Miniature wireless thermoelectric cooling device

By combining a wireless power supply mechanism and a semiconductor cooling mechanism, the problem of traditional thermoelectric cooling technology being limited by a fixed power source is solved, realizing flexible power supply and precise temperature control for miniature wireless thermoelectric cooling devices, which are suitable for a variety of application scenarios.

WO2026123480A1 Publication Date: 2026-06-18SHANGHAI TECH UNIV
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SHANGHAI TECH UNIV
Filing Date
2025-03-10
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Existing thermoelectric cooling technology is limited by the fixed power source location, resulting in complex circuit layouts and large space occupation, making it difficult to use flexibly in various application scenarios.

⚗Method used

This miniature wireless thermoelectric cooling device combines a wireless power supply mechanism and a semiconductor cooling mechanism. It generates a magnetic field through a wireless power supply transmitting coil and uses the principle of electromagnetic induction to power a miniature semiconductor cooling chip, thus achieving wireless power supply and precise temperature control.

🎯Benefits of technology

It realizes flexible mobile power supply of micro-semiconductor cooling chips, which can provide precise cooling and temperature control for mobile target objects without occupying extra space, and has the ability to quickly cool down and maintain temperature difference.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the technical field of semiconductor thermoelectric energy conversion. Provided is a miniature wireless thermoelectric cooling device. The miniature wireless thermoelectric cooling device provided in the present invention comprises a wireless power supply mechanism and a semiconductor cooling mechanism which are independent of each other, wherein the wireless power supply mechanism comprises a wireless power supply transmitting coil, a first conversion circuit module and a power source, which are connected in sequence; and the semiconductor cooling mechanism comprises a miniature semiconductor cooling chip, a second conversion circuit module and a wireless power supply receiving coil, which are connected in sequence. The present invention uses the wireless power supply mechanism as a power supply portion of the miniature wireless thermoelectric cooling device, thereby overcoming the restriction imposed by the fixed position of the power source in conventional cooling modes; and the wireless power supply transmitting coil can provide a magnetic field in a target region, and the wireless power supply receiving coil can generate an induced alternating current in the magnetic field, thereby providing electric energy for the miniature semiconductor cooling chip and achieving the effect of the miniature semiconductor cooling chip being able to provide accurate cooling and temperature control for a movable target object.
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