Merging transmission lines into one system reduces circuit complexity and power consumption while maintaining accurate time and address information generation.
Merging detection and count circuits in SPAD pixels preserves spatial resolution while reducing manufacturing complexity.
Merging distinct imaging and pulse detection circuits onto one chip reduces pixel weight while maintaining independent signal processing.
Capacitor integration accumulates weak return signals against ambient light noise, enabling accurate depth sensing in bright conditions.
A bridge section integrates heater and breakage detection wiring to enable self-diagnosis of an infrared sensor chip.
A single-photon detector uses a surface-plasmon wavelength-selective surface to resonantly transmit incident light within a passband.
An optical detector applies periodic test voltages below breakdown levels to count dark current pulses, preventing aging degradation failures.
Floating gate injection devices store unique control voltages to adjust per-pixel detector bias, resolving non-uniformity across infrared imaging arrays.
Histogram-based dynamic range control for optical detection devices prevents signal saturation during photon counting.