Resin pasting machine

By measuring the temperature in real time and adjusting the movement amount in the resin pasting machine, the problem of uneven resin thickness was solved, constant resin thickness was achieved at different temperatures, and thickness deviation was reduced.

CN112289707BActive Publication Date: 2025-09-26DISCO CORP
1 Cites 0 Cited by

Patent Information

Application Number
CN202010712066.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-07-23
Filing Date
2020-07-22
Publication Date
2025-09-26
Estimated Expiration
2040-07-22

AI Technical Summary

Technical Problem

In resin laminating machines, temperature variations in the holding portion and the worktable cause uneven resin thickness, making it impossible to apply the resin with a uniform thickness. This leads to thickness variations after cutting or grinding.

Method used

The temperature of the processing chamber is measured by the temperature measuring unit, and the control unit refers to the data in the correlation data storage unit to adjust the movement amount of the moving unit to keep the resin thickness constant, including adjusting the relative position of the holding unit and the workbench at different temperatures.

Benefits of technology

It effectively reduces the thickness deviation of the resin on the wafer, ensures the uniformity of the resin coating, and reduces the thickness unevenness problem caused by temperature changes.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

A resin bonding machine is provided that can reduce variations in the thickness of resin applied to a wafer. The resin bonding machine comprises a processing chamber, which includes a holding portion, a worktable, a resin supply portion, a moving portion, and a curing portion. The holding portion holds the wafer, the worktable is opposed to the holding portion, the resin supply portion supplies liquid resin to the worktable, the moving portion brings the holding portion and the worktable into relative proximity, and the curing portion cures the liquid resin. A temperature measuring portion measures the temperature within the processing chamber, and a control portion controls each mechanism. The control portion includes a correlation data storage portion that records correlation data between temperature and the amount of movement of the moving portion at each temperature as data for maintaining a constant thickness of the applied resin even at different temperatures. The control portion, referring to the correlation data, sets the amount of movement in the moving portion that corresponds to the temperature measured by the temperature measuring portion, thereby coating the wafer with resin to a predetermined thickness.
Need to check novelty before this filing date? Find Prior Art