Cold chain sensor with rapid change external hardware
The modular design of external sensor assemblies in cold chain monitoring systems addresses inefficiencies by enabling tool-free replacement and automatic calibration, reducing costs and downtime while maintaining enclosure integrity and supporting scalability.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- RIVERCITY INNOVATIONS LTD
- Filing Date
- 2024-12-15
- Publication Date
- 2026-06-18
AI Technical Summary
Existing cold chain monitoring systems face inefficiencies in sensor replacement, requiring full disassembly, increasing labor costs and downtime, and failing to maintain enclosure integrity during replacement, with temperature sensors degrading faster than other components.
A modular design separates temperature sensors and circuitry into an external assembly, allowing tool-free replacement without disassembling the enclosure, featuring automatic calibration and hermetic sealing to protect internal components.
Reduces maintenance costs and downtime, ensuring reliable operation with minimal disruption, and supports scalability by enabling quick sensor updates and integration with diverse monitoring systems.
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