A flexible chip packaging structure and method

By using microstructured flexible support film and gold wire bonding wire in chip packaging, combined with flexible packaging film, the problem that the chip packaging structure cannot be bent and deformed is solved, and stronger bending and deformation capabilities and bonding reliability are achieved.

CN110246815BActive Publication Date: 2024-12-17ZHEJIANG HEQING FLEXIBLE ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN201910555091.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-06-25
Publication Date
2024-12-17
Estimated Expiration
2039-06-25

AI Technical Summary

Technical Problem

The existing chips and their packaging structures cannot be bent and deformed, limiting the overall flexibility of the electronic terminal system.

Method used

The flexible circuit board is connected to the flexible chip with a microstructure, and electrically interconnected through a gold wire bonding wire, combined with a flexible packaging film covering to enhance the bending and deformation capability of the packaging structure.

Benefits of technology

By releasing stress and providing deformation space, the bending and deformation capability of the chip package structure is enhanced, the possibility of stress transmission to the chip is reduced, and the flexibility and bonding reliability of the package structure are improved.

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Abstract

A flexible chip packaging structure includes a flexible circuit board, a flexible support film with a microstructure, and a flexible chip, wherein the flexible support film is arranged between the flexible circuit board and the flexible chip, and the flexible circuit board and the flexible chip are electrically interconnected. The present invention also discloses a flexible chip packaging method, including: providing a flexible circuit board and a flexible chip, providing a flexible support film with a microstructure, and bonding and fixing the flexible circuit board and the flexible chip; providing a gold wire bonding line, and electrically interconnecting the flexible chip and the flexible circuit board. The present invention can realize the flexibility of the chip packaging structure and increase its bending and deformation ability.
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