Water polishing systems and electrochemical systems having such water polishing systems

Abstract

Systems, apparatuses, and methods are provided for treating a water source within an industrial system, such as an electrochemical system. In one example, a water polishing system is provided that includes: a first polishing bed and a second polishing bed; a plurality of on-off valves configured to control a flow of water to or from the first or second polishing bed; first and second transfer lines positioned between the first and second polishing beds; a central connection line connecting the first transfer line and the second transfer line; and a plurality of check valves within the first and second transfer lines to restrict and control flow between the two polishing beds. In one particular example, the water polishing system does not include any three-way valves for controlling or directing the flow of water within the system.

Description

WATER POLISHING SYSTEMS AND ELECTROCHEMICAL SYSTEMS HAVING SUCH WATER POLISHING SYSTEMS

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 729,614, filed December 9, 2024, which is hereby incorporated by reference in its entirety.FIELD

[0002] The following disclosure relates to water purification or water polishing systems for removing impurities within a water source, particularly in the context of electrochemical plants. More specifically, the following disclosure relates to fluid flow configurations within an industrial system or electrochemical system, as well as polishing systems having multiple treatment beds allowing for both parallel and series flow through the beds.BACKGROUND

[0003] The quality of water used in various industrial plants or systems may be crucial to the overall performance of the plant or system. For example, the water used within an electrochemical plant or system may require low level of impurities to provide high electrical conductivity and avoid unwanted side reactions.

[0004] Electrochemical plants or systems use electrical energy to drive a chemical reaction. For example, within a water splitting electrolysis reaction within electrolysis cells of an electrochemical stack, water is split to form hydrogen and oxygen. The products may be used as energy sources for later use. In recent years, improvements in operational efficiency have made electrolyzer systems competitive market solutions for energy storage, generation, and / or transport. For example, the cost of generation may be below $6 per kilogram of hydrogen in some cases. Increases in efficiency and / or improvements in operation will continue to drive installation of electrolyzer systems.

[0005] Electrochemical systems may include subsystems associated with both the anode and cathode sides of the system, working in tandem to split water into hydrogen and oxygen. During operation, water continuously moves across the membrane from the anode to the cathode through electro-osmosis. To prevent water accumulation in the cathode subsystem, the electro-osmotic (or 'protonic') water is redirected back to the anode side.

[0006] Circulation of unreacted water within the electrochemical system may pick up undesirable impurities within the piping and vessels of the system. As such, the water may require treatment or polishing prior to introduction of the water into the electrochemical stack for the water splitting reaction.

[0007] There remains a need for an improved, more cost-effective and / or efficient solution for water purification or water polishing, particularly within, but not necessarily limited to, electrochemical systems.SUMMARY

[0008] In one embodiment, a water polishing system includes: a first polishing bed and a second polishing bed, wherein each polishing bed of the first and second polishing beds is configured to remove impurities from an inlet water stream to the water polishing system; a first on-off valve positioned in a first inlet line upstream from the first polishing bed and configured to control a flow of water to the first polishing bed; a second on-off valve positioned in a second inlet line upstream from the second polishing bed and configured to control a flow of water to the second polishing bed; a third on-off valve positioned in a first outlet line downstream from the first polishing bed and configured to control flow of water from the first polishing bed; a fourth on-off valve positioned in a second outlet line downstream from the second polishing bed and configured to control flow of water from the second polishing bed; a first transfer line connecting the first inlet line and the second inlet line downstream from the first on-off valve and the second on-off valve and upstream from the first polishing bed and the second polishing bed; a second transfer line connecting the first outlet line and the second outlet line downstream from the first polishing bed and the second polishing bed and upstream from the third on-off valve and the fourth on-off valve; a central connection line connecting the first transfer line and the second transfer line; a first check valve positioned in the first transfer line between the first inlet line and the central connection line and oriented within the first transfer line to restrict flow toward the central connection line; a second check valve positioned in the first transfer line between the second inlet line and the central connection line and oriented within the first transfer line to restrict flow toward the central connection line; a third check valve positioned in the second transfer line between the first outlet line and the central connection line and oriented within the second transfer line to restrict flow toward the firstoutlet line; and a fourth check valve positioned in the second transfer line between the second outlet line and the central connection line and oriented within the second transfer line to restrict flow toward the second outlet line.

[0009] In another embodiment, a water polishing system includes: an inlet water line configured to transfer water within an industrial system; a cooling supply line configured to receive a first portion of the water within the inlet water line; a cooling bypass line configured to receive a second portion of the water within the inlet water line; a cooling supply valve positioned within the cooling supply line configured to control a flow rate of the first portion of the water; a cooling bypass valve positioned within the cooling bypass line configured to control a flow rate of the second portion of the water; a cooling system positioned downstream of the cooling supply valve and configured to receive the first portion of the water and cool the first portion of water to provide a cooled water stream; and at least one polishing bed positioned downstream of the cooling system and configured to receive a first portion of the cooled water stream, wherein the at least one polishing bed is configured to remove impurities from the cooled water stream to provide a polished water stream, and wherein the polished water stream is transferred to a unit within the industrial system.

[0010] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Exemplary embodiments are described herein with reference to the following drawings.

[0012] Figure 1 depicts an example of an electrochemical or electrolytic cell.

[0013] Figure 2 depicts an example of a system including an electrochemical stack having a plurality of electrochemical cells of Figure 1.

[0014] Figure 3 depicts an example of a water cooling and polishing system.

[0015] Figures 4A-4C depict an example of a water treatment system having three-way valves.

[0016] Figures 5A-5C depict an example of a water treatment system having on-off valves and check-valves (and no three-way valves).

[0017] While the disclosed compositions and methods are representative of embodiments in various forms, specific embodiments are illustrated in the drawings (and are hereafter described), with the understanding that the disclosure is intended to be illustrative and is not intended to limit the claim scope to the specific embodiments described and illustrated herein.DETAILED DESCRIPTION

[0018] Certain industrial plants, such as electrochemical plants, utilize a purified water source (e.g., ultrapure water (UPW)) for successful operation. Such plants may require removal of impurities, such as dissolved ions, within the water source in a process that may be referred to as "water polishing." This polishing may require flowing a portion of the water supply through one or more polishing beds to process and remove the impurities within the water source.

[0019] The following discussion relates to systems and methods for treating or polishing water within an industrial system (e.g., an electrochemical plant). The disclosure advantageously describes flow configurations within the plant for improved water polishing as well as water polishing systems having a plurality (e.g., at least two) of polishing beds or vessels configured to operate in parallel or in series with each other. The polishing system may include on-off valves and checkvalves within the system to provide advantages in operating efficiency and cost. That is, the polishing system may not have three-way valves within the system. This may allow for a reduction in operating complexity and reduced chance for coding / operating error within the multiple three-way valve configurations. Additionally, the use of on-off valves and check valves may provide a reduction in system costs due to the reduced complexity and cost of the on-off valves and check valves in relation to three-way valve designs.

[0020] Furthermore, the water polishing systems disclosed herein may advantageously extend the life of the polishing compositions (e.g., ion exchange resins) within the polishing beds, provide efficient cleaning of the water, provide energy efficiency in the operation of the polishing system, and improve safety in operation of the polishing system via removal of a potential cause of damage to the polishing composition / ion exchange resin.

[0021] As noted above, the use of such an improved water polishing system may be employed within any industrial plant or system requiring a purified water source.Nevertheless, the examples and discussion herein relate specifically to the use of a polishing system within an electrochemical plant or system.Electrochemical Cells and Stacks

[0022] Figure 1 depicts an example of an electrochemical cell for production of hydrogen gas and oxygen gas through the splitting of water. The electrochemical cell includes a cathode, an anode, and a membrane positioned between the cathode and anode. Within the water-splitting electrolysis reaction, one interface runs an oxygen evolution reaction (OER) while the other interface runs a hydrogen evolution reaction (HER). For example, the anode reaction is H2O->2H++1ZO2+2e and the cathode reaction is 2H++2e->H2. The water electrolysis reaction has recently assumed great importance and renewed attention as a potential foundation for a decarbonized "hydrogen economy."

[0023] Figure 2 depicts an example of an electrochemical system including an electrolyzer or electrochemical stack having a plurality of electrochemical cells of Figure 1.In certain examples, the electrolyzer or electrochemical stack may contain 50-1000 cells, 50- 100 cells, 500-700 cells, or more than 1000 cells. Any number of cells may make up a stack. The electrochemical cells within the electrochemical stack may be configured to operate with 200 mV or less of pure resistive loss when operating at a high current density (e.g., at least 3 Amps / cm2, at least 4 Amps / cm2, at least 5 Amps / cm2, at least 6 Amps / cm2, at least 7 Amps / cm2, at least 8 Amps / cm2, at least 9 Amps / cm2, at least 10 Amps / cm2, at least 11 Amps / cm2, at least 12 Amps / cm2, at least 13 Amps / cm2, at least 14 Amps / cm2, at least 15 Amps / cm2, at least 16 Amps / cm2, at least 17 Amps / cm2, at least 18 Amps / cm2, at least 19 Amps / cm2, at least 20 Amps / cm2, at least 25 Amps / cm2, at least 30 Amps / cm2, in a range of 1-30 Amps / cm2, in a range of 3-20 Amps / cm2, in a range of 3-15 Amps / cm2, in a range of 3- 10 Amps / cm2, or in a range of 10-20 Amps / cm2).

[0024] As illustrated in the system of Figure 2, water (H2O) may be supplied to the anodic inlet of an electrolyzer or electrochemical stack 12. In certain embodiments, only the anodic inlet of the electrochemical stack 12 may receive water. In these embodiments, the cathode side of the electrochemical stack 12 may not receive water (e.g., a dry cathode sidemay be used). In another embodiment, a cathode inlet may also receive water, wherein the water may be supplied to the cathode inlet to cool the electrochemical stack 12 during electrolysis.

[0025] The water supplied to the anodic inlet flows to an anodic inlet manifold that distributes the water to the anode side of the plurality of cells contained with the electrochemical stack 12. In embodiments where water is supplied to the cathode inlet, water supplied to the cathode inlet flows to a cathodic inlet manifold that distributes the water to the cathode side of the plurality of cells in the electrochemical stack 12. In certain examples, the amount of water (e.g., deionized (DI) water) transferred to or circulated through each cell of the electrochemical stack 12 may be in a range of 0.25-1 mL / Amp / cell / min, in a range of 0.25-5 mL / Amp / cell / min, or in a range of 0.5-1 mL / Amp / cell / min.

[0026] During electrolysis, oxygen (O2) is produced at the anode side of the electrolytic cells and hydrogen (H2) is produced at the cathode side of the electrolytic cells. Specifically, a water splitting electrolysis reaction is configured to take place within each individual cell in the cell stack 12. Each cell includes one interface (the anode side of the cell) configured to run an oxygen evolution reaction (OER) and another interface (the cathode side of the cell) configured to run a hydrogen evolution reaction (HER), such as depicted in Figure 1.

[0027] To prevent water accumulation in the cathode subsystem, the electro-osmotic (or 'protonic') water is redirected back to the anode side.

[0028] However, the circulation of unreacted water within the electrochemical system may pick up undesirable impurities within the piping and vessels of the system. As such, the water may require treatment or polishing prior to reintroduction of the water into the electrochemical stack for the water splitting reaction.

[0029] One solution involves utilizing a water purification or polishing system within the electrochemical plant to maintain the desired purity of the water (e.g., ultra-pure water) being fed into the electrochemical stack.

[0030] Therefore, the proposed water purification systems disclosed herein aim to advantageously preserve the purity of the water (e.g., within an electrochemical system) in an improved and cost-effective manner.Water Polishing Systems

[0031] Figure 3 depicts a water polishing system 200 within an industrial plant (i.e., an electrochemical plant). As noted above, while the system 200 relates to processing and purifying water for an electrochemical stack, the processing equipment may be applied in another industrial setting that requires a purified water source for operation of the plant / system.

[0032] In the example in Figure 3, the water polishing system 200 includes an inlet water source 202. In this example, the inlet water source 202 is provided from a separator 204 within the industrial / electrochemical plant. Additional or alternative inlet water sources may be possible. The separator 204 in this example may include an anode separator positioned downstream of an electrochemical stack that is configured to separate dissolved oxygen from unreacted water and return the unreacted water back to the electrochemical stack for further processing. Alternatively, or additionally, the separator 204 may include a cathodic separator configured to separate hydrogen gas from cooling water running through the cathode side of the electrochemical stack.

[0033] The inlet water source 202 may be provided to one or more main pumps 206 configured to assist in recycling or returning the water source back to the electrochemical stack.

[0034] In this configuration, following the pumps 206, the water may be directed toward a cooling line 208 and / or a bypass line 210. A cooling supply valve 212 may be positioned within the cooling line 208 to regulate or control a flow to a cooling system 214. Additionally, a cooling bypass valve 216 may be positioned within the bypass line 210 to regulate or control a separate flow to the electrochemical stack 220.

[0035] As depicted in Figure 3, the cooling system 214 is positioned downstream of the cooling supply valve 212. The cooling system 214 is configured to cool the water to a desired temperature for the inlet to the electrochemical stack 220 and water splitting reaction within the electrochemical stack 220. In certain examples, the cooling system 214 takes into consideration the temperature of the water within the bypass line 210, the flow rate of the water within the bypass line 210, and the flow rate of water within the cooling line 208 and is configured to cool the water within the cooling line 208 to target the desired temperaturefor the combined cooling line and bypass line water sources entering the electrochemical stack 220.

[0036] The cooling system 214 may include a plurality of dry or wet coolers configured to transfer and reject the waste heat (i.e., into the surrounding plant environment) that has been generated in the electrochemical stacks through the water splitting reactions. Further, the cooling system 214 may require a large amount of surface area to effectively reduce the temperature of the water source being sent in the cooling line 208 to the cooling system 214. This surface area problematically can assist in adding to the level of impurities within the ultrapure process water. As such, the cooled water supply 222 out of the cooling system 214 may be the least pure water in the plant. Therefore, polishing this less-pure water, while not addressing or purifying the bypass water in the bypass line 210 may advantageously provide a higher overall purity in water delivered to the electrolysis stack 220 at reduced operating cost.

[0037] The cooled water 222 downstream of the cooling system 214 may be directed toward a diverter valve or split in the line that directs a portion of the cooled water 222 back to the bypass line and a remaining portion of the water to one or more polishing beds 300, 400. The positioning of this diverter valve or split in the line downstream of the cooling system 214 in combination with the bypass line 210 may be advantageous in limiting a pressure drop across the entire flow, therein wasting energy and requiring larger pumps. In other words, the addition of a cooling bypass line 210 and bypass valve 216 allows for a portion less than all of the inlet water 202 to be processed through the cooling system 214 and subsequent diverter valve downstream of the cooling system 214. Further, to the extent all of the cooled water 222 in the cooling line 208 is sent through to the polishing beds 300, 400, the polishing beds 300, 400 may not be damaged, as the flow rate may remain manageable due to the bypass line and redirection of a portion of the overall flow to begin with.

[0038] Detailed examples of specific water flow arrangements and processing apparatuses for a plurality of polishing beds 300, 400 are discussed in greater detail below with reference to Figures 4A-4C and Figures 5A-5C.

[0039] In certain examples, an additional water source may be provided to the water polishing system downstream of the cooling system 214 via an additional water line 240. Asdepicted in Figure 3, the additional water line 240 may be connected to the system 200 downstream of the diverter valve or split such that all of the additional water source is directed to the polishing beds 300, 400. Alternatively, while not depicted in Figure 3, the additional water line 240 could be connected to the cooled water 222 before the diverter / split. In other examples, the additional water line 240 could be connected to the system 200 downstream of the purified water stream 230 downstream of the polishing beds 300, 400 (before or after the polishing pumps 232).

[0040] In certain examples, the additional water line 240 may be a makeup water line providing a makeup water (MUW) supply that may be added to the electrochemical plant to replace water that has been lost within the plant via the water splitting reaction within the electrochemical stack(s) or via evaporation, leakage, or other processes within the plant. In certain examples, the makeup water line 240 may be transferred to the water polishing system 200 via a makeup water tank and makeup water pump. In certain examples, the makeup water may be supplied to the makeup water tank upstream of the water polishing system 200 from an initial water treatment facility that may receive an initial water source from a utility water supply outside of the electrochemical plant. The initial water treatment facility may be a RO / DI facility configured to initially purify the utility water supply via reverse osmosis (RO) and distillation (DI). Therefore, while the makeup water line 240 provided to the water polishing system may have been treated / purified to create an ultrapure water source, the subsequent transfer of the makeup water within the electrochemical plant may pick up undesirable impurities within the piping and vessels of the system. As such, the treated makeup water or at least a portion thereof, may advantageously be directed to the polishing beds 300, 400 within the water polishing system 200 to further treat and remove the collected impurities shortly before being transferred to the electrochemical stack for the water splitting reaction. This subsequent treatment / polishing of at least a portion of the makeup water directly proceeding the electrochemical stack may advantageously provide minimal chances for collecting impurities within the ultrapure water source and therein providing optimal reaction conditions within the stack.

[0041] In certain examples, the polishing beds 300, 400 may include a polishing composition configured to treat and remove impurities from the water source. In certainexamples, the polishing composition may be a resin composition, e.g., an ion exchange resin, configured to remove impurities such as dissolved ions picked up by the water from the piping or cooling surfaces within the plant. The operating conditions (e.g., operating temperature, pressure, flow rate) within the polishing bed or beds may be any known operating condition known in the art.

[0042] In certain examples, the polishing bed(s) 300, 400 may be configured to purify the water to have a water resistivity of at least 1 megaohm (MOhm) at least 2 MOhm, at least 5 MOhm, at least 10 MOhm, at least 12 MOhm, in a range of 1-18.2 MOhm, in a range of 1-10 MOhm, in a range of 2-18.2 MOhm, in a range of 2-10 MOhm, in a range of 5-18.2 MOhm, in a range of 5-10 MOhm, in a range of 10-18.2 MOhm, or in a range of 12-18.2 MOhm.

[0043] In certain examples, the ion exchange resin or polishing composition may be degraded or damaged by high temperatures. As such, it is advantageous to position the polishing bed 300, 400 downstream of a cooling system 214 to provide a lower temperature water source entering the polishing bed 300, 400. Additionally, the inclusion of a cooling bypass line and bypass valve 216 advantageously improves the effectiveness and lifespan of the polishing composition within the polishing bed 300, 400. First, the outlet of the cooling system 214 is the coldest water in the system 200, as this cooled water supply 222 has not yet been mixed with bypass water or heated by electrolysis. This may advantageously extend the life and effectiveness of the ion exchange resins.

[0044] The polishing bed(s) 300, 400 may be configured to transfer the purified water stream 230 to the electrochemical stack 220. As depicted in the example in Figure 3, the purified water stream 230 from the polishing bed(s) 300, 400 is combined with the bypass water in the bypass line 210 to be collectively supplied to the electrochemical stack 220.

[0045] As depicted in Figure 3, one or more polishing pumps 232 may be positioned downstream of the polishing beds 300, 400 to assist in the transfer of the purified water stream 230 from the polishing beds 300, 400 to the electrochemical stack 220. The addition and positioning of such a polishing pump 232 may be advantageous in reducing or eliminating a pressure drop across a restrictive valve, therein reducing or eliminating excess pumping power within the system. Further, the pressure drop across the polishing beds 300, 400 may be controlled or limited to the operating conditions for the polishing pumps 232.That is, the polishing pumps 232 can assist in controlling the pressure drop across the polishing beds 300, 400.

[0046] Figures 4A-4C depict an example of a water polishing system 300 including a plurality of polishing beds / vessels (i.e., two beds). In certain examples, the water polishing system 300 is positioned within an industrial system upstream of a particular operating unit or vessel requiring a purified water source. In one example, the water polishing system 300 is positioned upstream of one or more electrochemical stacks having a plurality of electrochemical cells (such as depicted and described in Figures 2 and 3 above).

[0047] Figure 4A depicts a water polishing system 300 that includes four three-way valves 302, 304, 306, 308, two polishing beds 310, 312, and one check valve 314. An inlet water line 320 is provided to the system having an initial or inlet pressure. In certain examples, the inlet water line 320 is configured to transfer a water stream circulating within an industrial plant (e.g., electrochemical plant). The inlet water line 320 splits into a first inlet line 322 directed toward a first three-way valve 302 positioned before a first polishing bed 310 and a second inlet line 324 directed toward a second three-way valve 304 positioned before a second polishing bed 312. Additionally, a third three-way valve 306 is positioned downstream of the first polishing bed 310 and a fourth three-way 308 valve is positioned downstream of the second polishing bed 312. Further, a check valve 314 is positioned between the first polishing bed 310 and the second polishing bed 312 in a central connecting line 326 positioned between a first transfer line 328 and a second transfer line 330 in the system. Additionally, a purified water stream exiting from the first and / or second polishing bed 310, 312 is configured to exit the water polishing system 300 via an outlet line 340.

[0048] In certain examples, the water polishing system 300 may be configured to have water flow into the first and second polishing beds 310, 312 in a parallel configuration. Alternatively, the water may be configured to flow through the first and second polishing beds 310, 312 in series, wherein the inlet water flows to the first bed 310 and then the water from the first bed flows to the inlet of the second bed 312 (or vice versa, with the second bed 312 positioned upstream of the first bed 310).

[0049] Figure 4B depicts an example of a flow pattern for a parallel configuration, wherein the first three-way valve 302 is arranged and programmed to receive the firststream in the first inlet line 322 and direct the first stream toward the inlet of the first polishing bed 310. Similarly, the second three-way valve 304 is arranged and programmed to receive the second stream in the second inlet line 324 and direct the second stream toward the inlet of the second polishing bed 312. At the outlet of the first polishing bed 310 in a first outlet line 336, the third three-way valve 306 is arranged and programmed to receive the first bed polished water stream from the outlet of the first polishing bed 310 and direct the first bed polished water stream to a combined outlet stream of the water polishing system. Similarly, at the outlet of the second polishing bed in a second outlet line 338, the fourth three-way valve is arranged and programmed to receive the second bed polished water stream from the outlet of the second polishing bed 312 and direct the second bed polished water stream to the combined outlet stream of the water polishing system to exit the water polishing system via the outlet line 340.

[0050] Figure 4C depicts an example of a flow pattern for a series configuration, wherein the first three-way valve 302 is arranged and programmed to receive the first stream and direct the first stream toward the inlet of the first polishing bed 310, while the second three-way valve 304 is arranged and programmed to block the second stream from entering the second polishing bed 312.

[0051] At the outlet of the first polishing bed in the first outlet line 336, the third three- way valve 306 is arranged and programmed to receive the first bed polished water stream from the outlet of the first polishing bed 310 and direct the first bed polished water stream toward the inlet of the second polishing bed 312 (water flow through the fourth three-way valve 308 is blocked due to the arrangement of the fourth three-way valve in this series configuration). The check valve 314, positioned between the two polishing beds 310, 312, is configured to receive the first bed polished water stream. In this arrangement, the check valve 314 is oriented to restrict flow from the first transfer line 328 toward the second transfer line 330. That is, the check valve 314 is configured to only have water flow in the direction from the outlet of the first bed 310 toward the inlet of the opposite, second bed 312 (or vice versa) when a pressure drop allows for such a flow. For instance, the check valve 314 is configured to restrict flow from the outlet of the first bed 310 to the inlet of the opposing, second bed 312 if the inlet of the second bed has a higher pressure than the outlet of the first bed.

[0052] Following transfer through the check valve 314 from the outlet of the first bed 310, the second three-way valve 304 is arranged and programmed to receive the first bed polished water stream and transfer the stream to the inlet of the second polishing bed 312. At the outlet of the second polishing bed 312 in a second outlet line 338, the fourth three- way valve 308 is arranged and programmed to receive the second bed polished water stream from the outlet of the second polishing bed 312 and direct the second bed polished water stream toward an outlet line 340 of the water polishing system 300. In this series arrangement, the first polishing bed 310 acts as the primary bed or workhorse in treating and polishing the water as the first polishing bed 310 is positioned upstream in the arrangement, while the second polishing bed 312 acts as a secondary or backup source for treating and polishing the water.

[0053] As noted above, the series arrangement may be reversed via a reorientation of the three-way valve directions such that the second polishing bed 312 is positioned first / upstream from the first polishing bed 310.

[0054] Furthermore, as noted above, the complexity in operating a system of three-way valves and potential errors in programming or flow control within the system provides an opportunity for an improved water polishing system with lower installation costs and reduced chance for coding / operating error.

[0055] Figures 5A-5C depict such an improved, updated water polishing system 400 that eliminates the use of three-way valves and instead uses a collection of on-off valves and check valves to direct fluid flow arrangements through a plurality of polishing beds (i.e., two beds) in either a parallel configuration or in series.

[0056] As noted above, the water polishing system 400 depicted in this example may be positioned within an industrial system upstream of a particular operating unit or vessel requiring a purified water source. In one example, the water polishing system 400 is positioned upstream of one or more electrochemical stacks having a plurality of electrochemical cells (such as depicted and described in Figures 2 and 3 above).

[0057] Figure 5A depicts a water polishing system 400 including four on-off valves 402, 404, 406, 408, four check valves 432, 434, 436, 438, and no three-way valves. An inlet water line 420 is provided to the system at a starting or inlet pressure. In certain examples, the inlet water line 420 is configured to transfer a water stream circulating within an industrialplant (e.g., electrochemical plant). The inlet water line 420 splits into a first inlet line 422 directed toward a first polishing bed 410 and a second inlet line 424 directed toward a second polishing bed 412. A first on-off valve 402 is positioned in a first inlet line 422 upstream from the first polishing bed 410 and configured to control a flow of water to the first polishing bed 410. Additionally, a second on-off valve 404 is positioned in a first inlet line 424 upstream from the second polishing bed 412 and configured to control a flow of water to the second polishing bed 412.

[0058] Further, a third on-off valve 406 is positioned in a first outlet line 446 downstream of the first polishing bed 410 and configured to control flow of water from the first polishing bed 410. Also, a fourth on-off valve 408 is positioned in a second outlet line 448 downstream of the second polishing bed 412 and configured to control flow of water from the second polishing bed 412.

[0059] The water polishing system 400 further includes a first transfer line 428 connecting the first inlet line 422 and the second inlet line 424 downstream from the first on-off valve 402 and the second on-off valve 404 and upstream from the first polishing bed 410 and the second polishing bed 412. The water polishing system 400 further includes a second transfer line 430 connecting the first outlet line 446 and the second outlet line 448 downstream from the first polishing bed 410 and the second polishing bed 412 and upstream from the third on-off valve 406 and the fourth on-off valve 408. The water polishing system 400 further includes a central connection line 426 connecting the first transfer line 428 and the second transfer line 430.

[0060] Further, four check valves 432, 434, 436, 438 are positioned between the first polishing bed 410 and the second polishing bed 412 to control or restrict flow between the two polishing beds. In the example depicted in Figure 5A, a first check valve 432 is positioned in the first transfer line 428 between the first inlet line 422 and the central connection line 426 and oriented within the first transfer line 428 to restrict flow toward the central connection line 426 (i.e., flow can only occur toward the first inlet line when a pressure differential allows such flow to occur). Additionally, a second check valve 434 is positioned in the first transfer line 428 between the second inlet line 424 and the central connection line 426 and oriented within the first transfer line 428 to restrict flow toward the central connection line 426. Further, a third check valve 436 is positioned in the secondtransfer line 430 between the first outlet line 446 and the central connection line 426 and oriented within the second transfer line 430 to restrict flow toward the first outlet line 446 (i.e., flow can only occur toward the central connection line when a pressure differential allows such flow to occur). Finally, a fourth check valve 438 is positioned in the second transfer line 430 between the second outlet line 448 and the central connection line 426 and oriented within the second transfer line 430 to restrict flow toward the second outlet line 448.

[0061] As noted above, the water polishing system 400 may be configured to have water flow into the first and second polishing beds 410, 412 in a parallel configuration. Alternatively, the water may be configured to flow through the first and second polishing beds 410, 412 in series, wherein the inlet water flows to the first bed 410 and then the water from the first bed 410 flows to the inlet of the second bed 412 (or vice versa, with the second bed 412 positioned upstream of the first bed 410).

[0062] Figure 5B depicts an example of a flow pattern for a parallel configuration, wherein all four on-off valves 402, 404, 406, 408 are set to the on or open position allowing fluid flow through each valve. In this arrangement, the first open on-off valve 402 directs a first stream of water in the first inlet line 422 toward the inlet of the first polishing bed 410. Similarly, the second open on-off valve 404 directs a second stream of water in the second inlet line 424 toward the inlet of the second polishing bed 412.

[0063] After the outlet of the first polishing bed 410 and positioned in the first outlet line 446, the third open on-off valve 406 is configured to control the flow of water from the first bed polished water stream from the outlet of the first polishing bed 410 to an outlet line 440 of the water polishing system 400. Similarly, after the outlet of the second polishing bed 412 and positioned in the second outlet line 448, the fourth open on-off valve 408 is configured to control the flow of water from the second bed polished water stream to the outlet line 440 of the water polishing system 400. The first bed polished water stream and the second bed polished water stream have reduced pressures (i.e., pressures that are less than the inlet pressure due to a pressure drop via treatment / polishing within the respective polishing bed).

[0064] In this parallel configuration, first and second check valves 432, 434 positioned in a first transfer line 428 between the first and second polishing beds 410, 412 are arrangedto only allow flow from a center of the first transfer line 428 toward the polishing beds (as long as the pressure differential allows for the flow to occur). As such, fluid flow from the inlet of the water polishing system 400 toward the first and second polishing beds 410, 412 is restricted from flowing toward the center of the first transfer line 428 due to the orientation of the first and second check valves 432, 434.

[0065] Additionally, third and fourth check valves 436, 438 positioned in a second transfer line 430 between the first and second polishing beds 410, 412 are arranged to only allow flow from the exit of the respective polishing bed toward the center of the second transfer line 430 (as long as the pressure differential allows for the flow to occur).

[0066] As such, in the parallel configuration, in addition to fluid from the first bed polished water stream and the second bed polished water stream flowing out of the outlet line 440 of the polishing system 400 via the third and fourth open on-off valves 406, 408 in the first and second outlet lines 446, 448, additional fluid is configured to initially flow through the third check valve 436 in the second transfer line 430 and the fourth check valve 438 in the second transfer line 430. This combined stream is configured to flow through a central connection line 426 between the first and second transfer lines 428, 430 toward the first and second check valves 432, 434. In this configuration, the first and second check valves 432, 434 restrict any further fluid flow through the first and second check valves 432, 434 due to the pressure differential across the check valves. That is, the fluid within the central connection line 426 is at the reduced / lower pressure in comparison to the fluid on the opposite sides of the first and second checkvalves 432, 434 in inlet lines 402, 404, which is at the starting / inlet pressure. As such, once the central connection line 426 and second transfer line 430 are filled with the polished water exiting from the first and second polishing beds 410, 412, all fluid transfer then is directed out of the polishing system through the outlet 440.

[0067] Figure 5C depicts an example of a flow pattern for a series configuration. In this example, the first on-off valve 402 is arranged in an open position to direct the first stream in the first inlet line 422 toward the inlet of the first polishing bed 410, while the second on- off valve 404 is arranged in a closed position to block the second stream in the second inlet line 424 from entering the second polishing bed 412.

[0068] In this configuration, the first and second check valves 432, 434 positioned in a first transfer line are arranged to only allow flow from a center of the first transfer line 428 toward the respective polishing bed (as long as the pressure differential allows for the flow to occur). As such, the fluid flow in the first stream in the first inlet line 422 from the inlet 420 of the water polishing system 400 toward the first polishing bed 410 is restricted from flowing toward the center of the first transfer line 428.

[0069] After the outlet of the first polishing bed 410 in the first outlet line 446, the third on-off valve 406 is arranged in a closed position to direct the first bed polished water stream toward the inlet of the second polishing bed 412 through the third check valve 436 in the second transfer line 430, then through the central connection line 426, and then through the second check valve 434 in the first transfer line 428. This transfer occurs due the orientation of the various check valves as well as the operating pressures of the fluid streams in the system. Specifically, the third check valve 436 positioned in the second transfer line 430 is arranged to only allow flow from the exit of first polishing bed 410 toward the center of the second transfer line 430 (as long as the pressure differential allows for the flow to occur), which in this arrangement, allows for such a transfer toward the center of the second transfer line 430.

[0070] Additionally, the fourth check valve 438 positioned in the second transfer line 430 is arranged to only allow flow from the exit of second polishing bed 412 toward the center of the second transfer line 430 (as long as the pressure differential allows for the flow to occur). In this arrangement, the first bed polished water stream in the center of the second transfer line 430 is restricted from flowing toward the second outlet line 448 and the fourth on-off valve 408 due to the orientation of the fourth check valve 438. As such, the first bed polished water stream from the first polishing bed 410 is transferred along the central connection line 426 toward the first transfer line 428. Due to the pressure differential between the water stream in the central connection line 426 and the first stream in the first inlet line 422 entering the first polishing bed 410, the water stream is in the central connection line 426 is blocked from moving through the first check valve 432 back toward the first inlet line 422 and the first polishing bed 410. Instead, the first bed polished water stream moves through the second check valve 434 toward the second inlet line 424 and the inlet of the second polishing bed 412 (as the pressure differential betweenthe water in the central connection line 426 and the water in the second inlet line 424 allows such flow to occur).

[0071] Following further treatment of the water within the second polishing bed 412, after the outlet of the second polishing bed 412 within the second outlet line 448, the fourth on-off valve 408 is arranged in an open position to direct the second bed polished water stream through the outlet line 440 of the water polishing system 400. The second bed polished water stream in the second outlet line 448 has a further reduced pressure due to a further pressure drop via processing / treatment in the second polishing bed 412. Water at the outlet of the second polishing bed in the second outlet line 448 does not flow through the fourth check valve 438 in the second transfer line 430 toward the central connection line 426 due to the pressure differential between the water on the two sides of the check valve 438. Specifically, the further reduced pressure in the second bed polished water stream within the second outlet line 448 is less than the reduced pressure in the first bed polished water stream in the second transfer line 430 near the central connecting line 426, therein restricting flow through the fourth check valve 438.

[0072] As noted above, while Figure 5C depicts an example of a fluid flow arrangement in series, the arrangement may be reversed, wherein the second polishing bed 412 is positioned first / upstream from the first polishing bed 410. In such an arrangement, the first and fourth on-off valves are closed, and the second and third on-off valves are open. The reduced complexity of this arrangement is advantageous versus the programing and control required for the three-way valves to operate in the examples of Figures 4A-4C, as described above.

[0073] One or more embodiments of the disclosure may be referred to herein, individually and / or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any particular invention or inventive concept. Moreover, although specific embodiments have been illustrated and described herein, any subsequent arrangement designed to achieve the same or similar purpose may be substituted for the specific embodiments shown. This disclosure is intended to cover any and all subsequent adaptations or variations of various embodiments.Combinations of the above embodiments, and other embodiments not specifically described herein, are apparent to those of skill in the art upon reviewing the description.

[0074] As used herein, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise.

[0075] As used herein, "for example," "for instance," "such as," or "including" are meant to introduce examples that further clarify more general subject matter. Unless otherwise expressly indicated, such examples are provided only as an aid for understanding embodiments illustrated in the present disclosure and are not meant to be limiting in any fashion. Nor do these phrases indicate any kind of preference for the disclosed embodiment.

[0076] The Abstract of the Disclosure is provided to comply with 37 C.F.R. §1.72(b) and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. In addition, in the foregoing Detailed Description, various features may be grouped together or described in a single embodiment for the purpose of streamlining the disclosure. This disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive subject matter may be directed to less than all of the features of any of the disclosed embodiments. Thus, the following claims are incorporated into the Detailed Description, with each claim standing on its own as defining separately claimed subject matter.

[0077] It is intended that the foregoing detailed description be regarded as illustrative rather than limiting and that it is understood that the following claims including all equivalents are intended to define the scope of the disclosure. The claims should not be read as limited to the described order or elements unless stated to that effect. Therefore, all embodiments that come within the scope and spirit of the following claims and equivalents thereto are claimed as the disclosure.

Claims

CLAIMS1. A water polishing system comprising: a first polishing bed and a second polishing bed, wherein each polishing bed of the first and second polishing beds is configured to remove impurities from an inlet water stream to the water polishing system; a first on-off valve positioned in a first inlet line upstream from the first polishing bed and configured to control a flow of water to the first polishing bed; a second on-off valve positioned in a second inlet line upstream from the second polishing bed and configured to control a flow of water to the second polishing bed; a third on-off valve positioned in a first outlet line downstream from the first polishing bed and configured to control flow of water from the first polishing bed; a fourth on-off valve positioned in a second outlet line downstream from the second polishing bed and configured to control flow of water from the second polishing bed; a first transfer line connecting the first inlet line and the second inlet line downstream from the first on-off valve and the second on-off valve and upstream from the first polishing bed and the second polishing bed; a second transfer line connecting the first outlet line and the second outlet line downstream from the first polishing bed and the second polishing bed and upstream from the third on-off valve and the fourth on-off valve; a central connection line connecting the first transfer line and the second transfer line; a first checkvalve positioned in the first transfer line between the first inlet line and the central connection line and oriented within the first transfer line to restrict flow toward the central connection line; a second check valve positioned in the first transfer line between the second inlet line and the central connection line and oriented within the first transfer line to restrict flow toward the central connection line; a third check valve positioned in the second transfer line between the first outlet line and the central connection line and oriented within the second transfer line to restrict flow toward the first outlet line; anda fourth check valve positioned in the second transfer line between the second outlet line and the central connection line and oriented within the second transfer line to restrict flow toward the second outlet line.

2. The water polishing system of claim 1, further comprising: a central outlet line connecting the first outlet line downstream of the third on-off valve and the second outlet line downstream of the fourth on-off valve, wherein the central outlet line is configured to transfer a polished water stream out of the water polishing system.

3. The water polishing system of claim 2, wherein the polished water stream is configured to be transferred to one or more electrochemical stacks of an electrochemical plant.

4. The water polishing system of claim 2, wherein water in the polished water stream has a water resistivity of at least 2 Megaohms.

5. The water polishing system of claim 2, wherein water in the polished water stream has a water resistivity of at least 12 Megaohms.

6. The water polishing system of claim 1, wherein the water polishing system comprises no three-way valves.

7. The water polishing system of claim 1, wherein the inlet water stream to the water polishing system is received from a cooling system within an electrochemical plant.

8. The water polishing system of claim 1, wherein water flow within the water polishing system is configured to be arranged in a parallel flow configuration such that a first portion of water from the inlet water stream enters the first polishing bed and a second portion of water from the inlet water stream enters the second polishing bed.

9. The water polishing system of claim 1, wherein water flow within the water polishing system is configured to be arranged in a series flow configuration such that the inlet water stream enters the first polishing bed and is transferred from an outlet of the first polishing bed to an inlet of the second polishing bed.

10. The water polishing system of claim 1, wherein the first polishing bed and the second polishing bed individually comprises a polishing composition configured to remove the impurities within the inlet water stream.

11. The water polishing system of claim 10, wherein the polishing composition within each polishing bed is an ion exchange resin.

12. A water polishing system comprising: an inlet water line configured to transfer water within an industrial system; a cooling supply line configured to receive a first portion of the water within the inlet water line; a cooling bypass line configured to receive a second portion of the water within the inlet water line; a cooling supply valve positioned within the cooling supply line configured to control a flow rate of the first portion of the water; a cooling bypass valve positioned within the cooling bypass line configured to control a flow rate of the second portion of the water; a cooling system positioned downstream of the cooling supply valve and configured to receive the first portion of the water and cool the first portion of water to provide a cooled water stream; and at least one polishing bed positioned downstream of the cooling system and configured to receive a first portion of the cooled water stream, wherein the at least one polishing bed is configured to remove impurities from the cooled water stream to provide a polished water stream, and wherein the polished water stream is transferred to a unit within the industrial system.

13. The water polishing system of claim 12, wherein the industrial system is an electrochemical system, and wherein the unit within the industrial system is at least one electrochemical stack.

14. The water polishing system of claim 12, further comprising: at least one main pump positioned within the inlet water line upstream of a split between the cooling bypass line and the cooling supply line.

15. The water polishing system of claim 12, further comprising: at least one polishing pump positioned downstream of the at least one polishing bed, wherein the at least one polishing pump is configured to transfer the polished water stream to the unit within the industrial system.

16. The water polishing system of claim 15, wherein the at least one polishing pump is further configured to assist in controlling a pressure drop across the at least one polishing bed.

17. The water polishing system of claim 12, wherein a second portion of the cooled water stream is diverted to the cooling bypass line downstream of the cooling bypass valve, and wherein the second portion of the cooled water stream is not treated within the at least one polishing bed.

18. The water polishing system of claim 12, wherein the polished water stream is joined with the cooling bypass line downstream of the cooling bypass valve prior to transfer to the unit within the industrial system.

19. The water polishing system of claim 12, further comprising: an additional water line providing an additional water source to the water polishing system, wherein the additional water line is connected to the water polishing system downstream of the cooling system.

20. The water polishing system of claim 19, wherein the additional water line is connected to the water polishing system upstream of the at least one polishing bed.

21. The water polishing system of claim 20, wherein all of the additional water source is provided to the at least one polishing bed.

22. The water polishing system of claim 19, wherein the additional water source is a makeup water source.

23. The water polishing system of any of claims 12-22, wherein the at least one polishing bed comprises a first polishing bed and a second polishing bed, and wherein the water polishing system further comprises: a first on-off valve positioned in a first inlet line upstream from the first polishing bed and configured to control flow of water to the first polishing bed; a second on-off valve positioned in a second inlet line upstream from the second polishing bed and configured to control a flow of water to the second polishing bed; a third on-off valve positioned in a first outlet line downstream from the first polishing bed and configured to control a flow of water from the first polishing bed; a fourth on-off valve positioned in a second outlet line downstream from the second polishing bed and configured to control flow of water from the second polishing bed;a first transfer line connecting the first inlet line and the second inlet line downstream from the first on-off valve and the second on-off valve and upstream from the first polishing bed and the second polishing bed; a second transfer line connecting the first outlet line and the second outlet line downstream from the first polishing bed and the second polishing bed and upstream from the third on-off valve and the fourth on-off valve; a central connection line connecting the first transfer line and the second transfer line; a first check valve positioned in the first transfer line between the first inlet line and the central connection line and oriented within the first transfer line to restrict flow toward the central connection line; a second check valve positioned in the first transfer line between the second inlet line and the central connection line and oriented within the first transfer line to restrict flow toward the central connection line; a third check valve positioned in the second transfer line between the first outlet line and the central connection line and oriented within the second transfer line to restrict flow toward the first outlet line; and a fourth check valve positioned in the second transfer line between the second outlet line and the central connection line and oriented within the second transfer line to restrict flow toward the second outlet line.

24. The water polishing system of claim 23, further comprising: a central outlet line connecting the first outlet line downstream of the third on-off valve and the second outlet line downstream of the fourth on-off valve, wherein the central outlet line is configured to transfer the polished water stream to the unit of the industrial system.

25. The water polishing system of claim 24, wherein the polished water stream is configured to be transferred to one or more electrochemical stacks of an electrochemical plant.

26. The water polishing system of claim 24, wherein water in the polished water stream has a water resistivity of at least 2 Megaohms.

27. The water polishing system of claim 24, wherein water in the polished water stream has a water resistivity of at least 12 Megaohms.

28. The water polishing system of claim 23, wherein the water polishing system comprises no three-way valves.

29. The water polishing system of claim 23, wherein water flow within the water polishing system is configured to be arranged in a parallel flow configuration such that a first portion of water from the inlet water stream enters the first polishing bed and a second portion of water from the inlet water stream enters the second polishing bed.

30. The water polishing system of claim 23, wherein water flow within the water polishing system is configured to be arranged in a series flow configuration such that the inlet water stream enters the first polishing bed and is transferred from an outlet of the first polishing bed to an inlet of the second polishing bed.

31. The water polishing system of claim 23, wherein the first polishing bed and the second polishing bed individually comprises a polishing composition configured to remove the impurities within the inlet water stream.

32. The water polishing system of claim 31, wherein the polishing composition within each polishing bed is an ion exchange resin.

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