Method of altering an object

Abstract

A method of altering an object, the method includes: providing an object wherein at least part of the object is electrically conductive; dispensing a predetermined amount of solution from a dispensing device onto a selected area on the electrically conductive part of the object, wherein the solution is an electrolytic solution; forming an electrical circuit between a power supply, at least part of the dispensing device, the dispensed solution, and the electrically conductive part of the object; and applying current via the electrical circuit to the dispensed solution to deposit material on the object or strip material from the object.

Description

METHOD OF ALTERING AN OBJECTCROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority of US application 63 / 729,915 which was filed on 9 December 2024 and which is incorporated herein in its entirety by reference.FIELD

[0002] The present disclosure relates to a method and a dispensing device for altering an object. The object may be, for instance, a support structure for holding an item, such as a wafer, substrate or patterning device in a lithographic apparatus.BACKGROUND

[0003] A lithographic apparatus is a machine constructed to apply a desired pattern onto a substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may, for example, project a pattern at a patterning device (e.g., a mask or reticle) onto a layer of radiation-sensitive material (resist) provided on a substrate.

[0004] As semiconductor manufacturing processes continue to advance, the dimensions of circuit elements have continually been reduced while the amount of functional elements, such as transistors, per device has been steadily increasing over decades, following a trend commonly referred to as “Moore's law.” To keep up with Moore's law the semiconductor industry is chasing technologies that enable to create increasingly smaller features. To project a pattern on a substrate a lithographic apparatus may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of features that are patterned on the substrate. Typical wavelengths currently in use are 365 nm (i- line), 248 nm (KrF), 193 nm (ArF), and 13.5 nm (EUV). A lithographic apparatus, which uses extreme ultraviolet (EUV) radiation, having a wavelength within a range of 4 nm to 20 nm, for example 6.7 nm or 13.5 nm, may be used to form smaller features on a substrate than a lithographic apparatus which uses, for example, radiation with a wavelength of 193 nm.

[0005] At such short wavelengths, precise positioning of the patterning device and / or substrate within the lithographic apparatus is a significant issue.

[0006] Such lithographic apparatuses may be provided with one or more support structures to clamp the patterning device and / or substrate to a support, such as a mask table or a wafer table respectively. The support structure may be, for example, a mechanical clamp, a vacuum clamp, or an electrostatic clamp. Electrostatic clamps may be particularly suited to operating at EUV wavelengths, since regions of an EUV lithographic apparatus operate under near vacuum conditions. Near vacuum herein may refer to pressures in the range of 5 kPa and below, or in the range of 1 to 10 Pa.SUMMARY

[0007] Some electrostatic wafer clamps have a dielectric surface that includes (equally spaced) metallic lines, known in the art as, e.g., “Manhattan lines,” which electrically conductively connect protrusions or “burls” defining a plane for holding the patterning device and / or substrate.

[0008] Clamps with broken lines can impact flatness (e.g., through effects like tribocharging and electron emissions). Other defects can occur on a surface of a clamp or other object used for holding an item which may affect the flatness of the held item. Thus, it is preferable that there are no isolated lines or other defects on such support structures, and this may even be required to meet desired system performance requirements.

[0009] Functionally testing that there are no isolated lines (or other defects) generally involves testing the clamp when assembled. However, rework at this point in the process is slow and time consuming.

[0010] Thus, although it may be possible to test for and repair isolated lines (or other defects) as needed, the process for doing so can be very time consuming and costly.

[0011] It is an object of at least one embodiment to obviate or at least mitigate at least one of the above identified shortcomings of the art.

[0012] According to an embodiment of the present technology, a method of altering an object is provided. The method includes: providing an object wherein at least part of the object is electrically conductive; dispensing a predetermined amount of solution from a dispensing device onto a selected area on the electrically conductive part of the object, wherein the solution is an electrolytic solution; forming an electrical circuit between a power supply, at least part of the dispensing device, the dispensed solution, and the electrically conductive part of the object; and applying current via the electrical circuit to the dispensed solution to deposit material on the object or to strip material from the object.

[0013] According to another embodiment of the present technology, a dispensing device for altering an object, wherein at least part of the object is electrically conductive, is provided. The dispensing device includes: a reservoir configured to hold solution, the dispensing device being configured to dispense a predetermined amount of solution from the reservoir onto a selected area on the electrically conductive part of the object, wherein the solution is an electrolytic solution; an actuator for controlling the amount of solution dispensed via an aperture defined by the dispensing device, the aperture being in fluid communication with the reservoir; and an electrical conductor configured to apply a current from a power supply to the dispensed solution on the object.

[0014] According to another embodiment of the present technology, a system that includes the dispensing device described herein is provided. The system further includes at least one selected from: the power supply; an ammeter configured to measure the current of the electrical circuit, wherein the system is configured to evaluate the alteration of the object based on the measured current; a positioning device configured to support the dispensing device and to move the dispensing device to a location to dispense the solution onto the selected area; and / or an imaging device configured to take an image ofthe object for use in detecting a defect on the object for repair. In some embodiments, the system is configured to perform the method described herein.BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Embodiments will now be described, by way of example only, with reference to the accompanying schematic drawings, in which:- Figure 1 depicts a lithographic system comprising a lithographic apparatus and a radiation source;- Figure 2 depicts a perspective view of a portion of an electrostatic clamp having a plurality of conductive burls connected by a line;- Figure 3 depicts a top view of a burl and a line;- Figures 4 to 9 schematically depict cross sections of a support structure during steps of an embodiment of a method of refurbishing an area of a line using a dispensing device; and- Figure 10 schematically depicts a cross section during neutralizing and / or cleaning the refurbished area as in Figure 9, using a variation of the dispensing device.DETAILED DESCRIPTION

[0016] Figure 1 shows a lithographic system that includes a radiation source SO and a lithographic apparatus LA. The radiation source SO is configured to generate an EUV radiation beam B and to supply the EUV radiation beam B to the lithographic apparatus LA. The lithographic apparatus LA includes an illumination system IL, a patterning device table MT (otherwise referred to as a mask table) configured to support a patterning device MA (e.g., a mask), a projection system PS, and a substrate table WT configured to support a substrate W.

[0017] The illumination system IL is configured to condition the EUV radiation beam B before the EUV radiation beam B is incident upon the patterning device MA. Thereto, the illumination system IL may include a facetted field mirror device 10 and a facetted pupil mirror device 11. The faceted field mirror device 10 and faceted pupil mirror device 11 together provide the EUV radiation beam B with a desired cross-sectional shape and a desired intensity distribution. The illumination system IL may include other mirrors or devices in addition to, or instead of, the faceted field mirror device 10 and faceted pupil mirror device 11.

[0018] After being thus conditioned, the EUV radiation beam B interacts with the patterning device MA. As a result of this interaction, a patterned EUV radiation beam B’ is generated. The projection system PS is configured to project the patterned EUV radiation beam B’ onto the substrate W. For that purpose, the projection system PS may include a plurality of mirrors 13, 14 which are configured to project the patterned EUV radiation beam B’ onto the substrate W held by the substrate table WT. The projection system PS may apply a reduction factor to the patterned EUV radiation beam B’, thus forming an image with features that are smaller than corresponding features on the patterning deviceMA. For example, a reduction factor of 4 or 8 may be applied. Although the projection system PS is illustrated as having only two mirrors 13, 14 in Figure 1, the projection system PS may include a different number of mirrors (e.g., six or eight mirrors).

[0019] The substrate W may include previously formed patterns. Where this is the case, the lithographic apparatus LA aligns the image, formed by the patterned EUV radiation beam B’, with a pattern previously formed on the substrate W.

[0020] A relative vacuum, i.e., a small amount of gas (e.g., hydrogen) at a pressure well below atmospheric pressure, may be provided in the radiation source SO, in the illumination system IL, and / or in the projection system PS.

[0021] The radiation source SO shown in Figure 1 is, for example, of a type which may be referred to as a laser produced plasma (LPP) source. A laser system 1, which may, for example, include a CO2 laser, is arranged to deposit energy via a laser beam 2 into a fuel, such as tin (Sn) which is provided from, e.g., a fuel emitter 3. Although tin is referred to in the following description, any suitable fuel may be used. The fuel may, for example, be in liquid form, and may, for example, be a metal or alloy. The fuel emitter 3 may include a nozzle configured to direct tin, e.g., in the form of droplets, along a trajectory towards a plasma formation region 4. The laser beam 2 is incident upon the tin at the plasma formation region 4. The deposition of laser energy into the tin creates a tin plasma 7 at the plasma formation region 4. Radiation, including EUV radiation, is emitted from the plasma 7 during de-excitation and recombination of electrons with ions of the plasma.

[0022] The EUV radiation from the plasma is collected and focused by a collector 5. Collector 5 includes, for example, a near-normal incidence radiation collector 5 (sometimes referred to more generally as a normal-incidence radiation collector). The collector 5 may have a multilayer mirror structure which is arranged to reflect EUV radiation (e.g., EUV radiation having a desired wavelength such as 13.5 nm). The collector 5 may have an ellipsoidal configuration, having two focal points. A first one of the focal points may be at the plasma formation region 4, and a second one of the focal points may be at an intermediate focus 6, as discussed below.

[0023] The laser system 1 may be spatially separated from the radiation source SO. Where this is the case, the laser beam 2 may be passed from the laser system 1 to the radiation source SO with the aid of a beam delivery system (not shown) that includes, for example, suitable directing mirrors and / or a beam expander, and / or other optics. The laser system 1, the radiation source SO and the beam delivery system may together be considered to be a radiation system.

[0024] Radiation that is reflected by the collector 5 forms the EUV radiation beam B. The EUV radiation beam B is focused at intermediate focus 6 to form an image at the intermediate focus 6 of the plasma present at the plasma formation region 4. The image at the intermediate focus 6 acts as a virtual radiation source for the illumination system IL. The radiation source SO is arranged such that the intermediate focus 6 is located at or near to an opening 8 in an enclosing structure 9 of the radiation source SO.

[0025] Although Figure 1 depicts the radiation source SO as a laser produced plasma (LPP) source, any suitable source such as a discharge produced plasma (DPP) source or a free electron laser (FEL) may be used to generate EUV radiation.

[0026] A controller 150 may be provided as shown in Figure 1. The controller 150 may be electronically connected to components of the lithographic apparatus LA. The controller 150 may be a processor (such as a computer) configured to control the lithographic apparatus LA. Thus, the controller 150 may generate various control signals to govern operations of the lithographic apparatus LA. The controller 150 may also include processing circuitry configured to execute data, signal, and image processing functions, for example, on the data set e.g., embodied as signals such as detection signals. The controller 150 may thus include processing circuitry configured to execute processing functions on signal, image, and / or other data produced in the lithographic apparatus LA. While the controller 150 is shown in Figure 1 as being outside of the structure, it is appreciated that the controller 150 may be part of the structure. The controller 150 may be located in one of the components of the lithographic apparatus LA or it may be distributed over at least two of the components.

[0027] With reference to Figure 2, the substrate table WT may include a clamp 200, also known as a chuck, configured to clamp the substrate W to the substrate support WT. The main body of the electrostatic clamp generally corresponds in shape and size to the substrate W. At least on an upper surface 205 of the clamp, e.g., a surface which in use faces the substrate W, the clamp 200 has projections 210, 215, also referred to as burls. The burls extend from the upper surface 205 of the clamp to define a plane in which the substrate W is held.

[0028] It will be appreciated that the term “upper” is used in the context of, for example, lithographic apparatus LA of Figure 1. Herein the electrostatic clamp 200 is depicted in a particular orientation. It will be understood that the disclosed clamp may be disposed in various orientations, and therefore the term “upper” should be taken in the context of a particular described use case.

[0029] In an embodiment, there can be many hundreds, thousands, or tens of thousands of burls distributed across a clamp of a certain cross-section width (e.g., diameter), e.g., 200 mm, 300 mm, or 450 mm. Tips of the burls generally have a small area, e.g., less than 1 mm2, such that the total area of all of the burls extending from the upper surface of the electrostatic clamp 245 is less than about 10% of the total area of the total surface area of the upper surface. Because of the burl arrangement, there is a high probability that any particle that might be on the surface of the substrate W, electrostatic clamp 200, or substrate support WT will fall between burls and will not therefore result in a deformation of the substrate or substrate holder. The burl arrangement, which may form a pattern, can be regular or can vary as desired to provide appropriate distribution of force on the substrate W and substrate support WT.

[0030] Figure 2 depicts a perspective view of a portion of a dielectric member 245 of the electrostatic clamp 200. The dielectric member 245 has a surface 205, e.g., a surface facing the substrate W in use.

[0031] The depicted portion shows a first burl 210 and a second burl 215. Each burl 210, 215 may include an electrically conductive layer or coating. The burls 210, 215 are coupled to an electrically conductive element 220. The dielectric surface 205 of the electrostatic clamp 200 may include a plurality of such electrically conductive elements 220. The conductive elements or lines 220 may be laid out in a generally repetitive and / or regular pattern, and may be referred to as “Manhattan lines.” The surface of the burls touching the object (e.g., wafer) may have the same voltage or may be grounded.

[0032] The electrically conductive element 220 may be arranged on or embedded in a dielectric surface 205 of the electrostatic clamp 200. The electrically conductive element 220 may be raised, e.g., not flush, relative to the dielectric surface 205 of the electrostatic clamp 200. Alternatively, the conductive element 220 may be embedded in the surface 205 (not shown). In some embodiments, the electrically conductive element 220 is arranged such that it is in electrical communication with the proximal end of the burls 210, 215, as shown in Figures 2 and 3. In some embodiments, the electrically conductive element 220 is arranged such that it is in electrical communication with the sides and distal end of the burls 210, as shown in Figures 4-10.

[0033] In an embodiment, the electrostatic clamp 200 depicted in Figure 2 may be a clamp configurable to electrostatically clamp a semiconductor substrate or wafer in at least one selected from: a lithographic projection apparatus, a substrate handling apparatus, a substrate measurement apparatus and / or a substrate materials processing apparatus (e.g., a deposition tool, a resist application tool, a planarization tool, etc.). Additionally or alternatively, the electrostatic clamp 200 depicted in Figure 2 may be a clamp configurable to electrostatically clamp a lithographic projection reticle or reticle blank (i.e., a reticle without a pattern, e.g., for use in testing) in at least one selected from: a lithographic projection apparatus, a reticle handling apparatus, a reticle measurement apparatus and / or a reticle manufacturing apparatus. The reticle may otherwise be referred to as a patterning device.

[0034] Although the burls 210, 215 are depicted as cylindrical in Figures 2 and 3, it will be appreciated that the burls 210, 215 can have other shapes suitable for supporting an item, e.g., the substrate W or a patterning device MA. In some embodiments, the burls 210, 215 have the same shape and dimensions throughout their height. In other embodiments, the burls 210, 215 may be tapered. The burls 210, 215 may also vary in dimensions. For example, burls in different embodiments may project a distance of approximately 1 micrometer to approximately 5 millimeters.

[0035] Although only two burls 210, 215 are shown in Figure 2, it will be appreciated that the electrostatic clamp 200 map include many more burls, such as hundreds, thousands, or even tens of thousands of burls. Together, the burls define a plane for supporting an item such as the substrate W or patterning device MA.

[0036] Furthermore, for purposes of example only, the electrically conductive element 220 is depicted as being straight, e.g., the burls 210, are arranged on a linear path defined by the straight electrically conductive element 220. In an example embodiment, the electrostatic clamp includes a plurality of straight electrically conductive elements 220 arranged in parallel or in another pattern,wherein the burls are also arranged in straight lines. In other embodiments falling within the scope of the present technology, the electrically conductive elements 220 may have different shapes or arrangements, such as curves, circles, or spirals. In some embodiments, the electrically conductive elements 220 may be arranged to radially extend from a periphery and / or center of the dielectric surface 205.

[0037] In some embodiments, the burls may be arranged in concentric rings on the surface 205 of the dielectric member 245. A plurality of electrically conductive elements may extend between and connect each of the plurality of burls arranged in the rings.

[0038] As described above, the electrically conductive element 220 may be arranged in a trench (not shown) formed on the surface 205 of the dielectric member 245. The trench may be formed with sloping sidewalls. For example, in some embodiments an angle of the slope relative to a plane defined by the surface 205 of the dielectric member 245 may be between 30 and 40 degrees. Such sloping sidewalls may be formed by a process of wet-etching.

[0039] Defects on clamps for holding a substrate W (or another item) can be time intensive and costly to repair. An aim of at least one embodiment of the present technology is to mitigate or avoid at least some of these issues. As described further below, some embodiments are directed to repairing line breaks on assembled wafer clamps (and / or other defects on a surface of an object) by using local electroplating / electrostripping and / or automation of the repair process.

[0040] Referring to Figures 4 to 9, an embodiment of a method of repairing a clamp including at least one electrically conductive element 220 according to the present technology may include the following steps. Specifically, the embodiment described in relation to Figures 4 to 9 relates to locally electrodepositing material to repair a defect / hole on such a clamp, and more particularly a break in the electrically conductive element 220. Of course, similar techniques can be used to strip material.

[0041] In Figure 4, a defect 300 on a surface of the electrostatic clamp 200 can be seen. The defect 300 is a break in one of the electrically conductive elements 220 which can result in at least part of the electrically conductive element 220 being isolated. Breaks in the electrically conductive element 220 means that burls (e.g., 210) are no longer equipotential. As described above, such a defect can affect the flatness of an item, such as a substrate, held by the electrostatic clamp 200.

[0042] Figure 4 shows a first step of a method of altering an object, in this case, the electrostatic clamp 200, e.g., for supporting a substrate W. The first step includes providing the electrostatic clamp 200 wherein at least part of the clamp 200 is electrically conductive. The electrically conductive part corresponds to the electrically conductive element 220.

[0043] Figure 5 shows a second step of dispensing a predetermined amount of solution from a dispensing device 100 onto a selected area on the electrically conductive element 220. In an embodiment, the solution is referred to as repair solution (which repair might be deposition of material and / or stripping of material). The portion of the clamp 200 on which the solution is provided includes the defect 300 to be repaired. In other words, the method includes locally providing solution from thedispensing device 100 onto a selected area so that a repair can be made at that location. Thus, the solution can be dispensed from the dispensing device 100 into a defect / break in the electrically conductive element 220. As discussed further below, the dispensing of the solution can be controlled so as to maintain the solution locally.

[0044] The method includes forming an electrical circuit between a power supply 106, at least part of the dispensing device 100, the dispensed solution 70, and the electrically conductive element 220. This is possible as the dispensed solution 70 is provided on a portion of the electrically conductive element 220. The dispensed solution 70 provides part of the electrical circuit. The dispensing device 100 includes an electrical conductor 104 which forms part of the electrical circuit.

[0045] The method includes applying current via the electrical circuit to the dispensed solution 70 to deposit material 80 on the clamp 200. The current can be applied by the dispensing device 100 via the electrical conductor 104. The clamp 200 is altered as the material 80 is formed. The material 80 may be formed in a layer and / or coating on the surface of the clamp 200. The material 80 will grow on the surface of the electrically conductive element 220 of the clamp 200. As shown in Figure 6, as the deposited material 80 grows, the layer is deposited over the defect 300 and can result in the break in the electrically conductive element 220 being bridged by the material 80 so that the defect 300 is repaired.

[0046] By using an existing electrically conductive part of the object (i.e., the electrically conductive element 220), a circuit can be formed for applying the current for the plating process to repair the defect 300. In this way, the method can be used to locally plate the gap in the electrically conductive element 220 to repair the clamp 200.

[0047] The method is beneficial in that:- only the location of the defect 300 needs to be known (rather than requiring additional information relating to the angle / path of the electrically conductive element 220 as might be needed for other methods of repair);- very low volumes of chemicals are used as a solution is provided only on a selected area, i.e., for locally depositing (or stripping), which can reduce / minimize chemical volumes involved and reduce impact to other areas on the clamp 200; and- it allows for local repair of defects without having to strip and re-coat the whole clamp, which would use additional material and take significantly longer.

[0048] As the solution is dispensed onto the electrically conductive element 220, the circuit can be formed between that part of the clamp 200, the dispensed droplet 70, and the dispensing device 100. The internal conductivity of the clamp 200, and more particularly of the electrically conductive part (e.g., the electrically conductive member 220), allows the cathodic connection to be made far away from the defect 300 / point of repair. This means that the circuit can be formed while avoiding physical contact, except for the solution, on critical areas of the clamp 200. The only physical contact with the selected area may be the dispensed solution 70, as shown in Figures 5 and 6. Electrical contact between the clamp 200 and the power supply 106 can be made via another part of the clamp 200, preferablydistanced from the area of the clamp 200 being repaired. This may include contacting, for example, an end 220A of the electrically conductive element 220, as shown in Figure 6. Thus, the electrical circuit can be formed by physically contacting a non-critical surface of the object.

[0049] In an embodiment, the solution is a liquid solution. In an embodiment, the solution is an electrolytic solution. In an embodiment, the electrolytic solution is a liquid solution. In the example embodiment shown in the figures, in which the defect 300 is a gap on which material is to be provided, the solution is an electro-deposition solution. Thus, current can be applied via the dispensed solution to deposit the material on the selected area on the clamp 200.

[0050] In some embodiments, the electrically conductive element 220, and particularly the selected area of the electrically conductive element 220 onto which the solution is dispensed, includes chromium. However, the present technology contemplates embodiments in which the electrically conductive element 220 is formed of other materials.

[0051] In an embodiment, the deposited material comes from the solution. For example, an electrodeposition solution includes chromium ions which forms a layer of chromium (i.e., the material 80 referred to above) on the surface as shown in Figure 6. The solution may include a trivalent chromium solution, e.g., chromium chloride or chromium sulfate, or hexavalent chromium solution, e.g., chromic acid. Although trivalent chromium solutions have lower electrodeposition deficiency than industrystandard hexavalent chromium solutions, trivalent chromium solutions may be preferable to avoid toxicity and legal regulations associated with use of hexavalent chromium solutions.

[0052] The deposited material 80 may or may not be the same as the material of the object, and particularly of the electrically conductive element part. For example only, the electrically conductive element 220 may be formed of chromium and the solution may include chromium to form a layer of the same material at the location of the defect 300. However, it is not necessary for the deposited material 80 to be the same material as the electrically conductive element 220 (and / or the object). The deposited material 80 may differ from the material of the electrically conductive element 220 in that it has different chrome-nitrogen stoichiometry, etc. The deposited material 80 could include any appropriate material, such as nickel, copper, titanium, or cobalt (from citrate salts). In other words, the solution may include any of these electrically conductive materials for deposition.

[0053] In the embodiment shown in the figures, the deposited material comes from the solution rather than from the anode. As an alternative, some embodiments contemplate using a replaceable anode donor (e.g., a replaceable chrome donor). Although there may be challenges with dissolution rate not being fast enough to replace the material (e.g., chrome) in the solution, as used in the present technology it is unlikely that the solution will be depleted significantly given that the volume / area ratio is favorable at small scales.

[0054] The dispensing device 100 includes a reservoir 101 configured to hold the solution. The reservoir 101 may be formed by a housing 105 in which the solution is held. The dispensing device 100 is configured to dispense a predetermined amount of solution from the reservoir 101 onto the clamp200, and particularly, onto the selected area on the electrically conductive element 220. The dispensing device 100 includes an aperture 103 through which the solution is dispensed, i.e., so that the solution is external to the dispensing device 100. The aperture 103 is in fluid communication with the reservoir 101. In other words, the solution can flow from the reservoir 101 within the dispensing device 100 to the aperture 103. The aperture 103 may be defined by an edge of the reservoir 101 (i.e., at the edge of the housing 105) as shown in at least Figures 5 and 6.

[0055] The predetermined amount of solution may be a volume selected by a user. For example only, the predetermined amount may be approximately 10 pL to 500 pL, 30 pL to 350 pL, or 50 pL to 150 pL. The predetermined amount may be selected automatically. The predetermined amount may be selected based on the size of the defect being repaired. The predetermined amount may be selected to completely encapsulate a defect 300, i.e., to fully cover a surface of the defect 300 being repaired. For example, for a larger defect (e.g., a larger break in an electrically conductive element 220), a larger amount of solution may be provided to ensure that the defect is fully covered by the dispensed solution 70. The predetermined amount may vary based on the concentration of solution. The predetermined amount may be a set amount selected so as to avoid too much solution being present on the surface of the object. If the deposition is carried out using the set amount and it is determined that the further repair is required, the process could be repeated to deposit additional material.

[0056] The dispensing device 100 includes an actuator 102 configured to control the amount of solution dispensed from the dispensing device 100. Thus, the actuator 102 may be configured to dispense the predetermined volume of solution from the dispensing device 102. The actuator 102 may include any mechanism that can move the solution from the reservoir 101 through the aperture 103. The actuator 102 may be automatically controlled to dispense the predetermined amount of solution. For example, the controller 150 may be configured to control the actuator 102 to dispense the solution. Automatic operation of the actuator 102 may be particularly beneficial in that it allows repairs to be made in an automated way. This may be useful in providing a scalable solution which could allow multiple repairs on an object to be fixed.

[0057] The dispensing device may be configured to extract fluid, such as the dispensed solution, from the selected area. The dispensing device 100 may be configured to withdraw the solution from the surface of the clamp 200, for example, if too much solution has been erroneously dispensed and / or when the alteration of the clamp 200 is determined to be complete.

[0058] As shown in Figures 5 to 9, the dispensing device 100 may be a pipetting device. In this case, the actuator 102 may control a volume of the dispensing device in fluid communication with the reservoir 101 (or the volume of the reservoir 101 itself) so that as the volume is decreased, solution is dispensed through the aperture 103 (i.e., as shown in Figure 5). The volume may also be increased to draw solution in through the aperture 103 into the dispensing device 100, i.e., to extract solution from the surface (as shown in Figure 7).

[0059] Alternatively, the dispensing device may be a syringe (not shown in the figures) and may include a plunger (not shown), wherein the position of the plunger can be moved towards the aperture 103 to dispense solution. The plunger may also be moved away from the aperture 103 to draw solution in through the aperture 103 into the dispensing device 100, i.e., to extract solution from the selected area.

[0060] The dispensing device 100 may thus be provided by any appropriate device. The dispensing device may otherwise be referred to as a dispenser. The dispensing device may include a pipette or pipetting machine / device. The dispensing device may include a syringe, or syringing machine / device. The dispensing device may otherwise be referred to as “Poseidon's galvanic lance.”

[0061] The dispensing device 100 may be configured to accurately control dispensing of small amounts of the solution. Dispensing the solution may include dispensing at least one individual droplet of solution. In some embodiments, only a single droplet of solution may be provided. The size of the dispensed solution may be mechanically controlled by the dispensing device. The size may be in the range of approximately 10 pL to 500 pL, 30 pL to 350 pL, or 50 pL to 150 pL. Providing a relatively small volume means that the deposited solution can stay localized and well-controlled (i.e., is preferably kept in place by the tip of the dispensing device). If only a single droplet is provided, the size of the droplet may be the same as the predetermined amount of solution.

[0062] In some embodiments, additional volumes of solution could be provided. The size and / or number of volumes of solution (e.g., droplets) may be mechanically controlled by the dispensing device. If it is determined that the deposited volume of solution does not have enough donor ions remaining, the solution could be withdrawn into the dispensing device. For example, depletion of donor ions in the solution may be determined by a decrease in the current in the electrical circuit at the same voltage, and could be measured using ammeter 107 described further below. When the solution is withdrawn, it could mix with solution retained within the dispensing device and a further volume of liquid (e.g., droplet) could be dispensed with a greater number of donor ions for deposition.

[0063] As shown in Figure 6, the dispensed solution 70 is used to maintain electrical contact between the dispensing device 100 and the electrically conductive element 220. Thus, the position of the dispensing device 100 may be controlled to help ensure that electrical contact is provided / maintained between the dispensing device 100 and the dispensed solution 70 so that the electrical circuit can be formed. For example, a position of the dispensing device 100 may be controlled so as to maintain fluidic connection between the dispensed solution 70 and the electrical conductor 104 of the dispensing device 100. Therefore, the predetermined volume may depend on the intended position of the dispensing device 100.

[0064] The dispensing device 100 may be supported by a positioning device 140. The position of the dispensing device 100 may be controlled by the positioning device 140. The positioning device 140 may be an actuatable stage. The dispensing device may be moved to a location to dispense the solution onto the selected area (i.e., the location of the defect 300). The dispensing device 100 may be configuredto move parallel to the surface of the clamp 200 (i.e., in the X and Y directions in Figures 5-9, in which X could be left or right, and Y could be into or out of the page) and / or perpendicular to the surface of the clamp 200 (i.e., in the Z direction in Figures 5-9). In some embodiments, the controller 150 is configured to control the positioning device 140 to move the dispensing device 100. Automatic control of the positioning device 140 may be particularly beneficial in that it allows the dispensing device to be positioned in the relevant location, i.e., the location of a defect, to carry out repairs in an automated way. This may be useful in providing a scalable solution which could allow the dispensing device to be moved between multiple defects on an object so that they could be more efficiently repaired. In an embodiment, additionally or alternatively, the clamp 200 may be moved relative to the dispensing device 100 using an actuator (not shown).

[0065] The defect may be identified and / or located in any appropriate way. For example, a user may be able to identify the defect by eye or using microscopy. The user may then input the estimated size and / or location of the defect. Additionally or alternatively, the defect may be identified and / or located by an assessment or inspection tool which has detected a defect and / or identified its location. The defect may be identified and / or located by an imaging device 108, described further below.

[0066] The dispensing device 100 includes the electrical conductor 104 configured to apply a current from the power supply 106 to the dispensed solution 70 on the clamp 200. As shown in Figures 5-9, the electrical conductor may be a wire 104. In this case, at least part of the wire may be positioned in the reservoir 101. The wire 104 may extend from the reservoir 101 through the aperture 103. The wire 104 may be positioned substantially within the aperture 103 (i.e., the end of the wire may be level with the aperture 103), as shown in Figures 5-9. However, this is not a necessity.

[0067] The electrical conductor may be provided in other forms (not shown). For example, the electrical conductor may form at least part of the dispensing device defining the aperture 103. For example, the electrical conductor may include at least part of the housing 105 of the reservoir 101.

[0068] As discussed above, the dispensing device 100 may be used to withdraw the solution from the surface of the clamp 200. However, it is noted that removal of the solution may be imperfect, leaving some residue at the location of the repaired defect 300 and the surrounding area, as shown in Figure 7. The method may further include cleaning the clamp 200 of excess solution, e.g., to remove droplets of the solution shown in Figure 7. The method may include dispensing a neutralizing solution to the selected area (and preferably the surrounding area so as to reduce likelihood of remaining repair solution). The neutralizing solution may include an alkaline solution or deionized water, although any appropriate neutralizing solution may be used. The method may include dispensing a cleaning solution to the portion of the electrically conductive part. The cleaning solution may include water, isopropanol, and / or acetone, although any appropriate cleaning solution may be used. A greater amount of neutralizing and / or cleaning solution may be dispensed compared to the predetermined amount of repair solution so that the area covered by the neutralizing and / or cleaning solution is larger to reduce the likelihood of remaining repair solution on the clamp. By dispensing and removing larger and largervolumes of solution (e.g., drops), e.g., by extraction / withdrawal of the neutralizing and / or cleaning solution(s), the selected area and the surrounding area can be diluted and washed. Providing repair solution locally is beneficial in that simple cleaning can be carried out, e.g., as described above. If there were excess repair solution, it could get into internal channels and further cleaning (e.g., of the full object) might be needed but as only small volumes of the solution are used, any trace materials should be small enough to avoid impacting the product.

[0069] The dispensing device 100 shown in Figures 5-9 may be used for the cleaning the clamp 200. Thus, the dispensing device 100 may be used to dispense more than one solution. In line with the above, the dispensing device may be configured to dispense a neutralizing solution and / or a cleaning solution 75 as shown in Figure 9, i.e., using the same device. Thus, the dispensing device 100 can effectively wash the area by dispensing neutralizing and / or cleaning chemistry. This is beneficial in that cleaning of the area (and the surrounding area) which has been repaired can be automated.

[0070] The dispensing device 100 may be configured to dispense the neutralizing solution and / or the cleaning solution by replacing the repair solution. For example, the dispensing device 100 can be emptied, i.e., by dispensing / ejecting all of the repair solution. The dispensing device 100 could then be filled with a different solution, such as the neutralizing and / or cleaning solution. Thus, the different solutions could be dispensed by the same dispensing device 100.

[0071] Alternatively, the dispensing device may include an additional reservoir 101’ (with e.g., associated housing 105’ and aperture 103’) and corresponding actuator 102” as shown in Figure 10. The additional reservoir 101’ and corresponding additional actuator 102’ may include corresponding features to those described in relation to the reservoir 101 and actuator 102. The additional reservoir 101’ and corresponding actuator 102’ may be connected to the reservoir 101 and actuator 102 and may be configured to move together, e.g., may both be controlled by positioning device 140. Alternatively, the additional reservoir 101’ and corresponding actuator 102” may be controlled to move separately, e.g., by a further positioning device (not shown). Either way, the method may include positioning the reservoir 101 that includes the repair solution (which may be referred to as a first reservoir) over the defect 300, dispensing repair solution and depositing material 80 on the defect as described above in relation to Figures 5 and 6 to repair the defect, and extracting repair solution from the object as described in relation to Figure 7. The method may further include providing relative movement between the reservoirs and the clamp 200 to place the additional reservoir 101’ (which may be referred to as a second reservoir) over the repaired defect on which residue of repair residue may be found, dispensing neutralizing and / or cleaning solution from the additional reservoir as shown in Figure 10, and withdrawing the neutralizing and / or cleaning solution back into the additional reservoir 101’. Two separate additional reservoirs (not shown) may be provided, with each including one of the neutralizing or cleaning solutions which may be applied separately. In this case, relative movement between the additional reservoirs and the clamp 200 may be provided between dispensing to dispense the neutralizing solution then the cleaning solution.

[0072] It is noted that if any of the solutions are provided in different reservoirs, it may not be necessary to move the reservoirs between dispensing their respective solutions as the apertures of each of the reservoirs may be positioned close enough to the selected area to provide the solution and withdraw the solution.

[0073] The dispensing device may be part of a system, which may be referred to as a dispensing system or apparatus. The system may include the power supply 106. The current applied via the electrical circuit from the power supply 106 can be adapted to control the deposition of the material on the clamp 200. The current can be controlled by feedback loop, depending on measurement of the current. The current can be increased to increase the rate of material deposition and can be decreased to reduce the rate of material deposition.

[0074] The method may include measuring the current to estimate the amount of material deposited on the clamp 200. The system 130 may include an ammeter 107 configured to measure the current of the electrical circuit. The ammeter 107 can be provided anywhere in series on the electrical circuit. The system 130 may be configured to evaluate the alteration of the clamp 200 based on the measured current. Measurement of the current may be particularly useful as it can be indicative of the alteration of the object. Measurement of the current may be particularly useful in automation of the repairs (i.e., without total human supervision), as measurements of the current can be compared to one or more predetermined parameters to determine when the repair has been effectively carried out.

[0075] The method may include driving a further electrical current through the electrically conductive part of the object to measure the conductivity of the electrically conductive part of the object, i.e., the part of the object being repaired, to measure the conductivity. Thus, the further electrical current can be used for testing the repair. For example, the measurement could be made by a further circuit (which may be referred to as a testing circuit) which applies current to the electrically conductive part of the object on either side of the defect being repaired, i.e., across the repaired region. Variations for implementing the further circuit are shown in Figures 8A and 8B. The further circuit may be a parallel part of the same circuit which could be connected via a switch 109, for example as shown in Figure 8A, or a separate circuit as shown in Figure 8B. Either way, a current may be applied to the end 220A of the electrically conductive element 220 on the left hand side in Figures 8A and 8B and to another end 220B of the electrically conductive element 220, e.g., on the right hand side of the area of the deposited material in Figures 8A and 8B. Before this measurement, the repair solution would be substantially withdrawn from the surface into the deposition device 100. Further application of current via the electrical circuit for deposition may be prevented based on the current measured by the measurement circuit. Thus, when it is determined that the defect has been effectively repaired, the deposition process may be halted to prevent further deposition of material (or stripping of the clamp 200). If the separate circuit is provided as shown in Figure 8B, a further power supply 106’ and / or a further ammeter 107’ can be provided. Either variation of the testing circuits shown in Figures 8A or 8B could be used incombination with the system / steps shown in the other figures, even though they are not shown for simplicity.

[0076] The system may include an imaging device 108 configured to take an image of the clamp 200 for use in detecting a defect 300 on the clamp for repair. The imaging device 108 may otherwise be referred to as a “vision system.” The imaging device 108 may include one or more known sensors used to detect information relating to the surface of the clamp 200. The imaging device 108 may be used to identify the location of a defect to be repaired. For example only, the imaging device 108 may include or be part of a stitching imaging system, an optical coordinate measuring machine (optical CMM), an atomic force microscope (AFM), a scanning electric microscope (SEM), a white light interferometer, a laser confocal, and / or a scanning electro-static voltmeter (ESVM).

[0077] Any of the power supply 106, ammeter 107, imaging device 108, and / or positioning device 140 may be attached to, or even integral with, part of the dispensing device 100. These additional features are beneficial for providing an automated system as these features assist in controlling the repair of a defect 300 using the dispensing device.

[0078] It is noted that the predetermined amount of solution may be selected based on the repair, or could be set at a given amount. Example ranges of the amount of solution may be the same as the size of the droplet as discussed above. If it is determined that the defect is not fully repaired (e.g., which can be determined via any appropriate method, e.g., testing or visual inspection as appropriate), the method may include (i) withdrawing the solution into the dispensing device and delivering another droplet to carry out deposition, and / or (ii) repeating steps to carry out another round of deposition (e.g., including additional steps of cleaning, for example, if it is determined that the defect has not been fully repaired after the original cleaning steps have been carried out).

[0079] The above embodiments are beneficial in that the method and device (and / or system) can be used in a number of different ways, and is not limited to the specific application on the clamp 200 as described above.

[0080] In the above embodiments, the solution is dispensed onto a portion of the electrically conductive element 220 (e.g., a part of a Manhattan line) of a clamp 200. Although the electrostatic clamp 200 is described above, the present technology may be applied to any appropriate object wherein at least part of the object is electrically conductive. The present technology can thus be used to deposit material onto the electrically conductive part of the object. Although this is described in the context of repairing a break or gap above, the method may be used to improve the selected area, e.g., to add additional material to increase a thickness of a coating.

[0081] The object itself could be formed of an electrically conductive body, e.g., a solid metal object. In this case, the selected area may be an area that includes a defect or an area for improvement. The object may include an electrically conductive coating. Further applications of depositing material include spot-coating, e.g., on part of uniformity correction module (UNICOM). The object may be aclamp for holding a paterning device or a clamp for holding a substrate or a substrate table, in particular, where burl formation or other processes vary.

[0082] The present technology may be used to repair any appropriate defect. For example, the defect can be due to scratches, pinholes in coatings, damage during assembly, and / or pinholes in photoresist (etching issues). For example, the selected area may include a hole (e.g., a pin hole) or recess in a surface of a clamp for supporting a paterning device.

[0083] In particular, the present technology may be applied for fixing pinholes in reticle clamp ear shielding, fixing scratches on coatings or optics, hard-facing or locally coating burls, raising burl z- height (for example, if overcorrected in IBF, if coating was thinner than expected, e.g., if there were shadowing in the coating chamber), redeposition (e.g., after stripping), and / or changing roughness.

[0084] It will be understood that in the above embodiments, the present technology is used to deposit material on an object. However, the present technology may be used to strip material from the object instead. The present technology may be implemented in a very similar way to the embodiments and variations described above. However, in this instance, material can be stripped (instead of deposited) on the object. In this embodiment, the solution is an electro-stripping solution and the current is applied to strip material from the selected area.

[0085] As noted above for the deposition embodiments / variations above, the current can be adapted to control the stripping of the object. Additionally or alternatively, as noted for the deposition embodiment, the current can be measured to estimate the amount of material removed from the object.

[0086] Examples of locally stripping material from the object using the present technology include:- lowering a burl (e.g., a damaged burl);- cleaning by carrying out shallow strip (e.g., a shallow chrome strip) followed by redeposition(e.g., using deposition embodiments / variations above);- removing embedded particle contamination;- removing a short connection between lines;- smoothing spikes and / or removing an overcoating or coating in unintended areas, such as“chrome islands” on the glass on substrate clamp);- changing roughness of a surface; and / or- removing discolored areas of chrome.

[0087] As will be understood from the above, any of the steps / parts of the device / system which allow for automation is beneficial in that it provides a scalable solution, e.g., for atending to defects, which can be faster and carried out in a well-controlled way. By using minimal volumes, and having neutralizing and / or cleaning steps, an assembled clamp (or other object) can be altered / repaired with reduced or minimal risk, in an automated way. Additionally, the present technology may reduce or minimize contamination risk compared to existing reworking processes due to the way in which repairs can be carried out locally.

[0088] The above embodiments are beneficial in that they can be used to carry out repairs at multiple points in the process, i.e., when it is determined that a repair is needed. Furthermore, the repair can be carried out on an object irrespective of whether it has been assembled (and tests can be carried out as described to check the repair). This may be particularly useful, for example, in reworking pinholes in a coating of an unassembled clamp.

[0089] The dispensing device and / or system may have various configurations including at least some of the features described above. The dispensing device and / or system may be configured to carry out the method as described in any of the above embodiments or variations.

[0090] Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications. Possible other applications include the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquidcrystal displays (LCDs), thin-film magnetic heads, etc.

[0091] Although specific reference may be made in this text to embodiments of the present technology in the context of a lithographic apparatus, embodiments of the present technology may be used in other apparatus. Embodiments may form part of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or processes an object such as a wafer (or other substrate) or mask (or other patterning device). These apparatus may be generally referred to as lithographic tools. Such a lithographic tool may use vacuum conditions or ambient (non-vacuum) conditions.

[0092] Although specific reference may have been made above to the use of embodiments of the present technology in the context of optical lithography, it will be appreciated that the present technology, where the context allows, is not limited to optical lithography and may be used in other applications, for example imprint lithography.

[0093] An embodiment may take the form of a computer program containing one or more sequences of machine-readable instructions implementing one or more steps of a method as disclosed above, or a data storage medium (e.g. semiconductor memory, magnetic or optical disk) having such a computer program stored therein.

[0094] While specific embodiments of the present technology have been described above, it will be appreciated that the present technology may be practiced otherwise than as described. The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the present technology as described without departing from the scope of the claims set out below.

[0095] Example embodiments of the present technology are set out in the following numbered clauses:1. A method of altering an object, the method comprising: providing an object wherein at least part of the object is electrically conductive;dispensing a predetermined amount of solution from a dispensing device onto a selected area on the electrically conductive part of the object, wherein the solution is an electrolytic solution; forming an electrical circuit between a power supply, at least part of the dispensing device, the dispensed solution, and the electrically conductive part of the object; and applying current via the electrical circuit to the dispensed solution to deposit material on the object or strip material from the object.2. The method of clause 1, wherein dispensing the solution comprises dispensing at least one individual droplet of solution.3. The method of clause 2, wherein the size and / or number of droplets are mechanically controlled by the dispensing device.4. The method of any one of the preceding clauses, wherein the current is adapted to control the deposition on the object or stripping of the object.5. The method of any one of the preceding clauses, further comprising measuring the current to estimate the amount of material deposited on the object or the amount of material removed from the object.6. The method of any one of the preceding clauses, further comprising driving an electrical current through the electrically conductive part of the object to measure the conductivity and preventing the application of additional current via the electrical circuit based on the measured current.7. The method of any one of the preceding clauses, wherein the solution is an electro-deposition solution and the current is applied to deposit the material on the selected area.8. The method of clause 7, wherein the electro-deposition solution comprises chromium, trivalent chromium, hexavalent chromium, or combinations thereof.9. The method of any one of clauses 1 to 6, wherein the solution is an electro-stripping solution and the current is applied to strip material from the selected area.10. The method of any one of the preceding clauses, wherein the object is a substrate clamp, and the selected area of the electrically conductive part of the clamp to which the solution is applied comprises at least one defect.11. The method of clause 10, wherein the clamp comprises a plurality of burls extending from a surface of the clamp and an electrically conductive element connecting the burls, wherein the defect is a break in the electrically conductive element.12. The method of any one of clauses 1 to 9, wherein the selected area comprises a hole or recess in a surface of a clamp for supporting a patterning device.13. The method of any one of the preceding clauses, further comprising dispensing a neutralizing solution to the selected area.14. The method of clause 13, wherein the neutralizing solution comprises an alkaline solution or deionized water.15. The method of any one of the preceding clauses, further comprising dispensing a cleaning solution to the selected area.16. The method of clause 15, wherein the cleaning solution comprises water, isopropanol, acetone, or combinations thereof.17. The method of any one of the preceding clauses, wherein the selected area of the electrically conductive part of the object onto which the solution is dispensed comprises chromium.18. The method of any one of the preceding clauses, further comprising moving the dispensing device to a location to dispense the solution onto the selected area.19. The method of any one of the preceding clauses, wherein the only physical contact with the selected area on the electrically conductive part is the solution and the electrical circuit is formed by physically contacting a non-critical surface of the object.20. A dispensing device for altering an object, wherein at least part of the object is electrically conductive, the dispensing device comprising: a reservoir configured to hold solution, the dispensing device being configured to dispense a predetermined amount of solution from the reservoir onto a selected area on the electrically conductive part of the object, wherein the solution is an electrolytic solution; an actuator for controlling the amount of solution dispensed via an aperture defined by the dispensing device, the aperture being in fluid communication with the reservoir; and an electrical conductor configured to apply a current from a power supply to the dispensed solution on the object.21. The dispensing device of clause 20, wherein the electrical conductor comprises at least part of a housing of the reservoir.22. The dispensing device of clause 20, wherein the electrical conductor comprises a wire, wherein at least part of the wire is positioned in the reservoir.23. The dispensing device of clause 22, wherein the wire extends from the reservoir through the aperture.24. The dispensing device of clause 20, wherein the electrical conductor forms at least part of the dispensing device defining the aperture.25. The dispensing device of any one of clauses 20 to 24, wherein the dispensing device is a pipetting device or a syringe.26. The dispensing device of any one of clauses 20 to 25, wherein the dispensing device is configured to extract dispensed solution from the selected area.27. The dispensing device of any one of clauses 20 to 26, wherein the dispensing device is configured to automatically dispense the solution and apply the current to deposit material on the object or strip material from the object.28. A system comprising the dispensing device of any one of clauses 20 to 27 and further comprising at least one of:the power supply; an ammeter configured to measure the current of the electrical circuit, wherein the system is configured to evaluate the alteration of the object based on the measured current; a positioning device configured to support the dispensing device and to move the dispensing device to a location to dispense the solution onto the selected area; and an imaging device configured to take an image of the object for use in detecting a defect on the object for repair.29. The system of clause 28 being configured to perform the method of any one of clauses 1 to

Claims

CLAIMS1. A method of altering an object, the method comprising: providing an object wherein at least part of the object is electrically conductive, dispensing a predetermined amount of solution from a dispensing device onto a selected area on the electrically conductive part of the object, wherein the solution is an electrolytic solution; forming an electrical circuit between a power supply, at least part of the dispensing device, the dispensed solution, and the electrically conductive part of the object; and applying current via the electrical circuit to the dispensed solution to deposit material on the object or to strip material from the object.

2. The method of claim 1, wherein: dispensing the solution comprises dispensing at least one individual droplet of solution; and the size and / or number of droplets are mechanically controlled by the dispensing device.

3. The method of claim 1, wherein the current is adapted to control the deposition on the object or stripping of the object.

4. The method of claim 1, further comprising measuring the current to estimate the amount of material deposited on the object or the amount of material removed from the object.

5. The method of claim 1, further comprising driving an electrical current through the electrically conductive part of the object to measure the conductivity and preventing the application of additional current via the electrical circuit based on the measured current.

6. The method of claim 1, wherein: the solution is an electro-deposition solution and the current is applied to deposit the material on the selected area; the electro-deposition solution comprises chromium, trivalent chromium, hexavalent chromium, or a combination selected therefrom; and the solution is an electro-stripping solution and the current is applied to strip material from the selected area.

7. The method of claim 1, wherein: the object is a substrate clamp, and the selected area of the electrically conductive part of the clamp to which the solution is applied comprises at least one defect;the clamp comprises a plurality of burls extending from a surface of the clamp and an electrically conductive element connecting the burls, wherein the defect is a break in the electrically conductive element; and the selected area comprises a hole or recess in a surface of a clamp for supporting a patterning device.

8. The method of claim 1, further comprising dispensing a neutralizing solution to the selected area, wherein the neutralizing solution comprises an alkaline solution or deionized water; or further comprising dispensing a cleaning solution to the selected area, wherein the cleaning solution comprises water, isopropanol, acetone, or a combination selected therefrom.

9. The method of claim 1, wherein the selected area of the electrically conductive part of the object onto which the solution is dispensed comprises chromium.

10. The method of claim 1, further comprising moving the dispensing device to a location to dispense the solution onto the selected area.

11. The method of claim 1, wherein the only physical contact with the selected area on the electrically conductive part is the solution and the electrical circuit is formed by physically contacting a non-critical surface of the object.

12. A dispensing device for altering an object, wherein at least part of the object is electrically conductive, the dispensing device comprising: a reservoir configured to hold solution, the dispensing device being configured to dispense a predetermined amount of solution from the reservoir onto a selected area on the electrically conductive part of the object, wherein the solution is an electrolytic solution; an actuator configured to control the amount of solution dispensed via an aperture defined by the dispensing device, the aperture being in fluid communication with the reservoir; and an electrical conductor configured to apply a current from a power supply to the dispensed solution on the object.

13. The dispensing device of claim 12, wherein: the electrical conductor comprises at least part of a housing of the reservoir; wherein the electrical conductor comprises a wire, wherein at least part of the wire is positioned in the reservoir; and the wire extends from the reservoir through the aperture.

14. The dispensing device of claim 12, wherein: the electrical conductor forms at least part of the dispensing device defining the aperture; the dispensing device is a pipetting device or a syringe; the dispensing device is configured to extract dispensed solution from the selected area; and the dispensing device is configured to automatically dispense the solution and apply the current to deposit material on the object or to strip material from the object.

15. A system comprising the dispensing device of claim 12 and further comprising at least one selected from: (i) the power supply;(ii) an ammeter configured to measure the current of the electrical circuit, wherein the system is configured to evaluate the alteration of the object based on the measured current;(iii) a positioning device configured to support the dispensing device and to move the dispensing device to a location to dispense the solution onto the selected area; and / or (iv) an imaging device configured to take an image of the object for use in detecting a defect on the object for repair.

Images