Efficient LED Placement for Light-Emitting Devices
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Summary
Problems
The challenge in manufacturing light-emitting devices lies in efficiently arranging numerous light-emitting diodes on circuit boards within display and backlight modules, requiring an effective method to transfer and connect large numbers of LED chips, packages, or Chip Scale Packages (CSPs) to ensure proper alignment and electrical connectivity.
Innovation solutions
A method involving substrates with intermediate layers and adhesive units, where protrusions formed by laser are used to push light-emitting elements from one substrate to another, allowing for precise placement and connection of LED elements onto connecting pads, utilizing anisotropic conductive pastes or films to ensure both physical and electrical contact.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If traditional methods are used to arrange light-emitting diodes on circuit boards, then the manufacturing process is simpler, but the efficiency and accuracy of arranging numerous LEDs are reduced
Why choose this principle:
The invention divides the substrate into multiple regions with different adhesive properties. Specifically, a first region has a first adhesive material that bonds to the LED chip, while a second region has a second adhesive material that bonds to the circuit board. This segmentation allows for automated transfer and placement of multiple LEDs in a single process, significantly improving productivity without requiring complex external handling equipment for each individual LED.
Principle concept:
If traditional methods are used to arrange light-emitting diodes on circuit boards, then the manufacturing process is simpler, but the efficiency and accuracy of arranging numerous LEDs are reduced
Why choose this principle:
The substrate serves multiple functions simultaneously: it acts as a support structure for LED mounting, a transfer carrier for automated handling, and a circuit board for electrical connections. By integrating these functions into a single substrate structure with differentiated adhesive regions, the invention eliminates the need for separate handling and mounting steps, thereby improving efficiency while maintaining relatively simple device complexity.
Application Domain
Data Source
AI summary:
A method involving substrates with intermediate layers and adhesive units, where protrusions formed by laser are used to push light-emitting elements from one substrate to another, allowing for precise placement and connection of LED elements onto connecting pads, utilizing anisotropic conductive pastes or films to ensure both physical and electrical contact.
Abstract
This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements are partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.