Electronic device

Abstract

Provided is an isotope battery stack comprising: a plurality of isotope battery units stacked in a first direction; at least one cooling hole passing through the plurality of isotope battery units; and a refrigerant supply unit capable of supplying a refrigerant to the cooling hole. The isotope battery stack according to embodiments of the present invention has excellent heat dissipation and cooling performance.

Description

electronic devices

[0001] The present invention relates to an electronic device, and more specifically, to an electronic device that is economically advantageous and environmentally desirable.

[0002] The present application claims the benefit of priority based on Korean Patent Application No. 10-2024-0184396 dated December 12, 2024 and Korean Patent Application No. 10-2025-0195095 dated December 10, 2025, and all contents disclosed in the documents of said Korean patent applications are incorporated herein as part of the specification.

[0003] Radiation emitted by radioactive isotopes can be absorbed through the surface of a pn junction semiconductor and converted into electrical energy. Electron-hole pairs are generated in the space charge region within the pn junction semiconductor by the radiation, and the carriers generated therein exhibit voltage-current characteristics. Nuclear battery units utilizing these properties have the advantage of being able to stably supply power for a long period, but improvements are required from an environmental and economic perspective.

[0004] The technical problem that the present invention aims to solve is to provide an electronic device that is economically advantageous and environmentally desirable.

[0005] To achieve the above technical objective, the present invention provides an electronic device comprising: a housing; a display disposed on one side of the housing; a printed circuit board disposed inside the housing; a secondary battery disposed on one side of the printed circuit board inside the housing; and an isotope battery detachably provided on the printed circuit board, wherein the isotope battery is electrically connected to the secondary battery to charge the secondary battery.

[0006] In some embodiments, the printed circuit board may include a recess capable of accommodating the isotope cell.

[0007] In some embodiments, the isotope cell has a tapered sidewall, and the recess may have a tapered sidewall corresponding to the sidewall of the isotope cell.

[0008] In some embodiments, the recess portion includes a substrate terminal that can be electrically connected to the isotope cell at the bottom portion, and the isotope cell may include a cell terminal corresponding to the substrate terminal on a surface facing the bottom portion of the recess portion.

[0009] In some embodiments, the recess portion is provided with a plurality of substrate terminals, the isotope cell is provided with a plurality of cell terminals, and the surfaces facing each other of the substrate terminals and the cell terminals may be flat.

[0010] In some embodiments, the isotope cell may be configured to be inserted into the recess by sliding its tapered sidewall along the tapered sidewall of the recess.

[0011] In some embodiments, the cell terminal of the isotope cell and the corresponding substrate terminal of the printed circuit board may be configured to be joined by a protrusion-concave fit.

[0012] In some embodiments, an adhesive member may be partially interposed between the isotope cell and the printed circuit board.

[0013] In some embodiments, the isotope cell may be electrically connected to the secondary battery via a flexible printed circuit board, but not via the printed circuit board.

[0014] In some embodiments, the isotope cell may be electrically connected to the secondary battery via the printed circuit board.

[0015] In some embodiments, the substrate terminal of the printed circuit board corresponding to the battery terminal of the isotope battery may include at least one ground terminal.

[0016] In some embodiments, the isotope cell may include: a radiation source; a first conductivity semiconductor layer facing the radiation source; and a second conductivity semiconductor layer facing the radiation source with the first conductivity semiconductor layer in between.

[0017] An electronic device including an isotope cell according to the embodiments of the present invention has economically advantageous and environmentally desirable effects.

[0018] The effects obtainable from the exemplary embodiments of the present invention are not limited to those mentioned above, and other unmentioned effects can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure belong from the following description. That is, unintended effects resulting from the implementation of the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0019] FIG. 1 is an exploded perspective view showing an electronic device according to one embodiment of the present invention.

[0020] Figure 2 is a partial plan view showing part A of Figure 1 separately.

[0021] FIG. 3 is a partial cross-sectional view showing a cross section cut along the line III-III' of FIG. 2.

[0022] FIG. 4 is a cross-sectional view showing an isotope cell provided detachably on a printed circuit board according to one embodiment of the present invention.

[0023] FIG. 5 is a schematic diagram conceptually showing the insertion of an isotope cell (190) onto a printed circuit board according to one embodiment of the present invention.

[0024] FIG. 6 is a schematic diagram conceptually showing the insertion of an isotope cell (190) onto a printed circuit board according to another embodiment of the present invention.

[0025] FIGS. 7 and 8 are schematic diagrams conceptually illustrating the insertion of an isotope cell onto a printed circuit board according to another embodiment of the present invention.

[0026] FIG. 9 is a side cross-sectional view showing an isotope cell according to one embodiment of the present invention.

[0027] FIG. 10 is a schematic plan view showing the arrangement of a radiation source of an isotope cell according to one embodiment of the present invention.

[0028] Hereinafter, preferred embodiments of the concept of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the concept of the present invention may be modified in various different forms, and the scope of the concept of the present invention should not be interpreted as being limited by the embodiments described below. It is preferable to interpret the embodiments of the concept of the present invention as being provided to more completely explain the concept of the present invention to those with average knowledge in the art. Identical reference numerals denote identical elements throughout. Furthermore, various elements and areas in the drawings are depicted schematically. Accordingly, the concept of the present invention is not limited by the relative sizes or spacing depicted in the accompanying drawings.

[0029] Terms such as first, second, etc. may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the concept of the present invention, the first component may be named the second component, and conversely, the second component may be named the first component.

[0030] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the concept of the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, expressions such as “comprising” or “having” are intended to indicate the existence of the features, number, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, actions, components, parts, or combinations thereof.

[0031] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by those skilled in the art to which the concept of the present invention pertains. Furthermore, it will be understood that commonly used terms, such as those defined in advance, should be interpreted as having meanings consistent with their intent in the context of the relevant technology, and should not be interpreted in an overly formal sense unless explicitly defined herein.

[0032] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described in succession may be performed substantially simultaneously or in the reverse order of the description.

[0033] In the accompanying drawings, variations of the depicted shapes may be expected, for example, depending on manufacturing technology and / or tolerances. Accordingly, embodiments of the present invention should not be interpreted as being limited to specific shapes of the areas depicted herein, but should include, for example, variations in shape resulting from the manufacturing process. All terms "and / or" used herein include each of the mentioned components and all combinations of one or more thereof. Additionally, the term "substrate" as used herein may refer to the substrate itself, or a laminated structure including the substrate and a certain layer or film formed on its surface. Furthermore, the term "surface of the substrate" in this specification may refer to the exposed surface of the substrate itself, or the outer surface of a certain layer or film formed on the substrate.

[0034]

[0035] FIG. 1 is an exploded perspective view showing an electronic device (100) according to one embodiment of the present invention.

[0036] Referring to FIG. 1, the electronic device (100) may include a side member (110) (e.g., a side bezel structure), a first support member (111) (e.g., a bracket or support structure), a front plate (120) (e.g., a front cover), a display (130), a printed circuit board (140), a secondary battery (150), a second support member (160) (e.g., a rear case), an antenna (170), and a rear plate (180) (e.g., a rear cover). In some embodiments, the electronic device (100) may omit at least one of the components (e.g., the first support member (111) or the second support member (160)) or additionally include other components.

[0037] The first support member (111) may be disposed inside the electronic device (100) and connected to the side member (110), or may be formed integrally with the side member (110). The first support member (111) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (111) may have a display (130) attached to one side and a printed circuit board (140) attached to the other side. The printed circuit board (140) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0038] The above memory may include, for example, volatile memory or non-volatile memory.

[0039] The above interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (100) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0040] In some embodiments, the display (130) may include a flat display panel of the OCTA (on cell touch AMOLED (active matrix organic light-emitting diode)) type. In addition, the display (130) may include an unbreakable (UB) type OLED display (e.g., a curved display) panel. Furthermore, the light-emitting element constituting the display panel may be implemented as an inorganic light-emitting element made using inorganic materials, which is different from an OLED (organic light-emitting diode) made using organic materials. According to various embodiments, the light-emitting element may be a micro LED (light-emitting diode) (μ-LED). A micro LED may refer to an ultra-small inorganic light-emitting element of 100 micrometers (μm) or less in size that emits light on its own without a backlight or color filter.

[0041] The secondary battery (150) is a device for supplying power to at least one component of the electronic device (100) and may include, for example, an NCM-based secondary battery, an NCA-based secondary battery, an LFP-based secondary battery, an LMO-based secondary battery, an LCO-based secondary battery, a sodium battery, or an all-solid-state battery. At least a portion of the secondary battery (150) may be disposed substantially coplanar with, for example, a printed circuit board (140). In some embodiments, the secondary battery (150) may be integrally disposed inside the electronic device (100). In other embodiments, the secondary battery (150) may be detachably disposed on the electronic device (100).

[0042] The antenna (170) may be positioned between the rear plate (180) and the secondary battery (150). The antenna (170) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (170) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In other embodiments, the antenna structure may be formed by a part or combination thereof of the side member (110) and / or the first support member (111).

[0043] The front plate (120) is substantially transparent and may be formed by, for example, a glass plate or a polymer plate including various coating layers. The rear plate (180) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials.

[0044] In some embodiments, the electronic device (100) has a bar-type or plate-type appearance, but the invention is not limited thereto. For example, the illustrated electronic device (100) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms “foldable electronic device,” “slidable electronic device,” “stretchable electronic device,” and / or “rollable electronic device” may mean an electronic device in which the display (130) is capable of bending deformation so that at least a portion is folded, wound or rolled, at least a portion of the area is expanded, and / or can be housed inside a housing (e.g., an assembly of a front plate (120), a side member (110), and a rear plate (180)). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0045] Figure 2 is a partial plan view showing part A of Figure 1 separately.

[0046] Referring to FIG. 2, an isotope cell (190) may be disposed on the printed circuit board (140). In particular, the isotope cell (190) may be provided detachably on the printed circuit board (140).

[0047] The above isotope battery (190) can be electrically connected to the secondary battery (150). Furthermore, the above isotope battery (190) can be configured to charge the secondary battery (150).

[0048] In some embodiments, the secondary battery (150) may be electrically connected to the printed circuit board (140) by a flexible printed circuit board (FPCB) (142) including wiring. Also, the printed circuit board (140) may be electrically connected to the isotope battery (190). In some embodiments, the isotope battery (190) may be electrically connected to the secondary battery (150) via the printed circuit board (140).

[0049] In some other embodiments, the secondary battery (150) may be electrically connected to the isotope battery (190) via the FPCB (142). Specifically, the isotope battery (190) may be directly electrically connected to the FPCB (142), and the FPCB (142) may be directly electrically connected to the secondary battery (150). In this case, the isotope battery (190) is attached to the printed circuit board (140) but is not electrically connected to the printed circuit board (140). That is, the isotope battery (190) may be electrically connected to the secondary battery (150) via the FPCB (142) but not via the printed circuit board (140).

[0050] With the rapid advancement of electronic technology, the replacement cycle of electronic products is becoming increasingly shorter. Since the isotope battery (190) according to the embodiments of the present invention is provided to be detachably attached to the printed circuit board (140), when the lifespan of the electronic device (100) ends or replacement is required, the isotope battery (190) can be detached and attached to another electronic device for use. Therefore, even if the electronic device (100) is discarded, the isotope battery (190) can continue to be used in another electronic device, which is economically advantageous and environmentally desirable.

[0051] FIG. 3 is a partial cross-sectional view showing a cross section cut along the line III-III' of FIG. 2.

[0052] Referring to FIG. 3, the printed circuit board (140) may include a recess (140r) capable of at least partially accommodating the isotope cell (190). In some embodiments, the height of the isotope cell (190) may be greater than the depth of the recess (140r).

[0053] In some embodiments, the isotope battery (190) may be electrically connected to the printed circuit board (140) by being inserted into the recess (140r). Furthermore, the isotope battery (190) may be electrically connected to the secondary battery (150) via the printed circuit board (140).

[0054] In some embodiments, the secondary battery (150) may be electrically connected to the printed circuit board (140) through an FPCB (142) including wiring, and ultimately to the isotope battery (190). The isotope battery (190) may be configured to charge the secondary battery (150) through this electrical connection.

[0055] As previously explained, the isotope battery (190) may be provided detachably on the printed circuit board (140). Any means known to those skilled in the art may be employed to make the isotope battery (190) detachable. The isotope battery (190) will be described in more detail later with reference to FIGS. 9 and FIGS. 10.

[0056] FIG. 4 is a cross-sectional view showing an isotope cell (190) provided detachably on a printed circuit board (140) according to one embodiment of the present invention.

[0057] Referring to FIG. 4, the isotope cell (190) has tapered sidewalls (190s), and the recess (140r) of the printed circuit board (140) may also have tapered sidewalls (140s).

[0058] The tapered sidewall (190s) of the isotope cell (190) and the tapered sidewall (140s) of the recess (140r) can be configured to correspond to each other. That is, the position and inclination of the tapered sidewall (190s) of the isotope cell (190) and the tapered sidewall (140s) of the recess (140r) can be substantially the same. As a result, the sidewall (190s) of the isotope cell (190) can slide along the tapered sidewall (140s) of the recess (140r), and accordingly, the isotope cell (190) can be inserted horizontally into the recess (140r).

[0059] FIG. 5 is a schematic diagram conceptually showing the insertion of an isotope cell (190) onto a printed circuit board (140) according to one embodiment of the present invention.

[0060] Referring to FIG. 5, the isotope battery (190) can be detachably coupled to the printed circuit board (140) by sliding it into the recess (140r). At least one substrate terminal (140rt) that can be electrically connected to the isotope battery (190) may be disposed on the bottom portion of the recess (140r). Additionally, the isotope battery (190) may include at least one battery terminal (190t) corresponding to the substrate terminal (140rt) on the surface facing the bottom portion of the recess (140r).

[0061] In some embodiments, the recess (140r) is provided with a plurality of substrate terminals (140rt), and the isotope cell (190) may include a plurality of battery terminals (190t) corresponding to the substrate terminals (140rt). The battery terminals (190t) of the isotope cell (190) of FIG. 5 may be arranged to face the substrate terminals (140rt). The surfaces facing each other of the substrate terminals (140rt) and the battery terminals (190t) may be flat. Therefore, the battery terminals (190t) may slide over the substrate terminals (140rt), and furthermore, the substrate terminals (140rt) may come into close contact with the battery terminals (190t).

[0062] When the isotope battery (190) is inserted into the recess (140r), the battery terminal (190t) comes into close contact with the substrate terminal (140rt), thereby allowing the isotope battery (190) to be electrically connected to the printed circuit board (140).

[0063] The battery terminal (190t) may include at least one positive terminal and one negative terminal. Additionally, the battery terminal (190t) may include at least one ground terminal. The substrate terminal (140rt) may include at least one positive terminal and one negative terminal. Additionally, the substrate terminal (140rt) may include at least one ground terminal.

[0064] When the above isotope battery (190) is attached to the above printed circuit board (140), the positive terminal of the battery terminal (190t) may be configured to contact the positive terminal of the board terminal (140rt), the negative terminal of the battery terminal (190t) may be configured to contact the negative terminal of the board terminal (140rt), and the ground terminal of the battery terminal (190t) may be configured to contact the ground terminal of the board terminal (140rt).

[0065] FIG. 6 is a schematic diagram conceptually showing an isotope cell (190) inserted on a printed circuit board (140) according to another embodiment of the present invention.

[0066] Referring to FIG. 6, the battery terminal (190t) of the isotope battery (190) and the corresponding substrate terminal (140rt) of the printed circuit board (140) may be configured to be joined by a protrusion-concave fit. Although FIG. 6 is illustrated such that the battery terminal (190t) includes a protrusion and the substrate terminal (140rt) includes a concave portion, a person skilled in the art will understand that the battery terminal (190t) may be configured to include a concave portion and the substrate terminal (140rt) may include a protrusion.

[0067] The battery terminal (190t) including the above protrusion may be provided on the surface facing the bottom of the recess (140r) of the isotope battery (190). Additionally, substrate terminals (140rt) including a recess corresponding to the above protrusion may be provided on the bottom of the recess (140r).

[0068] FIGS. 7 and 8 are schematic diagrams conceptually illustrating the insertion of an isotope cell (190) onto a printed circuit board (140) according to another embodiment of the present invention. The embodiment illustrated in FIGS. 7 and 8 differs from the embodiment illustrated in FIG. 6 in that a recess (140r) is not formed.

[0069] Referring to FIG. 7, substrate terminals (140t) may be provided on the upper surface of a printed circuit board (140). The battery terminal (190t) of the isotope cell (190) and the corresponding substrate terminal (140t) of the printed circuit board (140) may be configured to be joined by a protrusion-concave fit. Although FIG. 7 is illustrated such that the battery terminal (190t) includes a protrusion and the substrate terminal (140t) includes a concave portion, a person skilled in the art will understand that the battery terminal (190t) may be configured to include a concave portion and the substrate terminal (140t) may include a protrusion.

[0070] The battery terminal (190t) including the above protrusion may be provided on the surface facing the upper surface of the printed circuit board (140) of the isotope battery (190). Additionally, the upper surface of the printed circuit board (140) may be provided with substrate terminals (140rt) including a recess corresponding to the above protrusion.

[0071] An adhesive member (140adh) may be partially interposed between the isotope cell (190) and the printed circuit board (140). The adhesive member (140adh) may include, for example, an epoxy adhesive, an acrylic adhesive, a silicone adhesive, a urethane adhesive, or a combination thereof. The adhesive member (140adh) may have an adhesive force such that the adhesive force can be released by a force applied to the isotope cell (190) when the isotope cell (190) is subsequently detached.

[0072] FIG. 9 is a side cross-sectional view showing an isotope cell (190) according to one embodiment of the present invention. FIG. 10 is a schematic plan view showing the arrangement of a radiation source (211) of an isotope cell (190) according to one embodiment of the present invention.

[0073] Referring to FIG. 9, the isotope cell (190) may include a plurality of isotope cell units (210-1, 210-2, ..., 210-N) stacked in a first direction (e.g., x-axis direction). Each of the plurality of isotope cell units (210-1, 210-2, ..., 210-N) may include a radiation source (211), a first conductivity type semiconductor layer (213a, 213b), and a second conductivity type semiconductor layer (215a, 215b).

[0074] In some embodiments, the radiation source (211) may include a radioactive isotope that emits beta rays. For example, the radiation source (211) may be tritium ( 3 H, tritium), calcium-45( 45 Ca), nickel-63 63 Ni), copper-67 67 Cu), strontium-90 ( 90 Sr), promethium-147( 147 Pm), osmium-194( 194 OS), Thulium-171( 171 Tm), thallium-204( 204 Tl), tantalum-182( 182 Ta), cadmium-115( 115 Cd), cadmium-113( 113 Cd), germanium-75( 75 Ge), cerium-141( 141 Ce), cerium-144( 144Ce) and tungsten-185( 185 It may include one or more selected from the group consisting of W). However, the present invention is not limited to these.

[0075] In some embodiments, the radiation source (211) may include a radioactive isotope that emits alpha rays. For example, the radiation source (211) may be americium-241 ( 241 Am), americium-243( 243 Am), polonium-209( 209 Po), polonium-210( 210 Po), plutonium-238( 238 Pu), Plutonium-239 ( 239 Pu), curium-242( 242 Cm), curium-244( 244 Cm), curium-249( 249 Cm), promethium-147( 147 Pm), uranium-238( 238 U), thorium-232( 232 Th), Radium-226( 226 Ra), bismuth-210( 210 Bi), neptunium-237( 237 Np), europium-152( 152 Eu), Francium-223 223 Fr), astatine-210( 210 At), protactinium-231( 231 Pa), einsteinium-253( 253 Es), californium-252( 252 Cf), and berkelium-249(249 It may include one or more selected from the group consisting of Bk). However, the present invention is not limited to these.

[0076] The above radiation source (111) can be formed by any method known to a person skilled in the art. For example, the above radiation source (111) can be formed by various methods such as plating, vapor deposition, and atomic layer deposition (ALD).

[0077] In some embodiments, the radiation source (111) may be formed by plating. When the radiation source (111) is formed by plating, the radiation source (111) may be formed by performing electroplating after forming a seed layer. Optionally, the radiation source (111) may be formed by electroless plating.

[0078] In some embodiments, a first conductive semiconductor layer (213a, 213b) may be provided facing the radiation source (211). In some embodiments, the first conductive semiconductor layer may be provided only on one side of the radiation source (211). In other embodiments, the first conductive semiconductor layer (213a, 213b) may be provided on the upper and lower sides of the radiation source (211).

[0079] In some embodiments, a second conductive semiconductor layer (215a, 215b) may be provided to face the radiation source (211) with the first conductive semiconductor layer (213a, 213b) in between. In some embodiments, the second conductive semiconductor layer (215a, 215b) may be provided on the upper and lower sides of the radiation source (211).

[0080] In some embodiments, the first conductivity type semiconductor layer (213a, 213b) may be doped with first conductivity type dopants within the substrate.

[0081] The above description may include, for example, a III-V semiconductor material. The III-V semiconductor material may include InAlP, InGaP, InAlGaP, ZnSe, AlAs, AlAsP, or yttria-stabilized zirconia (YSZ).

[0082] In some embodiments, the substrate may comprise a diamond substrate, a SiC substrate, a GaN substrate, a Bi2O3 / GeO2 substrate, a Sm2O3 / Bi2O3 / GeO2 substrate, a Sm2O3 / Bi2O3 / B2O3 substrate, a Sm2O3 / Bi2O3 / GeO2 / B2O3 substrate, a sapphire substrate, or a combination thereof, and these may be undoped substrates.

[0083] In some other embodiments, the substrate may comprise a diamond substrate, a SiC substrate, a GaN substrate, a Bi2O3 / GeO2 substrate, a Sm2O3 / Bi2O3 / GeO2 substrate, a Sm2O3 / Bi2O3 / B2O3 substrate, a Sm2O3 / Bi2O3 / GeO2 / B2O3 substrate, a sapphire substrate, or a combination thereof, and these may be substrates doped with a dopant.

[0084] In some other embodiments, the above description may have the chemical formula AMO3 (wherein A is one or more selected from the group consisting of La, Ba, Sr, and K, and M is one or more selected from the group consisting of Al, In, Ga, Ti, Sn, Hf, Ta, and Zr).

[0085] Specifically, the above description includes BaSnO3, BaHfO3, BaZrO3, and BaHf 1-x Ti x O3(here 0 <x<1), Ba 1-x La x SnO3(here 0 <x<1), Bi4Ge3O 12, Al2O3, Y2O3, La2O3, Ga2O3, Bi2O3, ZrO2, HfO2, Ta2O5, TiO2, LaInO3, LaGaO3, SrZrO3, SrHfO3, SrTaO7, LaIn 1-x Ga x O3(here 0 <x<1), LaGaO3, SrTiO3, KTaO3, HfSiO4, Ta3Ti2O x It may include one or more selected from the group consisting of and LaAlO3 (where 0 <x<1).

[0086] In some embodiments, the substrate may include an insulating substrate. In some embodiments, the substrate may include a semiconductor substrate.

[0087] In some embodiments, the first conductivity type semiconductor layer (213a, 213b) may comprise a metal oxide having a bandgap energy of 2.7 eV or more. In some embodiments, the metal oxide may have the chemical formula AMO3 (wherein A is one or more selected from the group consisting of La, Ba, Sr, and K, and M is one or more selected from the group consisting of Al, In, Ga, Ti, Sn, Hf, Ta, and Zr).

[0088] Specifically, the metal oxides are BaSnO3, BaHfO3, BaZrO3, and BaHf 1-x Ti x O3(here 0 <x<1), Ba 1-x La x SnO3(here 0 <x<1), Bi4Ge3O 12 , Al2O3, Y2O3, La2O3, Ga2O3, Bi2O3, ZrO2, HfO2, Ta2O5, TiO2, LaInO3, LaGaO3, SrZrO3, SrHfO3, SrTaO7, LaIn 1-x Ga x O3(here 0 <x<1), LaGaO3, SrTiO3, KTaO3, HfSiO4, Ta3Ti2O xIt may include one or more selected from the group consisting of and LaAlO3 (where 0 <x<1).

[0089] The above metal oxide is not only stable even in high temperature and high humidity environments, but also has high carrier mobility, so it can efficiently absorb radiation emitted from a radiation source (211) and provide high energy conversion efficiency. In addition, there are no inelastic collisions during carrier movement, so there is no energy loss and it is advantageous for heat dissipation. For example, the above metal oxide is 45 cm 2 / (V·s) or more, 80 cm 2 / (V·s) or more, 120 cm 2 / (V·s) or more, furthermore 300 cm 2 It can have a high carrier mobility of / (V·s) or higher.

[0090] These metal oxides are bidirectional doping materials and have the advantage of being able to provide high current or high voltage depending on the direction of the applied bias.

[0091] In some embodiments, the second conductivity type semiconductor layer (215a, 215b) may be doped with second conductivity type dopants within the substrate.

[0092] The substrate of the second conductivity type semiconductor layer (215a, 215b) may be the same as the substrate described in relation to the first conductivity type semiconductor layer (213a, 213b). In some embodiments, the substrate of the second conductivity type semiconductor layer (215a, 215b) may be the same as the substrate of the first conductivity type semiconductor layer (213a, 213b). In other embodiments, the substrate of the second conductivity type semiconductor layer (215a, 215b) may be different from the substrate of the first conductivity type semiconductor layer (213a, 213b).

[0093] In some embodiments, the first conductivity type semiconductor layer (213a, 213b) may be doped with a dopant of the first conductivity type. The second conductivity type semiconductor layer (215a, 215b) may be doped with a dopant of the second conductivity type. The first conductivity type semiconductor layer (213a, 213b) and the second conductivity type semiconductor layer (215a, 215b) may generate electron-hole pairs by radiation emitted from the radiation source (211).

[0094] In some embodiments, the first conductivity type dopant may be an n-type dopant and the second conductivity type dopant may be a p-type dopant. In other embodiments, the first conductivity type dopant may be a p-type dopant and the second conductivity type dopant may be an n-type dopant. A person skilled in the art will understand that, depending on the conductivity type of the dopant doped in each region, one of the first conductivity type semiconductor layer (213a, 213b) and the second conductivity type semiconductor layer (215a, 215b) may operate as a cathode and the other as an anode. That is, if the first conductivity type dopant is an n-type dopant and the second conductivity type dopant is a p-type dopant, the first conductivity type semiconductor layer (213a, 213b) may act as an anode and the second conductivity type semiconductor layer (215a, 215b) may act as a cathode. Conversely, if the first conductivity type dopant is a p-type dopant and the second conductivity type dopant is an n-type dopant, the first conductivity type semiconductor layer (213a, 213b) can act as a cathode and the second conductivity type semiconductor layer (215a, 215b) can act as an anode.

[0095] The region doped with the above n-type dopant may be a semiconductor region doped with, for example, nitrogen (N), phosphorus (P), arsenic (As), or antimony (Sb), which are Group 15 elements of the periodic table, or a compound semiconductor doped with nitrogen (N), phosphorus (P), arsenic (As), or antimony, which are Group 15 elements of the periodic table. In this specification, a compound semiconductor refers to a semiconductor composed of two or more elements, and may be, for example, silicon carbide, silicon oxide, aluminum phosphide (AlP), aluminum arsenide (AlAs), gallium arsenide (GaAs), or gallium nitride (GaN).

[0096] The region doped with the above p-type dopant may be a semiconductor region doped with, for example, boron (B), aluminum (Al), gallium (Ga), or indium (In), which are group 13 elements of the periodic table, or a compound semiconductor doped with boron (B), aluminum (Al), gallium (Ga), or indium (In), which are group 13 elements of the periodic table.

[0097] In some embodiments, the first conductivity semiconductor layer (213a, 213b) and / or the second conductivity semiconductor layer (215a, 215b) may include an organic material used in an organic layer that receives light and generates power in the field of solar cells, etc. For example, the first conductivity semiconductor layer (213a, 213b) and / or the second conductivity semiconductor layer (215a, 215b) may include a thiophene-type compound. Meanwhile, the first conductivity semiconductor layer (213a, 213b) and / or the second conductivity semiconductor layer (215a, 215b) may be an organic-inorganic hybrid type by appropriately mixing the aforementioned inorganic material and organic material.

[0098] In some embodiments, a depletion region may be formed near the interface where the first conductivity type semiconductor layer (213a, 213b) and the second conductivity type semiconductor layer (215a, 215b) come into contact with each other.

[0099] In some embodiments, the first conductivity semiconductor layer (213a, 213b) and the second conductivity semiconductor layer (215a, 215b) may be extended in a direction perpendicular to the first direction (e.g., the x-axis direction). In some embodiments, the first conductivity semiconductor layer (213a, 213b) and the second conductivity semiconductor layer (215a, 215b) may be in the form of a flat plate extending in a direction perpendicular to the first direction (e.g., the x-axis direction).

[0100] Specifically, the radiation source (211) may include radiation source structures (211s) distributed in a direction perpendicular to a first direction (e.g., x-axis direction). The radiation source structures (211s) may have a point shape as shown in FIG. 10 and may be distributed spaced apart in a second direction (e.g., y-axis direction) and a third direction (e.g., z-axis direction). However, the present invention is not limited thereto. In some embodiments, the radiation source structures (211s) may have the form of straight lines that are spaced apart in a third direction (e.g., z-axis direction) or a second direction (e.g., y-axis direction) while extending in a second direction (e.g., y-axis direction) or a third direction (e.g., z-axis direction). In some embodiments, the radiation source structures (211s) may have the form of lines spaced apart in the third direction (e.g., z-axis direction) or the second direction (e.g., y-axis direction) while extending in a zigzag shape toward the second direction (e.g., y-axis direction).

[0101] The lower surface of the radiation source structures (211s) may face the lower first conductive semiconductor layer (213a). The upper surface of the radiation source structures (211s) may face the upper first conductive semiconductor layer (213b). The lower surface of the radiation source structures (211s) may face the lower second conductive semiconductor layer (215a) with the lower first conductive semiconductor layer (213a) in between. The upper surface of the radiation source structures (211s) may face the upper second conductive semiconductor layer (215b) with the upper first conductive semiconductor layer (213b) in between.

[0102] In some embodiments, each of the isotope cell units (210-1, 210-2, ..., 210-N) may further include a photon generating layer (212a, 212b). The photon generating layer (212a, 212b) may be any layer of material capable of emitting photons in response to radiation particles emitted from the radiation source (211).

[0103] For example, the photon generating layer (212a, 212b) may employ materials such as Ba2Ca(BO3)2, BaHfO3, BaI2:Ce, BeO, BaF2, BaMgF4, Cs2LiLuCi6:Ce, K2YF5, KCaF3, YI3:Ce, but is not limited to these. Various examples of the photon generating layer (212a, 212b) are disclosed at https: / scintillator.lbl.gov / inorganic-scintillator-library / . If the radiation source (211) is a species that emits beta rays, the photon generating layer (212a, 212b) may be omitted.

[0104] In some embodiments, a lower photon generating layer (212a) may be disposed on the lower surface of the radiation source structures (211s), and an upper photon generating layer (212b) may be disposed on the upper surface of the radiation source structures (211s). In some embodiments, the radiation source structures (211s) may be surrounded by photon generating layers (212a, 212b).

[0105] The above-described isotope battery (190) may include a first electrode (205a) and a second electrode (205b) capable of transmitting generated electrical energy to the outside. The type, size, and shape thereof of the first electrode (205a) and the second electrode (205b) are not particularly limited as long as they possess electrical conductivity without causing physical and chemical changes in the isotope battery (190). For example, the first electrode (205a) and the second electrode (205b) may be cylindrical, tetrahedral, hexahedral, torus-shaped, or pad-shaped. In some embodiments, the first electrode (205a) and the second electrode (205b) may each independently include a metal material such as gold (Au), silver (Ag), platinum (Pt), stainless steel, copper (Cu), aluminum (Al), nickel (Ni), or titanium (Ti), or include a transparent oxide such as fluorine (F)-doped tin oxide (FTO) or indium oxide (ITO, In2O3), or include a carbon-based compound such as a carbon nanotube, graphene, or graphene oxide.

[0106] In some embodiments, the isotope cell units (210-1, 210-2, ..., 210-N) may be sealed within an encapsulating material (250). In some embodiments, the encapsulating material (250) may include a polymer material such as an epoxy molding compound (EMC). In some embodiments, the encapsulating material (250) may be a container containing metal. In some embodiments, the encapsulating material (250) may include a shielding layer capable of blocking electromagnetic interference.

[0107] As described above, although embodiments of the present invention have been described in detail, a person skilled in the art to which the present invention pertains will be able to modify and implement the present invention in various ways without departing from the spirit and scope of the present invention as defined in the appended claims. Therefore, future modifications to the embodiments of the present invention will not depart from the technology of the present invention.

[0108]

[0109] [Explanation of the symbol]

[0110] 100: Electronic device

[0111] 110: Side member

[0112] 111: First supporting member

[0113] 120: Front plate

[0114] 130: Display

[0115] 140: Printed circuit board

[0116] 140adh: Adhesive member

[0117] 140r: Recess section

[0118] 140rt, 140t: Board terminals

[0119] 142: Flexible Printed Circuit Board

[0120] 150: Secondary battery

[0121] 160: Second support member

[0122] 170: Antenna

[0123] 180: Rear plate

[0124] 190: Isotope battery

[0125] 190t: Battery terminal

[0126] 205a: First electrode

[0127] 205b: Second electrode

[0128] 210-1, 210-2, 210-N: Isotope cell units

[0129] 211: Radiation source

[0130] 211s: Radiation source structure

[0131] 212a, 212b: Photon generation layer

[0132] 213a, 213b: First conductivity type semiconductor layer

[0133] 215a, 215b: Second conductivity type semiconductor layer

[0134] 250: Bag material

Claims

1. Housing; A display disposed on one side of the above housing; A printed circuit board disposed inside the above housing; A secondary battery disposed on one side of the printed circuit board inside the above housing; and Isotope cell detachably provided on the above printed circuit board; Includes, The above-mentioned isotope battery is an electronic device electrically connected to the secondary battery so as to be able to charge the secondary battery.

2. In Paragraph 1, An electronic device characterized in that the above printed circuit board includes a recess capable of accommodating the above isotope cell.

3. In Paragraph 2, The above-mentioned isotope cell has tapered sidewalls, and An electronic device characterized in that the above-described recess has a tapered sidewall corresponding to the sidewall of the isotope cell.

4. In Paragraph 3, The above recess portion includes a substrate terminal in the bottom portion that can be electrically connected to the isotope cell, and An electronic device characterized in that the above-mentioned isotope cell includes a cell terminal corresponding to the substrate terminal on a surface facing the bottom portion of the recess.

5. In Paragraph 4, An electronic device characterized in that a plurality of substrate terminals are provided in the recess portion, a plurality of cell terminals are provided in the isotope cell, and the substrate terminals and the cell terminals have flat surfaces facing each other.

6. In Paragraph 3, An electronic device characterized in that the above-described isotope cell is configured such that its tapered sidewall slides along the tapered sidewall of the recess portion to be inserted into the recess portion.

7. In Paragraph 1, An electronic device characterized in that the battery terminal of the above-mentioned isotope battery and the corresponding substrate terminal of the above-mentioned printed circuit board are configured to be joined by a protrusion-concave fit.

8. In Paragraph 7, An electronic device characterized by having at least partially an adhesive member interposed between the above-mentioned isotope cell and the above-mentioned printed circuit board.

9. In Paragraph 1, An electronic device characterized in that the above-mentioned isotope battery is electrically connected to the above-mentioned secondary battery via a flexible printed circuit board, but not via the above-mentioned printed circuit board.

10. In Paragraph 1, An electronic device characterized in that the above-mentioned isotope battery is electrically connected to the above-mentioned secondary battery via the above-mentioned printed circuit board.

11. In Paragraph 1, An electronic device characterized in that the substrate terminal of the printed circuit board corresponding to the battery terminal of the above-mentioned isotope battery includes at least one ground terminal.

12. In Paragraph 1, The above isotope cell is: Radiation source; A first conductive semiconductor layer facing the above radiation source; and A second conductivity type semiconductor layer facing the radiation source with the first conductivity type semiconductor layer in between; An electronic device characterized by including

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