Method for reconstructive aesthetic procedure for minimizing suture marks and scars

The reconstructive cosmetic procedure through subcutaneous suturing, wound dressing, and laser treatment with double taping effectively addresses the issue of visible scars and infection, enhancing wound healing and regeneration.

WO2026127161A1PCT designated stage Publication Date: 2026-06-18ON BIO CO LTD

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
ON BIO CO LTD
Filing Date
2024-12-19
Publication Date
2026-06-18

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Abstract

The present invention relates to a method for a reconstructive aesthetic procedure for minimizing suture marks and scars, comprising: a suturing procedure step of suturing the dermis and subcutaneous tissue by a subcutaneous suturing method; after the suturing procedure step, a regeneration procedure step of applying a wound dressing material into the skin and performing laser irradiation to promote hemostasis, infection prevention, and skin regeneration; and after the regeneration procedure step, a double-taping step of preventing secondary infection by stably fixing a suture site to prevent the separation thereof, thereby enabling acceleration of wound healing and, in particular, enabling treatment to prevent scars caused by suture marks, wounds, and surgical incisions.
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