Electrophoretic Coatings TRIZ Cases
- Zinc-Rich Primer for Complex Metal Parts Using Hybrid Binder
Hybrid organic-inorganic binder enables dark zinc-rich primer to protect complex metal parts at 1.5 mils thickness, reducing touch point visibility.
- Roughened Copper Foil Electrolytic Process for PCB Adhesion
Controlled electrolytic deposition creates a roughening layer with low surface roughness and high peel resistance.
- Floating Metallized Element Assembly with Plateable Resin Networks
A floating metallized element assembly uses plateable and non-plateable resin networks to create isolated electrical circuits for distinct metal finishes.
- Nano-object positioning via electrostatic potential energy minima
Electrostatic potential energy guides nano-objects into precise positions, resolving placement accuracy limits in high aspect ratio device integration.