Photonic fanout interposer
Using glass substrates with low-loss waveguides and integrated PICs addresses the limitations of SOI wafers, improving yield and reducing costs for high-performance optical communication systems.
WO2026128363A1PCT designated stage Publication Date: 2026-06-18LIGHTMATTER INC
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- LIGHTMATTER INC
- Filing Date
- 2025-12-08
- Publication Date
- 2026-06-18
Smart Images
Figure US2025058578_18062026_PF_FP_ABST
Abstract
Described herein are systems and techniques for providing photonic devices having glass substrates for use in an optical interconnect system. The photonic devices comprise a glass substrate and one or more optoelectronic assemblies coupled through openings of the glass substrate. Waveguides of the optoelectronic assemblies may be optically coupled with waveguides of the glass substrate forming an optical network through the glass substrate. The assembly waveguides may be optically coupled to the glass waveguides through pluggable optical couplers, evanescent coupling, and / or edge coupling.
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