Recyclable packaging material

Abstract

A paper-based packaging material is shown and described herein. In aspects and embodiments, the paper-based packaging material comprises at least on paper layer, and at least one layer comprising a thermally conductive material. A paper-based packaging material is provided that is suitable for use in heat seal processing operations to form a package enclosing a product of choice.

Description

PATENT APPLICATIONDocket No.: IR-9649 55334-00021RECYCLABLE PACKAGING MATERIALCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to and the benefit of U.S. Provisional Patent Application No. 63 / 730,130, filed on December 10, 2024, titled “RECYCLABLE PACKAGING MATERIAL.” the disclosure of which is incorporated herein by reference in its entirety.FIELD OF INVENTION

[0002] The present technology relates to a packaging material, packages employing such materials, and methods for making the same. In particular, the present technology relates to recyclable packaging materials comprising of paper. The packaging material is configured for undergoing heat sealing operations to form a package while maintaining relatively high processing speeds.BACKGROUND

[0003] Product packaging takes on a variety of forms depending on the type of product being packaged. In some applications, products having a shelflife (e.g., food, pharmaceuticals) are wrapped or covered with a flexible packaging film that is heat-sealed to effect an air and moisture-tight seal. Many packagers utilize non-recyclable flexible packaging films, which are unsuitable for processing through conventional recyclable streams. This is problematic insofar as it contributes to waste generation and leads to the depletion of raw materials and natural resources. Using eco-friendly, recyclable / sustainable materials for flexible films (e.g., recyclable paper or a recyclable polyolefin) would resolve these issues. Use of such materials, however, is not practicable for several reasons. For example, using recyclable paper as a flexible packaging film requires that a majority of the film (and perhaps even at least 80%) be paper by weight to minimize the contamination effect of any sealant applied thereon (e.g., when sealing the product package). This requires the use of heavy paper stock as a base material to134571837.1 37249611.1offset the contamination effect of any sealant applied thereon. Paper is a heat insulator, and achieving a proper heat seal with a conventional heat sealing mechanism (e.g.. heat-sealing rollers / jaws) requires a considerable amount of time for heat to transfer through the paper to the sealant disposed on an inner surface thereof, which consequently hinders the throughput of the packaging line.

[0004] In a related manner, using recyclable plastic as a flexible packaging film requires that the film be almost or entirely comprised of polyethylene (PE) materials ( e.g., high-density polyethylene (HDPE)). Generally, this is because PE materials are generally the only flexible film material accepted in most recycling streams. Using a recyclable plastic film, however, is complex insofar as the melting temperature of the film is only slightly higher than that of the sealant applied thereon, e.g., by about 20 degrees F. This is problematic because a conventional heat sealing mechanism operates at a temperature that would otherwise melt the plastic film, causing it to stick to the sealing surface. Consequently, the temperature of the heat sealing mechanism must be decreased to avoid melting the film, which undesirably produces a bottleneck in the packaging line.SUMMARY

[0005] The following presents a summary of this disclosure to provide a basic understanding of some aspects. This summary is intended to neither identify key or critical elements nor define any limitations of embodiments or claims. Furthermore, this summary may provide a simplified overview of some aspects that may be described in greater detail in other portions of this disclosure.

[0006] Provided is a paper-based packaging material suitable for use in heat seal processing operations to form a package enclosing a product of choice. In aspects and embodiments, the paper-based packaging material comprises at least one paper layer, and at least one layer comprising a thermally conductive material. In embodiments, a paper layer in the packaging material comprises a thermally conductive material. In embodiments, the heat seal layer comprises a thermally conductive additive. Applicant has found that incorporating a thermally conductive additive in one or more layers of the packaging material can enhance thermal transfer through the packaging material to facilitate heat sealing of the packaging material to form all or part of a package. In particular, incorporation of a thermally conductive material allows for more efficient thermal transfer to form packing materials via heat sealing processing at relatively high line processing speeds.234571837.137249611.1

[0007] In one aspect, provided is a packaging material comprising: a paper layer having an upper surface and a lower surface, and a heat sealing material disposed on a surface of the packaging material, wherein at least one layer of the packaging material comprises a thermally conductive material.

[0008]

[0009] In one embodiment, the paper layer comprises the thermally conductive material.

[0010] In one embodiment in accordance with any previous embodiment, the heat sealing material comprises the thermally conductive material.

[0011] In one embodiment in accordance with any previous embodiment, the packaging material comprises a print layer disposed on an outer surface of the packaging material.

[0012] In one embodiment, the print layer comprises the thermally conductive material.

[0013] In one embodiment in accordance with any previous embodiment, the packaging material comprises an over print varnish layer disposed on an outer surface of the packaging material.

[0014] In one embodiment, the over print varnish layer comprises the thermally conductive material.

[0015] In one embodiment in accordance with any previous embodiment, the paper layer comprises two or more paper layers.

[0016] In one embodiment, each of the two or more paper layers comprises the thermally conductive material.

[0017] In one embodiment in accordance with any previous embodiment, adjacent paper layers of the two or more paper layers are adhered via an adhesive layer.

[0018] In one embodiment in accordance with any previous embodiment, the adhesive layer comprises the thermally conductive material.

[0019] In one embodiment in accordance with any previous embodiment, the heat sealing material is disposed on the lower surface of the paper layer.

[0020] In one embodiment in accordance with any previous embodiment, the packaging material comprises a polymeric film layer disposed adjacent the lower surface of the paper layer.

[0021] In one embodiment in accordance with any previous embodiment, the polymeric film layer has an upper surface and a lower surface, wherein the upper surface is334571837.137249611.1oriented toward the lower surface of the paper layer, and the heat sealing material is disposed on a lower surface of the polymeric film layer.

[0022] In one embodiment, in accordance with any previous embodiment, the polymeric film layer comprises a recyclable polymer.

[0023] In one embodiment, in accordance with any previous embodiment, the polymeric film layer comprises polyethylene.

[0024] In one embodiment, the heat sealing material is disposed on a surface of the polymeric film layer.

[0025] In one embodiment in accordance with any previous embodiment, the thermally conductive material is selected from a thermally conductive filler, a thermally conductive polymer, or a combination thereof.

[0026] In one embodiment in accordance with any previous embodiment, the thermally conductive material is selected from boron nitride, zinc oxide, glass fiber, glass flake, clays, exfoliated clays, calcium carbonate, talc, mica, wollastonite, aluminosilicate, alumina, aluminum nitride, graphite, metallic powders or flakes of aluminum, copper, bronze, or brass, fibers or whiskers of aluminum, copper, bronze, brass, silicon carbide, silicon nitride, aluminum nitride, alumina, zinc oxide, carbon nanotubes, graphene, boron nitride nanoparticles, boron nitride nanotubes, boron nitride nanosheets, polyaniline, polypyrrole, polyacetylene, polypropylene, polyvinylchloride, polyparaphenylene, or a combination of two or more thereof.

[0027] In one embodiment in accordance with any previous embodiment, the thermally conductive material has a thermal conductivity at 25° C. of at least about 0.5 W / m K.

[0028] In one embodiment in accordance with any previous embodiment, the thermally conductive material has a thermal conductivity at 25° C. of about 0.5 W / m K to about 30 W / m K.

[0029] In one embodiment in accordance with any previous embodiment, the packaging material is recyclable.

[0030] In another aspect, provided is a package comprising the packaging material of any of the previous aspects or embodiments.

[0031] In one embodiment, the package is in the form of a flexible package.

[0032] In one embodiment, the flexible package is selected from a wrapper, a bag, or a pouch.

[0033] In one embodiment, the package comprises a container body and a lid disposed on the container body, and wherein the lid is formed from the packaging material.434571837.137249611.1

[0034] In one embodiment in accordance with any previous embodiment, the package is recyclable.

[0035] The following description and the drawings disclose various illustrative aspects. Some improvements and novel aspects may be expressly identified, while others may be apparent from the description and drawings.BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings illustrate various systems, apparatuses, devices and related methods, in which like reference characters refer to like parts throughout, and in which:

[0037] FIG. 1 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology;

[0038] FIG. 2 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology;

[0039] FIG. 3 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology;

[0040] FIG. 4 is a cross-sectional view of a package formed from a packaging film in accordance with the present technology;

[0041] FIG. 5 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology;

[0042] FIG. 6 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology7;

[0043] FIG. 7 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology;

[0044] FIG. 8 is a cross-sectional view of a package formed from a packaging film in accordance with the present technology;

[0045] FIG. 9 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology;

[0046] FIG. 10 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology;

[0047] FIG. 11 is a cross-sectional view of a packaging film in accordance with an embodiment of the present technology; and

[0048] FIG. 12 is a cross-sectional view of a package formed from a packaging film in accordance with an embodiment of the present technology.534571837.137249611.1DETAILED DESCRIPTION

[0049] Reference will now be made to exemplary embodiments, examples of which are illustrated in the accompanying drawings. It is to be understood that other embodiments may be utilized and structural and functional changes may be made. Moreover, features of the various embodiments may be combined or altered. As such, the following description is presented by way of illustration only and should not limit in any way the various alternatives and modifications that may be made to the illustrated embodiments. In this disclosure, numerous specific details provide a thorough understanding of the subject disclosure. It should be understood that aspects of this disclosure may be practiced with other embodiments not necessarily including all aspects described herein, etc.

[0050] As used herein, the words '‘example” and “exemplary” means an instance, or illustration. The words “example” or “exemplary” do not indicate a key or preferred aspect or embodiment. The word “or” is intended to be inclusive rather than exclusive, unless context suggests otherwise. As an example, the phrase “A employs B or C,” includes any inclusive permutation (e.g., A employs B; A employs C; or A employs both B and C). As another matter, the articles “a” and “an” are generally intended to mean “one or more” unless context suggest otherwise.

[0051] As used herein, the word “comprise” and variations such as “comprising"’ or “comprises” will be understood to imply the inclusion of a stated integer or step or group of integers or steps but not the exclusion of any other integer or step or group of integers or steps.

[0052] As used herein, the words “substantially,” “predominantly,” “about,” and variations thereof are intended to note that the described features are equal or approximately equal to a value or characteristic, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors. For example, the term “substantially rectangular” is intended to denote structure that is rectangular or approximately rectangular. As another example, the terms “substantially,” “predominately,” “about,” and variations thereof can denote values or characteristics that are exact or within 15% of exact, for example within 10% of exact, within 3% of exact, or within 1% of exact.

[0053] As used herein, a packaging material in accordance with the present technology is considered to be recyclable if it meets the standard for recyclability according to the “Voluntary Standard for Repulping and Recycling Corrugated Fiberboard Treated to Improve its Performance in the Presence of Water and Water Vapor” (Revised August 16, 2013), which is incorporated herein by reference in its entirety.6 34571837.1 37249611.1

[0054] In the specification and claims, numerical values of ranges including endpoints of various ranges and subranges for a particular component can be combined to form new and non-specified ranges.

[0055] Provided is a packaging material comprising at least one layer comprising paper, and a heat seal layer, wherein at least one of the layers of the packaging material comprises a thermally conductive material. Applicant has found that employing a thermally conductive material in one of the layers of the packaging material can provide sufficient transfer of heat through the bulk of the packaging material to the heat seal layer to allow for efficient transfer of thermal energy to effect sealing at relatively fast processing speeds. Depending on the particular layer of the material, the thermally conductive material may be an additive added to a base composition of the layer, or the material for forming a particular layer may itself be thermally conductive. Packaging materials in accordance with the present technology provide a recyclable, paper-based packaging material that is suitable for processing to form as a package using heat sealing techniques without significant or even any reduction in processing speeds.

[0056] The packaging material is generally provided as a laminate construction comprising at least one layer comprising paper. The packaging material may comprise one or more paper layers. The packaging material comprises a heat seal material disposed on an inner surface of the packaging material. As is discussed further herein, the packaging material include various other layers including, but not limited to, a polymeric film layer, barrier layers, print layers, overprint varnish layers, and the like. Generally, one or more of such layers may include a thermally conductive material. In embodiments, where a packaging material comprises a poly meric film layer, the polymeric film does not include a thermally conductive material.

[0057] The recyclable flexible packaging film may comprise a recyclable paper, for example, a commercial fiber paper that is highly calendared. The paper can have a weight as desired for a particular purpose or intended application. In embodiments, the paper can have a weight of from about 20 gsm to about 500 gsm, from about 50 gsm to about 250 gsm, or from about 100 gsm to about 200 gsm. In embodiments, the paper is a food grade paper. Food grade papers can be uncoated, single coated, double coated. The paper can be natural colored or include one or more pigments.

[0058] It will be appreciated that the paper material may be modified or have incorporated therein various fillers or other materials to provide or impart certain properties to the paper material. In embodiments, the paper material may have a polymer material734571837.137249611.1incorporated in the material. The polymer material incorporated in the paper material should generally be provided to allow for the paper to still be recyclable if desired. Polymers that may be included in the paper material may include those described herein with respect to the optional polymeric film layers.

[0059] The heat seal layer includes a sealant material suitable for forming a bond or seal to itself or a layer of the packaging film upon exposure to heat and pressure. Examples of heat sealant materials include, but are not limited to, a polyolefin, a polyurethane, a polyester, an ethylene / unsaturated ester copolymer, an alkyl-aromatic ester, and the like. Examples of suitable heat seal materials include, but are not limited to, polyethylene, polypropylene, polyethylene terephthalate, polylactic acid, ethylene / methyl acrylate copolymer, ethylene / methyl methacrylate copolymer, ethylene / ethyl acrylate copolymer, ethylene / ethyl methacrylate copolymer, ethylene / butyl acrylate copolymer, ethylene / 2-ethylhexyl methacrylate copolymer, ethylene / vinyl acetate copolymer„and the like. In one embodiment, the sealant is selected from a polyolefin such as polyethylene or polypropylene. In one embodiment, the sealant is selected from a low density polyethylene (LDPE). In some embodiments, the sealant may comprise an ethylene vinyl acetate, or a hot melt adhesive.

[0060] The heat seal layer can be disposed as a continuous layer or discontinuous layer. A discontinuous layer may also be referred to as a patterned layer. The continuous layer may cover substantially the entire surface of the polymer film. In embodiments of a discontinuous seal layer, the seal layer may be disposed in specific regions of the polymer film that will become the seal regions such as, for example ends of the packaging material that will be sealed to form the ends of the finished package, areas that will form a fin if a fin seal is desired, or areas to be adhered to a container body where the packaging material will be used to form a lid on a package.

[0061] In some embodiments, the heat-seal layer may include at least two component layers. For example, the heat-seal layer may comprise a base layer to provide the mechanical strength and a seal layer to provide sealing capability7. In some aspects, the seal layer may have a melting point or softening point below that of the base layer.

[0062] The heat seal layer can be applied as a wet layer and then dried. The heat seal layer can be applied by any suitable method including, but not limited to, rotogravure printing, lamination, extrusion, coating, or the like.

[0063] The heat seal layer can be applied in any suitable coat weight so as to provide a suitable seal upon heating. In embodiments, the heat seal layer can be applied in an amount of from about 2 pounds per ream (Ib / R) to about 6 pounds per ream (about 3.2 grams per square834571837.137249611.1meter (GSM) to about 8.2 GSM), from about 2.5 pounds per ream to about 4.5 pounds per ream (about 4 GSM to about 7.3 GSM), or from about 3 pounds per ream to about 4 pounds per ream (about 4.8 GSM to about 6.5 GSM). The levels of sealing material employed in the packaging film are such that the packaging film is still capable of being recycled.

[0064] The seal layer may also be such that the seal provided is a “peelable” seal, i.e., a seal that can be separated manually by a consumer or user, by hand, without the need for a tool.

[0065] The packaging material may optionally comprise a polymeric film layer. In embodiments, the polymeric film layer may be positioned as one of the lower layers that will be positioned toward the interior of the package formed from the packaging material. In embodiments comprising a polymeric film layer, the heat seal material may be disposed on a surface of the polymeric film. In embodiments, the polymeric film is formed from a recyclable polymeric material such that the packaging film can still be recyclable.

[0066] Examples of suitable polymers for forming the polymeric film layer include, but are not limited to, a polyolefin, a polyester, a polyamide, and the like. Examples of suitable polyolefins include, but are not limited to polyethylene, polypropylene, polybutylene, and the like. In one embodiment, the polyolefin is selected from polyethylene. The polyethylene is not particularly limited and can be selected from various types of polyethylene include, for example, a high density polyethylene, a medium density polyethylene, or a low density polyethylene. It will be appreciated that the polymer film layer can be formed from a blend of polymers, e.g., a blend of different polyolefins, a blend of a particular polyolefin (e.g., a blend of different polyethylenes), and the like.

[0067] Examples of suitable polyester materials include, but are not limited to, polyethylene terephthalate (PET), polyethylene terephthalate glycol (PETG), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyethylene isophthalate (PEI), poly cycloterephthalate (PCT), polytriethylene terephthalate (PT), and the like.

[0068] The polymeric film layer may be provided as a single film layer or may be provided as a laminate comprising two or more film layers. A polymeric film laminate may comprise films of the same or different types of polymers.

[0069] The thickness of the polymer film layer can be selected as desired for a particular purpose or intended application. In embodiments, the polymer film layer has a thickness of from about 0.2 mil to about 2 mil, from about 0.3 mil to about 1.8 mil, from about 0.5 mil to about 1.5 mil, from about 0.7 mil to about 1.2 mil, or from about 0.8 mil to about 1 mil.934571837.137249611.1

[0070] The polymeric film material may or may not comprise the thermally conductive material. In embodiments, the polymeric film may comprise the thermally conductive material. In other embodiments, the polymeric film materials employed as part of the laminate construction sufficiently conduct thermal energy such that it is not necessary to include thermally conductive additives for those layers.

[0071] It will be appreciated that the packaging material can comprise one or more adhesive layers to adhere adjacent layers of the packaging laminate together. The adhesive is not particularly limited and can be selected by those skilled in the art for adhering adjacent layers of selected materials. Examples of suitable adhesives include, but are not limited to, acrylic adhesives, polyolefins, natural rubber, synthetic rubber, st renic polymers, silicones, polyurethanes, and the like. Some examples include, but are not limited to, modified polyolefins, which are mostly based on LDPE or LLDPE co-polymers or, graft co-polymers with functional-group containing monomer units, such as carboxylic or glycidyl functional groups, e.g. (meth)acrylic acid monomers or maleic anhydride (MAH) monomers, (i.e. ethylene acrylic acid copolymer (EAA) or ethylene methacrylic acid copolymer (EMAA)), ethylene-glycidyl(meth)acrylate copolymer (EG(M)A) or MAH-grafted polyethylene (MAH- g-PE). When the packaging material is to be used for food packaging, the adhesives are generally selected from food-grade materials.

[0072] At least one or more of the layers of the packaging material comprises a thermally conductive material. In embodiments, the thermally conductive material is selected from a thermally conductive additive material such as a thermally conductive filler, e.g., thermally conductive particles, or a thermally conductive polymer. Examples of suitable thermally conductive filler materials include, but are not limited to, boron nitride, zinc oxide, glass fiber, glass flake, clays, exfoliated clays, calcium carbonate, talc, mica, wollastonite, aluminosilicate, alumina, aluminum nitride, graphite, metallic powders or flakes of aluminum, copper, bronze, or brass, fibers or whiskers of aluminum, copper, bronze, brass, silicon carbide, silicon nitride, aluminum nitride, alumina, zinc oxide, or a combination of two or more thereof. Still other examples of suitable thermally conductive fillers include, but are not limited to, carbon nanotubes, graphene, boron nitride nanoparticles, boron nitride nanotubes, boron nitride nanosheets, boron nitride fibers, zinc oxide nanotubes, or a combination of two or more thereof.

[0073] Examples of thermally conductive polymers include, but are not limited to, polyaniline, polypyrrole, polyacetylene, polypropylene, polyvinylchloride, polyparaphenylene, and the like.1034571837.137249611.1

[0074] When the packaging material is to be used for food packaging, the thermally conductive material is generally selected from food-grade materials.

[0075] In embodiments, the thermally conductive additive has a thermal conductivity at 25° C. of at least about 0.5 W / m K, of at least about 0.7 W / m K, of at least about 1 W / m K, or at least about 3 W / m K, or at least about 5 W / m K, or at least about 10 W / m K, or at least about 20 W / m K, or at least about 30 W / m K. In one embodiment, the thermally conductive material has a thermal conductivity of from about 0.5 W / m K to about 30 W / m K, from about 1 W / m K to about 25 W / m K, from about 5 W / m K to about 20 W / m K, or from about 10 W / m K to about 15 W / m K.

[0076] The size of the thermally conductive additive can be selected as desired. In embodiments, the thermally conductive additive has an average particle size of about 0.05 pm to about 500 pm; from about 0.5 pm to about 250 pm; from about 1 pm to about 150 pm; from about 5 pm to about 100 pm; even from about 10 pm to about 30 pm. In embodiments, the thermally conductive additive has an average particle size of about 10 nm to about 750 nm, from about 25 nm to about 500 nm, from about 50 nm to about 250 nm, or from about 75 nm to about 150 nm. Here as elsewhere in the specification and claims, numerical values can be combined to form non-specified ranges.

[0077] A particularly suitable thermally conductive filler is boron nitride. The form of the boron nitride used for the thermally conductive filler is not particularly limited. Boron nitride is commercially available from a number of sources, including, but not limited to, Momentive Technologies, Sintec Keramik, Kawasaki Chemicals, St. Gobain Ceramics, etc.

[0078] The form of boron nitride used in the thermally conductive filler is not limited and can be chosen from, for example, amorphous boron nitride (referred to herein as a-BN); boron nitride of the hexagonal system, having a laminated structure of hexagonal-shaped meshed layers (referred to herein as h-BN); or a turbostratic boron nitride, having randomly oriented layers (referred to herein as t-boron nitride); platelet boron nitride; boron nitride fibers; boron nitride agglomerates; boron nitride nanotubes, etc., or a combination of two or more thereof. In one embodiment, the boron nitride is in the platelet form, turbostratic form, hexagonal form, or mixtures of two or more thereof.

[0079] The size of the boron nitride particles employed in forming the thermally conductive filler can be selected as desired for a particular purpose or intended use. In one embodiment, the particle size can range from nanometers to micron size particles In one embodiment, the boron nitride powder has an average particle size of about 0.05 pm to about 500 pm; from about 0.5 pm to about 250 pm; from about 1 pm to about 150 pm; from about 51134571837.137249611.1pm to about 100 pm; even from about 10 pm to about 30 pm. In one embodiment, the boron nitride powder has an average particle size of at least 50 pm. In one embodiment, the boron nitride powder comprises irregularly shaped agglomerates of hBN platelets, having an average particle size of above 10 pm. In still other embodiments, the boron nitride material has an average particle size of about 10 nm to about 750 nm, from about 25 nm to about 500 nm, from about 50 nm to about 250 nm, or from about 75 nm to about 150 nm.

[0080] The thermally conductive material may be provided in an amount sufficient to provide the packaging material with a thermal conductivity suitable for allowing transfer of heat through the bulk of the packaging material to the heat sealing layer. In embodiments, a given layer of the packaging material comprises the thermally conductive material in an amount of from about 0. 1 to about 30 wt. %, from about 0.5 to about 25 wt. %, from about 1 wt.% to about 20 wt.%, from about 2 wt.% to about 18 wt.%, from about 5 wt.% to about 15 wt.%, or from about 8 wt.% to about 12 wt. % based on the weight of the layer containing the thermally conductive material. Thus, for example, if the packaging material comprises a plurality of paper layers, each paper layer comprising a thermally conductive material may independently comprise a thermally conductive material in the foregoing amounts.

[0081] The thermally conductive material can be added to a material of a given layer at any appropriate stage during processing and formation of the laminate structure. For materials that are added from solution (e.g., adhesive layers, print layers, heat seal layers) that are dried or cured on to another layer, the composition with the thermally conductive material can be obtained from a supplier, or the thermally conductive additive can be added on site prior to processing and application of the material layer. For certain layers that may be provided from pre-formed sheets or films such as the paper layer(s) and / or the polymeric layer(s), the thermally conductive material is generally added during compounding and formation of the paper and / or poly men c film.

[0082] Figure 1 shows a cross-section of a packaging material 100 having a paper layer 110, a heat seal coating layer 120, an ink layer 130 on a top surface of the paper layer, and an overprint varnish layer 140 overlying the ink layer. In the embodiment of Figure 1, the paper layer 110 and the heat seal coating layer 120 include a thermal conductive additive.

[0083] Figure 2 shows an embodiment of a package material 200 comprising a paper layer to 210 a heat seal coating layer 220 on an underside of the paper layer and ink layer 230 on an upper surface of the paper layer, and an overprint varnish layer 240 overlying the ink layer. In the embodiment of Figure 2, the heat seal coating layer, the ink layer, and the overprint varnish, each comprise a thermally conductive additive.1234571837.137249611.1

[0084] Figure 3 shows an embodiment of a packaging material 300 comprising a paper layer 310, a heat coating layer 320, an ink lay er 330 on an upper surface of the paper layer, and an overprint varnish layer 340 overlying the ink layer. In the embodiment of Figure 3, each of the paper layer, the heat seal coating layer, the ink, and the overprint varnish layer comprise a thermally conductive additive.

[0085] Figure 4 shows an embodiment of a packaging material 400 comprising a paper layer 410, a polymeric film layer 420 underlying the paper layer, a heat seal coating 430 disposed on an underside of the polymeric film, an ink layer overlying the paper layer 450, and an overprint varnish player 460 overlying the ink layer. The packaging material includes an adhesive 440 disposed between the paper layer and the polymeric film. In the embodiment of Figure 4. the paper layer, and the heat seal coating layer comprise a thermally conductive additive.

[0086] Figure 5 shows an embodiment of a packaging material 500 comprising a paper layer 510, a polymeric film layer 520 underlying the paper layer, a heat seal coating 530 disposed on an underside of the polymeric film, a print layer 550 overlying the paper layer, and an overprint varnish player 560 overlying the ink later. The packaging material includes an adhesive 540 disposed between the paper layer and the polymeric film. In the embodiment of Figure 5, the heat seal coating layer, the print layer, the adhesive layer, and the overprint varnish comprise a thermally conductive additive.

[0087] Figure 6 shows an embodiment of a packaging material 600 comprising a paper layer 610, a polymeric film layer 620 underlying the paper layer, a heat seal coating 630 disposed on an underside of the polymeric film, a print layer 650 overlying the paper layer, and an overprint varnish player 660 overlying the ink later. The packaging material includes an adhesive 640 disposed between the paper layer and the polymeric film. In the embodiment of Figure 6, the paper layer, the heat seal coating layer, the print layer, the adhesive layer, and the overprint varnish comprise a thermally conductive additive.

[0088] Figure 7 shows an embodiment of a packaging material 700 having a first paper layer 710, a second paper layer 720, a polymeric film layer 730 underlying the second paper layer, and a heat seal coating layer 740 disposed on the polymeric film. Packing material includes an ink layer 780 disposed on an upper surface of the first paper layer, and an overprint varnish 790 overlying the ink layer. The first and second paper layers are joined together by an adhesive 760. The second paper layer 720 and the polymeric film layer 730 are joined by an adhesive layer 750. In the embodiment of Figure 7, the paper layers 710 and 720, and the heat seal coating layer 740 comprise a thermally conductive additive.1334571837.137249611.1

[0089] Figure 8 shows an embodiment of a packaging material 800 having a first paper layer 810, a second paper layer 820, a polymeric film layer 830 underlying the second paper layer, and a heat seal coating layer 840 disposed on the polymeric film. The packaging material includes an ink layer 880 disposed on an upper surface of the first paper layer, and an overprint varnish 890 overlying the ink layer. The first and second paper layers are joined together by an adhesive 860. The second paper layer 820 and the polymeric film layer 830 are joined by an adhesive layer 850. In the embodiment of Figure 8, the heat seal coating layer, the adhesive layers, the print layer, and the overprint varnish layer comprise athermally conductive additive.

[0090] Figure 9 shows an embodiment of a packaging material 900 having a first paper layer 910, a second paper layer 920, a polymeric film layer 930 underlying the second paper layer, and a heat seal coating layer 940 disposed on the polymeric film. The packaging material includes an ink layer 980 disposed on an upper surface of the first paper layer, and an overprint varnish 990 overlying the ink layer. The first and second paper layers are joined together by an adhesive 960. The second paper layer 920 and the polymeric film layer 930 are joined by an adhesive layer 950. In the embodiment of Figure 9, each of the paper layers, the heat seal coating layer, the adhesive layers, the print layer, and the overprint varnish layer comprise a thermally conductive additive.

[0091] Figure 10 shows an embodiment of a packaging material 1000 having a first paper layer 1010, a second paper layer 1020, and a third paper layer 1030, a polymeric film layer 1040 underlying the paper layer 1030, and a heat seal coating layer 1050 disposed on the polymeric film. The packaging material includes an ink layer 1060 overlying the first paper layer, and an overprint varnish 1070 overlying the ink layer. The first paper layer 1010 and the second paper layer 1020 are joined by an adhesive 1015. The second paper layer 1020 and the third paper layer 1030 are joined by adhesive layer 1025. The third paper layer 1030 and the polymer film 1040 are joined by adhesive layer 1005. In the packaging material of this embodiment, each of the paper layers and the heat seal coating layer include a thermally conductive additive.

[0092] Figure 11 shows an embodiment of a packaging material 1100 having a first paper layer 1110, a second paper layer 1120. and a third paper layer 1130, a polymeric film layer 1140 underlying the paper layer 1130, and a heat seal coating layer 1150 disposed on the polymeric film. The packaging material includes an ink layer 1160 overlying the first paper layer, and an overprint varnish 1170 overlying the ink layer. The first paper layer 1110 and the second paper layer 1120 are joined by and adhesive 1115. The second paper layer 1120 and the third paper layer 1130 are joined by adhesive layer 1125. The third paper layer 1130 and1434571837.137249611.1the polymer film 1140 are joined by adhesive layer 1105. In the packaging material of this embodiment, the heat seal coating layer, the adhesive layers, the print layer, and the overprint varnish layer include a thermally conductive additive.

[0093] Figure 12 shows an embodiment of a packaging material 1200 having a first paper layer 1210, a second paper layer 1220, and a third paper layer 1230, a polymeric film layer 1240 underlying the paper layer 1230, and a heat seal coating layer 1250 disposed on the polymeric film. The packaging material includes an ink layer 1260 overlying the first paper layer, and an overprint varnish 1270 overlying the ink layer. The first paper layer 1210 and the second paper layer 1220 are joined by an adhesive 1215. The second paper layer 1220 and the third paper layer 1230 are joined by adhesive layer 1225. The third paper layer 1230 and the polymer film 1240 are joined by adhesive layer 1205. In the packaging material of this embodiment, each of the paper layers, the heat seal coating layer, the adhesive layers, the print layer, and the overprint varnish layer include a thermally conductive additive.

[0094] Where a construction comprises multiple layers of a particular category or type (e.g., multiple polymeric film layers, multiple adhesive layers, etc.), the respective layers may be of the same type of material or may be of different types of materials. Where the construction comprises multiple adhesive layers, the respective adhesive layers may be of the same type of adhesive or different types of adhesive.

[0095] The present packaging materials are provided for housing or storing a product, e.g., a food item. The present packaging materials are not configured for heating of a food product disposed therein, and the packaging materials will generally be free of a susceptor material (which is commonly employed in packages configured for heating of food via microwave energy). Rather, the packaging material is configured to facilitate heat sealing of the paper-based packaging material.

[0096] The laminate can be formed in any suitable manner. A stock material of a bulk laminate comprising the paper layer(s) and optionally any polymeric film layer may be formed by adhesively laminating the respective layers to one another. The sealant layer may be formed on a lower surface of the construction as part of a stock material or may be added just prior to or during processing of the laminate to form a package. The upper surface of the laminate can be subjected to a printing process (e.g., but not limited to, rotogravure printing, flexographic, digital printing, or the like) to apply graphics or indicia to the package. This can be done to the outermost paper layer prior or subsequent to formation of the bulk laminate (in a construction with multiple paper layers and / or polymeric film layers). The outer surface of the upper most1534571837.137249611.1paper layer may optionally be treated prior to printing to render the surface more receptive to the inks. Such treatments include corona discharge or flame treatment.

[0097] In embodiments, the packaging material may be used to form a cover or lid that is sealed to a container body by application of heat and pressure The container may be, for example, a tray, cup, or the like. The container material is not particularly limited and can be selected as desired. The container material may be, for example, flexible, semi-rigid, or rigid. Examples of suitable materials for a container include, but are not limited to. polyester, polyolefin (e.g., polyethylene, polypropylene, etc.), polystyrene, polyvinyl chloride, paper, metal, glass, ceramic, and the like. The container will ty pically have an upper surface, and the package film is sealed to the upper surface of the container. The package film is sealed to the container such that the package film can be peeled away from the container body to expose the contents of the container.

[0098] The packaging material may be employed to form all of or a portion of a package for housing one or more items. In embodiments, the packaging material may be used to form a flexible package (e.g., a pouch, bag, wrapper, or the like). Such packages can be formed using any suitable process such as, for example, vertical or horizontal flow wrapping processes. In one embodiment of a flow wrapping process, the heat sealing jaws that compress sides of the packaging material to form the end seals may be configured such that the sealing jaws will penetrate into the packaging material to a selected depth. This may allow for increased efficiency in transfer of heat to particular layers such as, for example, the paper layer(s).

[0099] In one embodiment, the packaging film can be employed to form a bag, pouch, or sachet. Such configurations are generally formed from multiple sheets of packaging film brought together to form the walls of the package. A pouch or bag may be sealed in a fin seal or lap seal configuration. A sachet may have side seals and end seals. Fitments or other closures may be sealed to any part of the recyclable film. The packaging can be formed from any suitable now known or later discovered packaging method. Examples of suitable methods for forming packaging include, but are not limited to, vertical form / fill / seal (VFFS), horizontal form / fill / seal (HFFS), thermoforming / lidstock, and continuous horizontal packaging. It will be appreciated that those skilled in the art will be capable of employing the present packaging film to provide the necessary conditions to form the shape of the packaging and effect sealing.

[0100] The packaging film can be used to package any type of product. Examples of suitable products include, but are not limited to, foods, beverages, pharmaceuticals, nutraceuticals, cosmetics, medical products, electronic devices and products, wipes, etc. Examples of food products that can be packaged using the packaging films include, but are not1634571837.137249611.1limited, dry foods, frozen foods, fresh foods, refrigerated foods, and the like. Examples of food products include but are not limited to, cereals, chips, pretzels, bars (e.g., candy bars, protein bars, granola bars, etc.), nuts, raisins, pizzas, tortillas, gum, popcorn, a grain, a seasoning, popsicles, a frozen bar, ready-to-bake dough, pet food, vegetables, fruits, meats, cheese, sugar and powders, candy, and the like.

[0101] What has been described above includes examples of the present specification. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the present specification, but one of ordinary skill in the art may recognize that many further combinations and permutations of the present specification are possible. Accordingly, the present specification is intended to embrace all such alterations, modifications and variations that fall within the spirit and scope of the appended claims. Furthermore, to the extent that the term '‘includes’’ is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term “comprising” as “comprising” is interpreted when employed as a transitional word in a claim.

[0102] The foregoing description identifies various, non-limiting embodiments of a packaging material and packages formed therefrom. Modifications may occur to those skilled in the art and to those who may make and use the invention. The disclosed embodiments are merely for illustrative purposes and not intended to limit the scope of the invention or the subject matter set forth in the claims.1734571837.137249611.1

Claims

CLAIMSWhat is claimed is:

1. A packaging material comprising: a paper layer having an upper surface and a lower surface, and a heat sealing material disposed on a surface of the packaging material, wherein at least one layer of the packaging material comprises a thermally conductive material.

2. The packaging material of claim 1, wherein the paper layer comprises the thermally conductive material.

3. The packaging material of claim 1 or 2, wherein the heat sealing material comprises the thermally conductive material.

4. The packaging material of any of claims 1-3 comprising a print layer disposed on an outer surface of the packaging material.

5. The packaging material of claim 4, wherein the print layer comprises the thermally conductive material.

6. The packaging material of any of claims 1-5 comprising an over print varnish layer disposed on an outer surface of the packaging material.

7. The packaging material of claim 6, wherein the over print varnish layer comprises the thermally conductive material.

8. The packaging material of any of claims 1-7 wherein the paper layer comprises two or more paper layers.

9. The packaging material of claim 8, wherein each of the two or more paper layers comprises the thermally conductive material.1834571837.137249611.

110. The packaging material of claim 8 or 9, wherein adjacent paper layers of the two or more paper layers are adhered via an adhesive layer.

11. The packaging material of claim 9, wherein the adhesive layer comprises the thermally conductive material.

12. The packaging material of any of claims 1-11, wherein the heat sealing material is disposed on the lower surface of the paper layer.

13. The packaging material of any of claims 1-11 comprising a polymeric film layer disposed adjacent the lower surface of the paper layer.

14. The packaging material of claim 13, wherein the polymeric film layer has an upper surface and a lower surface, wherein the upper surface is oriented toward the lower surface of the paper layer, and the heat sealing material is disposed on a lower surface of the polymeric film layer.

15. The packaging material of claims 13 or 14, wherein the polymeric film layer comprises a recyclable polymer.

16. The packaging material of any of claims 13-15, wherein the polymeric film layer comprises polyethylene.

17. The packaging material of any of claims 1-16, wherein the thermally conductive material is selected from a thermally conductive filler, a thermally conductive polymer, or a combination thereof.

18. The packaging material of any of claims 1-17, wherein the thermally conductive material is selected from boron nitride, zinc oxide, glass fiber, glass flake, clays, exfoliated clays, calcium carbonate, talc, mica, wollastonite, aluminosilicate, alumina, aluminum nitride, graphite, metallic powders or flakes of aluminum, copper, bronze, or brass, fibers or whiskers of aluminum, copper, bronze, brass, silicon carbide, silicon nitride, aluminum nitride, alumina, zinc oxide, carbon nanotubes, graphene, boron nitride nanoparticles, boron nitride nanotubes,1934571837.137249611.1boron nitride nanosheets, polyaniline, polypyrrole, polyacetylene, polypropylene, polyvinylchloride, polyparaphenylene, or a combination of two or more thereof.

19. The packaging material of any of claims 1-16, wherein the thermally conductive material has a thermal conductivity7at 25° C. of at least about 0.5 W / m K.

20. The packaging material of any of claims 1-19, wherein the thermally conductive material has a thermal conductivity at 25° C. of from about 0.5 W / m K to about 30 W / m K.

21. The packaging material of any of claims 1-20. wherein the packaging material is recyclable.

22. A package comprising the packaging material of any of claims 1-21.

23. The package of claim 22, wherein the package is in the form of a flexible package.

24. The package of claim 22, wherein the flexible package is selected from a wrapper, a bag, or a pouch.

25. The package of claim 22, wherein the package comprises a container body and a lid disposed on the container body, and wherein the lid is formed from the packaging material.

26. The packaging material of any of claims 22-25, wherein the package is recyclable.2034571837.137249611.1

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