Terminal block, power device assembly, system, method for producing a terminal block, and method for producing a power device assembly

Abstract

A terminal block (1) is specified, comprising - a connection board (4) with at least one first connection region (6), and - at least one terminal (7) electrically connected to the at least one first connection region (6), wherein - the connection board (4) extends in a main extension plane, - the at least one terminal (7) extends perpendicular to the main extension plane, - the terminal block (1) is prefabricated with the at least one terminal (7) to be attached to and aligned with a package body (9) of a power device (2) and / or a mounting portion of the power device (2), and - the at least one terminal (7) is arranged in the main extension plane for alignment with the package body (9) and electrical connection with the power device (2). Furthermore, a power device assembly, a system, a method for producing a terminal block, and a method for producing a power device assembly are specified.

Description

[0001] P2024, 0874 WO E / P240116W001 December 11, 2024

[0002] Description

[0003] TERMINAL BLOCK, POWER DEVICE ASSEMBLY, SYSTEM, METHOD FOR PRODUCING A TERMINAL BLOCK, AND METHOD FOR PRODUCING A POWER DEVICE ASSEMBLY

[0004] The present disclosure relates to a terminal block, a power device assembly, a system, a method for producing a terminal block, and a method for producing a power device assembly.

[0005] Typically, integration of molded power devices with vertically arranged terminals in customer applications, where the control board with openings is fixed to the vertically arranged terminals, is a complex challenge.

[0006] Particularly, the integration is a delicate process due to assembly tolerances and press-pin technology, where the vertically arranged terminals are exposed to considerable mechanical forces during the insertion of press-fit pins into openings of a printed circuit board.

[0007] Embodiments of the disclosure relate to a terminal block with vertically arranged terminals which is comparatively easy to handle. Further embodiments relate to a power device, a system, a method for producing such a terminal block, and a method for producing such a power device.

[0008] This is achieved by the subject-matter of the independent claims. Further embodiments are evident from the dependent claims and the following description.

[0009] A terminal block is described. P2024, 0874 WO E / P240116W001 December 11, 2024

[0010] According to an embodiment, the terminal block comprises a connection board with at least one first connection region. Exemplarily, the first connection region comprises an electrically conductive material, for example a metal or a metallic alloy. The first connection region is, for example, electrically connected to electrical connection lines, e.g. comprising copper or a copper alloy, aluminum or aluminum alloy, nickel, silver, and / or gold, of the connection board. Exemplarily, the first connection region can comprise the forgoing materials listed in connection to the electrical connection lines. The first connection region can have an optional conductive coating such as a nickel, silver, and / or gold layer.

[0011] According to the embodiment, the terminal block comprises at least one terminal electrically connected to the at least one first connection region. Exemplarily, the terminal is connected to the first connection region in a mechanically stable manner.

[0012] According to the embodiment of the terminal block, the connection board extends in a main extension plane. The main extension plane extends particularly in lateral directions. A vertical direction is oriented perpendicular to the lateral directions. Exemplarily, the terminal comprises or consists of an electrically conductive material like copper, aluminum, and / or a corresponding alloy.

[0013] According to the embodiment of the terminal block, the at least one terminal extends perpendicular to the main extension plane. In particular, the main extension direction of the terminal is approximately parallel to the vertical direction. For example, the terminal is connected to the P2024, 0874 WO E / P240116W001 December 11, 2024

[0014] connection board electrically conductively, and optionally in a mechanically stable manner.

[0015] According to the embodiment of the terminal block, the terminal block is prefabricated with the at least one terminal to be attached to and aligned with a package body of a power device and / or a mounting portion of the power device.

[0016] According to the embodiment of the terminal block, the at least one terminal is arranged within in the main extension plane for alignment with the package body and electrical connection with the power device.

[0017] Advantageously, the use of the terminal block, e.g. forming a common building block of a power device, effectively reduces a number of manufacturing steps when producing a corresponding power device having openings in the package body, thus leading to a cost reduction because of no need of an implementation of pin holders and / or vertically arranged pin terminals to the power device.

[0018] Advantageously, with such a terminal block, a massive simplification of alignment features and testing can be achieved, further reducing costs on system level. The terminal block can advantageously lead to a higher design flexibility for the connection board, particularly at the customer site, as the terminal can have different shapes. In particular, only one design of a package body of the power device is needed, whereas the connection board or even the complete terminal block can be designed and manufactured even by the customer itself. When using an intermediate board, the terminal setup can be adjusted to a customer-specific P2024, 0874 WO E / P240116W001 December 11, 2024

[0019] connection board. So only the terminal block, but not the whole power device must be adjusted.

[0020] According to a further embodiment, the terminal block comprises a first spacer element extending perpendicular to the main extension plane, exemplarily extending away from the connection board in direction to the power device on which the terminal block can be mounted. Exemplarily, the first spacer element is formed of a different material than the terminal. For example, the first spacer element is formed of an electrically insulating material. Alternatively, the first spacer is formed of a electrically conductive material, exemplarily formed of a material of the terminal, particularly when the first spacer element is just getting in mechanical contact with the package body.

[0021] According to a further embodiment of the terminal block, the first spacer element is connected to the connection board. For example, the terminal has a first length along the vertical direction, and the first spacer element has a second length along the vertical direction. The second length is, for example, equal to or smaller than the first length.

[0022] According to a further embodiment of the terminal block, the at least one terminal has an upper connection structure for establishing the connection to the connection board.

[0023] Exemplarily, the upper connection structure can have a width which is larger or smaller than a width of an adjacent part of the terminal. For example, the upper connection structure can have a cut-out. Alternatively or additionally, the upper connection structure can comprise or consist of an elastic P2024, 0874 WO E / P240116W001 December 11, 2024

[0024] portion such as a spring portion or a press-fit portion, and / or a bed stop.

[0025] According to a further embodiment of the terminal block, the at least one terminal has a lower connection structure opposite the upper connection structure.

[0026] Exemplarily, the lower connection structure can have a width which is larger or smaller than a further width of an adjacent part of the terminal. For example, the lower connection structure can have a further cut-out.

[0027] Alternatively or additionally, the lower connection structure can comprise or consist of an elastic portion such as a spring portion or a press-fit portion, and / or a bed stop.

[0028] The upper and / or the lower connection structure is in particular configured to prevent movement and / or displacement of the terminal. Advantageously, a fixation of the terminal comprising such a connection structure is particularly strong and reliable, particularly with respect to the connection board.

[0029] According to a further embodiment of the terminal block, the at least one terminal is connected to the first connection region by a first connection element. Exemplarily, the first connection element comprises or consists of an electrically conductive material configured to provide an electrically conductive connection between the terminal and the first connection region.

[0030] Exemplarily, the first connection element is a glue connection, an elastic connection, a solder connection, a press-fit connector, or a pin holder. P2024, 0874 WO E / P240116W001 December 11, 2024

[0031] For example, the glue connection is an electrically conductive glue, and / or the solder connection comprises a solder material. The glue and / or the solder material is in particular directly arranged on the first connection region and / or on the terminal, particularly the upper connection structure. Exemplarily, the elastic connection is a spring. For example, the press-fit connector is a counterpart for the press-fit portion of the terminal. For example, the pin holder is a counterpart for a terminal being a pin terminal.

[0032] Alternatively, the terminal is connected to the first connection region via welding such as resistive welding or laser welding.

[0033] According to a further embodiment, the terminal block comprises an intermediate board, in particular with at least one opening. For example, the intermediate board is arranged downstream of the connection board. In particular, the intermediate board is spaced apart from the connection board in the vertical direction. For example, the terminal is connected to the intermediate board in an electrically conductive or electrically insulated manner, and / or in a mechanically stable manner.

[0034] According to a further embodiment of the terminal block, the intermediate board has a main extension plane extending parallel to the main extension plane of the connection board. Exemplarily, the at least one terminal extends through the at least one opening in the vertical direction. In particular, the terminal can extend through the opening with or without being in electrical contact with the intermediate board. For example, in plan view along the vertical direction, the first P2024, 0874 WO E / P240116W001 December 11, 2024

[0035] connection region and the opening overlap in lateral directions. Exemplarily, the terminal can extend through the opening with or without mechanical contact.

[0036] According to a further embodiment of the terminal block, the at least one terminal comprises at least one first partial terminal electrically connected to the first connection region and to a first auxiliary connection region of the intermediate board. For example, in plan view along the vertical direction, the first connection region and the first auxiliary connection region overlap in lateral directions.

[0037] Exemplarily, the first auxiliary connection region comprises an electrically conductive material, for example a metal or a metallic alloy. The first auxiliary connection region is, for example, electrically connected to further electrical connection lines of the intermediate board. The first auxiliary connection region can have an optional conductive coating.

[0038] Exemplarily, the first partial terminal is connected to the first auxiliary connection region by a first auxiliary connection element. In particular all features of the first connection element are also applicable to the first auxiliary connection element.

[0039] According to a further embodiment of the terminal block, the at least one first partial terminal extends perpendicular to the main extension plane of the connection board and between the connection board and the intermediate board in the vertical direction. P2024, 0874 WO E / P240116W001 December 11, 2024

[0040] 8

[0041] According to a further embodiment of the terminal block, the at least one terminal further comprises at least one second partial terminal electrically connected to a second auxiliary connection region of the intermediate board. For example, in plan view along the vertical direction, the first connection region and the second auxiliary connection region do not overlap in lateral directions. In particular, the second auxiliary connection region is spaced apart from the first auxiliary connection region and the first connection region in lateral directions.

[0042] Exemplarily, the second auxiliary connection region comprises an electrically conductive material, for example a metal or a metallic alloy. The second auxiliary connection region is, for example, electrically connected to the further electrical connection lines of the intermediate board. The second auxiliary connection region can have an optional conductive coating.

[0043] Exemplarily, the second partial terminal is connected to the second auxiliary connection region by a second auxiliary connection element. In particular all features of the first connection element are also applicable to the second auxiliary connection element.

[0044] According to a further embodiment of the terminal block, the at least one second partial terminal extends perpendicular to the main extension plane of the connection board and extends from the intermediate board in a direction facing away from the connection board, exemplarily towards the power device on which the terminal block can be arranged. P2024, 0874 WO E / P240116W001 December 11, 2024

[0045] According to a further embodiment of the terminal block, the at least one first partial terminal and the at least one second partial terminal are spaced apart from one another in lateral directions.

[0046] According to a further embodiment of the terminal block, the intermediate board comprises an intermediate connection extending parallel to the main extension plane of the intermediate board, and the intermediate connection electrically connects the at least one first partial terminal and the at least one second partial terminal. For example, the intermediate connection can electrically connect different terminals. In particular, the intermediate connection is characteristic of the further electrical connection lines of the intermediate board, electrically connecting the first auxiliary connection element with the second auxiliary connection element.

[0047] According to a further embodiment of the terminal block, the intermediate board is formed of an auxiliary connection board, e.g. realized as a printed circuit board.

[0048] According to a further embodiment of the terminal block, the intermediate board is formed of a molded block. Exemplarily, the molded block comprises or consists of an electrically insulating material like a thermosetting or thermoplastic resin. The electrically insulated material can comprise ab inorganic filler like particles, fibers, or mesh. For example, the intermediate connection is embedded in the molded block. " Embedded" means that the intermediate connection can be arranged within the molded block such that at least one outer surface of the intermediate connection is covered by the molded block or that the intermediate P2024, 0874 WO E / P240116W001 December 11, 2024

[0049] 10

[0050] connection is arranged on a main surface of the molded block. Similarly, the intermediate connection can be embedded in a corresponding printed circuit board.

[0051] For example, the connection board can be for formed of a molded block.

[0052] According to a further embodiment of the terminal block, the intermediate board has at least one further opening, and the at least one spacer extends through the at least one further opening. The spacer can be in mechanical contact or spaced apart from intermediate board.

[0053] According to a further embodiment, the terminal block comprises a second spacer element extending perpendicular to the main extension plane.

[0054] According to a further embodiment of the terminal block, the second spacer element is connected to the connection board and the intermediate board and extends between the connection board and the intermediate board in the vertical direction. Exemplarily, the first spacer element and the second spacer element are spaced apart in lateral directions. In particular, the second spacer element is connected to the connection board and the intermediate board in a mechanically stable manner.

[0055] According to a further embodiment, the terminal block comprises a third spacer element extending perpendicular to the main extension plane, exemplarily in direction to the power device on which the terminal block can be mounted. P2024, 0874 WO E / P240116WO01 December 11, 2024

[0056] According to a further embodiment of the terminal block, the third spacer element is connected to the intermediate board and extends from the intermediate board in a direction facing away from the connection board. Exemplarily, the third spacer element is spaced apart from the first spacer element and / or the second spacer element in lateral directions. In particular, the third spacer element is connected to the intermediate board in a mechanically stable manner.

[0057] According to a further embodiment of the terminal block, the at least one terminal has an intermediate part located in the opening. Exemplarily, the terminal has an upper part, optionally comprising the upper connection structure, the intermediate part, and a lower part, optionally comprising the lower connection structure. In particular, the upper part faces the connection board and the lower part faces away from the connection board, in direction to the power device on which the terminal block can be mounted, wherein the intermediate part is located between the upper part and the lower part in the vertical direction.

[0058] According to a further embodiment of the terminal block, the intermediate part comprises an intermediate connection structure. Exemplarily, the intermediate connection structure can have a width which is larger or smaller than a further width of an adjacent part of the terminal. For example, the intermediate connection structure can have an intermediate cut-out. Alternatively or additionally, the intermediate connection structure can comprise or consist of an elastic portion such as a spring portion or a press-fit portion, and / or a bed stop or a locally thicker portion. P2024, 0874 WO E / P240116WO01 December 11, 2024

[0059] - 12 -

[0060] The intermediate connection structure is in particular configured to prevent movement and / or displacement of the terminal. Advantageously, a fixation of the terminal with such an intermediate connection structure to the intermediate board is particularly strong and reliable.

[0061] According to a further embodiment of the terminal block, the intermediate connection structure has a width which is larger and / or smaller than a width of the upper part and / or the lower part of the at least one terminal.

[0062] According to a further embodiment of the terminal block, the at least one terminal has the form of a pin. Exemplarily, the terminal has a cylindrical shape, a conical shape or a tapered shape, particularly a cylindrical, a conical or a tapered cross-section. Exemplarily, the terminal has a diameter in lateral directions of at least 0.1 mm to at most 5 mm.

[0063] According to a further embodiment of the terminal block, the connection board is formed of a printed circuit board.

[0064] Exemplarily, the intermediate board being an auxiliary connection board is formed of a further printed circuit board.

[0065] A further embodiment relates to a power device assembly, in particular comprising a terminal block as described herein above. Therefore, the features as described in connection with the terminal block are also applicable to the power device assembly and vice versa.

[0066] The term "power" here and in the following refers, for example, to power semiconductor devices and / or power P2024, 0874 WO E / P240116WO01 December 11, 2024

[0067] - 13 -

[0068] semiconductor chips adapted for processing voltages and currents of more than 100 V and / or more than 10 A, exemplarily voltages of up to 10 kV and electrical currents of up to 10 kA.

[0069] According to an embodiment, the power device assembly comprises a power device comprising at least one power semiconductor chip arranged on a mounting portion. The power semiconductor chip comprises, for example, a semiconductor material such as at least one of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). The power semiconductor chip is, for example, a power diode and / or a power metal insulating semiconductor field- effect transistor, power MISFET for short. The term MISFET shall also include MOSFETs, which have an oxide as an insulating material at a gate. The power semiconductor chip may also be an insulated-gate bipolar transistor, IGBT, or a high electron mobility transistor, HEMT.

[0070] The mounting portion is, for example, part of a carrier, a lead frame, a baseplate, an insulated metal substrate or a ceramic -based substrate of the power device. The mounting portion has, for example, a main extension plane. The main extension plane extends particularly in lateral directions. A vertical direction is oriented perpendicular to the lateral directions. Exemplarily, the power semiconductor chip has a main extension plane parallel to the lateral directions.

[0071] According to the embodiment, the power device assembly comprises a package body for the at least one power device, particularly the semiconductor chip, with at least one recess exposing at least one second connection region. The power semiconductor chip and / or the mounting portion is, P2024, 0874 WO E / P240116WO01 December 11, 2024

[0072] - 14 -

[0073] for example, embedded in the package body. " Embedded" means here and in the following that the package body is arranged at least partly on at least one outer surface of the power semiconductor chip and / or the mounting portion. For example, the power semiconductor chip is surrounded completely, e.g. three - dimensionally, by the package body and the mounting portion.

[0074] Exemplarily, the package body comprises or consists of an electrically insulating material. The electrically insulating material can comprise or consists of a thermosetting or thermoplastic resin, wherein the package body is particularly produced by transfer or injection molding. Exemplarily, an inorganic filler can be included in the electrically insulating material, such as fibers, particles, or mesh.

[0075] A length and / or a width in lateral directions of the package body is, for example, at least 10 mm or at least 20 mm and / or at most 100 mm. A height in the vertical direction of the package body is, for example, at least 2 mm.

[0076] Exemplarily, the second connection region comprises an electrically conductive material and exemplarily comprises a metal or a metallic alloy. The second connection region is, for example, electrically connected with a contact portion of the power semiconductor device. The second connection region can have an optional conductive coating such as a nickel, silver, and / or gold layer.

[0077] For example, the recess completely penetrates the package body in a vertical direction, particularly up to the second connection region. P2024, 0874 WO E / P240116WO01 December 11, 2024

[0078] - 15 -

[0079] " Exposing" means that at least the partial region of the second connection region or the whole area of the second connection region is not covered by the package body. In particular, the partial region of the second connection region and the recess overlap in lateral directions in a top view.

[0080] Exemplarily, the second connection region comprises at least one of a metal pattern of a substrate, a coated region e.g. of a carrier with a coating, a die pad and / or a terminal of a leadframe.

[0081] For example, the package body comprises a plurality of recesses exposing a plurality of second connection regions. Exemplarily, a number of recesses and a number of connection regions are equal to one another. Each of the recesses exposes at least one of the second connection regions, in particular exactly one of the second connection regions, particularly a part thereof. It is also possible that one of the recesses exposes more than one of the second connection regions.

[0082] At least one or at least some of the second connection regions can be part of the mounting portion. Alternatively or additionally, at least one or at least some of the second connection regions can be part of the semiconductor chip.

[0083] According to the embodiment, the power device assembly comprises the terminal block as described herein before. Exemplarily, the terminal block comprises a plurality of terminals. P2024, 0874 WO E / P240116WO01 December 11, 2024

[0084] - 16 -

[0085] According to the embodiment of the power device assembly, the terminal block is arranged on the package body. Exemplarily, the connection board and / or the intermediate board are spaced apart in the vertical direction from the package body.

[0086] According to the embodiment of the power device assembly, the at least one terminal is arranged in the at least one recess of the package body.

[0087] If the terminal block comprises a plurality of terminals, the number of recesses and the number of terminals can be equal to one another. In particular, each one of the first terminals is arranged in one of the recesses. Alternatively, it is possible that at least two of the first terminals are arranged in one of the recesses.

[0088] According to the embodiment of the power device assembly, the at least one terminal is electrically connected to the at least one second connection region. Exemplarily, the proposed power device is embedded in the package body with the recesses, such that portions of the second connection region are exposed from the package body, where the terminals can get in contact with the second connection regions or at least in electrical connection thereof. In particular, the terminal is a control terminal for the power semiconductor chip.

[0089] Alternatively or additionally, the first terminal can also be used as a power terminal.

[0090] According to the embodiment of the power device assembly, the mounting portion comprises a circuit metallization layer and an insulating layer. The circuit metallization layer can comprise a plurality of parts. At least some of the parts of the circuit metallization layer are spaced apart from one P2024, 0874 WO E / P240116WO01 December 11, 2024

[0091] - 17 -

[0092] another in lateral directions. At least some of the parts spaced apart from one another have no direct electrical connection. Exemplarily, the power semiconductor chip is arranged on a part of the circuit metallization layer. The circuit metallization layer can comprise a coating e.g. of a noble metal like nickel, gold or silver.

[0093] According to the embodiment of the power device assembly, a partial region of the circuit metallization layer is exposed by the at least one recess of the package body for forming the second connection region.

[0094] According to the embodiment of the power device assembly, a further partial region of the at least one power semiconductor chip is exposed by the at least one recess of the package body for forming the second connection region.

[0095] According to the embodiment of the power device assembly, the at least one terminal is connected to the second connection region by a second connection element. Exemplarily, the second connection element comprises or consists of an electrically conductive material configured to provide an electrically conductive connection between the terminal and the second connection region.

[0096] According to the embodiment of the power device assembly, the second connection element is at least one of a glue connection, an elastic connection, a solder connection or a press-fit connector.

[0097] For example, the glue connection is an electrically conductive glue, and / or the solder connection comprises a solder material. The glue and / or the solder material is in P2024, 0874 WO E / P240116WO01 December 11, 2024

[0098] - 18 -

[0099] particular directly arranged on the second connection region and / or on the terminal, particularly the lower connection structure. Exemplarily, the elastic connection is a spring. For example, the press-fit connector is a counterpart for the press-fit portion of the terminal.

[0100] Alternatively, the terminal is connected to the second connection region via welding such as resistive welding or laser welding.

[0101] A further embodiment relates to a system, in particular comprising a power device assembly as described herein above. Therefore, the features as described in connection with the system are also applicable to the power device assembly and vice versa.

[0102] According to the embodiment, the system comprises a power device assembly described herein above.

[0103] According to the embodiment, the system comprises a mounting element on which the power device assembly is arranged. For example, the mounting element is a cooler and / or heat sink. The heat sink comprises, for example, fins and / or other structures configured to increase a surface area being in contact with a coolant and particularly increase a cooling efficiency. The heat sink is exemplarily configured to absorb and dissipate heat from the power semiconductor chip. The cooler comprises, for example, a channel through which a cooling fluid can flow. Exemplarily, the heat sink is arranged on the cooler being in contact with the coolant. In particular, the cooler is exemplarily configured to absorb and dissipate heat from the power semiconductor chip and / or the heat sink. P2024, 0874 WO E / P240116WO01 December 11, 2024

[0104] - 19 -

[0105] According to the embodiment of the system, the connection board of the terminal block is connected to the mounting element by a connector.

[0106] According to the embodiment of the system, the intermediate connection board of the terminal block is connected to the mounting element by a further connector.

[0107] According to the embodiment, the system comprises a plurality of power devices, wherein at least some of the power devices are connected to a common connection board.

[0108] According to the embodiment, the system comprises a plurality of power devices, wherein at least some of the power devices are connected to a common intermediate connection board.

[0109] A further embodiment relates to a method for producing a terminal block, in particular a terminal block as described herein above. Therefore, the features as described in connection with the method are also applicable to the terminal block and vice versa.

[0110] According to the embodiment of the method, a connection board with at least one first connection region is provided.

[0111] According to the embodiment of the method, at least one terminal is provided.

[0112] According to the embodiment of the method, the at least one terminal is electrically connected to the at least one first connection region. P2024, 0874 WO E / P240116WO01 December 11, 2024

[0113] - 20 -

[0114] According to the embodiment of the method, the connection board extends in a main extension plane in lateral directions, and the at least one terminal extends perpendicular to the main extension plane in the vertical direction.

[0115] A further embodiment relates to a method for producing a power device assembly, in particular a power device assembly as described herein above. Therefore, the features as described in connection with the method are also applicable to the power device assembly and vice versa.

[0116] According to the embodiment of the method, at least one power semiconductor chip is provided which is arranged on a mounting portion, and a package body is provided, for the at least one power semiconductor chip, with at least one recess exposing at least one second connection region.

[0117] According to the embodiment of the method, the terminal block produced with the method described herein before is provided.

[0118] According to the embodiment of the method, the terminal block is arranged on the package body such that the at least one terminal is arranged in the at least one recess of the package body, and the at least one terminal is electrically connected to the at least one second connection region.

[0119] The accompanying figures are included to provide a further understanding. In the figures, elements of the same structure and / or functionality may be referenced by the same reference signs. It is to be understood that the embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale. P2024, 0874 WO E / P240116W001 December 11, 2024

[0120] Figures 1, 2 and 3 each shows a schematic view of a power device assembly with a terminal block according to an exemplary embodiment.

[0121] Figures 4, 5 and 6 each show a system with a power device assembly with a terminal block according to an exemplary embodiment.

[0122] According to the exemplary embodiment of Figure 1, a terminal block 1 is described which is to be arranged on a package body 9 for forming a power device assembly with a power device 2.

[0123] The terminal block 1 comprises a connection board 4 with first connection regions 6, and terminals 7. Each terminal 7 is electrically connected to one of the first connection regions 6. Exemplarily, at least one of the terminals 7 is electrically connected to a respective first connection region 6 by a first connection element 14. The connection board 4 extends in a main extension plane, e.g. defining lateral directions, and the terminals 7 each extend perpendicular to the main extension plane, e.g. in a vertical direction.

[0124] A first spacer element 8, extending perpendicular to the main extension plane, e.g. in the vertical direction, is arranged on the connection board 4.

[0125] Advantageously, such a terminal block 1 can be preassembled according to customer-specific needs, in particular according to customer-specific connection boards 4, therefore reducing alignment and positioning issues. This could advantageously P2024, 0874 WO E / P240116W001 December 11, 2024

[0126] - 22 -

[0127] be done on a single level. Consequently, only the terminal block 1 needs to be prepared individually, but not the power device. So the connection board can be the control board, and the terminal block 1 may provide an adjustment to the available power package also in combination with an intermediate board.

[0128] The connection board 4 according to Figure 1 is, for example, a printed circuit board, particularly configured as a control board with vertically arranged terminals 7 and an optional vertically arranged first spacer element 8 for mechanical support.

[0129] The power device 2 further comprises at least one power semiconductor chip arranged on a mounting portion that comprises at least two circuit metallization layers for realizing an electronic circuit with the at least one semiconductor chip, wherein the semiconductor chip is not shown in the Figures for better representability and for simplicity the circuit metallization layers are shown as a representative block 12. The at least one power semiconductor chip is covered by a package body 9, wherein the package body 9 has recesses 10 exposing second connection regions 11.

[0130] The mounting portion comprises a circuit metallization layer 12 and an insulating layer 13, wherein partial regions of the circuit metallization layer 12 are exposed by the recesses 10 of the package body 9 for forming the second connection regions 11.

[0131] The terminal block 1 can be moved on the package body 9, e.g. along the vertical direction in Figure 1, such that each of the terminals 7 is arranged in a respective recess 10 of the P2024, 0874 WO E / P240116W001 December 11, 2024

[0132] - 23 -

[0133] package body 9, such that each terminal 7 is electrically connected to a respective second connection region 11. The terminals 7 are each electrically connected to a respective second connection region 11 by a second connection element 15. The second connection elements 15 can be equal to or different from one another. In particular, the second connection elements 15 according to Figure 1 are different from one another regarding their type.

[0134] The package body 9 can be formed of a molded resin body with a size in lateral directions of up to 80 x 80 mm2, inclusive, in case of being a single-phase package, which is typically prepared from a thermosetting resin by a transfer molding process. If the package body 9 is used for a larger system 3, the package body 9 may be even larger. In the package body 9, for example, power terminals 7 can be embedded, particularly not shown in the Figures, wherein the power terminals 7 have a main extension plane in lateral directions.

[0135] Advantageously, the terminals 7 can be inserted into corresponding recesses 10 of the package body 9 and are electrically interconnected with the semiconductor chip, e.g. being a power semiconductor chip. The optional first spacer element 8 is getting in touch with a top surface of the package body 9 and defines a distance in the vertical direction of the connection board 4 to the package body 9. Exemplarily, the optional first spacer element 8 is arranged in a blind recess of the package body 9, advantageously for improved location and fixation. Exemplarily, any kind of terminals 7, particularly of upper and lower part thereof, is possible for the interconnection between the connection board 4 and the recesses 10, like standard pin terminals, press fit terminals, and / or spring - loaded pins. P2024, 0874 WO E / P240116W001 December 11, 2024

[0136] - 24 -

[0137] The terminal block 1 according to the exemplary embodiment of Figure 2 further comprises an intermediate board 5, wherein the intermediate board 5 has a main extension plane extending parallel to the main extension plane of the connection board 4.

[0138] The intermediate board 5 comprises an opening 21, wherein one of the terminals 7 extends through the opening 21 in the vertical direction, particular without contact with the intermediate board 5.

[0139] One of the terminals 7 comprises a first partial terminal 18 electrically connected to a respective first connection region 6 and to a first auxiliary connection region 16 of the intermediate board 5. Further, the first partial terminal 18 extends perpendicular to the main extension plane of the connection board 4 and between the connection board 4 and the intermediate board 5 in the vertical direction.

[0140] The terminal 7 comprising the first partial terminal 18 comprises a second partial terminal 19 electrically connected to a respective second auxiliary connection region 17 of the intermediate board 5. Further, the at least one second partial terminal 19 extends perpendicular to the main extension plane of the connection board 4 and extends from the intermediate board 5 in a direction facing away from the connection board 4, e.g. towards the mounting portion. An intermediate connection 20 extending parallel to the main extension plane of the intermediate board 5 electrically connects the first partial terminal 18 and the second partial terminal 19. P2024, 0874 WO E / P240116W001 December 11, 2024

[0141] 25

[0142] Advantageously, lateral positions of the first connection region 6 and the second connection region 11 can be spaced apart in lateral directions due to the intermediate connection 20. Particularly, the intermediate board 5 is a further connection board 4 being, for example, a further printed circuit board according to this exemplary embodiment of Figure 2.

[0143] The terminal block 1 according to the exemplary embodiment of Figure 3 comprises a second spacer element 22 and a third spacer element 23. Each spacer element extends approximately perpendicular to the main extension plane, i. e. in the vertical direction.

[0144] The second spacer element 22 is connected to the connection board 4 and the intermediate board 5 and extends between the connection board 4 and the intermediate board 5 in the vertical direction. The third spacer element 23 is connected to the intermediate board 5 and extends from the intermediate board 5 in a direction facing away from the connection board 4, e.g. towards the mounting portion.

[0145] Exemplarily, the terminals 7 can have locally thicker portions or local undercuts for an improved fixation within the terminal block 1, particularly with the connection board 4, the intermediate board 5, the mounting portion and / or package body 9. In particular, the intermediate part comprises an intermediate connection structure, wherein the intermediate connection structure can have a width which is larger or smaller than a further width of an adjacent part of the terminal 7. For example, the intermediate connection structure can have an intermediate cut-out. P2024, 0874 WO E / P240116W001 December 11, 2024

[0146] - 26 -

[0147] The spacer elements have, for example, no electrical functionality, which advantageously provides mechanical support, improved alignment and / or positioning, between the package body 9 and the terminal block 1.

[0148] Exemplarily, according to the exemplary embodiment of Figure 3, the intermediate board 5 is formed of a thermoplastic or thermosetting resin by an injection or a transfer molding process.

[0149] The system 3 according to Figure 4 comprises the power devices 2 each corresponding to the assembled power device assembly according to Figure 1 and assembled to a common terminal block. A simple configuration of the common terminal block is depicted in Figure 4 with a common connection board 4 arranged on a mounting element 24. The mounting element 24 is, in particular, a cooler comprising, for example, a channel through which a cooling fluid can flow. The channel is connected to an inlet port and an outlet port. Each power device 2 comprising at least one semiconductor chip and defined by one package body 9 is connected to a common connection board 4.

[0150] The connection board 4 of the terminal block 1 is connected to the mounting element 24 by connectors 25, e.g. providing a common terminal block. In particular, the connectors 25 provide a fixation of the connection board 4 to the mounting element 24, such that the connection board 4 is located above the mounting element 24 in the vertical direction.

[0151] The system 3 according to Figure 5 comprises the power devices 2 with a common terminal block feature wise corresponding to the terminal block 1 assembled in the power P2024, 0874 WO E / P240116W001 December 11, 2024

[0152] 27

[0153] device assembly according to Figure 3, which are arranged on a mounting element 24.

[0154] The intermediate connection board 4 is connected to the mounting element 24 by a further connector 26. Each power device 2comprising at least one semiconductor chip and defined by one package body 9 is connected to a common intermediate connection board 4.

[0155] In contrast to Figure 5, the system 3 according to Figure 6 comprises several individual intermediate connection boards 4, each associated with one power device 2 comprising at least one semiconductor chip and defined by one package body 9, whereas a common connection board 4 is provided.

[0156] The exemplary embodiments, in particular features of the exemplary embodiments, of the Figures can be combined with one another. P2024, 0874 WO E / P240116W001 December 11, 2024

[0157] 28

[0158] Reference Signs

[0159] 1 terminal block

[0160] 2 power device

[0161] 3 system

[0162] 4 connection board

[0163] 5 intermediate board

[0164] 6 first connection region

[0165] 7 terminal

[0166] 8 first spacer element

[0167] 9 package body

[0168] 10 recess

[0169] 11 second connection region

[0170] 12 circuit metallization layer

[0171] 13 insulating layer

[0172] 14 first connection element

[0173] 15 second connection element

[0174] 16 first auxiliary connection region 17 second auxiliary connection region 18 first partial terminal

[0175] 19 second partial terminal

[0176] 20 intermediate connection

[0177] 21 opening

[0178] 22 second spacer element

[0179] 23 third spacer element

[0180] 24 mounting element

[0181] 25 connector

[0182] 26 further connector

Claims

P2024, 0874 WO E / P240116W001 December 11, 2024- 29 -Claims1. Terminal block (1) comprising- a connection board (4) with at least one first connection region ( 6 ), and- at least one terminal (7) electrically connected to the at least one first connection region (6), wherein- the connection board (4) extends in a main extension plane, - the at least one terminal (7) extends perpendicular to the main extension plane,- the terminal block (1) is prefabricated with the at least one terminal (7) to be attached to and aligned with a package body (9 ) of a power device (2) and / or a mounting portion of the power device (2), and- the at least one terminal (7) is arranged in the main extension plane for alignment with the package body (9 ) and electrical connection with the power device (2).

2. Terminal block (1) according to claim 1, further comprising- a first spacer element (8) extending perpendicular to the main extension plane, wherein- the first spacer element (8) is connected to the connection board (4 ).

3. Terminal block (1) according to any one of claims 1 or 2, wherein- the at least one terminal (7) has an upper connection structure for establishing the connection to the connection board (4), and / or- the at least one terminal (7) has a lower connection structure opposite the upper connection structure.P2024, 0874 WO E / P240116W001 December 11, 20244. Terminal block (1) according to any one of claims 1 to 3, wherein- the at least one terminal (7) is connected to the first connection region (6) by a first connection element (14).

5. Terminal block (1) according to any one of claims 1 to 4, further comprising- an intermediate board (5), in particular with at least one opening (21), wherein- the intermediate board (5) has a main extension plane extending parallel to the main extension plane of the connection board (4).

6. Terminal block (1) according to claim 5, wherein- the at least one terminal (7) comprises at least one first partial terminal (18) electrically connected to the first connection region (6) and to a first auxiliary connection region (16) of the intermediate board (5), wherein- the at least one first partial terminal (18) extends perpendicular to the main extension plane of the connection board (4) and between the connection board (4) and the intermediate board (5) in a vertical direction, and / or- the at least one terminal (7) further comprises at least one second partial terminal (19 ) electrically connected to a second auxiliary connection region (17) of the intermediate board (5), wherein- the at least one second partial terminal (19 ) extends perpendicular to the main extension plane of the connection board (4) and extends from the intermediate board ( 5) in a direction facing away from the connection board (4), and / or - the at least one first partial terminal (18) and the at least one second partial terminal (19 ) are spaced apart from one another in lateral directions.P2024,0874 WO E / P240116WO01 December 11, 20247. Terminal block (1) according to claim 6, wherein- the intermediate board (5) comprises an intermediate connection (20) extending parallel to the main extension plane of the intermediate board (5), and- the intermediate connection (20) electrically connects the at least one first partial terminal (18) and the at least one second partial terminal (19 ).

8. Terminal block (1) according to any one of claims 5 to 7, wherein- the intermediate board (5) is formed of an auxiliary connection board (4), or- the intermediate board (5) is formed of a molded block.

9. Terminal block (1) according to claim 2 and any one of claims 5 to 8, wherein- the intermediate board (5) has at least one further opening, and- the at least one spacer extends through the at least one further opening.

10. Terminal block (1) according to any one of claims 5 to 9, further comprising- a second spacer element (22) extending perpendicular to the main extension plane, wherein- the second spacer element (22) is connected to the connection board (4) and the intermediate board (5) and extends between the connection board (4) and the intermediate board (5) in the vertical direction, and / or the terminal block (1) further comprising- a third spacer element (23 ) extending perpendicular to the main extension plane, and / orP2024,0874 WO E / P240116WO01 December 11, 2024- 32 -- the third spacer element (23 ) being connected to the intermediate board (5) and extending from the intermediate board (5) in a direction facing away from the connection board (4 ).

11. Terminal block (1) according to any one of claims 5 to 10, wherein- the at least one terminal (7) has an intermediate part located in the opening (21), and- the intermediate part comprises an intermediate connection structure.

12. Terminal block (1) according to claim 11, wherein- the intermediate connection structure has a width which is larger and / or smaller than a width of an upper part and / or a lower part of the at least one terminal (7).

13. Terminal block (1) according to any one of claims 1 to 12, wherein- the at least one terminal (7) has the form of a pin, and / or - the connection board (4) is formed of a printed circuit board.

14. Power device assembly comprising- at least one power device (2), comprising at least one power semiconductor chip arranged on a mounting portion, - a package body (9 ) for the at least one power device (2), with at least one recess (10) exposing at least one second connection region (11), and- the terminal block (1) according to any one of claims 1 to 12, wherein- the terminal block (1) is arranged on the package body (9 ),P2024,0874 WO E / P240116WO01 December 11, 2024- the at least one terminal (7) is arranged in the at least one recess (10) of the package body (9 ), and- the at least one terminal (7) is electrically connected to the at least one second connection region (11).

15. Power device assembly according to claim 14, wherein - the mounting portion comprises a circuit metallization layer (12) and an insulating layer (13 ), and- a partial region of the circuit metallization layer (12) is exposed by the at least one recess (10) of the package body (9 ) for forming the second connection region (11), and / or - a further partial region of the at least one power semiconductor chip is exposed by the at least one recess (10) of the package body (9 ) for forming the second connection region (11).

16. Power device assembly according to claim 15, wherein - the at least one terminal is connected to the second connection region (11) by a second connection element (15), and- the second connection element (15) is at least one of an elastic connection, a solder connection or a welded connection.

17. System (3 ) comprising- a power device assembly according to any one of claims 14 to 16, and- a mounting element (24) on which the power device (2) is arranged, wherein- the connection board (4) of the terminal block (1 ) is connected to the mounting element (24) by a connector (25), and / orP2024,0874 WO E / P240116WO01 December 11, 2024- the intermediate connection board (4) according to any one of claims 5 to 12 of the terminal block (1) is connected to the mounting element (24) by a further connector (26).

18. System (3 ) according to claim 17, comprising- a plurality of power devices (2), wherein- at least some of the power devices (2) are connected to a common connection board (4), and / or- at least some of the power devices (2) are connected to a common intermediate connection board (4).

19. Method for producing a terminal block (1), comprising: - providing a connection board (4) with at least one first connection region (6),- providing at least one terminal (7), and- electrically connecting the at least one terminal (7) to the at least one first connection region (6), wherein- the connection board (4) extends in a main extension plane in lateral directions, and- the at least one terminal (7) extends perpendicular to the main extension plane in the vertical direction.

20. Method for producing a power device assembly, comprising:- providing a power device (2), comprising- at least one power semiconductor chip arranged on a mounting portion,- a package body (9 ) for the at least one power semiconductor chip, with at least one recess (10) exposing at least one second connection region (11), - providing- the terminal block (1) produced according to claim 19, whereinP2024,0874 WO E / P240116WO01 December 11, 2024- the terminal block (1) is arranged on the package body (9 ) such that- the at least one terminal (7) is arranged in the at least one recess (10) of the package body (9 ), and- the at least one terminal (7) is electrically connected to the at least one second connection region (11).

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