Laser machining parameter determination method and apparatus, and laser machining control method and apparatus
By precisely locating the center and intersection of the target cutting path under a wide-angle camera, the laser on and off positions are determined, solving the problem of inaccurate control of the starting point, ending point, and length in laser processing. This achieves high-precision laser processing and reduces safety risks and equipment damage.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SHENZHEN MEGAROBO TECH CO LTD
- Filing Date
- 2025-09-19
- Publication Date
- 2026-06-18
AI Technical Summary
In laser processing, existing technologies struggle to accurately control the starting point, ending point, and length of material processing, leading to suboptimal product quality, safety hazards, and potentially shortened equipment lifespan.
By obtaining the position of the center of the target cutting track on the product to be processed under the wide-angle camera, the position information of the two intersection points is determined. Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, the laser on and off positions are obtained to achieve precise laser processing control.
It improves the precision of laser processing, reduces the risk of safety accidents, protects equipment, and avoids shortening equipment life due to improper control.
Smart Images

Figure CN2025122532_18062026_PF_FP_ABST
Abstract
Description
Methods for determining laser processing parameters, laser processing control methods and devices
[0001] This application claims priority to Chinese Patent Application No. 202411840487.4, filed on December 12, 2024, entitled "Method for Determining Laser Processing Parameters, Method and Apparatus for Controlling Laser Processing", the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of materials processing technology, and in particular to a method for determining laser processing parameters, a method for controlling laser processing, and an apparatus. Background Technology
[0003] When processing materials using high-power devices (such as lasers), inaccurate control over the starting and ending points of the processing, or the processing length, can easily lead to suboptimal product quality. Furthermore, inaccurate control over these factors can cause safety issues during processing or potentially shorten the lifespan of the processing equipment.
[0004] For example, during laser surface cutting, if the actual cutting length exceeds the material's cutting path length, or if the start and end points of the laser cut are not on the material, the laser heat may damage the processing stage and shorten the equipment's lifespan. If the cutting point falls onto the blue film, the heated blue film may ignite, causing a safety accident. These examples illustrate the importance of accurate control in laser processing. Improving the accuracy of laser processing control is a pressing technical problem that needs to be solved in this field. Summary of the Invention
[0005] To address the aforementioned issues, this application provides a method for determining laser processing parameters, a method for controlling laser processing, and an apparatus for doing so, with the aim of improving the accuracy of laser processing control.
[0006] The embodiments of this application disclose the following technical solutions:
[0007] The first aspect of this application provides a method for determining laser processing parameters, the method comprising:
[0008] The position of the center of the target cutting path on the product to be processed is obtained under the wide-angle camera; the cutting path is a strip-shaped area on the product to be processed used to divide multiple target features.
[0009] The position information of two intersection points that pass through the aforementioned position and are parallel to the preset direction and intersect with the contour of the product to be processed is determined; the contour is extracted based on the image of the product to be processed by the wide-angle camera, and the straight line direction of the cutting path is the preset direction;
[0010] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, as well as the position information of the two intersection points, the laser on-light position and laser off-light position for laser processing of the product to be processed are obtained.
[0011] In an optional implementation, the two intersection points include a first intersection point and a second intersection point; the conversion of the relative position of the field of view center of the wide-angle camera and the laser emission point, as well as the position information of the two intersection points, to obtain the laser on-light position and laser off-light position for laser processing of the product to be processed includes:
[0012] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point, a first position conversion result is calculated; and based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the second intersection point, a second position conversion result is calculated; of the first position conversion result and the second position conversion result, one is used as the laser on position and the other is used as the laser off position.
[0013] In an optional implementation, the step of calculating the first position transformation result based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point, includes: transforming the position information of the first intersection point from the pixel coordinate system to the axial coordinate system according to the proportional relationship between the axial coordinate system and the pixel coordinate system, to obtain the position information of the first intersection point in the axial coordinate system;
[0014] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point in the axial coordinate system, the first position transformation result is calculated as the laser switching position.
[0015] The step of calculating the second position transformation result based on the relative position of the wide-angle camera's field of view center and the laser emission point, and the position information of the second intersection point, includes:
[0016] Based on the proportional relationship, the position information of the second intersection point is transformed from the pixel coordinate system to the axis coordinate system to obtain the position information of the second intersection point in the axis coordinate system;
[0017] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the second intersection point in the axial coordinate system, the second position transformation result is calculated as the laser off position.
[0018] Among the optional implementation methods, the methods for determining laser processing parameters also include:
[0019] The relative position between the field of view center of the fine-tuning camera and the laser emission point is pre-calibrated;
[0020] Based on the relative positions of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, and the relative positions of the field of view center of the fine-tuning camera and the laser emission point, the relative positions of the field of view center of the wide-angle camera and the laser emission point are calculated.
[0021] In an optional implementation, the method for determining laser processing parameters further includes determining the relative positions of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera through the following steps:
[0022] When the field of view center of the wide-angle camera and the rotation center of the processing platform are pre-calibrated to coincide, the first rotation center position of the processing platform is determined, wherein the processing platform is used to support the product to be processed;
[0023] And, when the field of view center of the fine-tuning camera coincides with the rotation center of the machining stage, the position of the second rotation center of the machining stage is determined in advance;
[0024] Based on the first rotation center position and the second rotation center position, the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera is determined.
[0025] In an optional implementation, the method for determining laser processing parameters further includes determining the contour of the product to be processed through the following steps:
[0026] The first angle value of the rotation axis of the processing platform is obtained when the rotation center of the processing platform coincides with the field of view center of the wide-angle camera. The product to be processed is imaged by the wide-angle camera, and the initial outline of the product to be processed is extracted from the image. The processing platform is used to carry the product to be processed.
[0027] The processing stage is controlled to move the product to be processed sequentially to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera. After each movement, the center of the target cutting track on the product to be processed is adjusted to coincide with the center of the field of view of the camera above.
[0028] The second angle value of the rotation axis of the processing stage is obtained when the center of the target cutting path coincides with the field of view center of the fine-tuning camera;
[0029] Determine the angle difference between the first angle value and the second angle value;
[0030] Based on the position information of each pixel in the initial contour, calculate the position information of each pixel after rotating it around the field of view center of the wide-angle camera by the angle difference;
[0031] The contour of the product to be processed is obtained by fitting the rotational position information of each pixel.
[0032] In an optional implementation, controlling the processing stage to move the product to be processed sequentially below the coarse adjustment camera and then below the fine adjustment camera, and adjusting the center of the target cutting path on the product to be processed to coincide with the field of view center of the camera above after each movement, includes:
[0033] The processing stage is controlled to move the product to be processed below the coarse adjustment camera;
[0034] Based on the target cutting track center determined within the field of view of the coarse adjustment camera, the processing stage is controlled to move so that the target cutting track center is aligned with the field of view center of the coarse adjustment camera for the first time.
[0035] Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If it is parallel, control the processing stage to move the product to be processed below the fine-tuning camera. If it is not parallel, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction. Then control the processing stage to move so that the center of the target cutting path is aligned with the field of view center of the coarse-tuning camera for a second alignment operation. After the second alignment operation is completed, continue to control the processing stage to move the product to be processed below the fine-tuning camera.
[0036] Based on the target cutting track center determined within the field of view of the fine-tuning camera, the processing stage is controlled to move so that the target cutting track center is aligned with the field of view center of the fine-tuning camera for the first time.
[0037] Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If it is not parallel, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction. Then control the processing stage to move so that the center of the target cutting path is aligned with the field of view center of the fine-tuning camera for a second alignment operation.
[0038] In an optional implementation, the method for determining the center of the target cutting path within the field of view of the coarse adjustment camera is as follows:
[0039] A first template image corresponding to the field of view of the coarse-tuning camera is obtained; the first template image includes multiple mutually segmented target features for identifying the center of the cutting path;
[0040] Based on the multiple mutually segmented target features in the first template image, feature matching is performed on the pixels within the field of view of the coarse-tuning camera to determine one or more cutting channel centers.
[0041] If multiple cut path centers are determined, the cut path center that is closest to the field of view center of the coarse adjustment camera will be taken as the target cut path center.
[0042] Among the optional implementation methods, the methods for determining laser processing parameters also include:
[0043] When the center of the target cutting path coincides with the field of view center of the fine-tuning camera, and the first direction cutting path of the target cutting path center is parallel to the preset direction, the first position information of the target cutting path center under the fine-tuning camera is obtained;
[0044] The first rotation center position of the processing stage is determined by pre-calibrating the field of view center of the wide-angle camera and the rotation center of the processing stage; the second rotation center position of the processing stage is determined by pre-calibrating the field of view center of the fine-tuning camera and the rotation center of the processing stage; obtaining the position of the target cutting track center on the product to be processed under the wide-angle camera includes:
[0045] Based on the first position information and the relative position of the first rotation center position and the second rotation center position, the second position information of the target cutting track center under the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0046] Based on the second position information, the first rotation center position, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting track center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0047] In an optional implementation, calculating the pixel position of the target cutting path center within the field of view of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, based on the second position information, the first rotation center position, and the pixel coordinates of the field of view center of the wide-angle camera, includes:
[0048] Based on the second position information and the first rotation center position, calculate the relative position of the target cutting track center and the field of view center of the wide-angle camera in the axial coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0049] Based on the proportional relationship between the axial coordinate system and the pixel coordinate system, the relative position of the target cutting track center and the field of view center of the wide-angle camera in the axial coordinate system is transformed to the pixel coordinate system, so as to obtain the relative position of the target cutting track center and the field of view center of the wide-angle camera in the pixel coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0050] Based on the relative position of the target cutting track center and the field of view center of the wide-angle camera in the pixel coordinate system, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting track center within the field of view of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage is calculated.
[0051] Among the optional implementation methods, the methods for determining laser processing parameters also include:
[0052] The laser processing length is calculated based on the laser on position and the laser off position.
[0053] A second aspect of this application provides a method for controlling laser processing, the method comprising:
[0054] Receive laser processing parameters; the laser processing parameters include the laser switching position and laser processing length obtained by the laser processing parameter determination method provided in the first aspect;
[0055] After the processing stage is moved to the corresponding position according to the laser switching position,
[0056] Control the laser to turn on;
[0057] After the laser begins processing the product to be processed, the processing stage is controlled to move along a preset direction by the laser processing length, and the laser is controlled to be turned off.
[0058] A third aspect of this application provides a device for determining laser processing parameters, the device comprising:
[0059] The acquisition module is used to acquire the position of the center of the target cutting path on the product to be processed under the wide-angle camera; the cutting path is a strip-shaped area on the product to be processed used to divide multiple target features;
[0060] The intersection point determination module is used to determine the position information of two intersection points that pass through the stated position and are parallel to a preset direction with the contour of the product to be processed; the contour is extracted based on the image of the product to be processed by the wide-angle camera; the straight line direction where the cutting path is located is the preset direction.
[0061] The switch-on position acquisition module is used to convert the relative position of the field of view center of the wide-angle camera and the laser emission point, as well as the position information of the two intersection points, to obtain the laser on position and laser off position for laser processing of the product to be processed.
[0062] A fourth aspect of this application provides a control device for laser processing, the device comprising:
[0063] A parameter receiving module is used to receive laser processing parameters; the laser processing parameters include the laser switching position and the laser processing length obtained by the laser processing parameter determination method in the first aspect.
[0064] The control module is used to control the processing stage to move to the corresponding position according to the laser switching position, and then control the laser to be turned on.
[0065] Furthermore, it is also used to control the processing stage to move the laser processing length along a preset direction after the laser starts processing the product to be processed, and to control the laser to be turned off.
[0066] The fifth aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the laser processing parameter determination method as described in the first aspect, or the laser processing control method as described in the second aspect.
[0067] Compared with the prior art, this application has the following beneficial effects:
[0068] The method for determining laser processing parameters provided in this application first obtains the position of the center of the target cutting path on the product to be processed within a wide-angle camera, achieving precise positioning of the target cutting path center within the wide-angle camera. Next, the position information of two intersection points that pass through the position of the target cutting path center under the wide-angle camera and intersect the contour of the product to be processed, parallel to a preset direction, is determined. The preset direction corresponds to the direction of the straight line containing the cutting path. Subsequently, since the relative position between the field of view center of the wide-angle camera and the laser emission point can be calibrated, based on the relative position between the field of view center of the wide-angle camera and the laser emission point, and the position information of the two intersection points, the laser on / off position for laser processing the product to be processed can be obtained.
[0069] The above method leverages the technological advantage of wide-angle cameras, which can identify the contours of the product to be processed, to precisely locate the center of the target cutting path on the product under the wide-angle camera's view at the pixel level. Based on this, two intersection points are precisely located at the pixel level, and the laser on / off positions are determined accordingly, significantly improving their accuracy. Compared to existing technologies, the method used in this application to determine laser processing parameters offers improved accuracy. The laser processing parameters determined by this method facilitate highly precise on / off control during laser processing, reducing the risk of safety accidents. Furthermore, it better protects the equipment, preventing shortened equipment lifespan due to improper laser processing control. Attached Figure Description
[0070] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0071] Figure 1 is a flowchart of a method for determining laser processing parameters provided in an embodiment of this application;
[0072] Figure 2 is a schematic diagram of a processing scenario provided in an embodiment of this application;
[0073] Figure 3 is a schematic diagram of a cutting path, a cutting path center, and target features provided in an embodiment of this application;
[0074] Figure 4 is a schematic diagram of obtaining intersection location information according to an embodiment of this application;
[0075] Figure 5 is a flowchart illustrating the implementation of determining the outline of a product to be processed according to an embodiment of this application;
[0076] Figure 6 is a flowchart illustrating the specific implementation of the control processing stage provided in this application, which moves the product to be processed sequentially to the area below the coarse adjustment camera and the fine adjustment camera.
[0077] Figure 7 is a flowchart of a laser processing control method provided in an embodiment of this application;
[0078] Figure 8 is a schematic diagram of a laser processing parameter determination device provided in an embodiment of this application;
[0079] Figure 9 is a schematic diagram of a laser processing control device provided in an embodiment of this application;
[0080] Figure 10 is a schematic diagram of a camera calibration interface provided in an embodiment of this application;
[0081] Figure 11 is a schematic diagram of a rotation center calibration interface provided in an embodiment of this application. Detailed Implementation
[0082] Lasers, as high-power devices commonly used in laser processing, have a significant impact on product yield due to their precise control. Improper control can easily lead to production safety accidents. In some cases, improper laser control can also shorten the lifespan of the equipment. Improving the accuracy of laser processing control is a pressing problem that needs to be solved in the field of materials processing.
[0083] To address this problem, the inventors of this application propose a method for determining laser processing parameters, a method for controlling laser processing, and related apparatus. In this application, the advantage of a wide-angle camera in observing the complete outline of the product to be processed is utilized. The center of the cutting track is located under the wide-angle camera, and based on this, the two intersection points of the line passing through the center of the cutting track and following the direction corresponding to the straight line of the cutting track with the outline of the product to be processed are determined, achieving pixel-level positioning of the two intersection points under the wide-angle camera. Subsequently, based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the pixel-level positions of the two intersection points, the laser on / off positions for laser processing of the product to be processed are obtained. Thus, the pixel-level positions of the two intersection points under the wide-angle camera are converted to the axial coordinate system positions of the laser on / off positions under the laser processing head, thereby facilitating precise control of the processing stage and the laser on / off positions in the axial coordinate system.
[0084] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.
[0085] Referring to Figure 1, this figure is a flowchart of a method for determining laser processing parameters according to an embodiment of this application. As shown in Figure 1, the method for determining laser processing parameters includes:
[0086] S101. Obtain the position of the center of the target cutting path on the product to be processed under the wide-angle camera.
[0087] To facilitate understanding of the technical implementation of the technical solution of this application, the laser processing scenario will be described below with reference to Figure 2.
[0088] Figure 2 is a schematic diagram of a processing scenario provided by an embodiment of this application. Figure 2 shows a partial structure of the laser processing apparatus 200, including a laser processing head 201, a fine-tuning camera 202, a coarse-tuning camera 203, a wide-angle camera 204, and a stage 205. The stage 205 is used to hold the workpiece to be processed (e.g., a wafer awaiting processing). Figure 2 only exemplarily shows the relative positions of the various components at a certain moment. In the scenario shown in Figure 2, generally speaking, the laser processing head 201, fine-tuning camera 202, coarse-tuning camera 203, and wide-angle camera 204 do not move in a plane parallel to the stage 205. The stage 205 can move within the plane under the control of a processor or controller. Specifically, there are two mutually perpendicular coordinate axes in the plane, namely the X-axis and the Y-axis. The stage 205 can move under control along the positive or negative X-axis, and can also move under control along the positive or negative Y-axis.
[0089] For ease of description of the implementation process of the technical solution of this application, the workpiece to be processed on the processing stage is referred to as the product to be processed. The product to be processed can be a wafer or other types of materials. The type of product to be processed and its use after laser processing are not limited here.
[0090] In practical applications, the laser beam generated by the laser is transmitted to the laser processing head through a specific optical path. The laser processing head focuses and guides the laser beam to the product to be processed on the processing stage. Figure 2 also shows a star-shaped marker below the laser processing head 201, with the center of the star representing the laser processing point 206. When the laser is turned on, the laser beam enters the laser processing point 206. If the product to be processed is directly below the laser processing point 206, the energy transmitted by the laser beam can be used to process the product. Conversely, when the laser is turned off, no laser beam is emitted from the laser processing point 206, and therefore laser processing is no longer performed on the product to be processed on the stage 205.
[0091] The above text provides a brief introduction to the mechanism of laser processing and the control of laser beam switching. Combined with the above discussion of laser processing control issues in the field of materials processing, it is clear that improper laser beam switching, and inaccurate positioning of the product to be processed, can potentially lead to safety accidents and threaten the lifespan of the equipment. Therefore, the technical solution presented in this application provides a new approach to solving these problems:
[0092] A dicing ridge is a strip-shaped region on the product to be processed used to divide multiple target features. In one example, if the product to be processed is a wafer, the target feature may specifically be a grain. Figure 3 is a schematic diagram of a dicing ridge, dicing ridge center, and target features provided in an embodiment of this application. Figure 3 shows dicing ridge 31 and dicing ridge 32, where dicing ridge 31 is vertically oriented and dicing ridge 32 is horizontally oriented. Figure 3 shows multiple target features 33.
[0093] Cutting paths 31 and 32 intersect to form a cross shape, with the center of their intersection being the center of the cutting path 34. Laser processing along cutting path 32 creates a cutting line 321, as shown in Figure 3. The cutting line is a linear mark formed by laser processing.
[0094] In this embodiment, the center of a certain cutting path on the product to be processed is used as the reference point for forming a cutting line by laser processing on the product to be processed. The straight line direction where the cutting path is located is called the preset direction. The cutting line 321 can be regarded as a linear trace formed by processing along the straight line direction where the cutting path 32 is located and passing through or approaching the center of the cutting path 34 (ideally passing through the center of the cutting path).
[0095] As illustrated by the examples above, accurate processing control of the product requires the location information of the cutting kerf center. This application proposes obtaining the position of the target cutting kerf center of the product under a wide-angle camera. The target cutting kerf center mentioned here refers to one of the cutting kerf centers present on the product. This application uses the target cutting kerf center as an example to clearly illustrate the process of determining laser processing parameters. Since the cutting kerf center is formed and determined by the intersecting horizontal and vertical cutting kerfs, the center position of the entire cutting kerf can be accurately determined. This prevents the processed cutting line from deviating from or even damaging the target features (e.g., grains) within the cutting kerf, thus more effectively ensuring product processing yield.
[0096] S102. Determine the position information of two intersection points that pass through the position and are parallel to the preset direction and intersect with the outline of the product to be processed.
[0097] Figure 2 shows a scene illustrating a fine-tuning camera 202, a coarse-tuning camera 203, and a wide-angle camera 204. The coarse-tuning camera 203 has a larger field of view than the fine-tuning camera 202, and the wide-angle camera 204 has a larger field of view than the coarse-tuning camera 203. Compared to the coarse-tuning and fine-tuning cameras 203 and 202, the wide-angle camera 204, with its larger field of view, allows for imaging of the product to be processed on the stage 205 and extraction of its complete outline when the stage 205 moves under it. This outline extraction facilitates the accurate determination of laser processing parameters.
[0098] Since the position of the target cutting track center under the wide-angle camera has already been obtained in S101, if a straight line is drawn passing through the target cutting track center and extending along a preset direction, the position information of the two intersection points where this straight line intersects with the contour of the product to be processed can be determined. Figure 4 is a schematic diagram of obtaining the intersection point position information. In Figure 4, multiple intersecting cutting tracks are shown. A horizontal straight line L is drawn passing through the target cutting track center S. The straight line L intersects with the contour C of the product to be processed at two points, K1 and K2. The position information of these two intersection points is crucial for determining the laser processing parameters.
[0099] As mentioned earlier, the outline C of the product to be processed is extracted by imaging the product using a wide-angle camera. Therefore, the position of each point on this outline is pixel-level positional information. Based on this, the positional information of the two intersection points is also at the pixel level of the wide-angle camera.
[0100] S103. Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, as well as the position information of the two intersection points, the laser on-light position and laser off-light position for laser processing of the product to be processed are obtained.
[0101] In one embodiment, the laser on / off position and the laser off position can be understood as the positions the stage should be in when a laser processing cutting line is formed and when the laser is controlled to be turned on and off. In this case, during processing, the laser does not move along the cutting path, but the stage moves along the cutting path to process the area where the cutting path is located.
[0102] Referring to the example scenario shown in Figure 2, there is a positional difference between the wide-angle camera and the laser emission point. To obtain the laser on and off positions, this positional difference must be considered. In this step, the laser on and off positions are obtained by converting the relative positions of the wide-angle camera's field of view center and the laser emission point, as well as the position information of the two intersection points determined in S102.
[0103] It should be noted that, in the embodiments of this application, the position of the target cutting track center under the wide-angle camera is specifically the pixel-level position of the target cutting track center under the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the platform. Therefore, the position information of the two intersection points can also be understood as the pixel-level position information of the two intersection points relative to the field of view center of the wide-angle camera.
[0104] Assuming the two intersection points are the first intersection point and the second intersection point, in this application, a first position transformation result is calculated based on the relative position of the field of view center of the wide-angle camera and the laser emission point, as well as the position information of the first intersection point. A second position transformation result is calculated based on the relative position of the field of view center of the wide-angle camera and the laser emission point, as well as the position information of the second intersection point. Of the first and second position transformation results, one is used as the laser on position, and the other is used as the laser off position.
[0105] Since the stage is generally controlled in an axial coordinate system, the laser switching position and the laser switching position can be positional information in the axial coordinate system. However, the positional information of the first intersection point and the second intersection point are positional information in the pixel coordinate system of the wide-angle camera. Therefore, to achieve the conversion, the positional information can optionally be transformed between different coordinate axes.
[0106] For example, regarding the first intersection point:
[0107] Based on the proportional relationship between the axial coordinate system and the pixel coordinate system, the position information of the first intersection point is transformed from the pixel coordinate system to the axial coordinate system to obtain the position information of the first intersection point in the axial coordinate system.
[0108] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point in the axial coordinate system, the first position transformation result is calculated as the laser switching position.
[0109] For example, regarding the second intersection point:
[0110] Based on the proportional relationship between the axial coordinate system and the pixel coordinate system, the position information of the second intersection point is transformed from the pixel coordinate system to the axial coordinate system to obtain the position information of the second intersection point in the axial coordinate system;
[0111] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the second intersection point in the axial coordinate system, the second position transformation result is calculated as the laser off position.
[0112] In the above example of position information conversion, the proportional relationship between the axial coordinate system and the pixel coordinate system is utilized to transform the position information of the first and second intersection points from pixel coordinates to axial coordinates. Since the position information of the first and second intersection points in the pixel coordinate system is determined by the position of the target cutting track center and the contour of the product to be processed, it has a certain degree of accuracy. Therefore, the position information of the two intersection points in the axial coordinate system obtained through coordinate system transformation also has a certain degree of accuracy.
[0113] Optionally, if the relative position between the field of view center of the wide-angle camera and the laser emission point is calculated by subtracting the horizontal and vertical coordinates of the positions of the field of view center and the laser emission point, then the first position transformation result can be obtained by subtracting the position information of the first intersection point in the axial coordinate system from the relative position of the field of view center of the wide-angle camera and the laser emission point. If the relative position between the field of view center of the wide-angle camera and the laser emission point is calculated by subtracting the horizontal and vertical coordinates of the laser emission point and the field of view center of the wide-angle camera, then the first position transformation result can be obtained by summing the relative position of the field of view center of the wide-angle camera and the laser emission point with the position information of the first intersection point in the axial coordinate system. The calculation method for the second position transformation result is similar to that for the first position transformation result, and will not be repeated here.
[0114] The relative position between the field of view center of the wide-angle camera and the laser emission point mentioned above can be calibrated using the field of view center of the fine-tuning camera. Specifically, the relative positions (△XP, △YP) between the field of view center of the fine-tuning camera and the laser emission point can be pre-calibrated; then, based on the relative positions of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, and the relative positions (△XP, △YP) between the field of view center of the fine-tuning camera and the laser emission point, the relative position between the field of view center of the wide-angle camera and the laser emission point is calculated. If the relative positions of the field of view centers of the wide-angle camera and the fine-tuning camera are calculated by subtracting the horizontal and vertical coordinates of the two positions, and the relative positions of the field of view centers of the fine-tuning camera and the laser emission point are calculated by subtracting the horizontal and vertical coordinates of the two positions, then the relative positions of the field of view centers of the wide-angle camera and the fine-tuning camera, and the relative positions of the field of view centers of the fine-tuning camera and the laser emission point, can be summed on their respective horizontal and vertical coordinates to obtain the relative positions of the field of view centers of the wide-angle camera and the laser emission point.
[0115] The relative positions of the field of view center of the wide-angle camera mentioned above and the field of view center of the fine-tuning camera can be determined in the following way:
[0116] When the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, the first rotation center position (Xr1, Yr1) of the processing stage is determined in advance; and the second rotation center position (Xr2, Yr2) of the processing stage is determined in advance when the field of view center of the fine-tuning camera coincides with the rotation center of the processing stage. Based on the first and second rotation center positions, the relative positions of the field of view centers of the wide-angle camera and the fine-tuning camera are determined. For example, the relative positions (Xr1-Xr2, Yr1-Yr2) of the wide-angle camera and the fine-tuning camera can be obtained by subtracting the first and second rotation center positions (Xr1, Yr1) along the X and Y axes, respectively.
[0117] Based on the relative positions (Xr1-Xr2, Yr1-Yr2) of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, and the relative positions (△XP, △YP) of the field of view center of the fine-tuning camera and the laser emission point, the relative positions (Xr1-Xr2+△XP, Yr1-Yr2+△YP) of the field of view center of the wide-angle camera and the laser emission point are calculated.
[0118] Based on the relative positions of the wide-angle camera's field of view center and the laser emission point (Xr1-Xr2+△XP, Yr1-Yr2+△YP), and the position information of the first intersection point in the axial coordinate system (P1.X, P1.Y), the first position transformation result is calculated as the laser switching position (Xo1, Yo1), expressed by the formulas: Xo1=P1.X+Xr1-Xr2+△XP Yo1=P1.Y+Yr1-Yr2+△YP
[0119] Based on the relative positions of the wide-angle camera's field of view center and the laser emission point (Xr1-Xr2+△XP, Yr1-Yr2+△YP), and the position information of the second intersection point in the axial coordinate system (P2.X, P2.Y), the second position transformation result is calculated as the laser off position (Xo2, Yo2), expressed by the formulas: Xo2=P2.X+Xr1-Xr2+△XP Yo2=P2.Y+Yr1-Yr2+△YP
[0120] The above method leverages the technological advantage of wide-angle cameras, which can identify the contours of the product to be processed, to precisely locate the center of the target cutting path on the product under the wide-angle camera's view at the pixel level. Based on this, two intersection points are precisely located at the pixel level, and the laser on / off positions are determined accordingly, significantly improving their accuracy. Compared to existing technologies, the method used in this application to determine laser processing parameters offers improved accuracy. The laser processing parameters determined by this method facilitate highly precise on / off control during laser processing, reducing the risk of safety accidents. Furthermore, it better protects the equipment, preventing shortened equipment lifespan due to improper laser processing control.
[0121] Figure 5 is a flowchart illustrating the implementation of determining the outline of a product to be processed according to an embodiment of this application. Referring to Figure 5, the outline of the product to be processed mentioned in embodiment S102 above can be determined in the following manner, including the following steps:
[0122] S501. Obtain the first angle value of the rotation axis of the processing stage when the rotation center of the processing stage coincides with the field of view center of the wide-angle camera, and extract the initial outline of the product to be processed from the image by imaging the product to be processed through the wide-angle camera.
[0123] For example, the first angle value and the second angle value below can both be obtained by reading from the encoder.
[0124] In practical applications, the encoder can read the angle value of the rotation axis of the processing stage. To determine the contour of the product to be processed, this application proposes that when the rotation center of the processing stage coincides with the field of view center of the wide-angle camera, the wide-angle camera is used to image the product, and the angle value of the rotation axis of the processing stage at this position is extracted from the encoder. For ease of distinction, this angle value is referred to as the first angle value. The purpose of recording this first angle value is to provide a reference for the rotation angle in subsequent contour conversion operations.
[0125] S502. Control the processing stage to move the product to be processed to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera in turn. After each movement, adjust the center of the target cutting track on the product to be processed to coincide with the center of the field of view of the camera above.
[0126] Having recorded the first angle value and extracted the initial outline of the product to be processed, the next step is to execute S502, using a coarse-adjustment camera and a fine-adjustment camera to sequentially locate the center of the target cutting groove on the product. To ensure accuracy, the center of the target cutting groove needs to be aligned with the field of view of the camera above it. It is understandable that, compared to a wide-angle camera, the coarse-adjustment and fine-adjustment cameras can more accurately observe and obtain the position of the target cutting groove center through a relatively smaller field of view.
[0127] S503. Obtain the second angle value of the rotation axis of the machining stage when the center of the target cutting path coincides with the center of the field of view of the fine-tuning camera.
[0128] During the S502 process, the product to be processed is rotated during the adjustment period, specifically by adjusting the rotation axis of the processing stage. After S502 is completed, the encoder can read the angle value of the rotation axis of the processing stage when the center of the target cutting path coincides with the field of view center of the fine-tuning camera. This angle value is defined as the second angle value.
[0129] S504. Determine the angle difference between the first angle value and the second angle value.
[0130] By calculating the angle difference between the first angle value and the second angle value, the rotation angle of the product to be processed can be determined.
[0131] S505. Based on the position information of each pixel in the initial contour, calculate the rotation angle difference of each pixel in the initial contour around the field of view center of the wide-angle camera, and then calculate the rotation position information of each pixel.
[0132] When the product to be processed rotates, each pixel on its contour also rotates accordingly. In this embodiment, the position information of each pixel in the initial contour can be obtained, and then the rotated position information of each pixel on the initial contour can be obtained based on the angle difference calculated in S504.
[0133] S506. The contour of the product to be processed is obtained by fitting the rotational position information corresponding to each pixel.
[0134] After obtaining these rotated positional information, the contour of the product to be processed can be obtained by fitting. This contour can also be regarded as the transformed contour compared to the initial contour. For the contour C shown in Figure 4, contour C can also be understood as the transformed contour determined by executing S501 to S506.
[0135] In the process of determining the outline of the product to be processed as described in the above embodiment with reference to Figure 5, S502 mentions that it is necessary to control the processing stage to move the product to be processed sequentially below the coarse adjustment camera and the fine adjustment camera. After each movement, the center of the target cutting path on the product to be processed is adjusted to coincide with the center of the field of view of the camera above. This process will be described in detail below. Figure 6 is a flowchart of the specific implementation of controlling the processing stage to move the product to be processed sequentially below the coarse adjustment camera and the fine adjustment camera provided in the embodiment of this application. As shown in Figure 6, the process includes:
[0136] S5021, Control the processing stage to move the product to be processed to below the coarse adjustment camera.
[0137] S5022. Based on the target cutting track center determined within the field of view of the coarse adjustment camera, control the movement of the processing stage to perform the first alignment operation between the target cutting track center and the field of view center of the coarse adjustment camera.
[0138] The first alignment operation involves aligning the center of the target cutting path with the center of the coarse adjustment camera's field of view. During this process, to achieve this alignment, it may be necessary to adjust the machining stage along the X and / or Y axes, or even rotate the machining stage.
[0139] S5023. Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If it is parallel, proceed to S5024; if it is not parallel, proceed to S5025.
[0140] Referring to Figure 4, it can be understood that each cutting track center is formed by two intersecting cutting tracks; that is, the center of one cutting track corresponds to the intersection of two cutting tracks. In this application, the first direction cutting track can refer to one of the cutting tracks planned for laser processing. Laser processing is generally performed along the X-axis, forming a cutting line along the X-axis; therefore, the preset direction here can refer to a direction parallel to the X-axis. To achieve processing, if the first direction cutting track is not parallel to the preset direction after S5022, it is necessary to proceed to S5025 to adjust the first direction cutting track to be parallel to the preset direction. This operation can also be called a horizontal adjustment operation, where the X-axis corresponds to the horizontal direction.
[0141] S5024, Control the processing stage to move the product to be processed to below the fine-tuning camera, then proceed to S5026.
[0142] The purpose of moving the product to be processed below the fine-tuning camera is to more accurately determine the position information of the center of the target cutting track on the product from the smaller field of view of the camera.
[0143] S5025. Adjust the angle of the rotation axis of the processing stage so that the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. Then control the movement of the processing stage so that the center of the target cutting path is aligned with the center of the field of view of the coarse adjustment camera for a second alignment operation. After the second alignment operation is completed, return to S5024.
[0144] S5026. Based on the target cutting track center determined within the field of view of the fine-tuning camera, control the movement of the processing stage to perform the first alignment operation between the target cutting track center and the field of view center of the fine-tuning camera.
[0145] The first alignment operation involves aligning the center of the target cutting path with the center of the fine-tuning camera's field of view. During this process, to achieve this alignment, it may be necessary to adjust the machining stage along the X and / or Y axes, or even rotate the machining stage.
[0146] S5027. Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If it is parallel, stop adjusting the processing stage under the fine-tuning camera. If it is not parallel, proceed to S5028.
[0147] S5028. Adjust the angle of the rotation axis of the processing stage so that the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. Then control the movement of the processing stage to perform a second alignment operation between the center of the target cutting path and the center of the field of view of the fine-tuning camera.
[0148] Similar to the coarse-tuning camera, in the fine-tuning camera, if the first direction cutting path is not parallel to the preset direction, it is still necessary to control the movement and rotation of the processing stage to achieve a parallel state, thereby pulling the first direction cutting path horizontal.
[0149] During this period, each time the center of the target cutting path is adjusted to coincide with the center of the field of view of the camera, it is determined whether the first direction cutting path is parallel to the preset direction, thus achieving stable maintenance of the direction of the first direction cutting path.
[0150] The preceding sections, referencing Figure 6 and steps S5021-S5028, detailed the process of controlling the processing stage to move the product to be processed sequentially below the coarse-tuning camera and then below the fine-tuning camera, adjusting the center of the target cutting path on the product to coincide with the field of view of the camera above. The purpose of this series of operations is to acquire the first position information of the target cutting path center under the fine-tuning camera when the center of the target cutting path coincides with the field of view of the fine-tuning camera, and the first direction of the target cutting path is parallel to the preset direction. This first position information can be understood as position information read in an axial coordinate system. In practical applications, to achieve accurate positioning of the first and second intersection points, pixel-level positioning of the target cutting path center is also required within the field of view of the wide-angle camera. Furthermore, as mentioned above, since the first position information is formed through operations such as rotating the processing stage, the outline of the product to be processed has been transformed from the initial outline during this period. In other words, the first position information and the transformed outline of the product to be processed correspond to each other in terms of state and stage. Therefore, when it is necessary to convert the first position information into a pixel-level position under a wide-angle camera, the transformed position also corresponds to the transformed outline of the product to be processed.
[0151] Based on the preceding analysis, the following describes an example implementation of S101 in the above embodiments. The technical solution of this application pre-calibrates the first rotation center position (Xr1, Yr1) of the processing stage when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, and pre-calibrates the second rotation center position (Xr2, Yr2) of the processing stage when the field of view center of the fine-tuning camera coincides with the rotation center of the processing stage.
[0152] The step of obtaining the position of the center of the target cutting path on the product to be processed under the wide-angle camera includes:
[0153] First, based on the first position information and the relative positions (Xr1-Xr2, Yr1-Yr2) of the first rotation center position and the second rotation center position, the second position information of the target cutting track center under the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0154] As mentioned earlier, in specific implementation, the first position information of the target cutting path center under the fine-tuning camera is obtained when the center of the target cutting path coincides with the field of view center of the fine-tuning camera, and the first direction cutting path of the target cutting path center is parallel to the preset direction. The first rotation center position (Xr1, Yr1) is the position of the processing stage when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, and the second rotation center position (Xr2, Yr2) is the position of the processing stage when the field of view center of the fine-tuning camera coincides with the rotation center of the processing stage. Therefore, based on the relative positions (Xr1-Xr2, Yr1-Yr2) of the first and second rotation center positions, and the first position information of the target cutting path center under the fine-tuning camera, the second position information of the target cutting path center under the wide-angle camera can be calculated by reverse deduction. The following formula illustrates this calculation process.
[0155] Assuming the first position information of the target cutting edge center under the fine-tuning camera is represented as (X2, Y2), and the second position information of the target cutting edge center under the wide-angle camera is represented as (X3, Y3), see the formulas below: X3 = Xr1 - Xr2 + X2 Y3 = Yr1 - Yr2 + Y2
[0156] It is understandable that when the target cutting path center is located in the second position information under the wide-angle camera, the target cutting path center coincides with the field of view center of the wide-angle camera.
[0157] Next, based on the second position information, the first rotation center position, and the pixel coordinates of the wide-angle camera's field of view center, it is necessary to calculate the pixel position of the target cutting track center within the wide-angle camera's field of view when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage. This is because the second position information (X3, Y3) is only the position of the target cutting track center under the wide-angle camera when it coincides with the wide-angle camera's field of view center. It is also necessary to deduce the pixel position of the target cutting track center within the wide-angle camera's field of view when it coincides with the rotation center of the processing stage, based on the second position information (X3, Y3). This is because the initial outline of the product to be processed is extracted from the image when the rotation center of the processing stage coincides with the field of view center of the wide-angle camera, which is equivalent to needing to reconstruct the position of the target cutting track center when the rotation center of the processing stage coincides with the field of view center of the wide-angle camera.
[0158] Specifically, based on the second position information (X3, Y3) and the first rotation center position (Xr1, Yr1), the relative positions (Δx, Δy) of the target cutting track center and the wide-angle camera's field of view center in the axial coordinate system can be calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage. Δx = X3 - Xr1 Δy = Y3 - Yr1
[0159] Next, based on the proportional relationship between the axial coordinate system and the pixel coordinate system, the relative position of the target cutting track center and the field of view center of the wide-angle camera in the axial coordinate system is transformed to the pixel coordinate system, so as to obtain the relative position of the target cutting track center and the field of view center of the wide-angle camera in the pixel coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0160] Assuming the ratio between the axial coordinate system and the pixel coordinate system is k, the relative position of the center of the target cutting path and the field of view center of the wide-angle camera in the axial coordinate system can be expressed as △x / k and △y / k in the pixel coordinate system.
[0161] Based on the relative positions (Δx / k, Δy / k) of the target cutting track center and the field of view center of the wide-angle camera in the pixel coordinate system, and the pixel coordinates (Xc, Yc) of the field of view center of the wide-angle camera, the pixel position (X4, Y4) of the target cutting track center within the field of view of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage is calculated. This can be expressed by the formulas: X4 = Δx / k + Xc Y4 = Δy / k + Yc
[0162] In practical applications, the laser processing length is calculated based on the laser switching position and the laser switching position. The laser processing length is also used as a laser processing parameter to achieve laser processing control.
[0163] Regarding the target cutting track center described in the above embodiments, the following is an exemplary method for determining the target cutting track center:
[0164] In this embodiment, a first template image corresponding to the field of view of the coarse-tuning camera can be obtained. The first template image includes multiple mutually segmented target features for identifying the center of the cutting path. For example, the first template image may be an image containing multiple mutually segmented grains for identifying the center of the cutting path. Using this first template image, the center of the cutting path within the field of view of the coarse-tuning camera can be effectively identified. In specific implementation, feature matching can be performed on pixels within the field of view of the coarse-tuning camera based on the multiple mutually segmented target features in the first template image to determine one or more cutting path centers. If only one cutting path center is determined, this cutting path center is taken as the target cutting path center. In many actual processing scenarios, multiple cutting path centers can be determined through the first template image. In this case, the cutting path center closest to the center of the field of view of the coarse-tuning camera is taken as the target cutting path center. Taking the closest cutting path center as the target cutting path center can save the time for controlling the processing stage and improve the efficiency of determining laser processing parameters. It should be noted that if both cutting tracks containing the nearest cutting track center have been laser-processed, then for multiple cutting track centers, the nearest cutting track center where at least one cutting track has not been processed can be used as the target cutting track center.
[0165] Similarly, to identify the center of a target cut track under a fine-tuning camera, a template image can also be used. For example, a second template image can be used to identify the center of a target cut track in an image captured by the fine-tuning camera. It should be noted that the center of the target cut track determined within the field of view of both the coarse-tuning and fine-tuning cameras should be the same center of the target cut track.
[0166] This application provides a laser processing control method, as shown in Figure 7, which includes the following steps:
[0167] S701, Receive laser processing parameters.
[0168] The laser processing parameters may include the laser switching position and the laser processing length obtained by the laser processing parameter determination method.
[0169] S702. After controlling the processing stage to move to the corresponding position according to the laser switching position, control the laser to be turned on.
[0170] At this point, one of the two intersections on the contour has been aligned with the laser processing point, and the laser can be turned on to start laser processing from that aligned intersection.
[0171] S703. After the laser starts processing the product to be processed, control the processing stage to move the laser processing length along a preset direction, and control the laser to be turned off.
[0172] After laser processing begins, the processing stage needs to move a certain distance along a preset direction (parallel to the X-axis). This distance is determined by the laser processing length. After moving a distance equal to the laser processing length along this direction, another intersection point on the contour is aligned with the laser processing point. At this point, the cutting line has been formed, and the laser can be turned off.
[0173] It is understood that the methods for determining laser processing parameters and controlling laser processing described in the above embodiments are illustrated and introduced using cutting on a single cutting track as an example. In practical applications, a product to be processed may contain multiple parallel cutting tracks waiting to be processed. The methods for determining laser processing parameters and the control process for laser processing on each cutting track can be referred to the descriptions in the above method embodiments, and will not be repeated here.
[0174] Based on the method for determining laser processing parameters described above, this application also provides a device for determining laser processing parameters. As shown in Figure 8, the device includes:
[0175] The acquisition module 801 is used to acquire the position of the center of the target cutting path on the product to be processed under the wide-angle camera; the cutting path is a strip-shaped area on the product to be processed used to divide multiple target features;
[0176] The intersection point determination module 802 is used to determine the position information of two intersection points that pass through the position and are parallel to the preset direction and intersect with the contour of the product to be processed; the contour is extracted based on the image of the product to be processed by the wide-angle camera; the preset direction corresponds to the direction of the straight line where the cutting path is located.
[0177] The switch light position acquisition module 803 is used to convert the laser on position and laser off position for laser processing of the product to be processed based on the relative position of the field of view center of the wide-angle camera and the laser light output point, as well as the position information of the two intersection points.
[0178] In an optional implementation, the two intersection points include a first intersection point and a second intersection point; the switch light position acquisition module 803 is specifically used for:
[0179] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point, a first position conversion result is calculated; and based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the second intersection point, a second position conversion result is calculated; of the first position conversion result and the second position conversion result, one is used as the laser on position and the other is used as the laser off position.
[0180] In an optional implementation, the switch light position acquisition module 803 is specifically used to: convert the position information of the first intersection point from the pixel coordinate system to the axis coordinate system according to the ratio between the axis coordinate system and the pixel coordinate system, so as to obtain the position information of the first intersection point in the axis coordinate system;
[0181] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point in the axial coordinate system, the first position transformation result is calculated as the laser switching position.
[0182] Based on the proportional relationship, the position information of the second intersection point is transformed from the pixel coordinate system to the axis coordinate system to obtain the position information of the second intersection point in the axis coordinate system;
[0183] Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the second intersection point in the axial coordinate system, the second position transformation result is calculated as the laser off position.
[0184] In an optional implementation, the device for determining the laser processing parameters further includes:
[0185] A relative position calibration module is used to pre-calibrate the relative position between the field of view center of the fine-tuning camera and the laser emission point;
[0186] The relative position calculation module is used to calculate the relative position between the field of view center of the wide-angle camera and the laser emission point based on the relative position between the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, and the relative position between the field of view center of the fine-tuning camera and the laser emission point.
[0187] In the optional implementation, the relative position calibration module is also used for:
[0188] When the field of view center of the wide-angle camera and the rotation center of the processing platform are pre-calibrated to coincide, the first rotation center position of the processing platform is determined, wherein the processing platform is used to support the product to be processed;
[0189] And, when the field of view center of the fine-tuning camera coincides with the rotation center of the machining stage, the position of the second rotation center of the machining stage is determined in advance;
[0190] The relative position calculation module is also used to determine the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera based on the first rotation center position and the second rotation center position.
[0191] In the optional implementation, the laser processing parameter determination device further includes a contour determination module; the contour determination module is specifically used for:
[0192] The first angle value of the rotation axis of the processing platform is obtained when the rotation center of the processing platform coincides with the field of view center of the wide-angle camera. The product to be processed is imaged by the wide-angle camera, and the initial outline of the product to be processed is extracted from the image. The processing platform is used to carry the product to be processed.
[0193] The processing stage is controlled to move the product to be processed sequentially to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera. After each movement, the center of the target cutting track on the product to be processed is adjusted to coincide with the center of the field of view of the camera above.
[0194] The second angle value of the rotation axis of the processing stage is obtained when the center of the target cutting path coincides with the field of view center of the fine-tuning camera;
[0195] Determine the angle difference between the first angle value and the second angle value;
[0196] Based on the position information of each pixel in the initial contour, calculate the position information of each pixel after rotating it around the field of view center of the wide-angle camera by the angle difference;
[0197] The contour of the product to be processed is obtained by fitting the rotational position information of each pixel.
[0198] In an optional implementation, the contour determination module is specifically used for:
[0199] The processing stage is controlled to move the product to be processed below the coarse adjustment camera;
[0200] Based on the target cutting track center determined within the field of view of the coarse adjustment camera, the processing stage is controlled to move so that the target cutting track center is aligned with the field of view center of the coarse adjustment camera for the first time.
[0201] Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If it is parallel, control the processing stage to move the product to be processed below the fine-tuning camera. If it is not parallel, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction. Then control the processing stage to move so that the center of the target cutting path is aligned with the field of view center of the coarse-tuning camera for a second alignment operation. After the second alignment operation is completed, continue to control the processing stage to move the product to be processed below the fine-tuning camera.
[0202] Based on the target cutting track center determined within the field of view of the fine-tuning camera, the processing stage is controlled to move so that the target cutting track center is aligned with the field of view center of the fine-tuning camera for the first time.
[0203] Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If it is not parallel, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction. Then control the processing stage to move so that the center of the target cutting path is aligned with the field of view center of the fine-tuning camera for a second alignment operation.
[0204] In an optional implementation, the laser processing parameter determination device further includes a cutting track center determination module; this module is specifically used to determine the target cutting track center within the field of view of the coarse adjustment camera in the following manner.
[0205] A first template image corresponding to the field of view of the coarse-tuning camera is obtained; the first template image includes multiple mutually segmented target features for identifying the center of the cutting path;
[0206] Based on the multiple mutually segmented target features in the first template image, feature matching is performed on the pixels within the field of view of the coarse-tuning camera to determine one or more cutting channel centers.
[0207] If multiple cut path centers are determined, the cut path center that is closest to the field of view center of the coarse adjustment camera will be taken as the target cut path center.
[0208] In an optional implementation, the device for determining the laser processing parameters further includes:
[0209] The cutting path center position determination module is used to obtain the first position information of the target cutting path center under the fine-tuning camera when the center of the target cutting path coincides with the field of view center of the fine-tuning camera, and the first direction cutting path of the target cutting path center is parallel to the preset direction.
[0210] The relative position calibration module is used to pre-calibrate the first rotation center position of the processing stage when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, and to pre-calibrate the second rotation center position of the processing stage when the field of view center of the fine-tuning camera coincides with the rotation center of the processing stage.
[0211] The acquisition module 801 is specifically used for:
[0212] Based on the first position information and the relative position of the first rotation center position and the second rotation center position, the second position information of the target cutting track center under the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0213] Based on the second position information, the first rotation center position, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting track center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0214] In an optional implementation, the acquisition module 801 is specifically used for:
[0215] Based on the second position information and the first rotation center position, calculate the relative position of the target cutting track center and the field of view center of the wide-angle camera in the axial coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0216] Based on the proportional relationship between the axial coordinate system and the pixel coordinate system, the relative position of the target cutting track center and the field of view center of the wide-angle camera in the axial coordinate system is transformed to the pixel coordinate system, so as to obtain the relative position of the target cutting track center and the field of view center of the wide-angle camera in the pixel coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
[0217] Based on the relative position of the target cutting track center and the field of view center of the wide-angle camera in the pixel coordinate system, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting track center within the field of view of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage is calculated.
[0218] In an optional implementation, the device for determining the laser processing parameters further includes:
[0219] The processing length calculation module is used to calculate the laser processing length based on the laser on position and the laser off position.
[0220] Based on the laser processing control method described above, this application also provides a laser processing control device. As shown in Figure 9, this figure is a schematic diagram of the structure of the laser processing control device. Figure 9 shows that a laser processing control device includes:
[0221] The parameter receiving module 901 is used to receive laser processing parameters; the laser processing parameters include the laser switching position and laser processing length obtained by the laser processing parameter determination method described above.
[0222] The control module 902 is used to control the processing stage to move to the corresponding position according to the laser switching position, and then control the laser to be turned on; and is also used to control the processing stage to move the laser processing length along a preset direction and control the laser to be turned off after the laser starts processing the product to be processed.
[0223] In addition, this application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the laser processing parameter determination method as described above, or implements the laser processing control method as described above.
[0224] Figure 10 is a schematic diagram of a camera calibration interface provided in an embodiment of this application. In Figure 10, pixel coordinates refer to coordinates in the pixel coordinate system, and axis coordinates refer to coordinates in the axis coordinate system. The interface shown in Figure 10 can be used to perform calibration tests for wide-angle cameras, coarse-tuning cameras, and fine-tuning cameras respectively. Figure 11 is a schematic diagram of a rotation center calibration interface provided in an embodiment of this application.
[0225] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for the device embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method embodiments. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate. The components indicated as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment solution according to actual needs. Those skilled in the art can understand and implement this without creative effort.
[0226] The above description is merely one specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A method for determining laser processing parameters, characterized in that, include: Obtain the position of the center of the target cutting track on the product to be processed from the perspective of the wide-angle camera; The cutting channel is a strip-shaped area on the product to be processed used to divide multiple target features; The position information of two intersection points that pass through the aforementioned position and are parallel to the preset direction and intersect with the contour of the product to be processed is determined; the contour is extracted based on the image of the product to be processed by the wide-angle camera, and the straight line direction of the cutting path is the preset direction; Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, as well as the position information of the two intersection points, the laser on-light position and laser off-light position for laser processing of the product to be processed are obtained.
2. The method according to claim 1, characterized in that, The two intersection points include a first intersection point and a second intersection point; the conversion of the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the two intersection points, to obtain the laser on-light position and laser off-light position for laser processing of the product to be processed includes: Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point, a first position conversion result is calculated; and based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the second intersection point, a second position conversion result is calculated; of the first position conversion result and the second position conversion result, one is used as the laser on position and the other is used as the laser off position.
3. The method according to claim 2, characterized in that, The step of calculating the first position transformation result based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point, includes: transforming the position information of the first intersection point from the pixel coordinate system to the axis coordinate system according to the proportional relationship between the axis coordinate system and the pixel coordinate system, so as to obtain the position information of the first intersection point in the axis coordinate system; Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the first intersection point in the axial coordinate system, the first position transformation result is calculated as the laser switching position. The step of calculating the second position transformation result based on the relative position of the wide-angle camera's field of view center and the laser emission point, and the position information of the second intersection point, includes: Based on the proportional relationship, the position information of the second intersection point is transformed from the pixel coordinate system to the axis coordinate system to obtain the position information of the second intersection point in the axis coordinate system; Based on the relative position of the field of view center of the wide-angle camera and the laser emission point, and the position information of the second intersection point in the axial coordinate system, the second position transformation result is calculated as the laser off position.
4. The method according to claim 2, characterized in that, The method further includes: The relative position between the field of view center of the fine-tuning camera and the laser emission point is pre-calibrated; Based on the relative positions of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera, and the relative positions of the field of view center of the fine-tuning camera and the laser emission point, the relative positions of the field of view center of the wide-angle camera and the laser emission point are calculated.
5. The method according to claim 4, characterized in that, The method further includes determining the relative positions of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera through the following steps: When the field of view center of the wide-angle camera and the rotation center of the processing platform are pre-calibrated to coincide, the first rotation center position of the processing platform is determined, wherein the processing platform is used to support the product to be processed; And, when the field of view center of the fine-tuning camera coincides with the rotation center of the machining stage, the position of the second rotation center of the machining stage is determined in advance; Based on the first rotation center position and the second rotation center position, the relative position of the field of view center of the wide-angle camera and the field of view center of the fine-tuning camera is determined.
6. The method according to claim 1, characterized in that, The method further includes determining the outline of the product to be processed through the following steps: The first angle value of the rotation axis of the processing platform is obtained when the rotation center of the processing platform coincides with the field of view center of the wide-angle camera. The product to be processed is imaged by the wide-angle camera, and the initial outline of the product to be processed is extracted from the image. The processing platform is used to carry the product to be processed. The processing stage is controlled to move the product to be processed sequentially to the bottom of the coarse adjustment camera and the bottom of the fine adjustment camera. After each movement, the center of the target cutting track on the product to be processed is adjusted to coincide with the center of the field of view of the camera above. The second angle value of the rotation axis of the processing stage is obtained when the center of the target cutting path coincides with the field of view center of the fine-tuning camera; Determine the angle difference between the first angle value and the second angle value; Based on the position information of each pixel in the initial contour, calculate the position information of each pixel after rotating it around the field of view center of the wide-angle camera by the angle difference; The contour of the product to be processed is obtained by fitting the rotational position information of each pixel.
7. The method according to claim 6, characterized in that, The method of controlling the processing stage to move the product to be processed sequentially below the coarse adjustment camera and then below the fine adjustment camera, and adjusting the center of the target cutting path on the product to be processed to coincide with the field of view center of the camera above after each movement, includes: The processing stage is controlled to move the product to be processed below the coarse adjustment camera; Based on the target cutting track center determined within the field of view of the coarse adjustment camera, the processing stage is controlled to move so that the target cutting track center is aligned with the field of view center of the coarse adjustment camera for the first time. Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If it is parallel, control the processing stage to move the product to be processed below the fine-tuning camera. If it is not parallel, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction. Then control the processing stage to move so that the center of the target cutting path is aligned with the field of view center of the coarse-tuning camera for a second alignment operation. After the second alignment operation is completed, continue to control the processing stage to move the product to be processed below the fine-tuning camera. Based on the target cutting track center determined within the field of view of the fine-tuning camera, the processing stage is controlled to move so that the target cutting track center is aligned with the field of view center of the fine-tuning camera for the first time. Determine whether the first direction cutting path passing through the center of the target cutting path is parallel to the preset direction. If it is not parallel, adjust the angle of the rotation axis of the processing stage to make the first direction cutting path passing through the center of the target cutting path parallel to the preset direction. Then control the processing stage to move so that the center of the target cutting path is aligned with the field of view center of the fine-tuning camera for a second alignment operation.
8. The method according to claim 7, characterized in that, The method for determining the center of the target cutting path within the field of view of the coarse-tuning camera is as follows: A first template image corresponding to the field of view of the coarse-tuning camera is obtained; the first template image includes multiple mutually segmented target features for identifying the center of the cutting path; Based on the multiple mutually segmented target features in the first template image, feature matching is performed on the pixels within the field of view of the coarse-tuning camera to determine one or more cutting channel centers. If multiple cut path centers are determined, the cut path center that is closest to the field of view center of the coarse adjustment camera will be taken as the target cut path center.
9. The method according to claim 7, characterized in that, The method further includes: When the center of the target cutting path coincides with the field of view center of the fine-tuning camera, and the first direction cutting path of the target cutting path center is parallel to the preset direction, the first position information of the target cutting path center under the fine-tuning camera is obtained; The first rotation center position of the processing stage is determined by pre-calibrating the field of view center of the wide-angle camera and the rotation center of the processing stage; the second rotation center position of the processing stage is determined by pre-calibrating the field of view center of the fine-tuning camera and the rotation center of the processing stage; obtaining the position of the target cutting track center on the product to be processed under the wide-angle camera includes: Based on the first position information and the relative position of the first rotation center position and the second rotation center position, the second position information of the target cutting track center under the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage. Based on the second position information, the first rotation center position, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting track center within the field of view of the wide-angle camera is calculated when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage.
10. The method according to claim 9, characterized in that, The step of calculating the pixel position of the target cutting track center within the field of view of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage, based on the second position information, the first rotation center position, and the pixel coordinates of the field of view center of the wide-angle camera, includes: Based on the second position information and the first rotation center position, calculate the relative position of the target cutting track center and the field of view center of the wide-angle camera in the axial coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage. Based on the proportional relationship between the axial coordinate system and the pixel coordinate system, the relative position of the target cutting track center and the field of view center of the wide-angle camera in the axial coordinate system is transformed to the pixel coordinate system, so as to obtain the relative position of the target cutting track center and the field of view center of the wide-angle camera in the pixel coordinate system when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage. Based on the relative position of the target cutting track center and the field of view center of the wide-angle camera in the pixel coordinate system, and the pixel coordinates of the field of view center of the wide-angle camera, the pixel position of the target cutting track center within the field of view of the wide-angle camera when the field of view center of the wide-angle camera coincides with the rotation center of the processing stage is calculated.
11. The method according to any one of claims 1-10, characterized in that, Also includes: The laser processing length is calculated based on the laser on position and the laser off position.
12. A control method for laser processing, characterized in that, include: Receive laser processing parameters; the laser processing parameters include the laser switching position and laser processing length obtained by the method of claim 11; After the processing stage is moved to the corresponding position according to the laser switching position, Control the laser to turn on; After the laser begins processing the product to be processed, the processing stage is controlled to move along a preset direction by the laser processing length, and the laser is controlled to be turned off.
13. A device for determining laser processing parameters, characterized in that, include: The acquisition module is used to acquire the position of the center of the target cutting track on the product to be processed under the wide-angle camera. The cutting channel is a strip-shaped area on the product to be processed used to divide multiple target features; The intersection point determination module is used to determine the position information of two intersection points that pass through the stated position and are parallel to a preset direction and intersect with the contour of the product to be processed; the contour is extracted based on the image of the product to be processed by the wide-angle camera; the straight line direction of the cutting path is the preset direction. The switch-on position acquisition module is used to convert the relative position of the field of view center of the wide-angle camera and the laser emission point, as well as the position information of the two intersection points, to obtain the laser on position and laser off position for laser processing of the product to be processed.
14. A control device for laser processing, characterized in that, include: A parameter receiving module is used to receive laser processing parameters; the laser processing parameters include the laser switching position and laser processing length obtained by the method described in claim 11. The control module is used to control the processing stage to move to the corresponding position according to the laser switching position, and then control the laser to be turned on. Furthermore, it is also used to control the processing stage to move the laser processing length along a preset direction after the laser starts processing the product to be processed, and to control the laser to be turned off.
15. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method for determining laser processing parameters as described in any one of claims 1-11, or implements the laser processing control method as described in claim 12.