Middle frame and electronic device
By embedding a first heat dissipation plate in the middle plate and separating it from the battery, combined with the design of reinforcement components, the problems of heat dissipation and structural strength in the process of making electronic devices thinner are solved, achieving efficient heat dissipation and improved battery performance.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-12-11
- Publication Date
- 2026-06-18
Smart Images
Figure CN2025141913_18062026_PF_FP_ABST
Abstract
Description
Mid-frame and electronic devices
[0001] This application claims priority to Chinese Patent Application No. 202423089553.7, filed on December 13, 2024, with the invention entitled "Middle Frame and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of terminal equipment, and in particular to a mid-frame and electronic device. Background Technology
[0003] With the increasing power consumption and miniaturization of electronic products, heat dissipation of the motherboard has become an unavoidable issue in the design and development of these devices. Currently, most electronic devices on the market typically incorporate a heat spreader on the mid-frame plate to evenly distribute heat from the motherboard, preventing hot spots from forming in certain areas and causing localized screen overheating, thus affecting the user experience. However, this layering of heat spreaders on the mid-frame plate increases the overall thickness of the electronic device, hindering its pursuit of a thinner design. Summary of the Invention
[0004] This application provides a mid-frame and an electronic device, aiming to provide a mid-frame that can balance heat dissipation performance and the thinness of the electronic device, as well as an electronic device including the mid-frame.
[0005] In a first aspect, a mid-frame is provided. The mid-frame includes a frame, a mid-plate, and a first heat spreader. At least a portion of the first heat spreader is embedded in the mid-plate. The frame is fixedly connected to the periphery of the mid-plate and, together with the mid-plate and the first heat spreader, encloses a mounting space for the mid-frame. The mounting space is used to accommodate a battery and a circuit board. The mid-plate has a first region and a second region spaced apart. At least a portion of the heat spreader is located in the first region and spaced apart from the second region. The first region is used to support the circuit board, and the second region is used to support the battery.
[0006] Understandably, typical electronic devices usually have a heat spreader stacked on the middle plate of the frame, directly facing the circuit board. When the electronic device is operating, the heat-generating components on the circuit board generate heat. The heat spreader, positioned directly opposite the circuit board, absorbs and dissipates this heat, thus cooling the heat-generating electronic components. However, stacking the heat spreader on the middle plate increases the overall thickness of the electronic device. In this embodiment, the middle frame embeds the first heat spreader into the middle plate. This allows the first heat spreader to dissipate heat from the circuit board while also utilizing the thickness of the middle plate. This effectively balances the slim design of the electronic device with heat dissipation performance, preventing localized hot spots on the screen caused by the circuit board and thus improving screen performance and user experience.
[0007] Secondly, compared to electronic devices where the heat spreader is positioned directly over both the battery and the circuit board, both the battery and the circuit board generate heat when the device is operating. The heat generated by the circuit board is generally higher than that generated by the battery, resulting in a higher temperature for the heat spreader, which in turn exceeds the battery's temperature. This leads to a higher ambient temperature around the battery, affecting its charging and discharging performance and reducing battery efficiency. Furthermore, because the heat spreader also absorbs heat from the battery, its heat dissipation efficiency for the circuit board is lower, resulting in a higher circuit board temperature and negatively impacting the user experience.
[0008] In one possible implementation, the distance between the first heat spreader and the second region is greater than millimeters. This creates a certain distance between the first heat spreader and the battery, preventing the battery from being affected by the heat spreader and thus ensuring the battery's charging and discharging performance and efficiency. Simultaneously, the first heat spreader has good heat dissipation performance, helping to prevent the circuit board temperature from becoming too high and affecting its normal operation.
[0009] In one possible implementation, the distance between the outer contour of the projection of the first region onto the plane of the middle plate and the outer contour of the projection of the first heat spreader onto the plane of the middle plate is less than or equal to 3 millimeters. This results in a smaller area for the first heat spreader, which helps ensure the structural strength of the middle frame.
[0010] In one possible implementation, the ratio between the overlapping area of the projection of the first heat spreader onto the plane of the middle plate and the area of the first region is greater than or equal to 80%. This results in better heat dissipation of the circuit board by the first heat spreader, which is beneficial for ensuring the heat dissipation performance of the electronic equipment.
[0011] In one possible implementation, the first region of the middle plate has a through hole that connects to the mounting space, and the first heat spreader is fixed to the through hole. In this way, the design of the first heat spreader is relatively simple and easy to manufacture.
[0012] In one possible implementation, the first heat spreader includes a first cover plate, a second cover plate, and a capillary structure. The first cover plate and the second cover plate are stacked and together enclose a cavity. The capillary structure is located in the cavity. The first cover plate is closer to the installation space than the second cover plate, and the thickness of the second cover plate is greater than the thickness of the first cover plate.
[0013] It is understood that the thickness of the second cover plate of the first heat spreader in this embodiment can be greater than the thickness of the first cover plate. This greater thickness results in higher structural strength, allowing the second cover plate to further enhance the structural strength of the middle plate, thus extending the lifespan of the electronic device and improving the user experience.
[0014] Secondly, since the first cover plate is thicker than the second cover plate, the second cover plate is thinner, making it more difficult to control its surface flatness. Poor surface flatness of the second cover plate affects the flatness of the screen and the user experience. This embodiment, by increasing the thickness of the second cover plate, effectively ensures its surface flatness. This allows for improved structural strength of the mid-frame while maintaining screen surface flatness, thus enhancing the user experience.
[0015] In one possible implementation, the elastic modulus of the second cover plate is greater than that of the first cover plate. This results in higher structural strength for the second cover plate, which helps ensure the overall structural strength of the mid-frame and extends its service life.
[0016] In one possible implementation, the mid-frame further includes a reinforcing member located on the side of the first heat spreader facing away from the circuit board and fixedly connected to the mid-frame, covering the first heat spreader. This reinforcement ensures the structural strength of the mid-frame, thus extending its service life.
[0017] In one possible implementation, the thickness of the reinforcing member is greater than the thickness of the second cover plate of the first heat spreader. It is understandable that, compared to electronic devices without a reinforcing member, where the second cover plate of the heat spreader directly contacts the screen, the thinner second cover plate makes it more difficult to control its surface flatness during manufacturing, resulting in poor surface flatness that affects screen flatness and user experience. In this embodiment, a reinforcing member is provided between the first heat spreader and the screen, and the thickness of the reinforcing member can be greater than the thickness of the second cover plate. This thicker reinforcing member makes it easier to control its surface flatness during manufacturing, resulting in better surface flatness, which helps ensure screen flatness and improves the user experience.
[0018] In one possible implementation, the elastic modulus of the reinforcing member is greater than that of the elastic modulus of the second cover plate of the first heat-spreading plate. This results in better structural strength of the reinforcing member, which helps ensure the structural strength of the middle frame and extends its service life.
[0019] In one possible implementation, the reinforcing member is fixedly connected to the first heat spreader via thermally conductive gel. In this way, the heat from the first heat spreader can also be transferred to the reinforcing member through the thermally conductive gel, allowing the reinforcing member to assist the first heat spreader in heat dissipation, thus improving the heat dissipation performance of the mid-frame.
[0020] In one possible implementation, the reinforcing member is fixed to the middle plate by one of the following methods: welding, screwing, riveting, or bonding. This ensures a reliable connection between the reinforcing member and the middle plate, which helps guarantee the structural strength of the middle frame.
[0021] In one possible implementation, the first heat-spreading plate is fixedly connected to the middle plate by one of the following methods: welding, screwing, riveting, or bonding. This ensures a reliable connection between the first heat-spreading plate and the middle plate, which helps maintain the structural strength of the middle frame.
[0022] Secondly, an electronic device is provided. The electronic device includes a screen, a circuit board, a battery, and the aforementioned mid-frame. The circuit board is fixed to a first region of the mid-frame, the battery is fixed to a second region of the mid-frame, a first heat spreader is disposed opposite to the circuit board, and the screen is fixed to the side of the mid-frame facing away from the circuit board.
[0023] Understandably, typical electronic devices usually have a heat spreader stacked on the middle plate of the frame, directly facing the circuit board. When the electronic device is operating, the heat-generating components on the circuit board generate heat. The heat spreader, positioned directly opposite the circuit board, absorbs and dissipates this heat, thus cooling the heat-generating electronic components. However, stacking the heat spreader on the middle plate increases the overall thickness of the electronic device. In this embodiment, the middle frame embeds the first heat spreader into the middle plate. This allows the first heat spreader to dissipate heat from the circuit board while also utilizing the thickness of the middle plate. This effectively balances the slim design of the electronic device with heat dissipation performance, preventing localized hot spots on the screen caused by the circuit board and thus improving screen performance and user experience.
[0024] Secondly, compared to electronic devices where the heat spreader is positioned directly over both the battery and the circuit board, both the battery and the circuit board generate heat when the device is operating. The heat generated by the circuit board is generally higher than that generated by the battery, resulting in a higher temperature for the heat spreader, which in turn exceeds the battery's temperature. This leads to a higher ambient temperature around the battery, affecting its charging and discharging performance and reducing battery efficiency. Furthermore, because the heat spreader also absorbs heat from the battery, its heat dissipation efficiency for the circuit board is lower, resulting in a higher circuit board temperature and negatively impacting the user experience.
[0025] In one possible implementation, the overlapping area between the projection of the first heat spreader onto the plane of the circuit board and the circuit board is called the first area, and the ratio between the first area and the area of the circuit board is greater than or equal to 80%. In this way, the first heat spreader has a better heat dissipation effect on the circuit board, which is beneficial to ensuring the heat dissipation effect of electronic devices.
[0026] In one possible implementation, the distance between the outer contour of the projection of the first heat spreader onto the plane of the circuit board and the outer contour of the circuit board is less than or equal to 3 millimeters. This results in a smaller area for the first heat spreader, which helps ensure the structural strength of the middle frame.
[0027] In one possible implementation, a heat-generating device is mounted on the circuit board, and the projection of the first heat-spreading plate onto the plane of the circuit board overlaps with the heat-generating device. In this way, the first heat-spreading plate can effectively dissipate heat from the heat-generating device on the circuit board, improving the heat dissipation efficiency of the electronic device, preventing hot spots from forming on the screen, and thus reducing the screen's lifespan.
[0028] In one possible implementation, the heat-generating components include one or more of the following: a CPU chip, memory, a GPU chip, a charging module, and a power supply module. In this way, the first heat spreader can effectively dissipate heat from components on the circuit board that generate significant heat, improving the heat dissipation efficiency of the electronic device, preventing hot spots from forming on the screen, and thus reducing the screen's lifespan.
[0029] In one possible implementation, the distance between the first heat spreader and the battery is greater than millimeters. This distance prevents the battery from being affected by the heat spreader, thus ensuring the battery's charging and discharging performance and efficiency. Simultaneously, the first heat spreader has good heat dissipation performance, helping to prevent the circuit board from overheating and affecting its normal operation.
[0030] In one possible implementation, the electronic device further includes a second heat spreader located on the side of the circuit board facing away from the screen. In this way, the first and second heat spreaders can be located on opposite sides of the circuit board. A portion of the circuit board can be dissipated through the first heat spreader, while another portion can be dissipated through the second heat spreader. This means the circuit board can dissipate heat simultaneously through both heat spreaders, which improves the heat dissipation performance of the electronic device, prevents localized hot spots from forming on the screen due to circuit board heat, thus affecting screen performance and enhancing the user experience. Attached Figure Description
[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.
[0032] Figure 1 is a schematic diagram of the structure of the electronic device provided in some embodiments of this application;
[0033] Figure 2 is an exploded structural diagram of the housing and screen of the electronic device shown in Figure 1 in some embodiments;
[0034] Figure 3 is an exploded structural diagram of the electronic device shown in Figure 1 in some embodiments;
[0035] Figure 4 is an exploded structural diagram of the middle frame shown in Figure 3 in some embodiments;
[0036] Figure 5 is a structural schematic diagram of the main frame shown in Figure 4 from another perspective;
[0037] Figure 6a is a partial cross-sectional structural diagram of one embodiment of the electronic device shown in Figure 1, cut along point AA;
[0038] Figure 6b is a schematic diagram of the enlarged structure at point B of the structure shown in Figure 6a in some other embodiments;
[0039] Figure 7 is an exploded structural diagram of the first heat spreader shown in Figure 4 in some embodiments;
[0040] Figure 8 is a partial cross-sectional structural diagram of one embodiment of the electronic device shown in Figure 1, cut along point AA;
[0041] Figure 9 is a schematic diagram of the assembly structure of the middle frame and circuit board shown in Figure 3 in some embodiments;
[0042] Figure 10 is a partial cross-sectional structural diagram of one embodiment of the electronic device shown in Figure 1, cut along point AA;
[0043] Figure 11a is a partial cross-sectional structural diagram of one embodiment of the electronic device shown in Figure 1, cut along point AA;
[0044] Figure 11b is a simplified schematic diagram of part of the structure shown in Figure 11a;
[0045] Figure 12 is an exploded structural diagram of the first heat spreader shown in Figure 4 in another embodiment;
[0046] Figure 13 is a schematic diagram of a partial cross-sectional structure of the electronic device shown in Figure 1 cut along point AA in another embodiment;
[0047] Figure 14a is a partial cross-sectional view of the electronic device shown in Figure 1 cut along AA in another embodiment.
[0048] Figure 14b is a simplified schematic diagram of a portion of the structure shown in Figure 14a;
[0049] Figure 14c is a schematic diagram of the structure shown in Figure 14b in other embodiments;
[0050] Figure 15 is a partially exploded structural diagram of the electronic device shown in Figure 2 in some embodiments;
[0051] Figure 16 is a schematic diagram of a partial assembly structure of the structure shown in Figure 15 in some embodiments;
[0052] Figure 17 is a schematic diagram of the assembly structure of the structure shown in Figure 15 in some embodiments. Detailed Implementation
[0053] The embodiments of this application are described below with reference to the accompanying drawings.
[0054] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two.
[0055] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.
[0056] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.
[0057] References to "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in another embodiment" appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0058] It is understood that the specific embodiments described herein are merely for explaining the relevant application and not for limiting the application. It should also be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings.
[0059] Figure 1 is a structural schematic diagram of the electronic device 1000 provided in some embodiments of this application. Figure 2 is an exploded structural schematic diagram of the housing 100 and screen 200 of the electronic device 1000 shown in Figure 1 in some embodiments. Figure 3 is an exploded structural schematic diagram of the electronic device 1000 shown in Figure 1 in some embodiments.
[0060] As shown in Figures 1 to 3, the electronic device 1000 can be a mobile phone, tablet computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, wearable device, etc. Figure 1 illustrates the electronic device 1000 using a mobile phone as an example. It should be noted that Figures 1 to 3 and the related figures below only schematically show some components of the electronic device 1000; the actual shape, size, position, and structure of these components are not limited by Figure 1 and the figures below. For ease of description, the width direction of the electronic device 1000 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system of the electronic device 1000 can be flexibly set according to specific practical needs.
[0061] For example, the electronic device 1000 may include a housing 100 and a screen 200. The screen 200 may be mounted on the housing 100. The screen 200 may be used to display images, text, etc. The housing 100 may include a middle frame 10 and a back cover 20. The back cover 20 may be fixedly connected to the periphery of the middle frame 10 and, together with the middle frame 10, encloses the internal space of the housing 100. The screen 200 may be located on the side of the middle frame 10 facing away from the back cover 20 and is fixedly connected to the middle frame 10.
[0062] Exemplarily, the electronic device 1000 may further include a circuit board 30 and a battery 40. Both the circuit board 30 and the battery 40 can be installed within the internal space of the housing 100. The circuit board 30 may be a motherboard. The internal space of the housing 100 may also be used to house other internal components of the electronic device 1000, such as a camera module (not shown), a motor (not shown), etc. It should be noted that, for ease of understanding, the positions of the circuit board 30 and battery 40 installed in the mid-frame 10 are indicated by dashed lines and arrows in Figure 3. In other embodiments, the positions of the circuit board 30 and / or battery 40 within the mid-frame 10 may also be different. The size and shape of the circuit board 30 and / or battery 40 may also be different. This application does not limit these aspects.
[0063] In other embodiments, the electronic device 1000 may also be a foldable electronic device 1000. The housing 100 may include a first housing (not shown) and a second housing (not shown). The electronic device 1000 may also include a folding mechanism (not shown). The folding mechanism may connect the first housing and the second housing. The folding mechanism may deform to allow the first housing and the second housing to be folded or unfolded relative to each other. The screen 200 may be a flexible display screen and is fixedly connected to the first housing and the second housing. The circuit board 30 may be mounted in one of the housings, such as the first housing. The battery 40 may be mounted in the other housing, such as the second housing.
[0064] Figure 4 is an exploded structural diagram of the middle frame 10 shown in Figure 3 in some embodiments. Figure 5 is a structural diagram of the main body 10b of the middle frame shown in Figure 4 from another perspective.
[0065] As shown in Figures 3 to 5, the middle frame 10 may include a frame 11, a middle plate 12, a first heat spreader 13, a reinforcing member 14, and multiple adhesive layers 15. The frame 11 can be fixedly connected to the periphery of the middle plate 12, and together with the middle plate 12, encloses the installation space 10a of the middle frame 10. The frame 11 and the middle plate 12 can together form the main body 10b of the middle frame 10. In some embodiments, the frame 11 can be integrally formed with the middle plate 12, that is, the main body 10b of the middle frame can be an integrally formed structure. In other embodiments, the middle frame 10 may not include the reinforcing member 14 and / or multiple adhesive layers 15.
[0066] Exemplarily, the middle plate 12 may have a first region 12a and a second region 12b spaced apart. The first region 12a may be used to support the circuit board 30. The second region 12b may be used to support the battery 40. The middle plate 12 may also have a first surface 121 and a second surface 122 disposed opposite to each other. The first surface 121 may face the mounting space 10a. The middle plate 12 may also be provided with a through hole 123. The through hole 123 may penetrate the first surface 121 and the second surface 122 and communicate with the mounting space 10a. At least a portion of the through hole 123 may be located in the first region 12a.
[0067] For example, the ratio between the area of the through hole 123 and the area of the first region 12a can be greater than or equal to 80%. For instance, the ratio between the area of the through hole 123 and the area of the first region 12a can be greater than or equal to 90%. In this embodiment, the area of the through hole 123 can be equal to the area of the first region 12a.
[0068] For example, the distance between the outline of the through hole 123 and the outer outline of the first region 12a can be less than or equal to 3 mm. In this way, the area of the through hole 123 is small, which helps to ensure the structural strength of the middle frame 10.
[0069] For example, the distance between the through hole 123 and the second region 12b can be greater than 10 mm. In this way, the distance between the through hole 123 and the second region 12b is relatively large, that is, the distance between the through hole 123 and the battery 40 is relatively large.
[0070] Figure 6a is a partial cross-sectional structural diagram of one embodiment of the electronic device 1000 shown in Figure 1 cut along point AA.
[0071] As shown in Figures 5 and 6a, the reinforcing member 14 can be generally plate-shaped. The reinforcing member 14 can be located on the side of the middle plate 12 facing away from the mounting space 10a and is fixedly connected to the middle plate 12. The reinforcing member 14 can cover the through hole 123 of the middle plate 12. Exemplarily, the middle plate 12 can also be provided with a mounting notch 124. The mounting notch 124 can be arranged around the through hole 123 and communicate with the through hole 123. The reinforcing member 14 can be fixed to the mounting notch 124 by means of adhesive bonding or the like. For example, multiple adhesive layers 15 can include a first adhesive layer 151. The reinforcing member 14 can be fixedly connected to the mounting notch 124 through the first adhesive layer 151. In this way, the reinforcing member 14 can be set using the thickness space of the middle plate 12, which is beneficial for reducing the thickness of the entire middle frame 10 and achieving a thinner design.
[0072] For example, a baffle 125 may be provided on the side of the mounting notch 124 near the mounting space 10a. The first adhesive layer 151 may be located on the side of the baffle 125 facing away from the mounting space 10a. In this way, when the reinforcing member 14 is fixed with adhesive, the baffle 125 can prevent adhesive from overflowing from the mounting notch 124 and affecting the assembly or normal operation of other components. It should be noted that the baffle 125 is schematically divided by dashed lines in Figure 6a.
[0073] In some embodiments, please refer to Figure 6b, which is an enlarged view of the structure shown in Figure 6a at point B in other embodiments. The baffle 125 may not be provided within the mounting notch 124.
[0074] In other embodiments, the middle plate 12 may not have the mounting notch 124. The reinforcing member 14 may also be fixed to the surface of the middle plate 12 facing away from the mounting space 10a.
[0075] In some other embodiments, the reinforcing member 14 can also be fixedly connected to the middle plate 12 by welding, screwing, or other means.
[0076] Figure 7 is an exploded structural diagram of the first heat spreader 13 shown in Figure 4 in some embodiments. Figure 8 is a partial cross-sectional structural diagram of the electronic device 1000 shown in Figure 1 cut along line AA in one embodiment.
[0077] As shown in Figures 7 and 8, the first heat spreader 13 may include a heat dissipation body 13a and an extension structure 13b. The extension structure 13b may be disposed around the heat dissipation body 13a and fixedly connected to the heat dissipation body 13a. The thickness of the extension structure 13b may be less than the thickness of the heat dissipation body 13a. A groove 13c may be formed between the extension structure 13b and the heat dissipation body 13a. The groove 13c may communicate with the mounting space 10a of the middle frame body 10b.
[0078] Exemplarily, the first heat spreader 13 can be fixed within the through hole 123 of the middle plate 12. The first heat spreader 13 can be located on the side of the reinforcing member 14 facing the mounting space 10a and is fixedly connected to the reinforcing member 14. The surface of the first heat spreader 13 facing away from the reinforcing member 14 can be exposed relative to the through hole 123. In this case, the first heat spreader 13 can be considered as being embedded within the middle plate 12. Exemplarily, the first heat spreader 13 can be fixedly connected to the reinforcing member 14 by means of bonding, welding, or other methods. For example, the plurality of adhesive layers 15 may also include a second adhesive layer 152. The heat dissipation body 13a of the first heat spreader 13 can be fixedly connected to the reinforcing member 14 through the second adhesive layer 152.
[0079] For example, the first heat spreader 13 can also be fixedly connected to the middle plate 12 by means of bonding, welding, etc. For example, the plurality of adhesive layers 15 can also include a third adhesive layer 153. The third adhesive layer 153 can be located in the groove 13c of the first heat spreader 13, and the extension structure 13b of the first heat spreader 13 can be fixedly connected to the middle plate 12 through the third adhesive layer 153. In this way, the third adhesive layer 153 can fill the gap between the extension structure 13b of the first heat spreader 13 and the middle plate 12, which helps to improve the connection reliability between the first heat spreader 13 and the middle plate 12.
[0080] For example, the ratio between the area of the first heat spreader 13 and the area of the first region 12a can be greater than or equal to 80%. For instance, the ratio between the area of the first heat spreader 13 and the area of the first region 12a can be greater than or equal to 90%. In this embodiment, the area of the first heat spreader 13 can be equal to the area of the first region 12a.
[0081] For example, the distance between the outer contour of the projection of the first heat spreader 13 onto the plane of the middle plate 12 and the outer contour of the projection of the first region 12a onto the plane of the middle plate 12 can be less than or equal to 3 mm. In this way, the area of the first heat spreader 13 is smaller and the volume of the hollowed-out portion of the middle plate 12 (i.e., the through hole 123 in this embodiment) is smaller, which helps to ensure the structural strength of the middle frame 10.
[0082] For example, the distance between the first heat spreader 13 and the second region 12b can be greater than 10 mm. In this way, the distance between the first heat spreader 13 and the second region 12b is relatively large, which also means that the distance between the first heat spreader 13 and the battery 40 (see Figure 3) is relatively large.
[0083] In other embodiments, the first heat spreader 13 may also be fixedly connected to only one of the middle plate 12 and the reinforcing member 14.
[0084] Referring again to Figures 7 and 8, the first heat spreader 13 may include a first cover plate 131, a second cover plate 132, and a capillary structure 133. The first cover plate 131 may include a first straight portion 1311, a bent portion 1312, and a second straight portion 1313. The bent portion 1312 may surround and be fixedly connected to the first straight portion 1311. The second straight portion 1313 may surround and be fixedly connected to the bent portion 1312. The bent portion 1312 may be bent relative to the first straight portion 1311 and the second straight portion 1313. In this case, the first straight portion 1311 and the bent portion 1312 of the first cover plate 131 may form a recessed space 131a in the first cover plate 131. A groove 13c of the first heat spreader 13 may be formed between the second straight portion 1313 and the bent portion 1312 of the first cover plate 131.
[0085] Exemplarily, the second cover plate 132 may be located on the side of the second straight portion 1313 of the first cover plate 131 facing away from the first straight portion 1311, and fixedly connected to the second straight portion 1313. The second cover plate 132 may include a connected first portion 1321 and a second portion 1322. The second portion 1322 may be disposed around the first portion 1321. The second portion 1322 of the second cover plate 132 may be fixedly connected to the second straight portion 1313 of the first cover plate 131. The first portion 1321 of the second cover plate 132 may be spaced apart from the first straight portion 1311 of the first cover plate 131. The first portion 1321 of the second cover plate 132 may cover the recessed space 131a of the first cover plate 131.
[0086] For example, the first portion 1321 of the second cover plate 132, together with the first straight portion 1311 and the bent portion 1312 of the first cover plate 131, can jointly enclose the cavity 13d of the first heat spreader 13. The cavity 13d can be a sealed vacuum cavity. The capillary structure 133 can be disposed within the cavity 13d. In this case, the first portion 1321 of the second cover plate 132 can be stacked with the first cover plate 131 and the capillary structure 133.
[0087] At least a portion of the recessed space 131a of the first cover plate 131 can form the cavity 13d of the first heat spreader 13. In this case, the second portion 1322 of the second cover plate 132 and the second straight portion 1313 of the first cover plate 131 can together form the extension structure 13b of the first heat spreader 13. The first portion 1321 of the second cover plate 132, together with the capillary structure 133, the first straight portion 1311 of the first cover plate 131, and the bent portion 1312 of the first cover plate 131, can together form the heat dissipation body 13a of the first heat spreader 13. In this embodiment, the cavity 13d of the first heat spreader 13 can be entirely formed by the recessed space 131a of the first cover plate 131.
[0088] For example, the surface of the second cover plate 132 facing away from the first cover plate 131 can be fixedly connected to the reinforcing member 14 via the second adhesive layer 152. The elastic modulus of the reinforcing member 14 can be higher than that of the second cover plate 132 of the first heat spreader 13. The thickness of the reinforcing member 14 can be greater than the thickness of the second cover plate 132 of the first heat spreader 13. This results in better structural strength for the reinforcing member 14, which helps ensure the structural strength of the middle frame 10 and extends its service life. In some embodiments, the first heat spreader 13 can also be fixedly connected to the reinforcing member 14 or the middle plate 12 by welding or other methods. In some embodiments, the elastic modulus of the reinforcing member 14 can also be equal to that of the second cover plate 132.
[0089] Exemplarily, a portion of the first straight section 1311 of the first cover plate 131 may be recessed in the direction toward the capillary structure 133, forming a recess 1314. In this case, the opening of the recess 1314 may face away from the second cover plate 132. The bottom surface of the recess 1314 may or may not contact the capillary structure 133. Thus, by providing the recess 1314, the possibility of the first cover plate 131 recessing in the direction toward the capillary structure 133 due to external force can be reduced, which helps to ensure the structural stability of the first heat spreader 13 and extend the service life of the first heat spreader 13. Exemplarily, there may be multiple recesses 1314. Multiple recesses 1314 may be arranged in an array on the first straight section 1311.
[0090] Figure 9 is a schematic diagram of the assembly structure of the middle frame 10 and circuit board 30 shown in Figure 3 in some embodiments. Figure 10 is a partial cross-sectional schematic diagram of one embodiment of the electronic device 1000 shown in Figure 1 cut along AA. Figure 11a is a partial cross-sectional schematic diagram of one embodiment of the electronic device shown in Figure 1 cut along AA. Figure 11b is a simplified schematic diagram of the partial structure shown in Figure 11a. It should be noted that Figure 9 shows the first heat spreader 13, which is blocked by the circuit board 30, by dashed lines.
[0091] As shown in Figures 9 to 11b, the circuit board 30 can be housed in the mounting space 10a of the middle frame 10 and fixed to the first region 12a of the middle plate 12 (see Figure 3). The projection of the circuit board 30 onto the plane of the middle plate 12 can completely overlap with the projection of the first region 12a onto the plane of the middle plate 12, meaning the circuit board 30 can be positioned corresponding to the first region 12a of the middle plate 12. For example, the middle plate 12 can have a mounting boss (not shown). The circuit board 30 can be fixed to the mounting boss. In this case, the circuit board 30 can be spaced apart from the middle plate 12 and the first heat spreader 13 in the thickness direction of the housing 100. That is, there are gaps between the circuit board 30 and the middle plate 12 and the first heat spreader 13. The first heat spreader 13 can be positioned opposite to the circuit board 30.
[0092] Exemplarily, electronic devices can be provided on both sides of the circuit board 30 along its thickness direction. For example, electronic devices such as chips, such as system-on-chips (SOCs), can be provided on the side of the circuit board 30 facing away from the middle plate 12. Electronic devices such as sensors, capacitors / inductors, etc., can be provided on the side of the circuit board 30 facing the middle plate 12. All electronic devices can be spaced apart from the middle plate 12. At least some of the electronic devices can constitute heat-generating devices 31. Exemplarily, heat-generating devices 31 can include, but are not limited to, electronic devices that generate a large amount of heat, such as CPU chips, memory, GPU chips, power supply modules, charging modules, capacitors, resistors, etc.
[0093] For example, the overlapping area of the projection of the first heat spreader 13 onto the plane of the circuit board 30 and the circuit board 30 is the first area. The ratio between the first area and the area of the circuit board 30 can be greater than or equal to 80%. For example, the ratio between the first area and the area of the circuit board 30 can be greater than or equal to 90%. In this embodiment, the projection of the first heat spreader 13 onto the plane of the circuit board 30 (i.e., the first projection) can completely cover the circuit board 30. That is, the overlapping area of the two can be equal to the area of the circuit board 30. In this way, the first heat spreader 13 can better absorb the heat emitted by the circuit board 30, which is beneficial to improving the heat dissipation performance of the middle frame 10.
[0094] The projection of the first heat spreader 13 onto the plane of the circuit board 30 can overlap with the heat-generating device 31. For example, the projection of the first heat spreader 13 onto the plane of the circuit board 30 can completely cover the heat-generating device 31 on the circuit board 30. In this way, the first heat spreader 13 can better absorb the heat emitted by the heat-generating device 31, which is beneficial to improving the heat dissipation performance of the middle frame 10.
[0095] For example, the area of the first heat spreader 13 is relatively small. For instance, the distance between the outer contour of the projection of the first heat spreader 13 onto the plane of the circuit board 30 and the outer contour of the circuit board 30 can be less than or equal to 3 mm. In this way, the smaller area of the first heat spreader 13 is beneficial to reducing the size of the through hole 123 in the middle plate 12, and to ensuring the structural strength of the middle frame 10.
[0096] For example, the electronic device 1000 may also include a battery 40 (see FIG. 3). The battery 40 may be housed in the mounting space 10a of the middle frame 10 and fixed to the second region 12b of the middle plate 12. In this case, the battery 40 may be spaced apart from the circuit board 30. The battery 40 may also be spaced apart from the first heat spreader 13. For example, the projection of the battery 40 onto the plane of the middle plate 12 may be spaced apart from the first heat spreader 13. For example, the distance between the battery 40 and the first heat spreader 13 may be greater than 10 mm.
[0097] For example, the back cover 20 can be fixedly connected to the periphery of the frame 11 and spaced apart from the middle plate 12. The back cover 20 can cover the mounting space 10a of the middle frame 10. In this case, the back cover 20 and the middle frame 10 can together enclose the internal space of the housing 100. The mounting space 10a of the middle frame 10 can constitute at least a portion of the internal space of the housing 100. The battery 40 and the circuit board 30 can both be located in the internal space of the housing 100. The screen 200 can be located on the side of the middle plate 12 facing away from the back cover 20 and fixedly connected to the middle frame 10. In this embodiment, the internal space of the housing 100 can be entirely constituted by the mounting space 10a of the middle frame 10.
[0098] Understandably, typical electronic devices usually have a heat spreader stacked on the middle plate of the frame, facing the circuit board. When the electronic device is working, the heat-generating components on the circuit board generate heat. At this time, the heat spreader, facing the circuit board, can absorb and diffuse the heat, thereby cooling the heat-generating electronic components and achieving heat dissipation. However, stacking the heat spreader on the middle plate increases the overall thickness of the electronic device. In this embodiment, the middle frame 10 embeds the first heat spreader 13 into the middle plate 12. This allows the first heat spreader 13 to dissipate heat from the circuit board 30 while also utilizing the thickness of the middle plate 12. This effectively balances the thinness of the electronic device 1000 with heat dissipation performance, preventing the screen 200 from developing localized hot spots due to the heat generated by the circuit board 30, which would affect the performance of the screen 200 and improve the user experience.
[0099] Secondly, compared to electronic devices where the heat spreader is positioned directly over both the battery and the circuit board, both the battery and the circuit board generate heat when the device is operating. The heat generated by the circuit board is generally higher than that generated by the battery, resulting in a higher temperature for the heat spreader, which in turn exceeds the battery's temperature. This leads to a higher ambient temperature around the battery, affecting its charging and discharging performance and reducing battery efficiency. Furthermore, because the heat spreader also absorbs heat from the battery, its heat dissipation efficiency for the circuit board is lower, resulting in a higher circuit board temperature and negatively impacting the user experience.
[0100] In this embodiment, the middle plate 12 has a first region 12a and a second region 12b spaced apart. The first region 12a supports the circuit board 30, and the second region 12b supports the battery 40. A first heat spreader 13 is disposed in the first region 12a. The distance between the first heat spreader 13 and the battery 40 can be greater than 10 mm. This distance prevents the battery 40 from being affected by the first heat spreader 13, thus ensuring the charging and discharging performance and efficiency of the battery 40. Simultaneously, the first heat spreader 13 has good heat dissipation performance, helping to prevent the circuit board 30 from overheating and affecting its normal operation.
[0101] In addition, the mid-frame 10 in this embodiment may also include a reinforcing member 14, which can be fixed to the side of the mid-plate 12 facing the screen 200 and covers the through hole 123. The first heat dissipation plate 13 can be fixedly connected to the reinforcing member 14. In this way, the reinforcing member 14 can be used to enhance the structural strength of the mid-plate 12 of the mid-frame body 10b, thereby ensuring the heat dissipation effect and thin design of the mid-frame 10 while taking into account the structural strength of the mid-frame 10, which is beneficial to extending the service life of electronic devices and improving the user experience.
[0102] Furthermore, compared to electronic devices where the second cover plate of the heat spreader directly contacts the screen without a reinforcing member, the thinner second cover plate makes it difficult to control its surface flatness during manufacturing. This results in poor surface flatness, affecting the flatness of the screen and impacting the user experience. In this embodiment, a reinforcing member 14 is provided between the first heat spreader 13 and the screen 200. The thickness of the reinforcing member 14 can be greater than the thickness of the second cover plate 132 of the first heat spreader 13. This greater thickness of the reinforcing member 14 makes it easier to control its surface flatness during manufacturing, resulting in better surface flatness. This, in turn, helps ensure the flatness of the screen 200 and improves the user experience.
[0103] In some embodiments, the second cover plate 132 of the first heat spreader 13 can be fixedly connected to the reinforcing member 14 by thermally conductive gel, that is, the second adhesive layer 152 can be thermally conductive gel. In this way, the second adhesive layer 152 has good thermal conductivity, so that the heat of the first heat spreader 13 can also be transferred to the reinforcing member 14 through the second adhesive layer 152, so that the reinforcing member 14 can also assist the first heat spreader 13 in heat dissipation, which is beneficial to improving the heat dissipation performance of the middle frame 10.
[0104] In some embodiments, the first cover plate 131 of the first heat spreader 13 can be fixedly connected to the middle plate 12 by thermally conductive gel, that is, the third adhesive layer 153 can also be thermally conductive gel. In this way, the third adhesive layer 153 has good thermal conductivity, so that the heat of the first heat spreader 13 can also be transferred to the middle plate 12 through the third adhesive layer 153, thereby achieving further heat dissipation and improving the heat dissipation performance of the middle frame 10.
[0105] In some embodiments, the through hole 123 of the middle plate 12 may only penetrate the first surface 121 or the second surface 122 of the middle plate 12. That is, the through hole 123 may be a blind hole. In other embodiments, the middle plate 12 may not have a through hole 123. The first heat spreader 13 may be embedded in the middle plate 12 and completely covered by the middle plate 12. In this case, the first heat spreader 13 will not be exposed relative to the middle plate 12.
[0106] Figure 12 is an exploded structural diagram of the first heat spreader 13 shown in Figure 4 in another embodiment. Figure 13 is a partial cross-sectional structural diagram of the electronic device 1000 shown in Figure 1 cut along AA in another embodiment. Figure 14a is a partial cross-sectional structural diagram of the electronic device 1000 shown in Figure 1 cut along AA in another embodiment. Figure 14b is a simplified schematic diagram of the partial structure shown in Figure 14a.
[0107] As shown in Figures 12 to 14b, the structure of the electronic device 1000 in this embodiment is largely the same as that of the electronic device 1000 shown in Figure 1, and the similarities will not be described again. The following describes some differences between the two. For example, the middle frame 10 may not include reinforcing members. The area of the projection of the first cover plate 131 of the first heat spreader 13 onto the plane where the second cover plate 132 is located can be smaller than the area of the second cover plate 132. A portion of the second part 1322 of the second cover plate 132 can be fixedly connected to the second straight portion 1313 of the first cover plate 131, while a portion can be exposed relative to the first cover plate 131. In this case, the first part 1321 of the second cover plate 132, the first cover plate 131, and the capillary structure 133 can together constitute the heat dissipation body 13a of the first heat spreader 13. The second part 1322 can constitute the extension structure 13b of the first heat spreader 13.
[0108] For example, the second part 1322 can be fixedly connected to the mounting notch 124 of the middle plate 12 via the first adhesive layer 151. In this case, the second cover plate 132 can cover the through hole 123 of the middle plate 12. In some embodiments, the second part 1322 can also be fixedly connected to the middle plate 12 by welding, riveting, screwing, or other methods. In other words, the second part 1322 can be fixedly connected to the middle plate 12 by one of the following methods: welding, riveting, screwing, and bonding.
[0109] For example, the thickness of the second cover plate 132 may be greater than the thickness of the first cover plate 131. The thickness of the second cover plate 132 may be greater than 0.06 mm. For example, the thickness of the second cover plate 132 may be in the range of 0.15 mm to 0.2 mm.
[0110] For example, the elastic modulus of the second cover plate 132 can be greater than that of the first cover plate 131. The first cover plate 131 can be made of stainless steel, steel-copper composite materials, etc. The second cover plate 132 can be made of stainless steel, steel-copper composite materials, titanium alloy, titanium-copper composite materials, etc. This results in higher structural strength for the second cover plate 132, which helps ensure the overall structural strength of the middle frame 10 and extends its service life.
[0111] It is understood that the thickness of the second cover plate 132 of the first heat spreader 13 in this embodiment can be greater than the thickness of the first cover plate 131. In this way, the second cover plate 132 is thicker and has higher structural strength, so that the second cover plate 132 can also be used to enhance the structural strength of the middle plate 12, which is beneficial to extending the service life of the electronic device 1000 and improving the user experience.
[0112] Secondly, since the thickness of the first cover plate 131 is greater than that of the second cover plate 132, the second cover plate 132 is thinner, making it more difficult to control the surface flatness of the second cover plate 132. Poor surface flatness of the second cover plate 132 affects the flatness of the screen and the user experience. In this embodiment, by increasing the thickness of the second cover plate 132, the surface flatness of the second cover plate 132 can be effectively guaranteed. This allows for both improved structural strength of the mid-frame 10 and improved screen surface flatness, thus enhancing the user experience.
[0113] In some embodiments, the area of the projection of the first cover plate 131 onto the surface where the second cover plate 132 is located may be equal to the area of the second cover plate 132. In this case, the portion of the second cover plate 132 opposite the recessed space 131a of the first cover plate 131 can constitute part of the heat dissipation body 13a of the first heat spreader 13. The portion of the second cover plate 132 fixedly connected to the second straight portion 1313 of the first cover plate 131 can constitute part of the extension structure 13b of the first heat spreader 13.
[0114] In other embodiments, please refer to Figures 14a and 14c together. Figure 14c is a schematic diagram of the structure shown in Figure 14b in another embodiment. The area of the projection of the first cover plate 131 of the first heat spreader 13 onto the plane where the second cover plate 132 is located can also be larger than the area of the second cover plate 132. In this case, the portion of the first cover plate 131 extending relative to the second cover plate 132 can constitute an extension structure 13b of the first heat spreader 13. The extension structure 13b can be fixedly connected to the middle plate 12.
[0115] Figure 15 is a partially exploded structural diagram of the electronic device 1000 shown in Figure 2 in some embodiments. Figure 16 is a partially assembled structural diagram of the structure shown in Figure 15 in some embodiments. Figure 17 is an assembled structural diagram of the structure shown in Figure 15 in some embodiments.
[0116] In some embodiments, as shown in Figures 15 to 17, the electronic device 1000 can also be a foldable electronic device 1000, such as a foldable tablet computer. The electronic device 1000 may further include a fan 50, a speaker module 60, a heat-conducting component 70, and a second heat-spreading plate 80. The fan 50, speaker module 60, heat-conducting component 70, and second heat-spreading plate 80 can all be located within the mounting space 10a of the middle frame 10 and are fixedly connected to the middle frame 10. The fan 50, speaker module 60, and heat-conducting component 70 can all be spaced apart from the first region 12a and the second region 12b. That is, the fan 50 and speaker module 60 can both be spaced apart from the circuit board 30. The fan 50 and speaker module 60 can both be spaced apart from the first heat-spreading plate 13. The fan 50 may have an air inlet 51 and an air outlet 52. The air inlet 51 may be positioned away from the middle plate 12. The frame 11 may also have an air outlet 11a. The air outlet 52 of the fan 50 can be positioned toward the air outlet 11a of the frame 11 and connected to the air outlet 11a.
[0117] For example, the heat-conducting component 70 can be fixed to the middle plate 12 and positioned directly opposite the air outlet 52 of the fan 50. The heat-conducting component 70 can be made of a material with high thermal conductivity, such as copper. The heat-conducting component 70 can be a fin. The heat-conducting component 70 can be in a grid shape, allowing the air blown by the fan 50 to have a large contact area with the heat-conducting component 70. The second heat-spreading plate 80 can be fixed to the middle frame 10. A portion of the second heat-spreading plate 80 can be stacked on the speaker module 60, and a portion can be stacked on the heat-conducting component 70. For example, the second heat-spreading plate 80 can be fixedly connected to the heat-conducting component 70 by welding or other methods. The second heat-spreading plate 80 can be a vapor chamber (VC). Thus, when the speaker module 60 is working, the heat emitted by the speaker module 60 can be transferred sequentially through the second heat-spreading plate 80 and the heat-conducting component 70 to the air outlet 52 of the fan 50, and then the fan 50 blows air through it, achieving hot and cold air exchange and thus dissipating heat from the speaker module 60.
[0118] For example, a portion of the second heat spreader 80 may overlap with the circuit board 30 in the thickness direction of the housing 100. In this way, a portion of the heat generated by the circuit board 30 can be dissipated through the first heat spreader 13, while another portion can be transferred sequentially through the second heat spreader 80 and the heat conductor 70 to the air outlet 52 of the fan 50, thus dissipating heat from the circuit board 30. That is, the circuit board 30 can achieve heat dissipation through the combined action of the first heat spreader 13, the heat conductor 70, the second heat spreader 80, and the fan 50, which helps improve the heat dissipation performance of the electronic device 1000 and enhances the user experience.
[0119] It should be noted that, in the absence of conflict, the features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.
[0120] It should be noted that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.
[0121] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A middle frame (10), characterized in that, The frame includes a frame (11), a middle plate (12), and a first heat spreader (13). At least a portion of the first heat spreader (13) is embedded in the middle plate (12). The frame (11) is fixedly connected to the periphery of the middle plate (12) and together with the middle plate (12) and the first heat spreader (13), it encloses the mounting space (10a) of the middle frame (10). The mounting space (10a) is used to accommodate the battery (40) and the circuit board (30). The middle plate (12) has a first region (12a) and a second region (12b) spaced apart. At least part of the heat spreader (13) is located in the first region (12a) and spaced apart from the second region (12b). The first region (12a) is used to support the circuit board (30), and the second region (12b) is used to support the battery (40).
2. The middle frame (10) according to claim 1, characterized in that, The distance between the first heat spreader (13) and the second region (12b) is greater than 10 mm.
3. The middle frame (10) according to claim 1, characterized in that, The distance between the outer contour of the projection of the first region (12a) onto the plane where the middle plate (12) is located and the outer contour of the projection of the first heat spreader (13) onto the plane where the middle plate (12) is located is less than or equal to 3 mm.
4. The middle frame (10) according to claim 1, characterized in that, The ratio between the projection of the first heat spreader (13) onto the plane where the middle plate (12) is located and the overlapping area of the first region (12a) and the area of the first region (12a) is greater than or equal to 80%.
5. The middle frame (10) according to claim 1, characterized in that, The first region (12a) of the middle plate (12) is provided with a through hole (123), the through hole (123) is connected to the installation space (10a), and the first heat spreader (13) is fixed to the through hole (123).
6. The middle frame (10) according to claim 1, characterized in that, The first heat spreader (13) includes a first cover plate (131), a second cover plate (132), and a capillary structure (133). The first cover plate (131) and the second cover plate (132) are stacked and together enclose a cavity (13d). The capillary structure (133) is located in the cavity (13d). The first cover plate (131) is closer to the installation space (10a) than the second cover plate (132). The thickness of the second cover plate (132) is greater than the thickness of the first cover plate (131).
7. The middle frame (10) according to claim 6, characterized in that, The elastic modulus of the second cover plate (132) is greater than that of the first cover plate (131).
8. The middle frame (10) according to any one of claims 1 to 7, characterized in that, The middle frame (10) also includes a reinforcing member (14), which is located on the side of the first heat spreader (13) facing away from the circuit board (30) and is fixedly connected to the middle plate (12). The reinforcing member (14) covers the first heat spreader (13).
9. The middle frame (10) according to claim 8, characterized in that, The thickness of the reinforcing member (14) is greater than the thickness of the second cover plate (132) of the first heat spreader (13).
10. The middle frame (10) according to claim 8, characterized in that, The elastic modulus of the reinforcing member (14) is greater than that of the elastic modulus of the second cover plate (132) of the first heat-spreading plate (13).
11. The middle frame (10) according to claim 8, characterized in that, The reinforcing member (14) is fixedly connected to the first heat spreader (13) by thermally conductive gel.
12. The middle frame (10) according to claim 8, characterized in that, The reinforcing member (14) is fixedly connected to the middle plate (12) by one of the following methods: welding, screwing, riveting and bonding.
13. The middle frame (10) according to claim 1, characterized in that, The first heat spreader (13) is fixedly connected to the middle plate (12) by one of the following methods: welding, screwing, riveting and bonding.
14. An electronic device (1000), characterized in that, The device includes a screen (200), a circuit board (30), a battery (40), and a mid-frame (10) according to any one of claims 1 to 13. The circuit board (30) is fixed to a first region (12a) of the mid-frame (12), the battery (40) is fixed to a second region (12b) of the mid-frame (12), the first heat spreader (13) is disposed opposite to the circuit board (30), and the screen (200) is fixed to the side of the mid-frame (10) facing away from the circuit board (30).
15. The electronic device (1000) according to claim 14, characterized in that, The first heat spreader (13) has a projection on the plane of the circuit board (30) and the overlapping area of the circuit board (30) is the first area, and the ratio between the first area and the area of the circuit board (30) is greater than or equal to 80%.
16. The electronic device (1000) according to claim 14, characterized in that, The distance between the outer contour of the projection of the first heat spreader (13) onto the plane where the circuit board (30) is located and the outer contour of the circuit board (30) is less than or equal to 3 mm.
17. The electronic device (1000) according to claim 14, characterized in that, The circuit board (30) is provided with a heating device (31), and the projection of the first heat spreader (13) on the plane of the circuit board (30) overlaps with the heating device (31).
18. The electronic device (1000) according to claim 14, characterized in that, The heating device (31) includes one or more of the following: CPU chip, memory, GPU chip, charging module, and power supply module.
19. The electronic device (1000) according to claim 14, characterized in that, The distance between the first heat spreader (13) and the battery (40) is greater than 10 mm.
20. The electronic device (1000) according to any one of claims 14 to 19, characterized in that, The electronic device (1000) further includes a second heat spreader (80), which is located on the side of the circuit board (30) facing away from the screen (200).