Ultrafast thermal switching device and design method therefor
An ultrafast thermal switching device was designed by heterogeneous terminal pairing and transient polariton coupling excited by external ultrafast light. This design solves the problems of slow response speed and low thermal switching ratio in the prior art, and achieves picosecond-level response and high thermal switching ratio thermal flow control. It is suitable for high-speed optoelectronics, thermo-optic modulators and on-chip lasers.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SHANGHAI JIAOTONG UNIV
- Filing Date
- 2025-04-15
- Publication Date
- 2026-06-18
AI Technical Summary
Existing ultrafast thermal switching devices struggle to achieve faster response times, higher thermal switching ratios, and higher reliability, especially in precise heat flow control on nanosecond timescales. Existing technologies suffer from slow response speeds and weak material dependence on external fields.
By employing a heterogeneous terminal pairing design and the synergistic effect of external ultrafast light-excited transient polaritons, and through an asymmetric parallel planar structure with a fixed near-field gap, picosecond-level thermal switching function is achieved by utilizing the time-varying coupling of mid-infrared transient polaritons. This includes a heterogeneous material design of a first polariton layer and a second polariton layer, with external ultrafast light excitation generating high-density free carriers and controlling the opening and closing of the thermal switch.
It achieves picosecond-level ultrafast thermal switching response and a thermal switching ratio of up to four orders of magnitude, providing precise thermal control in fields such as high-speed optoelectronics, thermo-optic modulators, and on-chip lasers, and can achieve laser cooling effects within a single switching cycle.
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