Improved planar litz coil; associated manufacturing method and computer program product

The 3D planar Litz coil structure addresses non-homogeneous current flow issues by ensuring uniform current distribution, reducing resistive losses, and enhancing performance at high frequencies.

WO2026125583A1 Publication Date: 2026-06-18THALES SA
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
THALES SA
Filing Date
2025-12-11
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Existing planar coils experience significant resistive losses at high frequencies due to non-homogeneous current flow through their wires, leading to increased alternating resistance, which limits their effectiveness in high-frequency applications.

⚗Method used

A three-dimensional planar Litz coil structure is developed, comprising a stack of bifacial printed circuit boards with interconnected conductive layers and a modular design, featuring a hierarchical structure of strands, threads, and unit elements, which ensures uniform current distribution and reduces alternating resistance.

🎯Benefits of technology

The 3D planar Litz coil design enhances current uniformity and reduces alternating resistance, allowing for improved performance at higher frequencies and increased power density in electromagnetic coils.

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Abstract

The invention relates to a coil resulting from the stacking of at least two double-sided elements, each double-sided element comprising two conductive layers etched so as to form tracks. This coil comprises a bundle comprising a plurality of strands, each strand (50) comprising at least one wire, each wire comprising one filament or one pair of filaments, each filament resulting from the connection of a plurality of tracks. Each strand results from combining unit elements (51, 52, 53, 54) identical to one another, a unit element comprising an active central zone (51-2), an interconnect zone (51-1) and an exchange zone (51-3), an electrical connection of two unit elements being made by interconnect vias (21, 26) between either the interconnect zones when the two unit elements do not belong to the same double-sided element or the exchange zones when the two unit elements do belong to the same double-sided element.
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