the connecting conductor 230, and may be a part of a region different from the first region E1, or it may be the entire region. 【0127】The second region E2 of the insulating layer 210 is located on the surface of the insulating layer 210 opposite to the sealant 100, directly above the connecting conductor 230. In other words, the second region E2 of the insulating layer 210 is located on the surface of the insulating layer 210 opposite to the sealant 100, overlapping with the connecting conductor 230 only via the insulating layer 210. If the connecting conductor 230 has a multilayer structure (a two-layer structure in Figure 8) including multiple extended portions (a surface extended portion 230a and a connecting extended portion 230b in Figure 8), the second region E2 of the insulating layer 210 is located at a position where it overlaps only via the insulating layer 210 with the outermost surface of the connecting conductor 230 opposite to the sealant 100 (the outermost surface extending from the surface extended portion 230a to the connecting extended portion 230b in Figure 8) when the multiple extended portions are viewed as a single unit. 【0128】 The fact that the second region E2, where the recess 210S of the insulating layer 210 is provided, is located directly above the connecting conductor 230 can be confirmed by observing a cross-section along the thickness direction of the redistribution layer 200, as shown in Figure 8, using an optical microscope. 【0129】 The second region E2 of the insulating layer 210 is a region on the surface of the insulating layer 210 opposite to the sealant 100, and is different from the first region E1 of the insulating layer 210. In other words, the input / output electrodes 240 are not provided in the second region E2 of the insulating layer 210. 【0130】 Furthermore, no electrodes (conductors) other than the input / output electrodes 240 are provided in the second region E2 of the insulating layer 210. In other words, the connecting conductor 230 is not exposed in the second region E2 of the insulating layer 210. 【0131】 When viewing a cross-section along the thickness direction, it is preferable that the cross-sectional shape of the recess 210S in the insulating layer 210 is a tapered shape in which the diameter decreases from the side opposite the sealant 100 toward the sealant 100. In this case, the stress caused by the distortion of the insulating layer 210 that occurs when thermal shock is applied to the module 2 is sufficiently relieved, and delamination between the insulating layer 210 and the connecting conductor 230 is sufficiently suppressed. As a result, the reliability of the electrical characteristics of the module 2 is sufficiently improved. 【0132】The cross-sectional shape of the recess 210S in the insulating layer 210 can be confirmed by observing the cross-section along the thickness direction of the insulating layer 210 using an optical microscope, as shown in Figure 8. 【0133】 The planar shape of the recess 210S in the insulating layer 210 when viewed from the thickness direction is not particularly limited and may be, for example, circular, elliptical, rectangular (square or rectangular), etc. 【0134】 When the portion of the recess 210S in the insulating layer 210 that is furthest away from the sealant 100 is used as the opening, the diameter (opening diameter) Ps of the opening in the recess 210S of the insulating layer 210 is preferably 30 μm or more and 150 μm or less. 【0135】 The diameter Ps of the opening in the recess 210S of the insulating layer 210 represents the equivalent circular diameter calculated from the area of ​​the opening when viewed from the thickness direction. For example, if the planar shape of the recess 210S of the insulating layer 210 when viewed from the thickness direction is circular at the opening, then the diameter Ps of the opening represents the diameter of the opening (the diameter in the direction perpendicular to the thickness direction). 【0136】 The depth Qs of the recess 210S in the insulating layer 210 is preferably 3 μm or more and 10 μm or less. 【0137】 The number of recesses 210S in the insulating layer 210 is not particularly limited and may be one or multiple. 【0138】 If there are multiple recesses 210S in the insulating layer 210, the cross-sectional shapes of each recess 210S may be the same, different, or partially different. If there are multiple recesses 210S in the insulating layer 210, the planar shapes of each recess 210S may be the same, different, or partially different. If there are multiple recesses 210S in the insulating layer 210, the diameter Ps of the openings of each recess 210S may be the same, different, or partially different. If there are multiple recesses 210S in the insulating layer 210, the depth Qs of each recess 210S may be the same, different, or partially different. 【0139】 When viewed from the thickness direction, the density of the recesses 210S in the insulating layer 210 is 1 piece / mm ２ or more, which is preferable. In this case, when a thermal shock is applied to the module 2, the stress caused by the distortion of the insulating layer 210 is less likely to concentrate locally, so that the peeling between the insulating layer 210 and the connection conductor 230 is sufficiently suppressed. As a result, in the module 2, the reliability regarding electrical characteristics is sufficiently improved. 【0140】 When viewed from the thickness direction, the density of the recesses 210S in the insulating layer 210 is 2 pieces / mm ２ or less, which is preferable. In this case, in the module 2, in the direction perpendicular to the thickness direction, since the path through which heat is transferred and dissipated through the insulating layer 210 without passing through the recesses 210S in the insulating layer 210 is likely to be shortened, the heat dissipation performance assuming that a thermal shock is applied to the module 2 is sufficiently improved. 【0141】 The density of the recesses 210S in the insulating layer 210 is determined as follows. First, using an optical microscope, while observing the entire surface of the insulating layer 210 on the side opposite to the sealing body 100 from the thickness direction, the total number of recesses in the insulating layer 210 is counted. At this time, as will be described later, when a plurality of holes described later are provided in the third region located on the side opposite to the sealing body 100 with respect to the second region E2 where the recesses 210S to be counted are provided on the surface of the insulating layer 210 on the side opposite to the sealing body 100, these plurality of holes are excluded from the counting targets. Further, by polishing or grinding the surface of the insulating layer 210 on the side opposite to the sealing body 100 in the thickness direction, it is confirmed whether the recesses targeted for counting are located directly above the connection conductor 230. If recesses that are not located directly above the connection conductor 230 have been counted, that amount is subtracted from the above total number. Thus, the total number Ns (unit: piece) of the recesses 210S in the insulating layer 210 on the entire surface of the insulating layer 210 on the side opposite to the sealing body 100 is determined. Next, after acquiring an image of the entire surface of the insulating layer 210 on the side opposite to the sealing body 100 using an optical microscope, using image analysis software, from the above image, the area S (unit: mm ２) is calculated. Finally, the density Ds of the indentations 210S of the insulating layer 210 (unit: pieces / mm) is calculated. ２ This is calculated using the formula "Ds = Ns / S". 【0142】 Module 2 is manufactured in the same manner as Module 1, except that, in the "step of creating a recess in the insulating layer" described above, a recess 250 is created in the second insulating portion 210b that penetrates the second insulating portion 210b in the thickness direction so as to reach the input / output electrode 240 by laser processing the second insulating portion 210b, and a recess 210S is created in the second insulating portion 210b by laser processing a second region E2 that is located directly above the connecting conductor 230 and is different from the recess 250 (first region E1). When creating the recess 210S in the second insulating portion 210b, care is taken to ensure that the connecting conductor 230 is not exposed from the recess 210S. 【0143】 When performing laser processing on the second insulating portion 210b, it is preferable to use a UV laser. 【0144】 The timing of forming recesses 250 and 210S may be the same or different. If the timing of forming recesses 250 and 210S is different, recess 250 may be formed before recess 210S or after recess 210S. 【0145】 In the example shown in Figure 8, the cross-sectional contour of the recess 210S of the insulating layer 210 is composed of straight lines. On the other hand, the cross-sectional contour of the recess 210S of the insulating layer 210 does not have to be composed of straight lines. 【0146】 <Modification of Embodiment 2> In the module of the modification of Embodiment 2 of the present invention, the contour of the cross-section of the recess in the insulating layer is composed of a curve. 【0147】 Figure 9 is a schematic cross-sectional view showing an example of a module of a modified embodiment 2 of the present invention. 【0148】 In module 2' shown in Figure 9, similar to module 2 shown in Figure 8, the cross-sectional shape of the recess 210S in the insulating layer 210 is tapered, with the diameter decreasing from the side opposite the sealant 100 toward the sealant 100. 【0149】 On the other hand, in module 2', unlike module 2, the cross-sectional contour of the recess 210S in the insulating layer 210 is composed of a curve. 【0150】 In module 2', the cross-sectional contour of the recess 210S of the insulating layer 210 is curved. As a result, stress caused by distortion of the insulating layer 210 when thermal shock is applied to module 2' is less likely to concentrate at the end (bottom) of the recess 210S of the insulating layer 210 on the sealant 100 side. Therefore, delamination between the insulating layer 210 and the connecting conductor 230 is sufficiently suppressed. Consequently, the reliability of the electrical characteristics is significantly improved in module 2'. 【0151】 Module 2' is manufactured in the same manner as Module 2, except that, for example, in the "step of creating recesses in the insulating layer" described above, recesses 250 and 210S are formed by patterning the second insulating portion 210b. When patterning the second insulating portion 210b, for example, a photolithography method is used. 【0152】 In Embodiment 2 and its modified form, the cross-sectional shape of the recess in the insulating layer is shown to be tapered. However, the cross-sectional shape of the recess in the insulating layer may be, for example, a shape in which the diameter is constant (does not change) from the opposite side of the sealant toward the sealant. In other words, in the module of the present invention, the cross-sectional shape of the recess in the insulating layer is not particularly limited and may be a tapered shape in which the diameter decreases from the opposite side of the sealant toward the sealant, or it may be a shape in which the diameter is constant (does not change) from the opposite side of the sealant toward the sealant. 【0153】 Embodiment 2 and its modified examples show a configuration in which the cross-sectional contour of the recess in the insulating layer is composed of a straight line or a curve. However, the cross-sectional contour of the recess in the insulating layer may be composed of both a straight line and a curve. In other words, in the module of the present invention, the cross-sectional contour of the recess in the insulating layer may be composed of at least one of a straight line and a curve. 【0154】<Embodiment 3> In the module of Embodiment 3 of the present invention, a plurality of holes are periodically provided in a third region, which is located on the surface of the insulating layer opposite to the sealant, on the side opposite to the sealant with respect to the second region, and is different from the first and second regions. 【0155】 Figure 10 is a schematic cross-sectional view showing an example of a module according to Embodiment 3 of the present invention. 【0156】 In the module 3 shown in Figure 10, a plurality of holes 210T are periodically provided in a third region E3, which is located on the surface of the insulating layer 210 opposite to the sealant 100, on the side opposite to the sealant 100 with respect to the second region E2, and is different from the first region E1 and the second region E2. 【0157】 In module 3, even if stress is generated due to distortion of the insulating layer 210 when thermal shock is applied, the presence of holes 210T in addition to the recesses 210S in the insulating layer 210 allows for sufficient relaxation of the stress caused by distortion of the insulating layer 210 compared to module 2, which does not have holes 210T. In module 3, the stress caused by distortion of the insulating layer 210 when thermal shock is applied is sufficiently relaxed, so delamination between the insulating layer 210 and the connecting conductor 230 is sufficiently suppressed compared to module 2, for example. As a result, module 3 exhibits significantly improved reliability in terms of electrical characteristics compared to module 2, for example. 【0158】 The holes 210T in the insulating layer 210 only need to be located on the surface of the insulating layer 210 opposite to the sealant 100, on the side opposite to the sealant 100 with respect to the second region E2, and be provided in at least a part of the third region E3 which is different from the first region E1 and the second region E2. 【0159】 The third region E3 of the insulating layer 210 is located on the surface of the insulating layer 210 opposite to the sealant 100, and at least on the side opposite to the sealant 100 of the second region E2 of the insulating layer 210 (the bottom side). In the example shown in Figure 10, the third region E3 of the insulating layer 210 is the region on the surface of the insulating layer 210 opposite to the sealant 100 that is furthest away from the sealant 100. 【0160】The third region E3 of the insulating layer 210 is a region on the surface of the insulating layer 210 opposite to the sealant 100, and is different from the first region E1 of the insulating layer 210. In other words, the input / output electrodes 240 are not provided in the third region E3 of the insulating layer 210. 【0161】 Furthermore, no electrodes (conductors) other than the input / output electrodes 240 are provided in the third region E3 of the insulating layer 210. In other words, the connecting conductor 230 is not exposed in the third region E3 of the insulating layer 210. 【0162】 The third region E3 of the insulating layer 210 is a region on the surface of the insulating layer 210 opposite to the sealant 100, and is different from the second region E2 of the insulating layer 210. In other words, the third region E3 of the insulating layer 210 does not have a recess 210S. Also, the second region E2 of the insulating layer 210 does not have a hole 210T. 【0163】 The third region E3 of the insulating layer 210 is preferably located on the surface of the insulating layer 210 opposite to the sealant 100, directly above the connecting conductor 230. In other words, the third region E3 of the insulating layer 210 is preferably located on the surface of the insulating layer 210 opposite to the sealant 100, in a position that overlaps with the connecting conductor 230 only through the insulating layer 210. 【0164】 Figure 11 is a schematic plan view showing an example of the third region of the insulating layer shown in Figure 10, viewed from the thickness direction. 【0165】 As shown in Figure 11, the holes 210T in the insulating layer 210 are periodically provided in the third region E3 of the insulating layer 210. Here, the periodic arrangement of the holes 210T in the insulating layer 210 means that, when viewed from the thickness direction, the holes 210T in the insulating layer 210 are provided such that the distance (pitch) between the centers of adjacent holes 210T is constant. Furthermore, the constant pitch of adjacent holes 210T means that the pitch of adjacent holes 210T is substantially constant (the same). For example, the pitch of adjacent holes 210T may be strictly constant (the same), or there may be a difference of a few percent (for example, 1% or more, and 5% or less) in the pitch of adjacent holes 210T. 【0166】The holes 210T in the insulating layer 210 may be periodically provided throughout the entire third region E3 of the insulating layer 210, or they may be periodically provided in a part of the third region E3 of the insulating layer 210. 【0167】 The plurality of holes 210T may include only those holes 210T that are periodically provided in the third region E3 of the insulating layer 210. Alternatively, the plurality of holes 210T may include, in addition to those holes 210T that are periodically provided in the third region E3 of the insulating layer 210, holes 210T that are not periodically provided in the third region E3 of the insulating layer 210. In other words, all of the plurality of holes 210T may be periodically provided in the third region E3 of the insulating layer 210, or some of the holes 210T may be periodically provided in the third region E3 of the insulating layer 210. If some of the plurality of holes 210T are periodically provided in the third region E3 of the insulating layer 210, it is preferable that 70% or more of the total number of holes 210T are periodically provided in the third region E3 of the insulating layer 210. 【0168】 The arrangement of the holes 210T in the insulating layer 210 is not particularly limited, as long as they are periodically provided in the third region E3 of the insulating layer 210. For example, they may be arranged in a grid pattern or in a staggered pattern. 【0169】 The pitch Rt of the holes 210T in the insulating layer 210 is preferably 30 μm or more and 100 μm or less. 【0170】 The cross-sectional shape of the holes 210T in the insulating layer 210 when viewed in cross-section along the thickness direction is not particularly limited. For example, the diameter may be constant (unchanging) from the opposite side of the sealant 100 toward the sealant 100, or the diameter may not be constant (changes) toward the opposite side of the sealant 100 toward the sealant 100. 【0171】 If the cross-sectional shape of the holes 210T in the insulating layer 210 is such that the diameter is not constant from the side opposite to the sealant 100 toward the sealant 100, the cross-sectional shape of the holes 210T in the insulating layer 210 may be, for example, a tapered shape where the diameter decreases from the side opposite to the sealant 100 toward the sealant 100. 【0172】 The cross-sectional shapes of each hole 210T may be the same as, different from, or partially different. 【0173】 The cross-sectional shape of the holes 210T in the insulating layer 210 can be confirmed by observing a cross-section along the thickness direction of the insulating layer 210 using an optical microscope, as shown in Figure 10. 【0174】 The planar shape of the holes 210T in the insulating layer 210 when viewed from the thickness direction is not particularly limited and may be circular, elliptical, rectangular (square or rectangular), etc. 【0175】 The planar shapes of each hole 210T may be the same as, different from, or partially different. 【0176】 When the portion of the holes 210T in the insulating layer 210 that is furthest away from the sealant 100 is designated as the opening, the diameter (opening diameter) Pt of the opening of the holes 210T in the insulating layer 210 is preferably 7 μm or more and 40 μm or less. 【0177】 The diameter Pt of the opening of the hole 210T in the insulating layer 210 refers to the equivalent circular diameter calculated from the area of ​​the opening when viewed from the thickness direction. For example, if the planar shape of the hole 210T in the insulating layer 210 when viewed from the thickness direction is circular at the opening, then the diameter Pt of the opening refers to the diameter of the opening (the diameter in the direction perpendicular to the thickness direction). 【0178】 It is preferable that the diameter Pt of the opening of the hole 210T in the insulating layer 210 is smaller than the diameter Ps of the opening of the recess 210S in the insulating layer 210. In this case, it is preferable that the diameter Pt of the opening of the hole 210T in the insulating layer 210 is 30% or less of the diameter Ps of the opening of the recess 210S in the insulating layer 210. 【0179】 The diameter Pt of the opening of each hole 210T may be the same as, different from, or partially different. 【0180】 The depth Qt of the holes 210T in the insulating layer 210 is preferably 1 μm or more and 10 μm or less. 【0181】The depth Qt of the hole 210T in the insulating layer 210 is preferably smaller than the depth Qs of the recess 210S in the insulating layer 210. In this case, the depth Qt of the hole 210T in the insulating layer 210 is preferably 80% or less of the depth Qs of the recess 210S in the insulating layer 210. 【0182】 The depth Qt of each hole 210T may be the same as, different from, or partially different. 【0183】 The number of holes 210T in the insulating layer 210 is not particularly limited as long as there are multiple holes, but it is preferable that the number of holes is greater than the number of recesses 210S in the insulating layer 210. In this case, it is preferable that the number of holes 210T in the insulating layer 210 is 500% or more of the number of recesses 210S in the insulating layer 210. 【0184】 When viewed from the thickness direction, the density of holes 210T in the insulating layer 210 is 100 holes / mm². ２ The above is preferable. In this case, the stress caused by the distortion of the insulating layer 210 that occurs when thermal shock is applied to the module 3 is less likely to concentrate locally, so delamination between the insulating layer 210 and the connecting conductor 230 is sufficiently suppressed. As a result, the reliability of the electrical characteristics of the module 3 is sufficiently improved. 【0185】 When viewed from the thickness direction, the density of holes 210T in the insulating layer 210 is 300 holes / mm². ２ The following is preferable. In this case, when thermal shock is applied to the module 3, cracks are less likely to form in the insulating layer 210 along the depth direction of the holes 210T in the insulating layer 210 (here, the same direction as the thickness direction), and moisture is also suppressed from penetrating into the rewiring layer 200 etc. through these cracks. As a result, the reliability of the electrical characteristics of the module 3 is sufficiently improved. 【0186】 The density of holes 210T in the insulating layer 210 is determined as follows: First, using an optical microscope, the density of holes 210T on the surface of the insulating layer 210 opposite to the sealant 100 is determined within 10 mm. ２While observing the area from the thickness direction, the total number of holes 210T in the insulating layer 210 is counted. At this time, the recesses 210S in the insulating layer 210 that were counted using the method described above are excluded from the count. As a result, the surface of the insulating layer 210 opposite to the sealant 100 (10 mm) ２ The total number of holes 210T in the insulating layer 210 (in units of holes) is determined. Then, the density of holes 210T in the insulating layer 210 (in units of holes / mm) is determined. ２ This is calculated using the formula "Dt = Nt / 10". 【0187】 In the module 3 shown in Figure 10, the holes 210T of the insulating layer 210 are provided, in contrast to the module 2' shown in Figure 9. Module 3 is manufactured in the same manner as module 2', except that in the "step of forming the second layer of insulating layer" described above, a highly viscous insulating paste is applied using a screen printing method with a screen printing plate having a large mesh diameter. In this case, it is preferable to use an insulating paste with a viscosity of 7 Pa·s or more at a shear rate of 100 / s as the highly viscous insulating paste. It is also preferable to use a screen printing plate with a mesh diameter of 10 μm or more as the screen printing plate having a large mesh diameter. In this way, when a highly viscous insulating paste is applied using a screen printing method with a screen printing plate having a large mesh diameter in the "step of forming the second layer of insulating layer" described above, the leveling properties of the insulating paste are low, making it difficult for the insulating paste to flow around the intersections of the mesh of the screen printing plate. Therefore, the amount of insulating paste applied at positions corresponding to the intersections of the mesh of the screen printing plate is relatively small, and as a result, holes 210T are provided in the insulating layer 210 at positions corresponding to the intersections of the mesh of the screen printing plate. Since the holes 210T in the insulating layer 210 are provided at positions corresponding to the intersections of the mesh of the screen printing plate, they are provided periodically, just like the mesh intersections. 【0188】Unlike module 3 shown in Figure 10, module 2 shown in Figure 8 may have holes 210T in the insulating layer 210. This configuration is also manufactured in the same way as module 2, except that in the "step of forming the second insulating layer" described above, a highly viscous insulating paste is applied using a screen printing method with a screen printing plate that has a large mesh diameter. 【0189】 The module of the present invention is not limited to the above-described form, and various applications and modifications can be made within the scope of the present invention with respect to the module's configuration, manufacturing conditions, etc. 【0190】 In the embodiments (modifications) described above, the module of the present invention is shown to have only one sealant, but the module of the present invention may have multiple sealants. In other words, the number of sealants in the module of the present invention is not particularly limited and may be one or multiple. 【0191】 In the embodiments (modifications) described above, an embodiment in which the encapsulant has only one circuit board is shown, but the encapsulant may have multiple circuit boards. In other words, in the module of the present invention, the number of circuit boards in the encapsulant is not particularly limited and may be one or multiple. 【0192】 In the embodiments (modifications) described above, an embodiment in which the encapsulant has multiple electronic components was shown, but the encapsulant may have only one electronic component. In other words, in the module of the present invention, the number of electronic components in the encapsulant is not particularly limited and may be one or multiple. 【0193】 In the embodiments (modified versions) described above, the electronic components are shown mounted on the first main surface of the circuit board. However, the electronic components may also be mounted on the second main surface of the circuit board in addition to the first main surface. In other words, in the module of the present invention, the electronic components may be mounted on at least one main surface of the circuit board. 【0194】In the embodiments (modifications) described above, an embodiment in which the seal has only one conductor is shown, but the seal may have multiple conductors. In other words, in the module of the present invention, the number of conductors in the seal is not particularly limited and may be one or multiple. 【0195】 In the embodiments (modifications) described above, the module of the present invention is shown to have only one redistribution layer, but the module of the present invention may have multiple redistribution layers. In other words, the number of redistribution layers in the module of the present invention is not particularly limited and may be one or multiple. In the module of the present invention, if there are multiple redistribution layers, redistribution layers may be provided on each of the two opposing surfaces of the sealing body in the thickness direction. 【0196】 In the embodiments (modified versions) described above, an embodiment in which the rewiring conductor includes only one input / output electrode was shown, but the rewiring conductor may include multiple input / output electrodes. In other words, in the module of the present invention, the number of input / output electrodes in the rewiring conductor is not particularly limited and may be one or multiple. 【0197】 The module of the present invention may have other components, or may not have other components, as long as it has at least a sealant and a redistribution layer. 【0198】1, 2, 2', 3 Module 100 Encapsulation 110 Circuit board 110a First main surface 110b Second main surface 111 First electrode 112 Second electrode 113 Third electrode 120 Electronic component 121 First electronic component 121a External terminal 122 Second electronic component 122a First external electrode 122b Second external electrode 130 Conductor 140 Encapsulation resin 150 Solder 200 Rewiring layer 210 Insulating layer 210a First insulating part 210aa First part 210ab Second part 210b Second insulating part 210S Recess 210T Hole 220 Rewiring conductor 230 Connecting conductor 230a Surface extended part 230b Connecting extended part 230c Inclined extended part 240 Input / Output Electrodes 250 Recess E1 First Region E2 Second Region E3 Third Region Ps Diameter of recess opening Pt Diameter of hole opening Qs Depth of recess Qt Depth of hole Rt Pitch of hole Taa First hole Tab Second hole

Claims

1. A module comprising: a sealing body in which a circuit board and electronic components are sealed with sealing resin and a conductor is exposed on a part of its surface; a rewiring layer provided on the surface of the sealing body and having an insulating layer and a rewiring conductor connected to the conductor, wherein the rewiring conductor includes a connecting conductor provided inside the insulating layer and connected to the conductor, and input / output electrodes provided in a first region on the surface of the insulating layer opposite to the sealing body and connected to the connecting conductor, wherein the connecting conductor includes an inclined extension portion extending in a direction inclined with respect to the thickness direction, and when viewed in cross-section along the thickness direction, the cross-sectional shape of the inclined extension portion is a multi-step stepped shape.

2. The module according to claim 1, wherein a recess is provided in a second region, which is located directly above the connecting conductor and is different from the first region, on the surface of the insulating layer opposite to the sealant.

3. The module according to claim 2, wherein, when viewed in cross-section along the thickness direction, the cross-sectional shape of the recess in the insulating layer is a tapered shape in which the diameter decreases from the side opposite the sealant toward the sealant.

4. The module according to claim 3, wherein the contour of the cross-section of the recess in the insulating layer is composed of a curve.

5. When viewed from the thickness direction, the density of indentations in the insulating layer is 1 indentation / mm². ２ The module described above is as described in any one of claims 2 to 4.

6. The module according to any one of claims 2 to 5, wherein a plurality of holes are periodically provided in a third region on the surface of the insulating layer opposite to the sealant, which is located on the opposite side of the second region to the sealant and is different from the first region and the second region.

7. When viewed from the thickness direction, the density of holes in the insulating layer is 100 holes / mm². ２ The module according to claim 6.

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