Apparatus for using waste heat in server computers
CA3320967A1Pending Publication Date: 2026-09-21LINDNER SE
0 Cites 0 Cited by
Patent Information
- Application Number
- CA3320967
- Authority / Receiving Office
- CA · CA
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-08
- Filing Date
- 2025-03-06
- Publication Date
- 2026-09-21
AI Technical Summary
Technical Problem
Existing technologies for utilizing waste heat from server computers are inefficient, complex, and require additional cooling systems and heat exchangers, leading to energy losses and increased design complexity.
Method used
A device that immerses computing cores in a dielectric sleeve directly in a process fluid, allowing direct heat dissipation without separate cooling circuits or heat exchangers, using a modular design with a housing for control units and connection elements, enabling efficient heat transfer and decentralized installation.
Benefits of technology
Achieves improved heat transfer efficiency with reduced costs and structural complexity, allowing decentralized and modular utilization of waste heat in server computers, suitable for edge cloud systems.
✦ Generated by Eureka AI based on patent content.
Abstract
Device for using waste heat in server computers, in particular decentrally-arranged modular edge cloud computing systems, in a heat consumer or pipe network supplied with hot process fluid such as hot water, in particular hot service water, heating water or hot process fluid in industry; with at least one computing core or server blade which generates heat during operation of the server computer and which is accommodated in a sleeve; with a housing for receiving supply-, control- and / or connection-units of the server computer, wherein the housing and the sleeve are connected to one another at least via lines for power supply and data transmission to and from the computing core, and wherein the sleeve is a pressure-resistant heat cartridge sleeve which can be immersed in a sealed manner in the process fluid for the direct heat dissipation on the part of the computing core, having a dielectric in the interior for the electrical insulation of the computing core.
Need to check novelty before this filing date? Find Prior Art