Earphone

Abstract

Disclosed in the present application is an earphone. The earphone comprises a sound production portion, an abutting portion, and an elastic connection portion connected between the sound production portion and the abutting portion, wherein the sound production portion comprises a first housing, a second housing and a speaker assembly, and the elastic connection portion is connected to a first end of the first housing. The speaker assembly has an axial direction and a radial direction perpendicular to each other, the speaker assembly is partially inserted into the first housing in the radial direction from a second end of the first housing, and the speaker assembly is provided with a first bonding pad and a second bonding pad that are exposed from the first housing. The elastic connection portion comprises a first wire group extending from the abutting portion to the sound production portion, the first wire group extending from the first end to the second end, and comprises a first wire and a second wire that are electrically connected to the first pad and the second pad, respectively. In this way, the present application can facilitate the soldering of the first bonding pad and the second bonding pad to the first wire group, and reduce the accumulation of the first wire group inside the first housing or the second housing, thereby reducing the assembly difficulty of the earphone.

Description

earphone [Technical Field]

[0001] This application relates to the technical field of electronic devices, and in particular to headphones. [Background Technology]

[0002] With the increasing popularity of electronic devices, they have become indispensable social and entertainment tools in people's daily lives, and people's demands for electronic devices are also getting higher and higher. Electronic devices such as headphones and smart glasses are also widely used in people's daily lives. They can be used in conjunction with terminal devices such as mobile phones and computers to provide users with an auditory feast.

[0003] Because the internal space of headphones is small, but multiple components need to be installed, the wiring connections are often complex and the internal wires tend to pile up, which increases the difficulty of assembling the headphones. [Summary of the Invention]

[0004] To solve the aforementioned technical problems, one technical solution adopted in this application is to provide an earphone, which includes a sound-emitting part, a backing part, and an elastic connecting part connecting the sound-emitting part and the backing part. In the wearing state, the sound-emitting part is disposed within the concha cavity, the backing part abuts against the back of the auricle, and the elastic connecting part is wrapped around the periphery of the helix. The sound-emitting part includes a first housing, a second housing, and a speaker assembly. The elastic connecting part is connected to a first end of the first housing. The speaker assembly has mutually perpendicular axial and radial directions. The speaker assembly is inserted into the first housing from the second end along the radial direction, with the first end and the second end facing away from each other. The speaker assembly is provided with a first solder pad and a second solder pad, which are exposed outside the first housing. The elastic connecting part includes a first wire group extending from the backing part to the sound-emitting part. The first wire group extends from the first end to the second end and includes a first wire and a second wire electrically connected to the first solder pad and the second solder pad, respectively. The second housing is assembled with the second end of the first housing to cover the exposed portion of the speaker assembly relative to the first housing.

[0005] In some embodiments, the loudspeaker assembly includes two loudspeakers and an adapter circuit board. Each loudspeaker includes a diaphragm, a voice coil connected to the diaphragm, a magnetic circuit system, and a frame for supporting the diaphragm and the magnetic circuit system. The frames of the two loudspeakers are assembled together in an axial direction. A first pad and a second pad are disposed on the adapter circuit board and electrically connected to the voice coils of the two loudspeakers respectively through the adapter circuit board.

[0006] In some embodiments, when viewed in the axial direction, the first pad and the second pad are exposed outside the first housing.

[0007] In some embodiments, each basin frame is provided with a support platform located on the periphery of the magnetic circuit system and opposite to the other basin frame. The adapter circuit board includes two main boards respectively disposed on the support platforms of the two basin frames and an auxiliary board connected between the two main boards. The first pad and the second pad are disposed on the same main board.

[0008] In some embodiments, each support platform is provided with a third pad and a fourth pad that are electrically connected to the voice coil of their respective loudspeakers. Each main board is provided with a fifth pad and a sixth pad that overlap with and are electrically connected to the third pad and the fourth pad, respectively. The fifth pad and the sixth pad of the two main boards are electrically connected to the first pad and the second pad, respectively. Alternatively, the fifth pad and the sixth pad of one main board are the first pad and the second pad, respectively, and the fifth pad and the sixth pad of the other main board are electrically connected to the first pad and the second pad, respectively.

[0009] In some embodiments, the connections between the two fifth pads and the connections between the two sixth pads are arranged in an intersecting configuration.

[0010] In some embodiments, each frame is provided with two adhesive baffles located at both ends of the main body along the circumference of the speaker assembly, and the speaker assembly further includes sealant filled between the two adhesive baffles and covering the main body.

[0011] In some embodiments, the speaker assembly cooperates with a first housing and a second housing to form a first acoustic cavity around the speaker assembly. The frame is provided with a connecting hole that connects the first acoustic cavity and the diaphragms of the two speakers to opposite sides. The first housing has a pressure relief hole that connects the first acoustic cavity and the external environment. The second housing has a third end near the abutment and a fourth end away from the abutment. When viewed along the axial direction, the adapter circuit board is closer to the third end along the radial direction than the pressure relief hole.

[0012] In some embodiments, a second acoustic cavity is formed between the diaphragms of the two speakers, and the second housing has a sound outlet that connects the second acoustic cavity with the external environment. When viewed along the axial direction, the sound outlet is closer to the fourth end than the adapter circuit board.

[0013] In some embodiments, the resilient connection portion further includes a third housing, which is assembled with a first end of the first housing. The earphone also includes a microphone disposed in the third housing. The resilient connection portion further includes a second wire assembly extending from the abutment portion to the sound-emitting portion, which is electrically connected to the microphone.

[0014] In some embodiments, the abutment portion includes a control circuit, and the first wire group and the second wire group are electrically connected to the control circuit and fixedly disposed within the elastic connection portion.

[0015] The beneficial effects of this application are as follows: The sound-emitting part of this application includes a first housing, a second housing, and a speaker assembly. The speaker assembly is inserted into the first housing from the second end of the first housing. The speaker assembly is provided with a first solder pad and a second solder pad exposed outside the first housing. Therefore, the first wire group in the elastic connection part connects the first solder pad, the second solder pad, and the component in the abutment part. Therefore, the arrangement of the first solder pad and the second solder pad exposed outside the first housing allows for proper adjustment of the position of the first wire group and, after the speaker assembly is inserted into the first housing, soldering of the first solder pad and the second solder pad to the first wire group. This makes soldering of the first solder pad and the second solder pad to the first wire group more convenient, reduces the accumulation of the first wire group inside the first housing or the second housing, and facilitates the assembly of the speaker assembly with the first housing, reducing the assembly difficulty of the headphones. [Attached Image Description]

[0016] Figure 1 is a schematic diagram of the front outline of the user's ear as described in this application;

[0017] Figure 2 is a side-view three-dimensional structural diagram of an embodiment of the earphone provided in this application;

[0018] Figure 3 is an exploded structural diagram of the headphone embodiment shown in Figure 2;

[0019] Figure 4 is an exploded structural diagram of the sound-producing part and the elastic connector in the earphone embodiment shown in Figure 2;

[0020] Figure 5 is another exploded structural diagram of the headphone embodiment shown in Figure 2;

[0021] Figure 6 is a schematic diagram of the cross-sectional structure of the earphone embodiment shown in Figure 2 along section line AA;

[0022] Figure 7 is a three-dimensional structural schematic diagram of the speaker in the earphone embodiment shown in Figure 3;

[0023] Figure 8 is a three-dimensional structural schematic diagram of the adapter circuit board in the earphone embodiment shown in Figure 5;

[0024] Figure 9 is a schematic diagram of the cross-sectional structure of the sound-emitting part along section line BB in the headphone embodiment shown in Figure 2. 【Detailed Implementation Methods】

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0026] The reference to "embodiment" in this application means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0027] The following is an exemplary description of the headphones in the example embodiment.

[0028] Referring to Figure 1, the user's ear 1 may include physiological parts such as the external auditory canal 101, the concha 102, and the auricle 103. The auricle 103 may include the helix 1031. Although the external auditory canal 101 has a certain depth and extends to the tympanic membrane of the ear 1, for ease of description, unless otherwise specified, the external auditory canal 101 specifically refers to its entrance (i.e., ear canal) away from the tympanic membrane. Furthermore, the concha 102 has a certain volume and depth, and the concha 102 is directly connected to the external auditory canal 101; that is, the aforementioned ear canal can be simply considered as being located at the bottom of the concha 102.

[0029] Referring to Figure 2, the headphones 10 are an audio converter capable of receiving electrical signals emitted from a media player or receiver and converting the electrical signals into sound waves that can be heard by the user. In some embodiments, the headphones 10 can be clip-on headphones, ear-hook headphones, or behind-the-ear headphones, etc.

[0030] In some embodiments, as shown in FIG2 and FIG3, the earphone 10 may include a sound-emitting part 100, a contact part 200, and an elastic connecting part 300 connected between the sound-emitting part 100 and the contact part 200.

[0031] The sound-emitting part 100 can be a sound playback device, which can be used to convert electrical signals into sound signals (also known as "sound waves" or "sound signals") and transmit them to the wearer's ear 1.

[0032] The elastic connection 300 can be a spring or other elastic element, connecting the sound-generating part 100 and the abutment part 200, allowing the user to wear the earphone 10 on the ear 1 through the elastic connection 300. In the wearing state, the sound-generating part 100 can be disposed within the concha 102, the abutment part 200 abuts against the back of the auricle 103, and the elastic connection 300 can be wrapped around the periphery of the helix 1031. In some embodiments, the abutment part 200 may also house other components such as a control circuit, battery, circuit board, or sensor.

[0033] Referring to Figures 2, 3, and 4, the sound-emitting part 100 may include a first housing 110, a second housing 120, and a speaker assembly 130. The elastic connecting part 300 is connected to the first end 111 of the first housing 110. The second housing 120 is assembled with the second end 112 of the first housing 110, and the speaker assembly 130 may be disposed within the space formed by the first housing 110 and the second housing 120.

[0034] As shown in Figures 4 and 5, the speaker assembly 130 has mutually perpendicular axial and radial directions. The speaker assembly 130 can be inserted into the first housing 110 from the second end 112 portion along the radial direction, with the first end 111 and the second end 112 disposed opposite to each other. As an example, the axial direction of the speaker assembly 130 can be the direction shown by arrow C in Figures 4 and 5, and the radial direction can be the direction shown by arrow D in Figure 5.

[0035] As shown in Figures 3 to 5, the speaker assembly 130 may be provided with a first pad 131 and a second pad 132. The first pad 131 and the second pad 132 are exposed from the first housing 110. The resilient connection portion 300 includes a first wire group 310 extending from the abutment portion 200 to the sound-emitting portion 100. The first wire group 310 extends from a first end 111 to a second end 112 and includes a first wire 311 and a second wire 312 that are electrically connected to the first pad 131 and the second pad 132, respectively. The second housing 120 is assembled with the second end 112 of the first housing 110 to cover the exposed portion of the speaker assembly 130 relative to the first housing 110.

[0036] Specifically, one end of each of the first wire 311 and the second wire 312 extends from the first end 111 to the second end 112 to be soldered to the first pad 131 and the second pad 132, respectively. The other end of each of the first wire 311 and the second wire 312 extends along the extending direction of the elastic connection portion 300 to the abutment portion 200 and is connected to other components in the abutment portion 200.

[0037] In some embodiments, the first pad 131 and the second pad 132 can be respectively connected to the positive and negative terminals of the circuit in the speaker assembly 130, and the first wire 311 and the second wire 312 are respectively connected to the first pad 131 and the second pad 132, thereby connecting the positive and negative terminals of the circuit in the speaker assembly 130 to achieve communication with the circuit in the speaker assembly 130.

[0038] By exposing the first solder pad 131 and the second solder pad 132 outside the first housing 110, the speaker assembly 130 can be inserted into the first housing 110 before the first solder pads 131 and 132 are soldered to the first lead wire group 310. This makes soldering the first solder pads 131 and 132 to the first lead wire group 310 more convenient, and eliminates the need to first extend and pull out the first lead wire group 310 to solder to the speaker assembly 130 before inserting the speaker assembly 130 into the first housing 110. This reduces the accumulation of the first lead wire group 310 inside the first housing 110 or the second housing 120. This arrangement also allows for the assembly of the speaker assembly 130 to the first housing 110 first, followed by soldering the speaker assembly 130 to the first lead wire group 310, thereby reducing the assembly difficulty of the headphone 10.

[0039] In some embodiments, as shown in Figures 5 and 6, the loudspeaker assembly 130 may include two loudspeakers 133 and an adapter circuit board 134. Each loudspeaker 133 includes a diaphragm 1331, a voice coil 1332 connected to the diaphragm 1331, a magnetic circuit system 1333, and a frame 1334 for supporting the diaphragm 1331 and the magnetic circuit system 1333. The frames 1334 of the two loudspeakers 133 are assembled together along the axial direction C. A first pad 131 and a second pad 132 are disposed on the adapter circuit board 134 and electrically connected to the voice coils 1332 of the two loudspeakers 133 respectively through the adapter circuit board 134.

[0040] The voice coil 1332 can vibrate by interacting with the magnetic field of the magnetic circuit system 1333 when current passes through it, and the vibration drives the diaphragm 1331 to vibrate to generate sound waves, thereby enabling the loudspeaker assembly 130 to convert electrical signals into sound waves.

[0041] Specifically, the adapter circuit board 134 is electrically connected to the voice coils 1332 of the two speakers 133, and the first pad 131 and the second pad 132 on the adapter circuit board 134 are connected to the first wire group 310. The first wire group 310 connects to electronic components such as control circuits, batteries or circuit boards in the abutment part 200. Therefore, the voice coils 1332 of the two speakers 133 can be connected to electronic components such as control circuits, batteries or circuit boards in the abutment part 200 through the first pad 131, the second pad 132 and the adapter circuit board 134.

[0042] By electrically connecting the voice coils 1332 of the two speakers 133 to the adapter circuit board 134, the voice coils 1332 of the two speakers 133 can be electrically led out to the adapter circuit board 134, so that the first wire group 310 can be electrically connected to the voice coils 1332 through the first pad 131, the second pad 132 and the adapter circuit board 134.

[0043] In some embodiments, as shown in FIG4, when viewed along the axial direction C, the first pad 131 and the second pad 132 can be exposed from the first housing 110.

[0044] Since the radial direction D is the insertion direction when the speaker assembly 130 is inserted into the first housing 110, and the axial direction C is perpendicular to the radial direction D, placing the first pad 131 and the second pad 132 on the surface of the speaker assembly 130 when viewed along the axial direction C makes it less likely that the first pad 131 and the second pad 132 will be blocked by the first housing 110, and also facilitates the electrical connection of the first pad 131 and the second pad 132 to the first wire 311 and the second wire 312, respectively.

[0045] In some embodiments, referring to Figures 5 and 7, each basket 1334 may be provided with a support platform 13341 located around the magnetic circuit system 1333 and opposite to the other basket 1334. Referring to Figures 5 and 8, the adapter circuit board 134 may include two main board bodies 1341 respectively disposed on the support platforms 13341 of the two baskets 1334 and an auxiliary board body 1342 connected between the two main board bodies 1341, with the first solder pad 131 and the second solder pad 132 disposed on the same main board body 1341. The two main board bodies 1341 are disposed on the support platforms 13341 of the two baskets 1334 and can be electrically connected to the voice coils 1332 of the two speakers 133.

[0046] By setting a support platform 13341 on each tray 1334 to place two motherboard bodies 1341, and setting the first pad 131 and the second pad 132 on the same motherboard body 1341, it is convenient for the first wire 311 and the second wire 312 to be soldered to the first pad 131 and the second pad 132 respectively, so as to make the soldering operation more convenient.

[0047] In some embodiments, as shown in Figures 5 and 7, each support platform 13341 may be provided with a third pad 13342 and a fourth pad 13343 that are electrically connected to the voice coil 1332 of the speaker 133 to which they are respectively located. Each main board body 1341 may be provided with a fifth pad 13411 and a sixth pad 13412 that are overlapped with and electrically connected to the third pad 13342 and the fourth pad 13343 respectively. The fifth pad 13411 and the sixth pad 13412 of the two main board bodies 1341 are electrically connected to the first pad 131 and the second pad 132 respectively.

[0048] Specifically, the third pad 13342 and the fourth pad 13343 on each support platform 13341 are electrically connected to the voice coil 1332, thereby electrically leading the voice coil 1332 out of the support platform 13341 of the frame 1334. One of the third pad 13342 and the fourth pad 13343 is connected to the negative circuit of the voice coil 1332, and the other is connected to the positive circuit of the voice coil 1332. For example, the third pad 13342 is electrically connected to the negative circuit of the voice coil 1332, and the fourth pad 13343 is electrically connected to the positive circuit of the voice coil 1332.

[0049] The fifth pad 13411 and the sixth pad 13412 of each motherboard body 1341 can be overlapped with and electrically connected to the third pad 13342 and the fourth pad 13343, respectively, thus allowing the voice coil 1332 to be electrically led out of the motherboard body 1341. Similarly, one of the fifth pad 13411 and the sixth pad 13412 is connected to the positive terminal of the voice coil 1332, and the other is connected to the negative terminal of the voice coil 1332. For example, the fifth pad 13411 is electrically connected to the negative third pad 13342, and the sixth pad 13412 is electrically connected to the positive fourth pad 13343.

[0050] Furthermore, the arrangement of the fifth pad 13411 and the sixth pad 13412 overlapping with the corresponding third pad 13342 and the corresponding fourth pad 13343, respectively, not only simplifies the soldering process but also makes the connection between the pads more stable, thereby reducing the possibility of poor contact.

[0051] The two fifth pads 13411 and the sixth pad 13412 can be further electrically connected to the first pad 131 and the second pad 132 respectively via circuitry in the adapter circuit board 134. For example, the two fifth pads 13411 of the negative electrode are connected to the first pad 131 of the negative electrode, and the two sixth pads 13412 of the positive electrode are connected to the second pad 132 of the positive electrode.

[0052] By concentrating the fifth pad 13411 and the sixth pad 13412 of the two main board bodies 1341 to electrically connect with the first pad 131 and the second pad 132, the electrical connection process between the first wire group 310 and the two voice coils 1332 can be simplified. There is no need to set four wires in the first wire group 310 to electrically connect with the two voice coils 1332, thereby simplifying the soldering process of the headphone 10 and simplifying the internal structure of the headphone 10.

[0053] Alternatively, in other embodiments, the fifth pad 13411 and the sixth pad 13412 of one motherboard body 1341 can serve as the first pad 131 and the second pad 132, respectively, and the fifth pad 13411 and the sixth pad 13412 of the other motherboard body 1341 are electrically connected to the first pad 131 and the second pad 132, respectively. By directly using the fifth pad 13411 and the sixth pad 13412 of one motherboard body 1341 as the first pad 131 and the second pad 132, not only can the soldering process be reduced and the assembly process of the earphone 10 simplified, but resources can also be saved and the cost of the earphone 10 reduced.

[0054] Of course, in other embodiments, one of the first pad 131 and the second pad 132 can be used as the fifth pad 13411 or the sixth pad 13412, and the other is disposed on the motherboard body 1341. This arrangement makes it easier for the first pad 131 and the second pad 132 to be exposed on the first housing 110.

[0055] In some embodiments, as shown in FIG8, the lines connecting the two fifth pads 13411 and the lines connecting the two sixth pads 13412 may be arranged in an intersecting manner. For example, in the axial direction C, the position of the fifth pad 13411 may correspond to the sixth pad 13412 on another motherboard body 1341.

[0056] Specifically, the two speaker frames 1334 can be assembled and mated together along the axial direction C, and the main board 1341 can be disposed on the side of the corresponding speaker frame 1334 away from the other speaker frame 1334. Therefore, by setting the connection line of the fifth pad 13411 of the two main board frames 1341 and the connection line of the two sixth pads 13412 to intersect, the two speaker frames 1334 can be configured to have the same shape and be centrally symmetrical. Furthermore, the two speakers 133 can also be configured to be identical speakers 133, and the two speakers 133 can also be centrally symmetrical. This configuration simplifies the manufacturing and assembly of the speaker assembly 130.

[0057] In some embodiments, as shown in FIG7, each basket 1334 may be provided with two adhesive baffles 13344 located at both ends of the main body 1341 along the circumference of the speaker assembly 130. The speaker assembly 130 may also include a sealant (not shown) filled between the two adhesive baffles 13344 and covering the main body 1341.

[0058] The sealant can be used to bond the motherboard body 1341 and the support platform 13341, making the motherboard body 1341 more firmly bonded to the support platform 13341. Furthermore, the sealant can seal the gap between the motherboard body 1341 and the support platform 13341, preventing dust or moisture from easily entering the gap and thus reducing the likelihood of interference with the soldering of the third pad 13342 and the fourth pad 13343 on the support platform 13341 to the motherboard body 1341.

[0059] The two sealant-blocking portions 13344 can be used to prevent sealant from overflowing the mainboard body 1341 in the circumferential direction of the basin frame 1334 and affecting other components. In addition, the two sealant-blocking portions 13344 can further limit the position of the mainboard body 1341, thereby making the mainboard body 1341 more securely mounted on the basin frame 1334 and facilitating the mounting of the mainboard body 1341 on the support platform 13341.

[0060] In some embodiments, as shown in Figures 6, 7, and 9, the speaker assembly 130 can cooperate with the first housing 110 and the second housing 120 to form a first acoustic cavity 136 around the speaker assembly 130. The frame 1334 can be provided with a connecting hole 13345 that connects the first acoustic cavity 136 and the diaphragms 1331 of the two speakers 133 to opposite sides. The first housing 110 can be provided with a pressure relief hole 113 that connects the first acoustic cavity 136 and the external environment.

[0061] Specifically, the diaphragm 1331, the magnetic circuit system 1333, and the frame 1334 can enclose and form an internal acoustic cavity 135. The connecting hole 13345 on the frame 1334 can connect the internal acoustic cavity 135 with the first acoustic cavity 136 on the periphery of the protrusion. When the diaphragm 1331 vibrates to generate sound waves, the air in the internal acoustic cavity 135 can communicate with the air in the external environment of the headphone 10 through the connecting hole 13345, the first acoustic cavity 136, and the pressure relief hole 113, thereby allowing the internal acoustic cavity 135 to be depressurized.

[0062] In some embodiments, as shown in FIG3, FIG4 and FIG9, the second housing 120 may have a third end 121 near the abutment portion 200 and a fourth end 122 away from the abutment portion 200. When viewed along the axial direction C, the adapter circuit board 134 is closer to the third end 121 along the radial direction D than the pressure relief hole 113.

[0063] Since the sound-emitting part 100 is located inside the concha 102 when worn, and the abutment part 200 abuts against the back of the auricle 103, the third end 121 of the sound-emitting part 100 near the abutment part 200 will fit more tightly against the concha 102. Therefore, by setting the adapter circuit board 134 in the radial direction D closer to the third end 121 than the pressure relief hole 113, and by opening the pressure relief hole 113 in the first housing 110, the pressure relief hole 113 is less likely to come into contact with the concha 102 and be blocked by the ear 1 when the earphone 10 is worn, thereby improving the pressure relief effect of the pressure relief hole 113 and improving the sound output effect of the earphone 10.

[0064] In some embodiments, as shown in Figures 6 and 9, a second acoustic cavity 137 may be formed between the diaphragms 1331 of the two speakers 133. The second housing 120 may have a sound outlet 123 communicating between the second acoustic cavity 137 and the external environment. When the diaphragm 1331 vibrates to generate sound waves, the sound waves can be transmitted out of the earphone 10 through the second acoustic cavity 137 and the sound outlet 123.

[0065] When viewed along the axial direction C, the sound outlet 123 is closer to the fourth end 122 than the adapter circuit board 134. In the wearing state, the first end 111 near the abutment 200 fits tightly against the concha 102. Positioning the sound outlet 123 at the fourth end 122, away from the abutment 200, prevents it from being blocked by the walls of the concha 102, thus improving the sound output effect. Furthermore, positioning the adapter circuit board 134 closer to the third end 121 not only prevents it from obstructing the pressure relief hole 113 and the sound outlet 123 within the sound-generating part 100, thereby improving the sound output effect of the earphone 10, but also increases the space utilization within the sound-generating part 100.

[0066] In some embodiments, as shown in Figures 3 and 9, the resilient connection portion 300 may further include a third housing 320, which can be assembled with the first end 111 of the first housing 110. The earphone 10 may further include a microphone 400 disposed in the third housing 320. The resilient connection portion 300 may further include a second wire assembly 330 extending from the abutment portion 200 to the sound-emitting portion 100, and the second wire assembly 330 is electrically connected to the microphone 400. One end of the second wire assembly 330 is electrically connected to the microphone 400, and the other end extends to the abutment portion 200, so that the microphone 400 can be connected to electronic components such as control circuitry, batteries, or circuit boards in the abutment portion 200.

[0067] The microphone 400 can capture sounds from outside the headphones 10. These sounds can include, for example, the user's voice, horn sounds, car bell sounds, surrounding voices, or traffic signals.

[0068] In some embodiments, when worn, the microphone 400 can be positioned on the side of the third housing 320 further away from the auricle 103 of the human body. The adapter circuit board 134 can be located near the abutment 200 and the third end 121 of the auricle 103. This reduces the phenomenon of the first wire group 310 and the second wire group 330 getting tangled, and also reduces the possibility that the microphone 400 is located on the wiring path of the first wire group 310, affecting the soldering of the first wire group 310 with the first solder pad 131 and the second solder pad 132. This makes the arrangement of the components inside the earphone 10 more reasonable and facilitates the manufacturing and assembly of the earphone 10.

[0069] In some embodiments, as shown in FIG9, the contact part 200 may include a control circuit 210. The control circuit 210 may be a CPU (Central Processing Unit) or an integrated circuit chip with signal processing capabilities. The control circuit 210 may also include a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor may be a microprocessor or any conventional processor.

[0070] The first wire group 310 and the second wire group 330 can be electrically connected to the control circuit 210 respectively and are fixedly installed in the elastic connection part 300.

[0071] Specifically, the first wire group 310 can connect the control circuit 210 and the first pad 131 and the second pad 132, so that the control circuit 210 can electrically connect the voice coils 1332 in the two loudspeakers 133 through the first pad 131 and the second pad 132, thereby allowing the control circuit 210 to control the current flowing to the voice coils 1332, thereby affecting the interaction between the voice coils 1332 and the magnetic circuit system 1333, causing the diaphragm 1331 to vibrate and generate the required sound waves.

[0072] The second wire group 330 can connect the control circuit 210 and the microphone 400. The microphone 400 can collect external sounds and convert them into electrical signals, and transmit the electrical signals representing the external sounds to the control circuit 210 through the second wire group 330.

[0073] In summary, the sound-emitting part 100 of this application includes a first housing 110, a second housing 120, and a speaker assembly 130, wherein the speaker assembly 130 is partially inserted into the first housing 110 from the second end 112 of the first housing 110, and the speaker assembly 130 is provided with a first pad 131 and a second pad 132 exposed from the first housing 110. Therefore, the first wire group 310 in the elastic connection part 300 connects the first pad 131 and the second pad 132 and the components in the abutment part 200. Therefore, the exposed first pad 131 and second pad 132 from the first housing 110 allows for proper positioning of the first wire assembly 310 and, after the speaker assembly 130 is inserted into the first housing 110, soldering of the first pad 131 and second pad 132 to the first wire assembly 310. This makes soldering of the first pad 131 and second pad 132 to the first wire assembly 310 easier, reduces the accumulation of the first wire assembly 310 inside the first housing 110 or the second housing 120, facilitates the assembly of the speaker assembly 130 to the first housing 110, and reduces the assembly difficulty of the headphones 10.

[0074] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An earphone, characterized in that, The earphone includes a sound-emitting part, a backing part, and an elastic connecting part connecting the sound-emitting part and the backing part. When worn, the sound-emitting part is disposed in the concha cavity, the backing part abuts against the back side of the auricle, and the elastic connecting part is wrapped around the periphery of the helix. The sound-emitting part includes a first shell, a second shell, and a speaker assembly. The elastic connecting part is connected to the first end of the first shell. The speaker assembly has mutually perpendicular axial and radial directions. The speaker assembly is inserted into the first housing from the second end portion along the radial direction. The first end and the second end are disposed opposite to each other. The speaker assembly is provided with a first pad and a second pad. The first pad and the second pad are exposed outside the first housing. The elastic connection portion includes a first wire group extending from the abutment portion to the sound-emitting portion. The first wire group extends from the first end to the second end and includes a first wire and a second wire that are electrically connected to the first pad and the second pad, respectively. The second housing is assembled with the second end of the first housing to cover the exposed portion of the speaker assembly relative to the first housing.

2. The earphone according to claim 1, characterized in that, The loudspeaker assembly includes two loudspeakers and an adapter circuit board. Each loudspeaker includes a diaphragm, a voice coil connected to the diaphragm, a magnetic circuit system, and a frame for supporting the diaphragm and the magnetic circuit system. The frames of the two loudspeakers are assembled together along the axial direction. The first pad and the second pad are disposed on the adapter circuit board and electrically connected to the voice coils of the two loudspeakers respectively through the adapter circuit board.

3. The earphone according to claim 2, characterized in that, When viewed along the axial direction, the first pad and the second pad are exposed outside the first housing.

4. The earphone according to claim 3, characterized in that, Each of the basin frames is provided with a support platform located on the periphery of the magnetic circuit system and opposite to the other basin frame. The adapter circuit board includes two main boards respectively disposed on the support platforms of the two basin frames and an auxiliary board connected between the two main boards. The first pad and the second pad are disposed on the same main board.

5. The earphone according to claim 4, characterized in that, Each of the support platforms is provided with a third pad and a fourth pad, which are electrically connected to the voice coil of the speaker to which they are located. Each main board is provided with a fifth pad and a sixth pad, which are overlapped with and electrically connected to the third pad and the fourth pad, respectively. The fifth pad and the sixth pad of the two main boards are electrically connected to the first pad and the second pad, respectively. The fifth and sixth pads of one of the motherboard bodies are respectively the first pad and the second pad, and the fifth and sixth pads of the other motherboard body are electrically connected to the first pad and the second pad, respectively.

6. The earphone according to claim 5, characterized in that, The connections between the two fifth pads and the connections between the two sixth pads are arranged in an intersecting pattern.

7. The earphone according to claim 5, characterized in that, Each of the speaker frames is provided with two adhesive baffles located at both ends of the main body along the circumference of the speaker assembly, and the speaker assembly further includes sealant filled between the two adhesive baffles and covering the main body.

8. The earphone according to claim 2, characterized in that, The speaker assembly cooperates with the first housing and the second housing to form a first acoustic cavity around the speaker assembly. The frame is provided with a connecting hole that connects the first acoustic cavity and the diaphragms of the two speakers to opposite sides. The first housing has a pressure relief hole that connects the first acoustic cavity and the external environment. The second housing has a third end near the abutment and a fourth end away from the abutment. When viewed along the axial direction, the adapter circuit board is closer to the third end along the radial direction than the pressure relief hole.

9. The earphone according to claim 8, characterized in that, A second acoustic cavity is formed between the diaphragms of the two speakers. The second housing has a sound outlet that connects the second acoustic cavity to the external environment. When viewed along the axial direction, the sound outlet is closer to the fourth end than the adapter circuit board.

10. The earphone according to claim 1, characterized in that, The elastic connection portion further includes a third housing, which is assembled with a first end of the first housing. The earphone also includes a microphone disposed in the third housing. The elastic connection portion further includes a second wire assembly extending from the abutment portion to the sound-emitting portion, and the second wire assembly is electrically connected to the microphone.

11. The earphone according to claim 10, characterized in that, The abutment part includes a control circuit, and the first wire group and the second wire group are electrically connected to the control circuit and fixedly disposed in the elastic connection part.

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