Revolution Surface Grinding Machines TRIZ Cases

A compact centerless grinding machine merges grinding and regulator spindles on a shared carriage to reduce installation space.

Interactive working tables enable simultaneous feeding and deburring operations, reducing production time for rim and valve hole burrs.

A motorized blade rest moves laterally to adjust workpiece support during centerless grinding operations.

A belt grinding device shortens turbomachine impeller blades using a rotating blade and stationary tool.

Segmented design extracts motors onto a mobile platform, preventing fluid leakage damage while enabling easy maintenance of optical polishing systems.

An internal kelly transmits rotation to a cylindrical workpiece, eliminating center friction and improving concentricity during grinding.

Magnetic attraction and mechanical pins lock grinding tools to withstand shear forces during operation.

A two-stage semiconductor wafer polishing method transitions from colloidal silica slurry to an alkali solution for surface smoothing.

Independent fluid passages in a segmented substrate holder equalize pressure locally, preventing foam suction cup effects during wafer release.

A handheld sanding tool features a pivoting vacuum attachment structure for effective dust removal from working surfaces.

A silicon rod grinder coordinates two transfer devices to operate coarse and fine grinding tools simultaneously at separate machining positions.

Dynamic angle-plunge grinding controls surface temperature to prevent thermal damage while reducing cycle time for cylindrical bearing surfaces.

A superabrasive tool features a tip protuberance and concave profile to access complex geometries.

Interrupting reference probe contact with the self-ground chuck table reduces wear while maintaining accurate wafer thickness measurement.

Carrier-compatible grooves align with carrier rings to enhance slurry distribution, reducing consumption while maintaining substrate removal rates.

Thinner central hubs reduce material waste while thicker abrasive rings extend lifespan.

Lateral oscillation of the polishing pad assembly removes large debris particles before main CMP processing, maintaining throughput without double polishing.

A rotating tool carrier on the spindle holds multiple dressing tools, eliminating separate drives and reducing device complexity.

Automated calculation replaces manual teaching operations to set precise grinding wheel positions, eliminating setup time delays.

A resin pedestal pad with a non-absorbable surface prevents copper wiring corrosion by maintaining fluid coverage on polished wafers during transfer.

Rotating EDM tool profiles abrasive matrix surfaces to restore diamond grinding wheel geometry, reducing material loss and improving precision.

A polishing apparatus detects substrate escape using controlled light irradiation and image processing.

Continuous polishing agent and water supply maintains interface properties, preventing drying and sustaining high restoration capability.

Segmented cutting bar groups enable machining of stepped and through bores without tool changes, maintaining high coaxiality across different bore diameters.

Truncated cone rollers replace heavy drums to eliminate sudden slips and simplify maintenance during tapered roller machining.

Variable helix angles along the barrel shape maintain consistent contact points, resolving machining accuracy versus tool structure complexity.

Modular fixing devices decouple belt handling from the carrier, reducing alignment time while maintaining secure attachment stability.

A three-dimensional network polishing pad with interconnected unit cells enables dynamic contact and efficient fluid flow.

Segmented superabrasive tips on a CMP pad dresser minimize structural warpage during manufacturing, ensuring consistent leveling and extended operational life.

Servo-controlled brush belts adapt to varying wheel geometries, resolving the trade-off between automation versatility and structural complexity.

Moving the heat exchanger to a retreat position allows effective dirt removal from its bottom surface, preventing wafer scratches and improving throughput.

An annular protrusion on the core diffuses grinding fluid uniformly, eliminating reservoirs that destabilize rotation during wafer grinding.

Fits an optical model to in-situ spectra using diffraction effects, resolving endpoint detection errors on patterned substrates.

A turning machine with a stationary base part mounted on the workpiece rotates tools around the component.

An annular template with a specific diameter ratio deforms to maintain uniform pressure, preventing sag and raised shapes during large wafer polishing.

Multi-plane measurement along the grinding disc width enables adaptive CNC correction of crankshaft circularity and conicity defects during machining.

Regulating wheel drive rotates work pieces in both centerless and between-centers grinding modes without a separate driver.

Segmented grinding of shaft end regions creates stable reference surfaces that resolve support instability and pre-machining errors during finish grinding.

Welding carbide studs onto steel links eliminates complex jointing to boost cleaning efficiency.

Segmenting the support rail into a universal base and interchangeable inserts resolves the trade-off between geometric adaptability and device complexity.

Spiral line measurement calculates dynamic stiffness parameters to resolve grinding chatter without relying on static force assumptions.

Replacing pneumatic motors with cable-driven rotation and flexible strips allows the device to mill curvy pipes without street closures.

Segmented variable feed rates during gear grinding generate irregular micro-scratch patterns that resolve mesh noise without increasing machining complexity.

Retaining device prevents cooling lubricant contamination of hydrostatic bearing liquid, reducing shape deviations during extended machining.

Porous foam adhesive tape generates suction via elastic restoration to secure lenses, preventing axial misalignment on water-repellent coatings.

Segmented profiled grinding wheel reduces material waste and manufacturing costs by attaching pre-formed abrasive segments to a metal core via laser welding.

A manual hand lever pivots a swivel arm to adjust the carriage position, eliminating complex electronic controls while maintaining grinding precision.

Emulsion-based chemical extraction removes metal cations from semiconductor wafers, eliminating microscratches and dishing caused by abrasive particles.

Angulating the grinding wheel axis relative to the workpiece reduces contact area, lowering process forces while improving surface processing efficiency.

A swivelable wheel unit positions the grinding wheel on a vertical center line to simplify tapered roller machining alignment.