Thermal Dissipation and EMI Shielding in Semiconductor Packages
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Summary
Problems
Semiconductor packages face challenges with thermal dissipation and electromagnetic interference (EMI) as operation speed increases and device size decreases, leading to inefficient heat management and potential damage to electronic components.
Innovation solutions
A semiconductor package design featuring a substrate with a grounding element, a semiconductor chip, and a conductive connecting element that extends beyond the chip's lateral edge, encapsulated in a package body with a recess exposing the chip's upper surface, and covered by a conductive layer for both thermal dissipation and EMI shielding.
TRIZ Analysis
Specific contradictions:
General conflict description:
Principle concept:
If device size decreases and operation speed increases, then productivity and device integration are improved, but thermal dissipation becomes more difficult and EMI increases
Why choose this principle:
The conductive layer extends beyond the lateral edges of the semiconductor chip into the surrounding space, utilizing three-dimensional space for thermal management. This dimensional extension allows heat dissipation pathways to radiate outward in multiple directions rather than being confined to the chip plane, effectively increasing the thermal dissipation surface area without increasing the device footprint.
Principle concept:
If device size decreases and operation speed increases, then productivity and device integration are improved, but thermal dissipation becomes more difficult and EMI increases
Why choose this principle:
The conductive layer serves multiple functions simultaneously: it acts as a thermal dissipation pathway to conduct heat away from the chip, provides EMI shielding to protect against electromagnetic interference, and extends the grounding element to enhance electrical stability. This multi-functionality addresses multiple problems (thermal, electromagnetic, and electrical) with a single structural element.
Application Domain
Data Source
AI summary:
A semiconductor package design featuring a substrate with a grounding element, a semiconductor chip, and a conductive connecting element that extends beyond the chip's lateral edge, encapsulated in a package body with a recess exposing the chip's upper surface, and covered by a conductive layer for both thermal dissipation and EMI shielding.
Abstract
Semiconductor packages and related methods. The semiconductor package includes a substrate, a semiconductor chip, a package body, a recess and a conductive layer. The substrate includes a grounding element. The semiconductor chip is disposed on the substrate and has a lateral surface and an upper surface. The package body encapsulates the lateral surface of the semiconductor chip. The recess is formed in the package body and exposes the upper surface of the semiconductor chip. The conductive layer covers an outer surface of the package body, the grounding element and the upper surface of the semiconductor chip exposed by the recess to provide both thermal dissipation and EMI shielding for the semiconductor chip.